ETC MBI6650PSD

Macroblock
MBI6650
Preliminary Datasheet
1.2A DC/DC Converter
Features
Surface Mount Device
z
1.2A Constant Output Current
z
93% Efficiency @ input voltage 13V, 350mA, 3-LED
z
9~36V Input Voltage Range
z
Hysteretic PFM Improves Efficiency at Light Loads
z
Settable Output Current
z
Integrated Power Switch
z
Full Protection: Thermal/UVLO/Soft Start/LED Open-/Short- Circuit
z
Only 4 External Components Required
PSD: TO-252-5L
Product Description
The MBI6650 is a high efficiency, constant current, step-down DC/DC converter, designed to deliver constant
current to high power LED with only 4 external components. The MBI6650 is specifically designed with hysteretic
PFM control scheme to enhance the efficiency up to 93%. Output current of the MBI6650 can be programmed by
an external resistor, and LED dimming can be controlled via pulse width modulation (PWM) through DIM pin. In
addition, the embedded soft start function eliminates the inrush current while the power is on. The MBI6650 also
features under voltage lock out (UVLO), over temperature protection, LED open-circuit protection and LED
short-circuit protection to protect IC from being damaged.
Additionally, to ensure the system reliability, the MBI6650 is built with the thermal protection (TP) function and a
thermal pad. The TP function protects IC from over temperature (140°C). Also, the thermal pad enhances the
power dissipation. As a result, a large amount of current can be handled safely in one package.
Applications
z
Signage and Decorative LED Lighting
z
Automotive LED Lighting
z
High Power LED Lighting
z
Constant Current Source
Macroblock, Inc. 2007
Floor 6-4, No.18, Pu-Ting Rd., Hsinchu, Taiwan 30077, ROC.
TEL: +886-3-579-0068, FAX: +886-3-579-7534 E-mail: [email protected]
-1October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Typical Application Circuit
RSEN
+ VSEN -
VIN
CIN
VIN
SEN
DIM
10uF/50V
GND
+
D1
COUT
VOUT
10uF/50V
MBI6650
+
+
IOUT
L1
SW
-
47uH
CIN: VISHAY, 293D106X9050D2TE3, D case Tantalum Capacitor
COUT: VISHAY, 293D106X9050D2TE3, D case Tantalum Capacitor
L1: GANG SONG, GSRH8D43-470M
D1: ZOWIE, SSCD206
Figure 1
Functional Diagram
VIN
Bias
1.24V
SEN
Comp
Thermal
Shutdown
Vref
DIM
Digital
Comp
SW
Driver
GND
Figure 2
-2-
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Pin Configuration
Pin Description
Pin Name
Function
GND
Ground terminal for control logic and current sink
SW
Switch output terminal
DIM
Dimming control terminal
SEN
Output current sense terminal
VIN
Supply voltage terminal
Thermal Pad
Power dissipation terminal connected to GND*
*To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, the desired thermal conductivity will be improved, when a heat-conducting copper foil on PCB is
soldered with thermal pad.
Maximum Ratings
Operation above the maximum ratings may cause device failure. Operation at the extended periods of the
maximum ratings may reduce the device reliability.
Characteristic
Symbol
Rating
Unit
Supply Voltage
VIN
0~40
V
Output Current
IOUT
1.2
A
Sustaining Voltage at SW pin
VSW
-0.5~45
V
GND Terminal Current
IGND
1.2
A
Power Dissipation
(On 4 Layer PCB, Ta=25°C)*
PD
3.80
W
Thermal Resistance
(By simulation, on 4 Layer PCB)
32.9
PSD Type
Rth(j-a)
Empirical Thermal Resistance
(On 4 Layer PCB, Ta=25°C)*
°C/W
50.54
Operating Junction Temperature
Tj,max
125
°C
Operating Temperature
Topr
-40~+85
°C
Storage Temperature
Tstg
-55~+150
°C
*The PCB area is 7 times larger than that of IC’s, and the heat sink area of MBI6650 is 109mm2. Please refer to
Figure 38 for the PCB layout.
-3-
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Electrical Characteristics
(Test condition: VIN=12V, L1=47µH, CIN=COUT=10µF, TA=25°C; unless otherwise specified; refer to test circuit (a))
Characteristics
Symbol
Condition
Min.
