MICROCHIP 25LC512-E/MF

25AA512/25LC512
512 Kbit SPI Bus Serial EEPROM
Device Selection Table
Part Number
VCC Range
Page Size
Temp. Ranges
Packages
25LC512
2.5-5.5V
128 Byte
I,E
P, SN, SM, MF
25AA512
1.8-5.5V
128 Byte
I
P, SN, SM, MF
Features:
Description:
• 20 MHz max. Clock Speed
• Byte and Page-level Write Operations
- 128-byte page
- 5 ms max.
- No page or sector erase required
• Low-Power CMOS Technology
- Max. Write Current: 5 mA at 5.5V, 20 MHz
- Read Current: 10 mA at 5.5V, 20 MHz
- Standby Current: 1μA at 2.5V (Deep powerdown)
• Electronic Signature for Device ID
• Self-Timed Erase and Write cycles
- Page Erase (5 ms, typical)
- Sector Erase (10 ms/sector, typical)
- Bulk Erase (10 ms, typical)
• Sector Write Protection (16K byte/sector)
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• High Reliability
- Endurance: 1 Million erase/write cycles
• Temperature Ranges Supported;
- Industrial (I):
-40°C to +85°C
- Automotive (E):
-40°C to +125°C
The Microchip Technology Inc. 25AA512/25LC512
(25XX512*) is a 512 Kbit serial EEPROM memory with
byte-level and page-level serial EEPROM functions. It
also features Page, Sector and Chip erase functions
typically associated with Flash-based products. These
functions are not required for byte or page write operations. The memory is accessed via a simple Serial
Peripheral Interface (SPI) compatible serial bus. The
bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the
device is controlled by a Chip Select (CS) input.
Name
Function
CS
SO
Chip Select Input
Serial Data Output
WP
VSS
SI
SCK
Write-Protect
Ground
Serial Data Input
Serial Clock Input
HOLD
VCC
Hold Input
Supply Voltage
Package Types (not to scale)
DFN
PDIP/SOIC/SOIJ
(MF)
CS 1
SO 2
WP 3
VSS
4
(P, SN, SM)
8
VCC
7
HOLD
6
5
CS
SO
1
2
SCK
WP
3
SI
VSS
4
25LC512
Pin Function Table
The 25XX512 is available in standard packages including 8-lead PDIP, SOIC, and advanced 8-lead DFN
package. All packages are Pb-free and RoHS
compliant.
25LC512
• Pb-free and RoHS Compliant
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
8
7
VCC
HOLD
6
SCK
5
SI
*25XX512 is used in this document as a generic part number
for the 25AA512, 25LC512 devices.
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 1
25AA512/25LC512
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
D001
Sym.
Characteristic
Industrial (I):
Industrial (I):
Automotive (E):
TA = 0°C to +85°C
TA = -40°C to +85°C
TA = -40°C to +125°C
Min.
Max.
Units
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
VCC = 2.5V to 5.5V
Test Conditions
VIH1
High-level input
voltage
.7 VCC
VCC +1
V
Low-level input
voltage
-0.3
0.3 VCC
V
-0.3
0.2 VCC
V
VCC < 2.7V
Low-level output
voltage
—
0.4
V
IOL = 2.1 mA
—
0.2
V
IOL = 1.0 mA, VCC < 2.5V
VCC -0.5
—
V
IOH = -400 μA
VCC ≥ 2.7V
D002
VIL1
D003
VIL2
D004
VOL
D005
VOL
D006
VOH
High-level output
voltage
D007
ILI
Input leakage current
—
±1
μA
CS = VCC, VIN = VSS TO VCC
D008
ILO
Output leakage
current
—
±1
μA
CS = VCC, VOUT = VSS TO VCC
D009
CINT
Internal capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note)
D010
ICC Read
—
—
10
mA
5
mA
VCC = 5.5V; FCLK = 20.0 MHz;
SO = Open
VCC = 2.5V; FCLK = 10.0 MHz;
SO = Open
—
—
7
5
mA
mA
VCC = 5.5V
VCC = 2.5V
—
—
20
μA
10
μA
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, 125°C
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, 85°C
2
μA
1
μA
Operating current
D011
ICC Write
D012
ICCS
Standby current
D13
Note:
ICCSPD
Deep power-down
current
—
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, 125°C
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, 85°C
This parameter is periodically sampled and not 100% tested.
