MAXIM MAX3266CSA

19-4796; Rev 0; 1/99
KIT
ATION
EVALU
E
L
B
A
AVAIL
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
The MAX3266 is a transimpedance preamplifier for
1.25Gbps LAN fiber optic receivers. The circuit features
200nA input-referred noise, 920MHz bandwidth, and
1mA input overload.
The MAX3267 provides a pin-for-pin compatible solution for communications up to 2.5Gbps. It features
500nA input-referred noise, 1.9GHz bandwidth, and
1mA input overload.
Both devices operate from a single +3.0V to +5.5V supply and require no compensation capacitor. They also
include a space-saving filter connection that provides
positive bias for the photodiode through a 1.5kΩ resistor
to VCC. These features allow easy assembly into a TO-46
or TO-56 header with a photodiode.
The 1.25Gbps MAX3266 has a typical optical dynamic
range of -24dBm to 0dBm in a shortwave (850nm)
configuration or -27dBm to -3dBm in a longwave
(1300nm) configuration. The 2.5Gbps MAX3267 has a
typical optical dynamic range of -21dBm to 0dBm in a
shortwave configuration or -24dBm to -3dBm in a longwave configuration.
Features
♦ 200nA Input-Referred Noise (MAX3266)
500nA Input-Referred Noise (MAX3267)
♦ 920MHz Bandwidth (MAX3266)
1900MHz Bandwidth (MAX3267)
♦ 1mA Input Overload
♦ Single +3.0V to +5.5V Supply Voltage
Ordering Information
PART
TEMP. RANGE
MAX3266CSA
0°C to +70°C
PIN-PACKAGE
8 SO
MAX3266C/D
—
Dice*
MAX3267CSA
0°C to +70°C
8 SO
MAX3267C/D
—
Dice*
*Dice are designed to operate with junction temperatures of 0°C
to +100°C but are tested and guaranteed only at TA = +25°C.
Pin Configuration
TOP VIEW
VCC 1
Applications
N.C. 2
Gigabit Ethernet
IN
3
MAX3266
MAX3267
8
GND
7
OUT+
6
OUT-
5
GND
1.0Gbps to 2.5Gbps Optical Receivers
FILTER 4
Fibre Channel
SO
Typical Application Circuit
VCC
0.01µF
1.5k
CFILTER
400pF
VCC
FILTER
0.1µF
OUT+
PHOTODIODE
IN
100Ω
OUT-
MAX3266
MAX3267
0.1µF
LIMITING
AMPLIFIER
GND
________________________________________________________________ Maxim Integrated Products
1
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For small orders, phone 1-800-835-8769.
MAX3266/MAX3267
General Description
MAX3266/MAX3267
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC - GND) .................................-0.5V to +6.0V
IN Current..............................................................-4mA to +4mA
FILTER Current......................................................-8mA to +8mA
Voltage at OUT+, OUT- ...................(VCC - 1.5V) to (VCC + 0.5V)
Continuous Power Dissipation (TA = +70°C)
SO package (derate 6.7mW/°C above +70°C).............533mW
Storage Temperature Range .............................-55°C to +150°C
Operating Junction Temperature (die) ..............-55°C to +150°C
Processing Temperature (die) .........................................+400°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.5V, TA = 0°C to +70°C, 100Ω load between OUT+ and OUT-. Typical values are at TA = +25°C, VCC = 3.3V,
source capacitance = 0.85pF, unless otherwise noted.) (Note 1)