Typ.
Max.
Unit
Supply Voltage
VIN
9
36
V
Supply Current
IIN
VIN=9V~36V
1
4
mA
Output Current
IOUT
350
1200
mA
150mA≤IOUT≤750mA,
±5
±10
%
Output Current Accuracy
dIOUT/IOUT
±5
±10
75mA≤IOUT≤1200mA,
SW Dropout Voltage
△VSW
IOUT=1.2A
0.3
0.6
V
9V≤VIN≤36V, VOUT=3.6V,
Line Regulation
%/△VIN
±0.30
±0.37
%/V
IOUT=350mA
VIN=24V, IOUT=350mA,
±0.24
±1.38
3.6V≤VOUT≤18V
VIN=24V, IOUT=700mA,
%/V
Load Regulation
%/△V
±0.24
±1.50
3.6V≤VOUT≤18V
VIN=24V, IOUT=1200mA,
±0.24
±1.80
3.6V≤VOUT≤18V
Efficiency
VIN=13V, IOUT=350mA, VOUT=10.8V
93
%
“H” level
VIH
3.5
V
Input Voltage
1.5
V
“L” level
VIL
Switch ON resistance
Rds(on)
VIN=12V; refer to test circuit (b)
0.8
1.1
Ω
CURRENT SENSE
VSEN
Production code “A” *
0.28
Regulated RSEN Voltage
V
VSEN
Production code “B” *
0.33
THERMAL OVERLOAD
Thermal Shutdown
TSD
+130
+140
+155
°C
Threshold
Thermal Shutdown
TSD-HYS
40
45
55
°C
Hystersis
UNDER VOLTAGE LOCK OUT
UVLO Voltage
TA=-40~85°C
6.6
7.4
7.9
V
UVLO Hysteresis
0.5
0.6
1
V
Start Up Voltage
7.3
8.0
8.8
V
DIMMING
Rise Time of Output
VOUT=3.6V, IOUT=350mA, fDIM=1kHz,
tr
140
µs
Current
DutyDIM=50%
VOUT=3.6V, IOUT=350mA, fDIM=1kHz,
160
µs
Fall Time of Output Current
tf
DutyDIM=50%
*Refer to Product Top-Mark Information.
Test Circuit for Electrical Characteristics
D1
SW
SEN
VSW
RSEN
VIN
COUT
Electronic
Load
CIN
SW
MBI6650
Ω
DIM
VIN
DIM
GND
SEN
L1
MBI6650
VIN
VIN
VIH
GND
VIL
(a)
(b)
Figure 3
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October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Typical Performance Characteristics
Please refer to Typical Application Circuit, VIN=12V, L1=47uH, CIN=COUT=10uF, TA=25°C, unless otherwise specified.
1-LED VF=3.6V;
2-LED VF=7.2V;
3-LED VF=10.8V; 4-LED VF=14.4V;
5-LED VF=18V
1. Efficiency vs. Input Voltage at Various Load Current
100
95
1-LED
90
2-LED
3-LED
85
4-LED
80
5-LED
95
Efficiency (%)
Efficiency (%)
100
2-LED
85
75
3-LED
80
4-LED
75
5-LED
70
70
9
12
15
18
21
24
Input Voltage (V)
27
30
33
9
36
12
15
18
21
24
27
30
33
36
Input Voltage (V)
Figure 4. Efficiency vs. VIN @ 350mA, L1=47uH
Figure 5. Efficiency vs. VIN @ 700mA, L1=47uH
95
95
90
85
1-LED
80
2-LED
75
3-LED
70
65
4-LED
90
Efficiency (%)
Efficiency (%)
1-LED
90
5-LED
12
15
18
21
24
27
30
33
2-LED
80
3-LED
75
4-LED
70
5-LED
65
60
9
1-LED
85
60
36
9
12
15
18
21
24
Input Voltage (V)
Input Voltage (V)
Figure 6. Efficiency vs. VIN @ 1000mA, L1=47uH
27
30
33
36
Figure 7. Efficiency vs. VIN @ 1200mA, L1=47uH
2. Line Regulation
750
375
370
1-LED
365
2-LED
360
3-LED
355
4-LED
350
5-LED
Output Current (mA)
Output Current (mA)
380
345
1-LED
720
2-LED
710
700
3-LED
690
680
5-LED
4-LED
670
340
9
12
15
18
21
24
Input Voltage (V)
27
30
33
9
36
12
15
18
21
24
27
30
33
36
Input Voltage (V)
Figure 8. Line regulation @ 350mA, L1=47uH
Figure 9. Line regulation @ 700mA, L1=47uH
1150
1450
1100
Output Current (mA)
