SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 Features • • • • • • • Surface Mount 100 µm I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified) Parameter Absolute Maximum Forward Current 250 mA Reverse Voltage l -200 V l Operating Temperature -55 °C to +125 °C Storage Temperature -55 °C to +150 °C Junction Temperature +175 °C Dissipated Power (RF & DC) 1.8 W Mounting Temperature +235 °C for 10 seconds Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This Vertical Topology provides for Exceptional Heat Transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. 1. Operation of this device above any one of these parameters may cause permanent damage. Case Style ODS-1294 (MA4SPS421) These packageless devices are suitable for usage in Moderate Incident Power ( 10 W C.W. ) or Higher Incident Peak Power ( 500 W ) Series, Shunt, or Series-Shunt Switches. Smaller Parasitic Inductance, 0.1to 0.2 nH, and Excellent RC Constant ( 0.45 pS ), make the devices ideal for Higher Frequency Switch Elements compared to their Plastic Device Counterparts. Case Style ODS-1295 (MA4SPS422) B A A C C Dimensions Dim Inches Millimeters A Min. 0.040 Max. 0.042 Min. 1.025 Max. 1.075 B 0.021 0.023 0.525 0.575 C 0.004 0.008 0.102 0.203 D 0.013 0.015 0.325 0.375 E 0.011 0.013 0.275 0.325 F 0.013 0.015 0.325 0.375 G 0.019 0.021 0.475 0.525 G G D E F D E F Bottom Side Contacts are Circuit Side 1. Backside metal: 0.1 microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. 3. Both Devices have Same Outline Dimensions ( A to G ). 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 Electrical Specifications @ + 25 °C Parameter Symbol Conditions Units Min. Typ. Max. Capacitance CT 1 0 V, 1 MHz pF 0.130 Capacitance CT 0 V, 1 GHz1,3 pF .08 Capacitance CT -40 Volts, 1 MHz1 pF 0.090 pF .07 0.13 3.1 MA4SPS421 Capacitance CT -40 Volts, 1 GHz 1,3 Min. Typ. MA4SPS422 0.175 0.340 0.125 0.180 RS +10 mA, 1 GHz Ω 6.2 Forward Voltage VF +10 mA V 0.900 Reverse Leakage Current IR l -200 V l µA Input Third Order Intercept Point IIP3 F 1 = 1000 MHz F 2 = 1010 MHz Input Power = +10 dBm I bias = +10 mA dBm +50 +50 C.W. Thermal Resistance RθJL IH = 0.5 A, IL = 10 mA °C/W 80 70 Minority Carrier Lifetime TL µs 5 10 +10 mA / -6 mA (50% - 90% V) 0.500 0.14 Resistance 2,3 Max 0.950 0.840 l -10 l 0.300 0.900 l -10 l 1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2. Series resistance Rs is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3. Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with Sn 60 / Pb 40 solder. 4. Steady-state R θJL measured with die mounted in an ODS-186 package with Sn 60 / Pb 40 solder. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn or Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment may also be used for lower incident power (<1 W average incident power) applications. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface Mounting Instructions “ on the MA-COM website www.macom.com. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 MA4SPS420 Typical Performance Curves @ +25 °C Rs vs. Current (@ 100MHz & 1GHz) MA4SPS421 Rs vs. Current (@ 100MHz & 1GHz) MA4SPS422 100 Rs (ohms) Rs (ohms) 100 10 1 0.001 0.01 10 1 0.001 0.1 0.01 0.1 Current (A) Current (A) Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS421 Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS422 3.0E-13 3.0E-13 2.5E-13 2.5E-13 2.0E-13 2.0E-13 Ct (F) Ct (F) 100MHz 1.5E-13 100MHz 1.0E-13 5.0E-14 1.5E-13 1GHz 1.0E-13 1GHz 5.0E-14 0.0E+00 0.0E+00 0 10 20 30 40 0 10 Voltage (V) Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS421 30 40 30 40 Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS422 1000000 1000000 100MHz 10000 100000 Rp (ohms) 100000 Rp (ohms) 20 Voltage (V) 1GHz 1000 100 10 100MHz 10000 1GHz 1000 100 10 1 1 0 10 20 30 40 Voltage (V) 0 10 20 Voltage (V) 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 3 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 MA4SPS420 Typical Performance Curves @ +25 °C Ct vs Frequency (@ 0, 5 & 40V) MA4SPS422 3.0E-13 3.0E-13 2.5E-13 2.5E-13 2.0E-13 2.0E-13 Ct (F) Ct (F) Ct vs Frequency (@ 0, 5 & 40V) MA4SPS421 1.5E-13 0V 1.0E-13 5.0E-14 0V 1.5E-13 40V 1.0E-13 40V 0.0E+00 0.0E+00 5.0E-14 5.0E+08 1.0E+09 1.5E+09 0.0E+00 0.0E+00 2.0E+09 5.0E+08 1.0E+09 Frequency (Hz) 1.5E+09 2.0E+09 Frequency (Hz) Ls vs Frequency (@ 10mA & 100mA) MA4SPS421 Ls vs Frequency (@ 10mA & 100mA) MA4SPS422 3.00E-10 3.00E-10 2.50E-10 2.50E-10 100mA 2.00E-10 Ls (H) Ls (H) 2.00E-10 10mA 1.50E-10 100mA 1.50E-10 1.00E-10 1.00E-10 5.00E-11 5.00E-11 10mA 0.00E+00 0.0E+00 5.0E+08 1.0E+09 1.5E+09 0.00E+00 0.0E+00 2.0E+09 Frequency (Hz) Rs (ohms) Rs (ohms) 100mA 4E+8 6E+8 1.5E+09 2.0E+09 Rs vs Frequency (@ 10mA & 100mA) MA4SPS422 10mA 2E+8 1.0E+09 Frequency (Hz) Rs vs Frequency (@ 10mA & 100mA) MA4SPS421 10 9 8 7 6 5 4 3 2 1 0 0E+0 5.0E+08 8E+8 1E+9 Frequency (H) 10 9 8 7 6 5 4 3 2 1 0 0E+0 10mA 100mA 2E+8 4E+8 6E+8 8E+8 1E+9 Frequency (H) 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 MA4SPS421 SPICE Model wBv=260 V wPmax=1.6 W Ffe=1.0 PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=100 um Rr=11 K Ohm Cmin=0.06 pF Tau= 5 usec Rs=0.1 Ohm Cj0=0.07 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=3.1 E+8 A/m^2 Kf=0.0 Af=1.0 MA4SPS421 Schematic Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Series V2 MA4SPS422 SPICE Model wBv=340 V wPmax=1.8 W Ffe=1.0 PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=100 um Rr=9 K Ohm Cmin=0.12 pF Tau= 10 usec Rs=0.1 Ohm Cj0=0.13 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=7.8 E+7 A/m^2 Kf=0.0 Af=1.0 MA4SPS422 Schematic Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 7 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.