PARAMETER
CONDITIONS
Input Bias Voltage
MIN
TYP
MAX
0.69
0.83
0.91
V
26
50
mA
Supply Current
Transimpedance
Differential, measured
with 30µAp-p signal
(40µAp-p for MAX3267)
MAX3266
2260
2800
3400
MAX3267
1540
1900
2330
UNITS
Ω
Output Impedance
Single-ended (per side)
48
50
52
Ω
Maximum Differential Output
Voltage
Input = 1mAp-p
185
250
415
mVp-p
1220
1500
1860
Ω
Filter Resistor
AC Input Overload
1.0
mAp-p
DC Input Overload
0.65
mA
Die, packaged in TO-56
header (Note 2)
Input-Referred RMS Noise
SO package
(Note 2)
Input-Referred Noise Density
Small-Signal Bandwidth
(Note 2)
MAX3266
192
MAX3266
200
MAX3267
485
MAX3266
MAX3267
6.6
11.0
256
nA
655
pA/(Hz)1/2
MAX3266
750
920
1100
MAX3267
1530
1900
2420
Low-Frequency Cutoff
-3dB, input ≤ 20µADC
Transimpedance Linear Range
Peak-to-peak
0.95 < linearity < 1.05
Deterministic Jitter
(Note 3)
Power-Supply Rejection Ratio
(PSRR)
Output referred, f < 2MHz
PSRR = -20log (∆VOUT/∆VCC)
44
MAX3266
MAX3267
MHz
kHz
30
40
µAp-p
MAX3266
19
76
MAX3267
12
50
50
ps
ps
dB
Note 1: Source Capacitance represents the total capacitance at the IN pin during characterization of noise and bandwidth parameters. Figure 1 shows the typical source capacitance vs. reverse voltage for the photodiode used during characterization of
TO-56 header packages. Noise and bandwidth will be affected by the source capacitance. See the Typical Operating
Characteristics for more information.
Note 2: Input-Referred Noise is calculated as RMS Output Noise / (Gain at f = 10MHz). Noise Density is (Input-Referred Noise) /
√bandwidth. No external filters are used for the noise measurements.
Note 3: Deterministic Jitter is measured with the K28.5 pattern applied to the input [00111110101100000101].
2
_______________________________________________________________________________________
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
210
200
190
CIN = 1.0pF
560
540
520
500
480
25
50
75
CIN 1.5pF
25
50
75
100
1M
1G
10G
DETERMINISTIC JITTER
vs. INPUT AMPLITUDE
INPUT-REFERRED RMS NOISE CURRENT
vs. DC INPUT CURRENT
SMALL-SIGNAL TRANSIMPEDANCE
vs. TEMPERATURE
40
MAX3266
20
10
MAX3267
69
68
700
MAX3267
600
500
400
300
1000
10
100
0
1000
CIN = 0.5pF
890
840
BANDWIDTH (MHz)
940
2000
CIN = 0.5pF
CIN = 1.0pF
1800
50
75
JUNCTION TEMPERATURE (°C)
100
1500
40
50
60
70
80
400
INPUT = 1mAp-p
380
360
340
320
300
280
240
220
1600
CIN = 1.5pF
30
260
1700
740
20
MAX3266/MAX3267
OUTPUT AMPLITUDE vs. TEMPERATURE
CIN IS SOURCE CAPACITANCE
2300 PRESENTED TO DIE, INCLUDES
PACKAGE PARASITIC, PIN DIODE,
2200 AND PARASITIC INTERCONNECT
CAPACITANCE
2100
1900
10
AMBIENT TEMPERATURE (°C)
2400
MAX3266/67-07
990
25
MAX3267
63
MAX3267
BANDWIDTH vs. TEMPERATURE
CIN IS SOURCE CAPACITANCE
PRESENTED TO DIE, INCLUDES
PACKAGE PARASITIC, PIN DIODE,
AND PARASITIC INTERCONNECT
CAPACITANCE
CIN = 1.0pF
64
DIFFERENTIAL DC INPUT CURRENT (µA)
MAX3266
BANDWIDTH vs. TEMPERATURE
1040
65
60
1
PEAK-TO-PEAK AMPLITUDE (µA)
1090
66
61
MAX3266
AMPLITUDE (mV)
100
MAX3266
67
62
200
0
10