DS22021B-page 2
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
TABLE 1-2:
AC CHARACTERISTICS
Param.
No.
Sym.
TA = 0°C to +85°C
TA = -40°C to +85°C
TA = -40°C to +125°C
Industrial (I):
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Characteristic
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
VCC = 2.5V to 5.5V
Min.
Max.
Units
Conditions
—
—
—
20
10
2
MHz
MHz
MHz
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
1
FCLK
Clock frequency
2
TCSS
CS setup time
25
50
250
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
3
TCSH
CS hold time
50
100
500
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
(Note 3)
4
TCSD
CS disable time
50
—
ns
5
Tsu
Data setup time
5
10
50
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
6
THD
Data hold time
10
20
100
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
7
TR
CLK rise time
—
20
ns
(Note 1)
8
TF
CLK fall time
—
20
ns
(Note 1)
9
THI
Clock high time
25
50
250
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
10
TLO
Clock low time
25
50
250
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
11
TCLD
Clock delay time
50
—
ns
12
TCLE
Clock enable time
50
—
ns
13
TV
Output valid from clock low
—
—
—
25
50
250
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.8 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
14
THO
Output hold time
0
—
ns
(Note 1)
15
TDIS
Output disable time
—
—
—
25
50
250
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
(Note 1)
16
THS
HOLD setup time
10
20
100
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
17
THH
HOLD hold time
10
20
100
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from our web site at www.microchip.com.
3: Includes THI time.
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 3
25AA512/25LC512
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Param.
No.
Sym.
TA = 0°C to +85°C
TA = -40°C to +85°C
TA = -40°C to +125°C
Industrial (I):
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Characteristic
Min.
Max.
Units
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
VCC = 2.5V to 5.5V
Conditions
18
THZ
HOLD low to output
High-Z
15
30
150
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
(Note 1)
19
THV
HOLD high to output valid
15
30
150
—
—
—
ns
ns
ns
4.5 ≤ VCC ≤ 5.5
2.5 ≤ VCC < 4.5
1.8 ≤ VCC < 2.5
20
TREL
CS High to Standby mode
—
100
μs
VCC = 1.8V to 5.5V
21
TPD
CS High to Deep powerdown
—
100
μs
VCC = 1.8V to 5.5V
22
TCE
Chip erase cycle time
—
10
ms
VCC = 1.8V to 5.5V
23
TSE
Sector erase cycle time
—
10
ms
VCC = 1.8V to 5.5V
24
TWC
Internal write cycle time
—
5
ms
Byte or Page mode and Page
Erase
25
—
Endurance
1M
—
E/W (Note 2) Per Page
Cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from our web site at www.microchip.com.
3: Includes THI time.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
VLO = 0.2V
VHI
= VCC - 0.2V
—
(Note 1)
VHI = 4.0V
(Note 2)
CL = 30 pF
—
Timing Measurement Reference Level
Input
0.5 VCC
Output
0.5 VCC
Note 1: For VCC ≤ 4.0V
2: For VCC > 4.0V
DS22021B-page 4
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
FIGURE 1-1:
HOLD TIMING
CS
16
17
16
17
16
17
16
17
SCK
18
n
n+1
SO
High-Impedance
Don’t Care
SI
19
n-1
High-Impedance
19
n-2
Don’t Care
5
n
n+1
18
n
n-1
n
n-2
HOLD
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
7
Mode 1,1
8
3
12
11
SCK Mode 0,0
5
SI
6
MSB in
LSB in
High-Impedance
SO
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
3
10
Mode 1,1
SCK
Mode 0,0
13
SO
14
MSB out
SI
© 2007 Microchip Technology Inc.
15
LSB out
Don’t Care
Preliminary
DS22021B-page 5
25AA512/25LC512
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
BLOCK DIAGRAM
The 25XX512 is a 65,536 byte Serial EEPROM
designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today’s popular
microcontroller families, including Microchip’s PIC®
microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using
discrete I/O lines programmed properly in firmware to
match the SPI protocol.
STATUS
Register
I/O Control
Logic
The 25XX512 contains an 8-bit instruction register. The
device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses, and data are transferred MSB first, LSB
last.
Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25XX512 in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
TABLE 2-1:
HV Generator
Memory
Control
Logic
EEPROM
Array
X
Dec
Page Latches
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
VCC
VSS
INSTRUCTION SET
Instruction Name
Instruction Format
Description
READ
0000 0011
Read data from memory array beginning at selected address
WRITE
0000 0010
Write data to memory array beginning at selected address
WREN
0000 0110
Set the write enable latch (enable write operations)
WRDI
0000 0100
Reset the write enable latch (disable write operations)
RDSR
0000 0101
Read STATUS register
WRSR
0000 0001
Write STATUS register
PE
0100 0010
Page Erase – erase one page in memory array
SE
1101 1000
Sector Erase – erase one sector in memory array
CE
1100 0111
Chip Erase – erase all sectors in memory array
RDID
1010 1011
Release from Deep power-down and read electronic signature
DPD
1011 1001
Deep Power-Down mode
DS22021B-page 6
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 25XX512 followed by the 16-bit address. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin. The data stored in the memory at the next
address can be read sequentially by continuing to
FIGURE 2-1:
provide clock pulses. The internal Address Pointer is
automatically incremented to the next higher address
after each byte of data is shifted out. When the highest
address is reached (FFFFh), the address counter rolls
over to address 0000h allowing the read cycle to be
continued indefinitely. The READ instruction is
terminated by raising the CS pin (Figure 2-1).
READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
0
0
0
16-bit Address
0
1
1 15 14 13 12
2
1
0
Data Out
High-Impedance
7
SO
© 2007 Microchip Technology Inc.
Preliminary
6
5
4
3
2
1
0
DS22021B-page 7
25AA512/25LC512
2.2
Write Sequence
.
Note:
Prior to any attempt to write data to the 25XX512, the
write enable latch must be set by issuing the WREN
instruction (Figure 2-4). This is done by setting CS low
and then clocking out the proper instruction into the
25XX512. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write
enable latch. If the write operation is initiated immediately after the WREN instruction without CS being
brought high, the data will not be written to the array
because the write enable latch will not have been
properly set.
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’), and end at addresses that are
integer multiples of page size – 1. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
A write sequence includes an automatic, self timed
erase cycle. It is not required to erase any portion of the
memory prior to issuing a WRITE instruction.
Once the write enable latch is set, the user may
proceed by setting the CS low, issuing a WRITE instruction, followed by the 16-bit address, and then the data
to be written. Up to 128 bytes of data can be sent to the
device before a write cycle is necessary. The only
restriction is that all of the bytes must reside in the
same page. When doing a write of less than 128 bytes
the data in the rest of the page is refreshed along with
the data bytes being written. This will force the entire
page to endure a write cycle, for this reason endurance
is specified per page
FIGURE 2-2:
For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the nth data byte has been clocked in. If CS is
brought high at any other time, the write operation will
not be completed. Refer to Figure 2-2 and Figure 2-3
for more detailed illustrations on the byte write
sequence and the page write sequence, respectively.
While the write is in progress, the STATUS register may
be read to check the status of the WPEN, WIP, WEL,
BP1 and BP0 bits (Figure 2-6). A read attempt of a
memory array location will not be possible during a
write cycle. When the write cycle is completed, the
write enable latch is reset.
BYTE WRITE SEQUENCE
CS
Twc
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
0
1
0 15 14 13 12
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
16-bit Address
Data Byte
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
DS22021B-page 8
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
FIGURE 2-3:
PAGE WRITE SEQUENCE
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
16-bit Address
0 1
0 15 14 13 12
Data Byte 1
2
1
0
7
6
5
4
3
2
1
0
CS
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Data Byte 2
SI
7
6
5
4
© 2007 Microchip Technology Inc.
3
2
Data Byte n (128 max)
Data Byte 3
1
0
7
6
5
4
3
2
Preliminary
1
0
7
6
5
4
3
2
1
0
DS22021B-page 9
25AA512/25LC512
2.3
Write Enable (WREN) and Write
Disable (WRDI)
•
•
•
•
•
•
•
The 25XX512 contains a write enable latch.
See
Table 2-4 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WREN instruction will set the
latch, and the WRDI will reset the latch.