Output Current (mA)
740
730
1-LED
2-LED
1050
3-LED
4-LED
1000
5-LED
950
1400
1-LED
1350
2-LED
1300
3-LED
1250
4-LED
1200
5-LED
1150
1100
9
12
15
18
21
24
Input Voltage (V)
27
30
Figure 10. Line regulation @ 1000mA, L1=47uH
33
36
9
12
15
18
21
24
Input Voltage (V)
27
30
33
36
Figure 11. Line regulation @ 1200mA, L1=47uH
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October 2007, V1.00
MBI6650
1.2A DC/DC Converter
3. Load Regulation
350
Output Current (mA)
Output Current (mA)
360
Vin=12V
340
Vin=24V
Vin=36V
330
320
310
1
2
3
LED (#)
4
Vin=12V
690
Vin=24V
685
Vin=36V
680
675
670
665
1
5
Figure 12. Load regulation @ 350mA, L1=47uH
2
3
LED (#)
4
5
Figure 13. Load regulation @ 700mA, L1=47uH
1250
1000
980
Vin=12V
960
Vin=24V
940
Vin=36V
920
900
Output Current (mA)
1020
Output Current (mA)
705
700
695
880
1200
1150
Vin=12V
1100
Vin=24V
1050
Vin=36V
1000
950
1
2
3
LED (#)
4
5
1
Figure 14. Load regulation @ 1000mA, L1=47uH
2
3
LED (#)
4
5
Figure 15. Load regulation @ 1200mA, L1=47uH
600
350
300
250
200
150
100
50
0
Iout=350mA
Iout=700mA
Iout=1000mA
Iout=1200mA
F requenc y (k H z )
F requenc y (k H z )
4. Switching Frequency
500
Iout=350mA
400
Iout=700mA
300
Iout=1000mA
200
Iout=1200mA
100
0
9
12
15
18
21
24
27
30
33
9
36
12
15
18
24
27
30
33
36
Figure 17. Switching frequency @ 2-LED, L1=47uH
800
700
600
500
400
300
200
100
0
Iout=350mA
Iout=700mA
Iout=1000mA
Iout=1200mA
F requenc y (k H z )
F requenc y (k H z )
Figure 16. Switching frequency @ 1-LED, L1=47uH
600
Iout=350mA
Iout=700mA
400
Iout=1000mA
200
Iout=1200mA
0
9
12
15
18
21
24
27
30
33
15
36
18
21
24
27
30
33
36
Input Voltage (V)
Input Voltage (V)
Figure 18. Switching frequency @ 3-LED, L1=47uH
Figure 19. Switching frequency @ 4-LED, L1=47uH
VIN=12V, Iout=350mA
360
800
350
600
Iout=350mA
Iout=700mA
400
Iout=1000mA
200
Iout=1200mA
0
18
21
24
27
30
33
SwitchingFrequency(kHz
F requenc y (k H z )
21
Input Voltage (V)
Input Voltage (V)
330
320
310
300
36
290
Input Voltage (V)
Figure 20. Switching frequency @ 5-LED, L1=47uH
340
-40
-15
10
35
Temperature (℃)
60
85
Figure 21. Switching frequency vs. temperature
-6-
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
5. Miscellaneous
40
350
300
fDIM=100Hz
250
fDIM=300Hz
Output Current (mA)
Output Current (mA)
400
fDIM=500Hz
200
fDIM=700Hz
150
fDIM=1000Hz
100
50
35
30
fDIM=100Hz
25
fDIM=300Hz
fDIM=500Hz
20
fDIM=700Hz
15
fDIM=1000Hz
10
5
0
0
0
10
20
30
40
50
60
Duty Cycle (%)
70
80
90
100
0
1
2
3
4
5
6
Duty Cycle (%)
7
8
9
10
Figure 23. Output current vs. DIM duty cycle @ 1-LED,
IOUT=350mA
IOUT=350mA
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.90
Quiescent Current (mA)
Rds (on) (Ω)
Figure 22. Output current vs. DIM duty cycle @ 1-LED,
9
12
15
18
21
24
27
30
33
0.85
0.80
0.75
0.70
0.65
0.60
36
9
Input Voltage (V)
15
18
21
24
Input Voltage (V)
27
30
33