MAX3266/67-06
800
100
0
70
MAX3266/67-05
900
TRANSIMPEDANCE (dB)
60
50
1000
INPUT-REFERRED NOISE (nA)
MAX3266/67-04
70
0
100M
FREQUENCY (Hz)
80
790
10M
JUNCTION TEMPERATURE (°C)
K28.5 DATA STREAM
EXTINCTION RATIO > 8
30
MAX3266/67-03
CIN 1.0pF CIN 0.5pF
JUNCTION TEMPERATURE (°C)
100
90
MAX3267
60
50
0
100
65
55
440
420
0
BANDWIDTH (MHz)
70
460
CIN = 1.5pF
170
PEAK-TO-PEAK JITTER (ps)
580
MAX3266
MAX3266/67-08
180
CIN = 0.5pF
600
TRANSIMPEDANCE (dB)
220
CIN IS SOURCE CAPACITANCE
PRESENTED TO DIE, INCLUDES
PACKAGE PARASITIC, PIN DIODE,
AND PARASITIC INTERCONNECT
CAPACITANCE
620
FREQUENCY RESPONSE
75
MAX3367 toc3
INPUT-REFERRED NOISE (nA)
230
640
MAX3267 toc02
CIN IS SOURCE CAPACITANCE
PRESENTED TO DIE, INCLUDES
PACKAGE PARASITIC, PIN DIODE,
AND PARASITIC INTERCONNECT
CAPACITANCE
240
MAX3267
INPUT-REFERRED NOISE vs. TEMPERATURE
INPUT-REFERRED NOISE (nA)
250
MAX3266/67-01
MAX3266
INPUT-REFERRED NOISE vs. TEMPERATURE
CIN = 1.5pF
0
25
50
75
JUNCTION TEMPERATURE (°C)
100
200
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
_______________________________________________________________________________________
3
MAX3266/MAX3267
Typical Operating Characteristics
(VCC = +3.3V, TA = +25°C, MAX3266/MAX3267 EV kit, source capacitance = 0.85pF, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VCC = +3.3V, TA = +25°C, MAX3266/MAX3267 EV kit, source capacitance = 0.85pF, unless otherwise noted.)
MAX3266/67-10
INPUT: 27-1 PRBS
5mV/div
30mV/div
4mV/div
MAX3266/67-11
MAX3267
EYE DIAGRAM (INPUT = 20µAp-p)
MAX3266
EYE DIAGRAM (INPUT = 1mAp-p)
MAX3266
EYE DIAGRAM (INPUT = 10µAp-p)
MAX3266/67-09
INPUT: 27-1 PRBS
INPUT: 27-1 PRBS
80ps/div
160ps/div
160ps/div
MAX3267
EYE DIAGRAM (INPUT = 1mAp-p)
DC TRANSFER FUNCTION
30mV/div
150
MAX3266/67-13
INPUT: 27-1 PRBS
100
OUTPUT VOLTAGE (mVp-p)
MAX3266/67-12
MAX3266/MAX3267
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
MAX3267
50
MAX3266
0
-50
-100
-150
80ps/div
-200 -150 -100 -50
0
50
100 150 200
INPUT CURRENT (µA)
Pin Description
4
PIN
NAME
FUNCTION
1
VCC
Supply Voltage
2
N.C.
No Connection
3
IN
Amplifier Input
4
FILTER
5
GND
Ground
6
OUT-
Inverting Output. Current flowing into IN causes VOUT- to decrease.
7
OUT+
Noninverting Output. Current flowing into IN causes VOUT+ to increase.
8
GND
Ground
Provides bias voltage for the photodiode through a 1.5kΩ resistor to VCC. When grounded, this pin disables
the DC Cancellation Amplifier to allow a DC path from IN to OUT+ and OUT- for testing.
_______________________________________________________________________________________
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
The MAX3266 is a transimpedance amplifier designed
for 1.25Gbps fiber optic applications. Figure 2 is a functional diagram of the MAX3266, which comprises a transimpedance amplifier, a voltage amplifier, an output
buffer, an output filter, and a DC cancellation circuit.
The MAX3267, a transimpedance amplifier designed
for 2.5Gbps fiber optic applications, shares similar
architecture with the MAX3266.