Power-up
WRDI instruction successfully executed
WRSR instruction successfully executed
WRITE instruction successfully executed
PE instruction successfully executed
SE instruction successfully executed
CE instruction successfully executed
The following is a list of conditions under which the
write enable latch will be reset:
FIGURE 2-4:
WRITE ENABLE SEQUENCE (WREN)
CS
0
1
2
3
4
5
6
7
SCK
0
SI
0
0
0
1
1
0
High-Impedance
SO
FIGURE 2-5:
0
WRITE DISABLE SEQUENCE (WRDI)
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
1
10
0
High-Impedance
SO
DS22021B-page 10
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
2.4
Read Status Register Instruction
(RDSR)
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch and is read-only. When set to
a ‘1’, the latch allows writes to the array, when set to a
‘0’, the latch prohibits writes to the array. The state of
this bit can always be updated via the WREN or WRDI
commands regardless of the state of write protection
on the STATUS register. These commands are shown
in Figure 2-4 and Figure 2-5.
The Read Status Register instruction (RDSR) provides
access to the STATUS register. The STATUS register
may be read at any time, even during a write cycle. The
STATUS register is formatted as follows:
TABLE 2-2:
STATUS REGISTER
7
6 5 4
3
2
1
W/R
– – – W/R W/R
R
WPEN X X X BP1 BP0 WEL
W/R = writable/readable. R = read-only.
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSR instruction. These
bits are nonvolatile, and are shown in Table 2-3.
0
R
WIP
See Figure 2-6 for the RDSR timing sequence.
The Write-In-Process (WIP) bit indicates whether the
25XX512 is busy with a write operation. When set to a
‘1’, a write is in progress, when set to a ‘0’, no write is
in progress. This bit is read-only.
FIGURE 2-6:
READ STATUS REGISTER TIMING SEQUENCE (RDSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
0
High-Impedance
SO
© 2007 Microchip Technology Inc.
1
0
1
Data from STATUS Register
7
Preliminary
6
5
4
3
2
DS22021B-page 11
25AA512/25LC512
2.5
Write Status Register Instruction
(WRSR)
The Write-Protect Enable (WPEN) bit is a nonvolatile
bit that is available as an enable bit for the WP pin. The
Write-Protect (WP) pin and the Write-Protect Enable
(WPEN) bit in the STATUS register control the
programmable hardware write-protect feature. Hardware write protection is enabled when WP pin is low
and the WPEN bit is high. Hardware write protection is
disabled when either the WP pin is high or the WPEN
bit is low. When the chip is hardware write-protected,
only writes to nonvolatile bits in the STATUS register
are disabled. See Table 2-4 for a matrix of functionality
on the WPEN bit.
The Write Status Register instruction (WRSR) allows the
user to write to the nonvolatile bits in the STATUS
register as shown in Table 2-2. The user is able to
select one of four levels of protection for the array by
writing to the appropriate bits in the STATUS register.
The array is divided up into four segments. The user
has the ability to write-protect none, one, two or all four
of the segments of the array. The partitioning is
controlled as shown in Table 2-3.
See Figure 2-7 for the WRSR timing sequence.
TABLE 2-3:
ARRAY PROTECTION
BP1
BP0
Array Addresses
Write-Protected
Array Addresses
Unprotected
0
0
none
All (Sectors 0, 1, 2 & 3)
(0000h-FFFFh)
0
1
Upper 1/4 (Sector 3)
(C000h-FFFFh)
Lower 3/4 (Sectors 0, 1 & 2)
(0000h-BFFFh)
1
0
Upper 1/2 (Sectors 2 & 3)
(8000h-FFFFh)
Lower 1/2 (Sectors 0 & 1)
(0000h-7FFFh)
1
1
All (Sectors 0, 1, 2 & 3)
(0000h-FFFFh)
none
FIGURE 2-7:
WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
Data to STATUS Register
0
0
0
1
7
6
5
4
3
2
High-Impedance
SO
DS22021B-page 12
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
2.6
Data Protection
2.7
The following protection has been implemented to
prevent inadvertent writes to the array:
• The write enable latch is reset on power-up
• A write enable instruction must be issued to set
the write enable latch
• After a byte write, page write or STATUS register
write, the write enable latch is reset
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
TABLE 2-4:
Power-On State
The 25XX512 powers on in the following state:
• The device is in low-power Standby mode
(CS = 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low-level transition on CS is required to
enter active state
WRITE-PROTECT FUNCTIONALITY MATRIX
WEL
(SR bit 1)
WPEN
(SR bit 7)
WP
(pin 3)
Protected Blocks
Unprotected Blocks
STATUS Register
0
x
x
Protected
Protected
Protected
1
0
x
Protected
Writable
Writable
1
1
0 (low)
Protected
Writable
Protected
1
1
1 (high)
Protected
Writable
Writable
x = don’t care
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 13
25AA512/25LC512
2.8
PAGE ERASE
CS must then be driven high after the last bit of the
address or the PAGE ERASE will not execute. Once
the CS is driven high the self-timed PAGE ERASE
cycle is started. The WIP bit in the STATUS register
can be read to determine when the PAGE ERASE cycle
is complete.