36
Figure 25. Quiescent current vs. VIN
0.90
365
0.85
360
O
utput Current (m
A)
Shutdown Current (mA)
Figure 24. Rds (on) vs. VIN
12
0.80
0.75
0.70
0.65
VIN=12V, Iout=350mA
355
350
345
340
0.60
9
12
15
18
21
24
27
Input Voltage (V)
30
33
335
36
-40
Figure 26. Shutdown current vs. VIN
-15
10
35
Temperature (℃)
60
85
Figure 27. Output current vs. temperature
VIN=12V, Iout=350mA
0.325
0.32
0.315
VSEN(V)
0.31
0.305
0.3
0.295
0.29
0.285
0.28
0.275
-40
-15
10
35
Temperature (℃)
60
85
Figure 28. VSEN vs. temperature
VSW
VIN
VSEN (Attenuation Ratio: 1/20)
VSW
IOUT
IOUT
Figure 29. Start-up waveform @ VOUT=7.2V, IOUT=350mA
Figure 30. Switching waveform @ VOUT=3.6V,
IOUT=350mA
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October 2007, V1.00
MBI6650
1.2A DC/DC Converter
VIN
VSW
VIN
VOUT (Attenuation Ratio: 1/20)
VOUT (Attenuation Ratio: 1/20)
IL
VSW
IL
Figure 31. Open-circuit protection waveform
Figure 32. Short -circuit protection waveform
@ IOUT=350mA
@IOUT=350mA
SW
SW
IOUT
DIM
DIM
IOUT
Figure 33. Rise time of output current @ 1-LED,
Figure 34. Fall time of output current @ 1-LED,
IOUT=350mA, tr=140µs
IOUT=350mA, tr=160µs
SW
VIN
VSW
DIM
VOUT (Attenuation Ratio: 1/20)
IOUT
IOUT
Figure 36. Thermal protection
Figure 35. Dimming waveform @ 1-LED,
IOUT=350mA, fDIM=100Hz, DutyDIM=10%
-8-
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Application Information
The MBI6650 is embedded with all the features to implement a simple, cost effective, and high efficient buck
converter to drive more than 1A of loading. The MBI6650 contains an N-Channel switch, is easy to implement, and
is available in the thermally enhanced TO252-5L package. The MBI6650’s operation is based on a hysteretic PFM
control scheme resulting in the operating frequency remaining relatively constant with load and input voltage
variations. The hysteretic PFM control requires no loop compensation resulting in very fast load transient response
and achieving excellent efficiency performance at light loading.
Setting Output Current
The output current (IOUT) is set by an external resistor, RSEN. The relationship between IOUT and RSEN is as below; for
production code information, please refer to Product Top-Mark Information:
For production code A,
VSEN=0.28V;
RSEN=(VSEN/IOUT)=(0.28V/IOUT);
IOUT=(VSEN/RSEN)=(0.28V/RSEN)
where RSEN is the resistance of the external resistor connected to SEN terminal and VSEN is the voltage of external
resistor. The magnitude of current (as a function of RSEN) is around 1000mA at 0.28Ω.
For production code B,
VSEN=0.33V;
RSEN=(VSEN/IOUT)=(0.33V/IOUT);
IOUT=(VSEN/RSEN)=(0.33V/RSEN)
where RSEN is the resistance of the external resistor connected to SEN terminal and VSEN is the voltage of external
resistor. The magnitude of current (as a function of RSEN) is around 1000mA at 0.33Ω.