1.85
CAPACITANCE (pF)
1.70
The output buffer provides a reverse-terminated voltage output. The buffer is designed to drive a 100Ω differential load between OUT+ and OUT-. The output
current is divided between internal, 50Ω load resistors
and the external load resistor. In the typical operating
circuit, this creates a voltage divider with gain of 1/2.
The MAX3266 can also be terminated with higher output impedances, which increases gain and output voltage swing.
For optimum supply-noise rejection, the MAX3266
should be terminated with a differential load. If a singleended output is required, the unused output should be
similarly terminated. The MAX3266 will not drive a DCcoupled, 50Ω grounded load.
1.55
1.40
1.25
1.10
0.95
0.80
0.65
0.50
0
1
2
3
4
Voltage Amplifier
The voltage amplifier converts single-ended signals to
differential signals and introduces a voltage gain.
Output Buffer
MAX3266/67 fig01
2.00
Transimpedance Amplifier
The signal current at the input flows into the summing
node of a high-gain amplifier. Shunt feedback through
RF converts this current to a voltage with gain of approximately 2.2kΩ (1.0kΩ for MAX3267). Schottky diodes
clamp the output voltage for large input currents, as
shown in Figure 3.
5
REVERSE BIAS (V)
Figure 1. Typical Photodiode Capacitance vs. Bias Voltage
MAX3266
RF
TRANSIMPEDANCE
AMPLIFIER
VOLTAGE
AMPLIFIER
OUTPUT
BUFFER
50Ω
OUTPUT
FILTER
OUT+
OUT-
IN
50Ω
LOWPASS FILTER
VCC
VCC
GND
DISABLE
1.5k
DC CANCELLATION
CIRCUIT
FILTER
Figure 2. MAX3266 Functional Diagram
_______________________________________________________________________________________
5
MAX3266/MAX3267
General Description
MAX3266/MAX3267
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
Output Filter
The MAX3266 includes a 1-pole lowpass filter which
limits the circuit bandwidth and improves noise performance.
DC Cancellation Circuit
The DC cancellation circuit uses low-frequency feedback to remove the DC component of the input signal
(Figure 4). This feature centers the input signal within
the transimpedance amplifier’s linear range, thereby
reducing pulse-width distortion on large input signals.
The DC cancellation circuit is internally compensated
and therefore does not require external capacitors. This
circuit minimizes pulse-width distortion for data
sequences that exhibit a 50% duty cycle. A duty cycle
significantly different from 50% will cause the MAX3266
to generate pulse-width distortion.
DC cancellation current is drawn from the input and
creates noise. For low-level signals with little or no DC
component, this is not a problem. Amplifier noise will
increase for signals with significant DC component (see
Typical Operating Characteristics).
Applications Information
Optical Power Relations
Many of the MAX3266 specifications relate to the input
signal amplitude. When working with fiber optic
receivers, the input is usually expressed in terms of average optical power and extinction ratio. Figure 5 shows
relations that are helpful for converting optical power to
input signal when designing with the MAX3266.
Optical power relations are shown in Table 1; the definitions are true if the average duty cycle of the input data
is 50%.
Optical Sensitivity Calculation
The input-referred RMS noise current (I N ) of the
MAX3266 generally determines the receiver sensitivity.
To obtain a system bit error rate (BER) of 1E-12, the
signal-to-noise ratio must always exceed 14.1. The
input sensitivity, expressed in average power, can be
estimated as:
 14.1 I r + 1

N e
1000 dBm
Sensitivity = 10 log 
 2ρ r − 1



(e
(
)
)
Where ρ is the photodiode responsivity in A/W.
