FUJITSU SEMICONDUCTOR DATA SHEET DS05-20860-3E FLASH MEMORY CMOS 8M (1M × 8/512K × 16) BIT MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ FEATURES • Single 3.0 V read, program, and erase Minimizes system level power requirements • Simultaneous operations Read-while-Erase or Read-while-Program • Compatible with JEDEC-standard commands Uses same software commands as E2PROMs • Compatible with JEDEC-standard world-wide pinouts (Pin compatible with MBM29LV800TA/BA) 48-pin TSOP(I) (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type) 48-ball FBGA (Package suffix: PBT) • Minimum 100,000 program/erase cycles • High performance 70 ns maximum access time • Sector erase architecture Two 16K byte, four 8K bytes, two 32K byte, and fourteen 64K bytes. Any combination of sectors can be concurrently erased. Also supports full chip erase. • Boot Code Sector Architecture T = Top sector B = Bottom sector • Embedded EraseTM Algorithms Automatically pre-programs and erases the chip or any sector • Embedded ProgramTM Algorithms Automatically writes and verifies data at specified address • Data Polling and Toggle Bit feature for detection of program or erase cycle completion • Ready/Busy output (RY/BY) Hardware method for detection of program or erase cycle completion • Automatic sleep mode When addresses remain stable, automatically switch themselves to low power mode. • Low VCC write inhibit ≤ 2.5 V • Erase Suspend/Resume Suspends the erase operation to allow a read in another sector within the same device (Continued) Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc. MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 (Continued) • Sector protection Hardware method disables any combination of sectors from program or erase operations • Sector Protection Set function by Extended sector protection command • Fast Programming Function by Extended Command • Temporary sector unprotection Temporary sector unprotection via the RESET pin. ■ PACKAGE 48-pin plastic TSOP (I) 48-pin plastic TSOP (I) Marking Side Marking Side (FPT-48P-M19) (FPT-48P-M20) 48-pin plastic FBGA (BGA-48P-M02) (BGA-48P-M12) 2 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ GENERAL DESCRIPTION The MBM29DL800TA/BA are a 8M-bit, 3.0 V-only Flash memory organized as 1M bytes of 8 bits each or 512K words of 16 bits each. The MBM29DL800TA/BA are offered in a 48-pin TSOP(I) and 48-ball FBGA packages. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers. MBM29DL800TA/BA provides simultaneous operation which can read a data while program/erase. The simultaneous operation architecture provides simultaneous operation by dividing the memory space into two banks. The device can allow a host system to program or erase in one bank, then immediately and simultaneously read from the other bank. The standard MBM29DL800TA/BA offer access times 70 ns and 120 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable (WE), and output enable (OE) controls. The MBM29DL800TA/BA are pin and command set compatible with JEDEC standard E2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the devices is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices. The MBM29DL800TA/BA are programmed by executing the program command sequence. This will invoke the Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the devices automatically time the erase pulse widths and verify proper cell margin. A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.) The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29DL800TA/BA are erased when shipped from the factory. The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been completed, the devices internally reset to the read mode. Fujitsu’s Flash technology combines years of EPROM and E2PROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29DL800TA/BA memories electrically erase the entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a time using the EPROM programming mechanism of hot electron injection. 