The PAGE ERASE instruction will erase all bits (FFh)
inside the given page. A Write Enable (WREN) instruction must be given prior to attempting a PAGE ERASE.
This is done by setting CS low and then clocking out
the proper instruction into the 25XX512. After all eight
bits of the instruction are transmitted, the CS must be
brought high to set the write enable latch.
If a PAGE ERASE instruction is given to an address
that has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The PAGE ERASE instruction is entered by driving CS
low, followed by the instruction code (Figure 2-8) and
two address bytes. Any address inside the page to be
erased is a valid address.
FIGURE 2-8:
PAGE ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23
SCK
Instruction
SI
0
1
0
0
0
16-bit Address
0
1
0 15 14 13 12
2
1
0
High-Impedance
SO
DS22021B-page 14
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
2.9
SECTOR ERASE
CS must then be driven high after the last bit of the
address or the SECTOR ERASE will not execute. Once
the CS is driven high the self-timed SECTOR ERASE
cycle is started. The WIP bit in the STATUS register
can be read to determine when the SECTOR ERASE
cycle is complete.
The SECTOR ERASE instruction will erase all bits
(FFh) inside the given sector. A Write Enable (WREN)
instruction must be given prior to attempting a SECTOR
ERASE. This is done by setting CS low and then clocking out the proper instruction into the 25XX512. After
all eight bits of the instruction are transmitted, the CS
must be brought high to set the write enable latch.
If a SECTOR ERASE instruction is given to an address
that has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The SECTOR ERASE instruction is entered by driving
CS low, followed by the instruction code (Figure 2-9)
and two address bytes. Any address inside the sector
to be erased is a valid address.
FIGURE 2-9:
See Table 2-3 for Sector Addressing.
SECTOR ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23
SCK
Instruction
SI
1
1
0
1
1
16-bit Address
0
0
0 15 14 13 12
2
1
0
High-Impedance
SO
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 15
25AA512/25LC512
2.10
CHIP ERASE
The CS pin must be driven high after the eighth bit of
the instruction code has been given or the CHIP
ERASE instruction will not be executed. Once the CS
pin is driven high the self-timed CHIP ERASE instruction begins. While the device is executing the CHIP
ERASE instruction the WIP bit in the STATUS register
can be read to determine when the CHIP ERASE
instruction is complete.
The CHIP ERASE instruction will erase all bits (FFh) in
the array. A Write Enable (WREN) instruction must be
given prior to executing a CHIP ERASE. This is done
by setting CS low and then clocking out the proper
instruction into the 25XX512. After all eight bits of the
instruction are transmitted, the CS must be brought
high to set the write enable latch.
The CHIP ERASE instruction is entered by driving the
CS low, followed by the instruction code (Figure 2-10)
onto the SI line.
FIGURE 2-10:
The CHIP ERASE instruction is ignored if either of the
Block Protect bits (BP0, BP1) are not 0, meaning ¼,
½, or all of the array is protected.
CHIP ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
1
0
0
0
1
1
1
High-Impedance
SO
DS22021B-page 16
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
2.11
DEEP POWER-DOWN MODE
Deep Power-Down mode of the 25XX512 is its lowest
power consumption state. The device will not respond
to any of the Read or Write commands while in Deep
Power-Down mode, and therefore it can be used as an
additional software write protection feature.
All instructions given during Deep Power-Down mode
are ignored except the Read Electronic Signature
command (RDID). The RDID command will release
the device from Deep power-down and outputs the
electronic signature on the SO pin, and then returns
the device to Standby mode after delay (TREL)
The Deep Power-Down mode is entered by driving CS
low, followed by the instruction code (Figure 2-11) onto
the SI line, followed by driving CS high.
Deep Power-Down mode automatically releases at
device power-down. Once power is restored to the
device it will power-up in the Standby mode.