Minimum Input Voltage
The minimum input voltage is the sum of the voltage drops on RSEN, RS, DCR of L1, Rds(on) of internal MOSFET and
the total forward voltage of LEDs. The dynamic resistance of LED, RS, is the inverse of the slope in linear forward
voltage model for LED. This electrical characteristic can be provided by LED manufacturers. The equivalent
impedance of the MBI6650 application circuit is shown as in Figure 36. As the input voltage is smaller than
minimum input voltage, which is pointed out by MBI6650 Design Tool, the output current will be larger than the
present output current, and is limited to 1.3 times of preset one. For detailed information, please refer to the
MBI6650 Application Note V1.00.
-9-
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
RSEN
VIN
SEN
Schottky Diode
Equivalent Circuit
MBI6650
Rs
VF,D1
VF,LED
SW
Rds(on)
LED
Equivalent
Circuit
DCR
Inductor
Equivalent
Circuit
GND
Figure 37. The equivalent impedance in a MBI6650 application circuit
Dimming
The dimming of LEDs can be performed by applying PWM signals to DIM pin. A logic low (below 1.5V) at DIM will
disable the internal MOSFET and shut off the current flow to the LED array. An internal pull-up circuit ensures that
the MBI6650 is on when DIM pin is unconnected, eliminating the need for an external pull-up resistor.
LED Open-Circuit Protection
When any LED connected to the MBI6650 is open-circuit, output current of the MBI6650 will be turned off.
LED Short-Circuit Protection
When any LED connected to the MBI6650 is short-circuit, output current of the MBI6650 will still be limited to its
preset value.
Under Voltage Lock Out Protection
When the voltage at VIN of the MBI6650 is below 7.4V, output current of the MBI6650 will be turned off. When VIN
voltage of the MBI6650 resumes to 8.0V, output current of the MBI6650 will be turned on again.
Internal Soft Start Protection
With embedded soft start function inside the MBI6650, output ripple of the MBI6650 can be eliminated.
- 10 -
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
TP Function (Thermal Protection)
When the junction temperature exceeds the threshold, TX (140°C), TP function turns off the output current. Thus,
the junction temperature starts to decrease. As soon as the temperature is below 140°C, the output current will be
turned on again. The on-state and off-state switch are at a high frequency; thus, the blinking is imperceptible.
However, the average output current is limited, and therefore, the driver is protected from being overheated.
Inductor Selection
The inductance is determined by two factors: the switching frequency and the inductor ripple current. The
calculation of the inductance, L1, can be described as
L1 > ( VIN - VOUT - VSEN - (R ds(on) x IOUT )) x
D
fSW x ∆IL
where
Rds(on) is the on-resistance of internal MOSFET of the MBI6650. The typical is 0.8Ω at 12VIN.
D is the duty cycle of the MBI6650, D=VOUT/VIN.
fSW is the switching frequency of the MBI6650.
△IL is the ripple current of inductor, △IL=(1.3xIOUT)–(0.7xIOUT)=0.6xIOUT.
When selecting an inductor, the inductance is not the only factor to affect the performance of module, but the
saturation current also needs to be considered. In general, it is recommended to choose an inductor with 1.5 times
of LED current as the saturation current. Also, the larger inductance gains the better line/load regulation. However,
when at the same inductor size, the inductance and saturation current becomes a trade-off. An inductor with shield
is recommended to reduce the EMI interference, but this is another trade-off with heat dissipation.
Schottky Diode Selection
The MBI6650 needs a flywheel diode, D1, to carry the inductor current when the MOSFET is off. The
recommended flywheel diode is schottky diode with low forward voltage for better efficiency. Two factors determine
the selection of schottky diode. One is the maximum reverse voltage, and the recommended rated voltage of the
reverse voltage is at least 1.5 times of input voltage. The other is the maximum forward current, which works when
the MOSFET is off, and the recommended forward current is 1.5 times of output current.
Input Capacitor Selection
The input capacitor, CIN, can supply pulses of current for the MBI6650 when the MOSFET is on, and CIN is charged
by input voltage when the MOSFET is off. As the input voltage is lower than the tolerable input voltage, the internal
MOSFET of the MBI6650 becomes constantly “on”, and the LED current is limited to 1.3 times of normal current.
Therefore the key factor in input capacitor selection is the minimum input voltage, which can be tolerated. The
minimum input capacitor (CIN, MIN) can be calculated by the following equation
CIN, MIN = 1.3 x IOUT x
D x TS
VIN - VIN, MIN
where
VIN, MIN is the tolerable input voltage, VIN, MIN=VIN–VOUT, MAX.
