MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Features MA4SW610B-1 Layout • Ultra Broad Bandwidth: 2GHz to 18GHz • 1.9dB Insertion Loss, 35dB Isolation at 18GHz • Reliable. Fully Monolithic, Glass Encapsulated Construction Description The MA4SW610B-1 is a reflective SP6T series shunt broad band switch with integrated bias networks made with M/A-COM’s HMIC TM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through 18 GHz. Nominal Chip Dimensions Applications Chip Dimensions (mm) These high performance switches are suitable for the use in multi-band ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5V/-5V, TTL controlled PIN diode driver, 80ns switching speeds are achieved. Absolute Maximum Ratings1 @ TAMB = +25°C (unless otherwise specified) Parameter Value Operating Temperature -65°C to +125°C Storage Temperature -65°C to +150°C RF CW Incident Power +30dBm DC Bias Current (Forward) +/- 20mA Applied Voltage (Reverse) 15V Note: 1) Exceeding any of these values may result in permanent damage. 1 Chip X 3370 Pad Dimensions (mm) Y 3120 RF DC X 400 125 Pad Locations (mm) Y 125 125 J1 J2 B2 J3 B3 J4 B4 J5 B5 J6 B6 J7 B7 X Y 0 0 -1535 +300 -1535 +1000 -1535 +1800 -1535 +2500 -750 +2820 -50 +2820 +750 +2820 +1450 +2820 +1535 +1800 +1535 +1100 +1535 +300 +900 0 Pad Locations Relative to J1 Notes: 1) Topside and backside metallization is gold , 2.5μm thick typical. 2) Yellow areas indicate bondpads ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Electrical Specifications @ TA = 25 °C, +/- 10 mA Bias Current (On-Wafer Measurements) Parameters Insertion Loss Isolation Input Return Loss Output Return Loss Switching Speed1 Frequency Minimum 6 GHz - 12 GHz - 18 GHz Typical Maximum Units 1.4 dB 1.3 2.0 dB - 1.9 2.9 dB 6 GHz 43 49 - dB 12 GHz 35 43 - dB 18 GHz 30 39 - dB 6 GHz - 18 - dB 12 GHz - 20 - dB 18 GHz - 16 - dB 6 GHz - 19 - dB 12 GHz - 22 - dB 18 GHz - 20 - dB 10 GHz - 80 - nS 1.0 1. Typical switching speed is measured from 10% to 90% of the detected RF voltage driven by a TTL compatible driver. Driver output parallel RC network uses a capacitor between 390pF - 560pF and a resistor between 150 - 220Ω to achieve 80ns rise and fall times. Typical Driver Connections Control Level (DC Current) B2 B3 B4 B5 B6 Condition of RF Output B7 J2-J1 J3-J1 J4-J1 J5-J1 J6-J1 J7-J1 -10 mA +10 mA +10 mA +10 mA +10 mA +10 mA Low Loss Isolation Isolation Isolation Isolation Isolation +10 mA -10 mA +10 mA +10 mA +10 mA +10 mA Isolation Low Loss Isolation Isolation Isolation Isolation +10 mA +10 mA -10 mA +10 mA +10 mA +10 mA Isolation Isolation Low Loss Isolation Isolation Isolation +10 mA +10 mA +10 mA -10 mA +10 mA +10 mA Isolation Isolation Isolation Low Loss Isolation Isolation +10 mA +10 mA +10 mA +10 mA -10 mA +10 mA Isolation Isolation Isolation Isolation Low Loss Isolation +10 mA +10 mA +10 mA +10 mA +10 mA -10 mA Isolation Isolation Isolation Isolation Isolation Low Loss 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Typical R.F. Microwave Performance TYPICAL INSERTION LOSS 0.00 IL ( dB ) -1.00 -2.00 -3.00 -4.00 -5.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 FREQUENCY ( GHz ) J2 J3 J4 J5 J6 J7 TYPICAL ISOLATION 0.00 -10.00 ISO ( dB ) -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 FREQUENCY ( GHz ) J2 J3 J4 J5 J6 J7 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Typica R.F. Microwave Performance TYPICAL INPUT RETURN LOSS 0.00 IRL ( dB ) -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 FREQUENCY ( GHz ) J2 J3 J4 J5 J6 J7 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Operation of the MA4SW610B-1 Switch The simultaneous application of negative DC current to the low loss port and positive DC current to the remaining isolated ports as shown in the schematic provides successful RF operation of the MA4SW Series of PIN Diode Switches. The backside area of the die is the RF and DC return ground plane. The DC bias return is located on common port J1. Constant current sources should supply the DC control currents. In the low loss state, the series diode must be forward biased and the shunt diode reverse biased. For all isolated ports, the shunt diode is forward biased while the series diode is reverse biased. This design improves insertion loss, P1dB, IP3, and switching speed by Incorporating a voltage pull-up resistor (~100 Ω ) in the DC return path ,J1, under insertion loss Bias. A Typical Value of |-3 V| is achieved at the Insertion Loss Bias Node using ±20mA, with a Standard , ±5V TTL Controlled PIN Diode Driver. MA4SW610B-1 Schematic J1 ( Common Port ) DC Bias J7 J2 J6 J5 J4 J3 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW610B-1 SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz Rev. V2 Assembly Considerations The following precautions should be observed for successful assembly of the die. Cleanliness These chips should be handled in a clean environment free of dust and contaminants. Electro-Static Sensitivity The MA4SW Series PIN switches are ESD, Class 1 sensitive. The proper ESD handling procedures should be used. Wire Bonding Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bonds should be as short as possible to minimize inductance. Mounting These chips have Ti-Pt-Au back metal. They can be die mounted with a 80Au/20Sn or Sn62/Pb36/Ag2 solder preform or electrically conductive Ag epoxy. Mounting surface must be clean of oils and contaminants and flat. Eutectic Die Attachment An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255 oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290 oC. The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds. No more than 3 seconds should be required for the attachment. Epoxy Die Attachment Assembly should be preheated to 125-150oC. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer’s recommended schedule. 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.