Input Optical Overload
The overload is the largest input that the MAX3266
accepts while meeting specifications. The optical overload can be estimated in terms of average power with
the following equation:
 1mA

Overload = 10 log 
1000 dBm
 2ρ

AMPLITUDE
AMPLITUDE
INPUT FROM PHOTODIODE
TIME
TIME
OUTPUT (SMALL SIGNALS)
OUTPUT (LARGE SIGNALS)
Figure 3. MAX3266 Limited Output
6
INPUT (AFTER DC CANCELLATION)
Figure 4 . DC Cancellation Effect On Input
_______________________________________________________________________________________
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
OPTICAL POWER
PI
PAVE
PO
TIME
Figure 5. Optical Power Relations
Table 1. Optical Power Relations
PARAMETER
SYMBOL
Average Power
PAVE
RELATION
Extinction Ratio
re
re = P1/P0
Optical Power
of a “1”
P1
P1 = 2PAVE (re) / (re + 1)
Optical Power
of a “0”
P0
P0 = 2PAVE / (re + 1)
Signal
Amplitude
PIN
PIN = P1 - P0
= 2PAVE (re) / (re + 1)
PAVE = (P0 + P1)/2
Photodiode Filter
Supply voltage noise at the cathode of the photodiode
produces a current I = CPD ∆V/∆t, which reduces the
receiver sensitivity (C PD is the photodiode capacitance.) The filter resistor of the MAX3266, combined
with an external capacitor, can be used to reduce this
noise (refer to the Typical Application Circuit). Current
generated by supply noise voltage is divided between
CFILTER and CPD. The input noise current due to supply
noise is (assuming the filter capacitor is much larger
than the photodiode capacitance):
INOISE = (VNOISE)(CPD) / (RFILTER)(CFILTER)
If the amount of tolerable noise is known, the filter
capacitor can be easily selected:
CFILTER = (VNOISE)(CPD) / (RFILTER)(INOISE)
Optical Linear Range
The MAX3266 has high gain, which limits the output
when the input signal exceeds 30µAp-p (40µAp-p for
MAX3267). The MAX3266 operates in a linear range for
inputs not exceeding:
(
)
 30µA r + 1

e
1000 dBm
Linear Range = 10 log 
 2ρ r − 1



e
(
)
Layout Considerations
Use good high-frequency design and layout techniques. The use of a multilayer circuit board with separate ground and power planes is recommended.
Connect the GND pins to the ground plane with the
shortest possible traces.
For example, with maximum noise voltage = 100mVp-p,
CPD = 0.85pF, RFILTER = 1.5kΩ, and INOISE selected to
be 100nA (1/2 of the MAX3266’s input noise):
CFILTER = (100mV)(0.85pF) / (1500Ω)(100nA) = 570pF
Wire Bonding
For high current density and reliable operation, the
MAX3266 uses gold metalization. Connections to the
die should be made with gold wire only, using ball
bonding techniques. Wedge bonding is not recommended. Die thickness is typically 15 mils (0.375mm).
_______________________________________________________________________________________
7
MAX3266/MAX3267
Noise performance and bandwidth will be adversely
affected by capacitance at the IN pin. Minimize capacitance on this pin and select a low-capacitance photodiode. Assembling the MAX3266 in die form using chip
and wire technology provides the best possible performance. Figure 6 shows a suggested layout for a TO
header.
The SO package version of the MAX3266 is offered as
an easy way to characterize the circuit and become
familiar with the circuit’s operation, but it does not offer
optimum performance. When using the SO version of
the MAX3266, the package capacitance adds approximately 0.3pF at the input. The PC board between the
MAX3266 input and the photodiode also adds parasitic
capacitance. Keep the input line short, and remove
power and ground planes beneath it.
MAX3266/MAX3267
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedance Preamplifiers for LANs
TOP VIEW OF TO-56 HEADER
VCC
CFILTER
PHOTODIODE
OUT+
OUT-
MAX3266/MAX3267
CASE IS GROUND
Figure 6. Suggested Layout for TO-56 Header
Chip Topographies
MAX3267
MAX3266
FILTER
INPUT
VCC
FILTER
GND
GND
INPUT
GND
GND
0.50"
(1.25mm)
OUT-
0.50"
(1.25mm)
OUT-
OUT+
VCC
0.030"
(0.75mm)
OUT+
0.030"
(0.75mm)
TRANSISTOR COUNT: 320
SUBSTRATE CONNECTED TO GND
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 1999 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.