3 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ FLEXIBLE SECTOR-ERASE ARCHITECTURE • Two 16K bytes, four 8K bytes, two 32K bytes, and fourteen 64K bytes • Individual-sector, multiple-sector, or bulk-erase capability • Individual or multiple-sector protection is user definable. (×8) (×16) (×8) FFFFFH 7FFFFH 16K byte FFFFFH 7FFFFH 64K byte FBFFFH 7DFFFH 8K byte EFFFFH 77FFFH 64K byte F9FFFH 7CFFFH 8K byte DFFFFH 6FFFFH 64K byte F7FFFH 7BFFFH 32K byte CFFFFH 67FFFH 64K byte EFFFFH 77FFFH 64K byte BFFFFH 5FFFFH 64K byte DFFFFH 6FFFFH 64K byte AFFFFH 57FFFH 64K byte CFFFFH 67FFFH 64K byte 9FFFFH 4FFFFH 64K byte BFFFFH 5FFFFH 64K byte 8FFFFH 47FFFH 64K byte AFFFFH 57FFFH 64K byte 7FFFFH 3FFFFH 64K byte 9FFFFH 4FFFFH 64K byte 6FFFFH 37FFFH 64K byte 8FFFFH 47FFFH 64K byte 5FFFFH 2FFFFH 64K byte 7FFFFH 3FFFFH 64K byte 4FFFFH 27FFFH 64K byte 6FFFFH 37FFFH 64K byte 3FFFFH 1FFFFH 64K byte 5FFFFH 2FFFFH 64K byte 2FFFFH 17FFFH 64K byte 4FFFFH 27FFFH 64K byte 1FFFFH 0FFFFH 64K byte 3FFFFH 1FFFFH 64K byte 0FFFFH 07FFFH 32K byte 2FFFFH 17FFFH 64K byte 07FFFH 03FFFH 8K byte 1FFFFH 0FFFFH 64K byte 05FFFH 02FFFH 8K byte 0FFFFH 07FFFH 64K byte 00000H 00000H MBM29LV800TA Sector Architecture 4 (×16) 03FFFH 01FFFH 16K byte 00000H 00000H MBM29LV800BA Sector Architecture MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ PRODUCT LINE UP Part No. MBM29DL800TA/MBM29DL800BA VCC = 3.3 V +0.3 V –0.3 V -70 — — VCC = 3.0 V +0.6 V –0.3 V — -90 -12 Max. Address Access Time (ns) 70 90 120 Max. CE Access Time (ns) 70 90 120 Max. OE Access Time (ns) 30 35 50 Ordering Part No. ■ BLOCK DIAGRAM RY/BY Buffer DQ 0 to DQ 15 RY/BY V CC V SS Erase Voltage Generator Input/Output Buffers WE BYTE RESET State Control Command Register Program Voltage Generator Chip Enable Output Enable Logic CE STB Data Latch OE STB Low V CC Detector Timer for Program/Erase Address Latch Y-Decoder Y-Gating X-Decoder Cell Matrix A0 to A18 A-1 5 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ CONNECTION DIAGRAMS SOP (Top View) TSOP(I) A15 A14 A13 A12 A11 A10 A9 A8 N.C. N.C. WE RESET N.C. N.C. RY/BY A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 (Marking Side) MBM29LV800TA/MBM29LV800BA Standard Pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE VSS DQ 15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE VSS CE A0 FPT-48P-M19 A1 A2 A3 A4 A5 A6 A7 A17 A18 RY/BY N.C. N.C. RESET WE N.C. N.C. A8 A9 A10 A11 A12 A13 A14 A15 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 (Marking Side) MBM29LV800TA/MBM29LV800BA Reverse Pinout FPT-48P-M20 6 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 A0 CE VSS OE DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 VCC DQ4 DQ12 DQ5 DQ13 DQ6 DQ14 DQ7 DQ15/A-1 VSS BYTE A16 RY/BY 1 44 RESET A18 2 43 WE A17 3 42 A8 A7 4 41 A9 A6 5 40 A10 A5 6 39 A11 A4 7 38 A12 A3 8 37 A13 A2 9 36 A14 A1 10 35 A15 A0 11 34 A16 CE 12 33 BYTE VSS 13 32 V SS OE 14 31 DQ 15/A-1 DQ0 15 30 DQ 7 DQ8 16 29 DQ 14 DQ1 17 28 DQ 6 DQ9 18 27 DQ 13 DQ2 19 26 DQ5 DQ10 20 25 DQ 12 DQ3 21 24 DQ4 DQ11 22 23 VCC FPT-44P-M16 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 (Continued) FBGA (Top View) Marking side A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 D1 D2 D3 D4 D5 D6 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 G1 G2 G3 G4 G5 G6 H1 H2 H3 H4 H5 H6 BGA-48P-M02 BGA-48P-M12 A1 A3 A2 A7 A3 RY/BY A4 WE A5 A9 A6 A13 B1 A4 B2 A17 B3 N.C. B4 RESET B5 A8 B6 A12 C1 A2 C2 A6 C3 A18 C4 N.C. C5 A10 C6 A14 D1 A1 D2 A5 D3 N.C. D4 N.C. D5 A11 D6 A15 E1 A0 E2 DQ0 E3 DQ2 E4 DQ5 E5 DQ7 E6 A16 F1 CE F2 DQ8 F3 DQ10 F4 DQ12 F5 DQ14 F6 BYTE G1 OE G2 DQ9 G3 DQ11 G4 VCC G5 DQ13 G6 DQ15/A-1 H1 VSS H2 DQ1 H3 DQ3 H4 DQ4 H5 DQ6 H6 VSS 7 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ LOGIC SYMBOL Table 1 MBM29DL800TA/BA Pin Configuration Pin A-1 19 A0 to A18 16 or 8 Function A-1, A0 to A18 Address Inputs DQ0 to DQ15 Data Inputs/Outputs CE Chip Enable OE Output Enable WE Write Enable DQ 0 to DQ 15 CE OE WE RESET BYTE RY/BY Ready/Busy Output RESET Hardware Reset Pin/Temporary Sector Unprotection RY/BY BYTE 8 Selects 8-bit or 16-bit mode N.C. No Internal Connection VSS Device Ground VCC Device Power Supply MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Table 2 MBM29DL800TA/BA User Bus Operations (BYTE = VIH) Operation CE OE WE A0 A1 A6 A9 