The rated voltage of input capacitor should be at least 1.5 times of input voltage. A tantalum or ceramic capacitor
can be used as an input capacitor. The advantages of tantalum capacitor are high capacitance and low ESR. The
- 11 -
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
advantages of ceramic capacitor are high frequency characteristic, small size and low cost. Users can choice an
appropriate one for applications.
Output Capacitor Selection (Optional)
A capacitor paralleled with cascaded LED can reduce the LED ripple current and allow the use of smaller
inductance.
PCB Layout Consideration
To enhance the efficiency and stabilize the system, careful considerations of PCB layout is important. There are
several factors to be considered.
1. Keep a complete ground area is helpful to eliminate the switching noise.
2. Keep the IC’s GND pin and the ground leads of input and output filter capacitors less than 5mm.
3. Maximize output power efficiency and minimize output ripple voltage, use a ground plane and solder the IC’s
GND pin directly to the ground plane.
4. Stabilize the system, the heat sink of the MBI6650 is recommended to connect to ground plane directly.
5. Enhance the heat dissipation, the area of ground plane, which IC’s heat sink is soldered on, should be as large
as possible.
6. The input capacitor should be placed to IC’s VIN pin as close as possible.
7. The area, which is comprised by IC’s SW pin, schottky diode and inductor, should be wide and short.
8. The path, which flows large current, should be wide and short to eliminate the parasite element.
9. When SW is on/off, the direction of power loop should keep the same way to enhance the efficiency. The
sketch is shown as Figure 38.
LED1
LEDn
L1
Rsen
D1
VIN
+
-
+ CIN
SW
SW --> ON
SW --> OFF
Figure 38. Power loop of MBI6650
PCB Layout
Figure 39 is the recommended layout diagram of the MBI6650.
Top layer
Bottom layer
Figure 39. The layout diagram of the MBI6650
Top-Over layer
- 12 -
Bottom-Over layer
October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Package Power Dissipation (PD)
The maximum power dissipation, PD(max)=(Tj–Ta)/Rth(j-a), decreases as the ambient temperature increases.
MBI6650 Maximum Heat Dissipation at Various Ambient Temperature
Power Dissipation (W)
4.0
3.5
3.0
PSD Type: Rth=32.9°C/W
2.5
2.0
Safe Operation Area
1.5
1.0
0.5
0.0
0
20
40
60
80
100
Ambient Temperature (°C)
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October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Outline Drawing
MBI6650PSD Outline Drawing
Note: The unit for the outline drawing is mm.
Product Top Mark Information
The first row of printing
Part number
ID number
The second row of printing
MBIXXXX ○
Digits
or
MBIXXXX ○ ○
Production Code
Package Code
Product No.
○
Manufacture
Code
Device Version Code
Process Code
G: Green and Pb-free
Product Revision History
Datasheet version
V1.00
Device Version Code
A
Product Ordering Information
Part Number
MBI6650PSD
Production Code
A
B
“Pb-free” Package Type
Weight (g)
TO-252-5L
0.3142g
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October 2007, V1.00
MBI6650
1.2A DC/DC Converter
Disclaimer
Macroblock reserves the right to make changes, corrections, modifications, and improvements to their products and
documents or discontinue any product or service without notice. Customers are advised to consult their sales
representative for the latest product information before ordering. All products are sold subject to the terms and
conditions supplied at the time of order acknowledgement, including those pertaining to warranty, patent
infringement, and limitation of liability.
Macroblock’s products are not designed to be used as components in device intended to support or sustain life or
in military applications. Use of Macroblock’s products in components intended for surgical implant into the body, or
other applications in which failure of Macroblock’s products could create a situation where personal death or injury
may occur, is not authorized without the express written approval of the Managing Director of Macroblock.
Macroblock will not be held liable for any damages or claims resulting from the use of its products in medical and
military applications.
All text, images, logos and information contained on this document is the intellectual property of Macroblock.
Unauthorized reproduction, duplication, extraction, use or disclosure of the above mentioned intellectual property
will be deemed as infringement.
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October 2007, V1.00