If the CS pin is not driven high after the eighth bit of the
instruction code has been given, the device will not
execute Deep power-down. Once the CS line is driven
high there is a delay (TDP) before the current settles to
its lowest consumption.
FIGURE 2-11:
DEEP POWER-DOWN SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
0
1
1
1
0
0
1
High-Impedance
SO
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 17
25AA512/25LC512
2.12
RELEASE FROM DEEP POWERDOWN AND READ ELECTRONIC
SIGNATURE
Release from Deep Power-Down mode and Read
Electronic Signature is entered by driving CS low,
followed by the RDID instruction code (Figure 2-12)
and then a dummy address of 16 bits (A15-A0). After
the last bit of the dummy address is clock in, the 8-bit
Electronic Signature is clocked out on the SO pin.
Once the device has entered Deep Power-Down
mode all instructions are ignored except the Release
from Deep Power-down and Read Electronic Signature command. This command can also be used when
the device is not in Deep power-down to read the
electronic signature out on the SO pin unless another
command is being executed such as Erase, Program
or Write Status Register.
FIGURE 2-12:
After the signature has been read out at least once,
the sequence can be terminated by driving CS high.
The device will then return to Standby mode and will
wait to be selected so it can be given new instructions.
If additional clock cycles are sent after the electronic
signature has been read once, it will continue to output
the signature on the SO line until the sequence is
terminated.
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
0
1
1
0
2
3
4
5
6
0
1
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
1
0
16-bit Address
1
1 15 14 13 12
2
1
0
Electronic Signature Out
High-Impedance
SO
7
6
5
4
3
2
1
0
0
0
1
0
1
0
0
1
Manufacturer’s ID = 0x29
Driving CS high after the 8-bit RDID command but before the Electronic Signature has been transmitted will still ensure
the device will be taken out of Deep Power-Down mode. However, there is a delay TREL that occurs before the device
returns to Standby mode (ICCS), as shown in Figure 2-13.
FIGURE 2-13:
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
0
1
2
3
4
5
6
0
1
7
TREL
SCK
Instruction
SI
1
0
1
0
1
1
High-Impedance
SO
DS22021B-page 18
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
3.0
PIN DESCRIPTIONS
The WP pin function is blocked when the WPEN bit in
the STATUS register is low. This allows the user to
install the 25XX512 in a system with WP pin grounded
and still be able to write to the STATUS register. The
WP pin functions will be enabled when the WPEN bit is
set high.
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Name
Pin Number
CS
1
Chip Select Input
SO
2
Serial Data Output
WP
3
Write-Protect Pin
VSS
4
Ground
SI
5
Serial Data Input
SCK
6
Serial Clock Input
HOLD
7
Hold Input
VCC
8
Supply Voltage
3.1
Function
3.4
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
3.5
Chip Select (CS)
Serial Output (SO)
The SO pin is used to transfer data out of the 25XX512.
During a read cycle, data is shifted out on this pin after
the falling edge of the serial clock.
3.3
Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
STATUS register to prohibit writes to the nonvolatile
bits in the STATUS register. When WP is low and
WPEN is high, writing to the nonvolatile bits in the
STATUS register is disabled. All other operations
function normally. When WP is high, all functions,
including writes to the nonvolatile bits in the STATUS
register, operate normally. If the WPEN bit is set, WP
low during a STATUS register write sequence will
disable writing to the STATUS register. If an internal
write cycle has already begun, WP going low will have
no effect on the write.
© 2007 Microchip Technology Inc.
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25XX512. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After powerup, a low level on CS is required prior to any sequence
being initiated.
3.2
Serial Input (SI)
3.6
Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25LC512 while in the middle of a serial sequence without having to re-transmit the entire sequence over
again. It must be held high any time this function is not
being used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence.
The HOLD pin should be brought low while SCK is low,
otherwise the HOLD function will not be invoked until
the next SCK high-to-low transition. The 25LC512 must
remain selected during this sequence. The SI and SCK
levels are “don’t cares” during the time the device is
paused and any transitions on these pins will be
ignored. To resume serial communication, HOLD
should be brought high while the SCK pin is low, otherwise serial communication will not be resumed until the
next SCK high-to-low transition.
The SO line will tri-state immediately upon a high-tolow transition of the HOLD pin, and will begin outputting
again immediately upon a subsequent low-to-high
transition of the HOLD pin, independent of the state of
SCK.
