Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 — Preliminary Information Features ♦ 0.6 Watt Saturated Output Power Level ♦ Variable Drain Voltage (4-10V) Operation ♦ MSAG™ Process Description The MAAPGM0026-DIE is a 2-stage, 0.6 W power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™) Process, each device is 100% RF tested on wafer to ensure performance compliance. M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Primary Applications ♦ ♦ ♦ ♦ 2.5-2.7 GHz MMDS GPS WLAN Point-to-Multipoint Radios Electrical Characteristics: TB = 40°C1, Z0 = 50 Ω, VDD = 8V, VGG = -2V, Pin = 12 dBm Parameter Typical Units Bandwidth f 1.5-3.3 GHz Output Power POUT 28 dBm Power Added Efficiency PAE 25 % 1-dB Compression Point P1dB 27 dBm Small Signal Gain G 20 dB Input VSWR VSWR 1.7:1 Gate Current IGG < 10 mA Drain Current IDD < 300 mA Output Third Order Intercept OTOI 36 dBm Noise Figure NF 6 dB 3 Order Intermodulation Distortion Single Carrier Level = 23 dBm IM3 31 dBc 5th Order Intermodulation Distortion Single Carrier Level = 23 dBm IM5 41 dBc 2nd Harmonic 2f -15 dBc 3f -25 dBc rd rd 3 Harmonic 1 Symbol 1. TB = MMIC Base Temperature M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 — Preliminary Information Maximum Operating Conditions2 Parameter Symbol Absolute Maximum Units Input Power PIN 17.0 dBm Drain Supply Voltage VDD +12.0 V Gate Supply Voltage VGG -3.0 V Quiescent Drain Current (No RF) IDQ 360 mA PDISS 2.4 W Junction Temperature Tj 180 °C Storage Temperature TSTG -55 to +150 °C Quiescent DC Power Dissipated (No RF) 2. Operation beyond these limits may result in permanent damage to the part. Recommended Operating Conditions3 Characteristic Symbol Min Typ Max Unit Drain Voltage VDD 4.0 8.0 10.0 V Gate Voltage VGG -2.3 -2.0 -1.5 V Input Power PIN 15.0 dBm Junction Temperature Tj 150 °C Thermal Resistance ΘJC 150 °C/W MMIC Base Temperature TB Note 3 °C 33.1° 3. Maximum MMIC Base Temperature = 150°C— ΘJC * VDD * IDQ 4. Operation outside of these ranges may reduce product reliability. Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8 V. 3. Adjust VGG to set IDQ, (approximately @ –2 V). 4. Set RF input. 5. Power down sequence in reverse. Turn VGG off last. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 — Preliminary Information 50 50 POUT PAE 40 35 35 30 25 20 15 30 25 20 15 10 10 5 5 0 1.25 POUT PAE 45 40 POUT (dBm), PAE(%) POUT (dBm), PAE(%) 45 0 1.75 2.25 2.75 3.25 3.75 4 5 Frequency (GHz) 6 7 8 9 10 Drain Voltage (volts) Figure 1. Output Power and Power Added Efficiency vs. Frequency at VDD = 8V. Figure 2. Saturated Output Power and Power Added Efficiency vs. Drain Voltage at fo = 2.25 GHz. 40 6 30 GAIN 35 VSWR 25 5 20 4 15 3 10 2 25 20 VSWR Gain (dB) P1dB (dBm) 30 15 10 VDD = 4 VDD = 8 5 1.25 1.75 VDD = 6 VDD = 10 2.25 2.75 3.25 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage 3.75 5 1.25 1.75 2.25 2.75 3.25 Frequency (GHz) Figure 4. Small Signal Gain and VSWR vs. Frequency at VDD = 8V. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 1 3.75 Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 — Preliminary Information Mechanical Information Chip Size: 2.980 x 1.580 x 0.075 mm (117 x 62 x 3 mils) 2.980mm. 1.490mm. 0.177mm. 1.580mm. VDD 1.378mm. OUT IN 0.840mm. 0.840mm. VGG 0.202mm. 0 2.853mm. 1.490mm. 0 Figure 5. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad Size (μm) Size (mils) RF In and Out 100 x 200 4x8 DC Drain Supply Voltage VDD 200 x 150 8x6 DC Gate Supply Voltage VGG 150 x 150 6x6 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 — Preliminary Information Assembly and Bonding Diagram VDD 0.1 μF 100 pF VDD RFIN RFOUT OUT IN VGG 100 pF VGG 0.1 μF Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW test- Assembly Instructions: Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.