Preliminary
DS22021B-page 19
25AA512/25LC512
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead DFN
XXXXXXX
T/XXXXX
YYWW
NNN
25LC512
I/MF e3
0728
1L7
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
25AA512
I/P e3 1L7
0728
8-Lead SOIC
Example:
XXXXXXXT
XXXXYYWW
NNN
25LC512I
SN e3 0728
1L7
8-Lead SOIJ
XXXXXXXX
T/XXXXXX
YYWWNNN
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Note:
*
Example:
Example:
25LC512
I/SM e3
07281L7
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
DS22021B-page 20
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
D
L
b
N
N
K
E2
E
EXPOSED PAD
NOTE 1
1
2
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
1.27 BSC
0.85
1.00
Standoff
A1
0.00
0.01
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
5.00 BSC
Overall Width
E
Exposed Pad Length
D2
3.90
4.00
4.10
Exposed Pad Width
E2
2.20
2.30
2.40
6.00 BSC
Contact Width
b
0.35
0.40
0.48
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
–
Microchip Technology Drawing C04-122B
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 21
25AA512/25LC512
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS22021B-page 22
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
L1
Units
Dimension Limits
Number of Pins
β
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 23
25AA512/25LC512
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
1
2
e
b
α
A2
A
c
φ
β
A1
Units
Dimension Limits
Number of Pins
L
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
1.77
1.27 BSC
–
Molded Package Thickness
A2
1.75
–
1.98
Standoff §
A1
0.05
–
0.25
Overall Width
E
7.62
–
8.26
Molded Package Width
E1
5.11
–
5.38
Overall Length
D
5.13
–
5.33
Foot Length
L
0.51
–
0.76
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.15
–
0.25
Lead Width
b
0.36
–
0.51
Mold Draft Angle Top
α
–
–
15°
Mold Draft Angle Bottom
β
–
–
15°
2.03
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
DS22021B-page 24
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
APPENDIX A:
REVISION HISTORY
Revision A
Original release.
Revision B (06/2007)
Revised Device Selection Table; Revised Features
section; Revised Table 1-1 DC Characteristics;
Revised Table 1-2 AC Characteristics; Replaced Package Drawings (Rev. AP); Revised Package Marking
(SOIC, SOIJ); Revised Product ID section.
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 25
25AA512/25LC512
NOTES:
DS22021B-page 26
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 27
25AA512/25LC512
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
Device: 25AA512/25LC512
N
Literature Number: DS22021B
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS22021B-page 28
Preliminary
© 2007 Microchip Technology Inc.
25AA512/25LC512
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
Device
Tape & Reel
–
X
/XX
Temp Range
Package
Examples:
a)
b)
Device:
25AA512
25LC512
512 Kbit, 1.8V, 128-Byte Page SPI Serial EEPROM
512 Kbit, 2.5V, 128-Byte Page SPI Serial EEPROM
Tape & Reel:
Blank
T
=
=
Standard packaging (tube)
Tape & Reel
Temperature
Range:
I
E
=
=
-40°C to+85°C
-40°C to+125°C
Package:
MF
P
SN
=
=
=
Micro Lead Frame (6 x 5 mm body), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
© 2007 Microchip Technology Inc.
c)
d)
e)
Preliminary
f)
25AA512-I/SN = 512 Kbit, 1.8V Serial
EEPROM, Industrial temp., SOIC package
25AA512T-I/SM = 512 Kbit, 1.8V Serial
EEPROM, Industrial temp., Tape & Reel, SOIJ
package
25AA512T-I/MF = 512 Kbit, 1.8V Serial
EEPROM, Industrial temp., Tape & Reel, DFN
package
25LC512-I/SM = 512 Kbit, 2.5V Serial
EEPROM, Industrial temp., SOIJ package
25LC512-I/P = 512 Kbit, 2.5V Serial EEPROM,
Industrial temp., P-DIP package
25LC512T-E/MF = 512 Kbit, 2.5V Serial
EEPROM, Extended temp., Tape & Reel, DFN
package
DS22021B-page 29
25AA512/25LC512
NOTES:
DS22021B-page 30
Preliminary
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
Preliminary
DS22021B-page 31
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Web Address:
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12/08/06
DS22021B-page 32
Preliminary
© 2007 Microchip Technology Inc.