DQ0 to DQ15 RESET Auto-Select Manufacturer Code (1) L L H L L L VID Code H Auto-Select Device Code (1) L L H H L L VID Code H Read (3) L L H A0 A1 A6 A9 DOUT H Standby H X X X X X X HIGH-Z H Output Disable L H H X X X X HIGH-Z H Write (Program/Erase) L H L A0 A1 A6 A9 DIN H Enable Sector Protection (2), (4) L VID L H L VID X H Verify Sector Protection (2), (4) L L H L H L VID Code H Temporary Sector Unprotection (5) X X X X X X X X VID Reset (Hardware)/Standby X X X X X X X HIGH-Z L Table 3 MBM29DL800TA/BA User Bus Operations (BYTE = VIL) Operation CE OE WE DQ15/ A-1 A0 A1 A6 A9 Auto-Select Manufacturer Code (1) L L H L L L L VID Code H Auto-Select Device Code (1) L L H L H L L VID Code H Read (3) L L H A-1 A0 A1 A6 A9 DOUT H Standby H X X X X X X X HIGH-Z H Output Disable L H H X X X X X HIGH-Z H Write (Program/Erase) L H L A-1 A0 A1 A6 A9 DIN H Enable Sector Protection (2), (4) L VID L L H L VID X H Verify Sector Protection (2), (4) L L H L L H L VID Code H Temporary Sector Unprotection (5) X X X X X X X X X VID Reset (Hardware)/Standby X X X X X X X X HIGH-Z L Legend: L = VIL, H = VIH, X = VIL or VIH, DQ0 to DQ7 RESET = Pulse input. See DC Characteristics for voltage levels. Notes: 1. Manufacturer and device codes may also be accessed via a command register write sequence. See Table 8. 2. Refer to the section on Sector Protection. 3. WE can be VIL if OE is VIL, OE at VIH initiates the write operations. 4. VCC = 3.0 V ± 10% 5. It is also used for the extended sector protection. 9 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ ORDERING INFORMATION Standard Products Fujitsu standard products are available in several packages. The order number is formed by a combination of: MBM29DL800 T A -70 PFTN PACKAGE TYPE PFTN = 48-Pin Thin Small Outline Package (TSOP) Standard Pinout PFTR = 48-Pin Thin Small Outline Package (TSOP) Reverse Pinout PBT = 48-Ball Fine Pitch Ball Grid Array Package (FBGA:BGA-48P-M02) PBT-SF2 =48-Ball Fine Pitch Ball Grid Array Package (FBGA:BGA-48P-M12) SPEED OPTION See Product Selector Guide Device Revision BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION MBM29DL800 8Mega-bit (1M × 8-Bit or 512K × 16-Bit) CMOS Flash Memory 3.0 V-only Read, Program, and Erase 10 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ FUNCTIONAL DESCRIPTION Simultaneous Operation MBM29DL800TA/BA have feature, which is capability of reading data from one bank of memory while a program or erase operation is in progress in the other bank of memory (simultaneous operation), in addition to the conventional features (read, program, erase, erase-suspend read, and erase-suspend program). The bank selection can be selected by bank address (A16 to A18) with zero latency. The MBM29DL800TA/BA have two banks which contain Bank 1 (16KB, 32KB, 8KB, 8KB, 8KB, 8KB, 32KB, and 16KB) and Bank 2 (64KB × fourteen sectors). The simultaneous operation can not execute multi-function mode in the same bank. Table 4 shows combination to be possible for simultaneous operation. Table 4 Simultaneous Operation Case Bank 1 Status Bank 2 Status 1 Read mode Read mode 2 Read mode Autoselect mode 3 Read mode Program mode 4 Read mode Erase mode * 5 Autoselect mode Read mode 6 Program mode Read mode 7 Erase mode * Read mode *: An erase operation may also be supended to read from or program to a sector not being erased. Read Mode The MBM29DL800TA/BA have two control functions which must be satisfied in order to obtain data at the outputs. CE is the power control and should be used for a device selection. OE is the output control and should be used to gate data to the output pins if a device is selected. Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the addresses have been stable for at least tACC-tOE time.) When reading out a data without changing addresses after power-up, it is necessary to input hardware reset or to change CE pin from “H” or “L” Standby Mode There are two ways to implement the standby mode on the MBM29DL800TA/BA devices, one using both the CE and RESET pins; the other via the RESET pin only. When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at VCC ± 0.3 V. Under this condition the current consumed is less than 5 µA max. During Embedded Algorithm operation, VCC active current (ICC2) is required even CE = “H”. The device can be read with standard access time (tCE) from either of these standby modes. When using the RESET pin only, a CMOS standby mode is achieved with RESET input held at VSS ± 0.3 V (CE = “H” or “L”). Under this condition the current is consumed is less than 5 µA max. Once the RESET pin is taken high, the device requires tRH of wake up time before outputs are valid for read access. In the standby mode the outputs are in the high impedance state, independent of the OE input. 11 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Automatic Sleep Mode There is a function called automatic sleep mode to restrain power consumption during read-out of MBM29DL800TA/BA data. This mode can be used effectively with an application requested low power consumption such as handy terminals. To activate this mode, MBM29DL800TA/BA automatically switch themselves to low power mode when MBM29DL800TA/BA addresses remain stably during access fine of 300 ns. It is not necessary to control CE, WE, and OE on the mode. Under the mode, the current consumed is typically 1 µA (CMOS Level). During simultaneous operation, VCC active current (ICC2) is required. Since the data are latched during this mode, the data are read-out continuously. If the addresses are changed, the mode is canceled automatically and MBM29DL800TA/BA read-out the data for changed addresses. Output Disable With the OE input at a logic high level (VIH), output from the devices are disabled. This will cause the output pins to be in a high impedance state. Autoselect The autoselect mode allows the reading out of a binary code from the devices and will identify its manufacturer and type. This mode is intended for use by programming equipment for the purpose of automatically matching the devices to be programmed with its corresponding programming algorithm. This mode is functional over the entire temperature range of the devices. To activate this mode, the programming equipment must force VID (11.5 V to 12.5 V) on address pin A9. Two identifier bytes may then be sequenced from the devices outputs by toggling address A0 from VIL to VIH. All addresses are DON’T CARES except A0, A1, and A6 (A-1). (See Tables 2 and 3.) The manufacturer and device codes may also be read via the command register, for instances when the MBM29DL800TA/BA are erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is illustrated in Table 8. (Refer to Autoselect Command section.) Word 0 (A0 = VIL) represents the manufacturer’s code (Fujitsu = 04H) and word 1 (A0 = VIH) represents the device identifier code (MBM29DL800TA = 4AH and MBM29DL800BA = CBH for ×8 mode; MBM29DL800TA = 224AH and MBM29DL800BA = 22CBH for ×16 mode). These two bytes/words are given in the tables 5.1 and 5.2. All identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read the proper device codes when executing the autoselect, A1 must be VIL. (See Tables 5.1 and 5.2.) In case of applying VID on A9, since both Bank 1 and Bank 2 enters Autoselect mode, the simultenous operation can not be executed. 12 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Table 5 .1 MBM29DL800TA/BA Sector Protection Verify Autoselect Codes Type A12 to A18 A6 A1 A0 A-1*1 Code (HEX) X VIL VIL VIL VIL 04H VIL 4AH X VIL VIL VIH X 224AH VIL CBH X 22CBH VIL 01H*2 Manufacture’s Code Byte MBM29DL800TA Word Device Code Byte MBM29DL800BA X VIL VIL VIH Word Sector Addresses Sector Protection VIH VIL VIL *1: A-1 is for Byte mode. *2: Outputs 01H at protected sector addresses and outputs 00H at unprotected sector addresses. Table 5 .2 Expanded Autoselect Code Table Type Code Manufacturer’s Code 04H DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 0 0 0 0 0 1 0 0 4AH A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0 1 0 0 1 0 1 0 0 1 0 0 1 0 1 0 (B) CBH A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 1 1 0 0 1 0 1 1 (B) A-1/0 0 0 0 0 0 0 0 MBM29DL800TA (W) 224AH Device Code 0 0 1 0 0 0 1 0 MBM29DL800BA (W) 22CBH Sector Protection 01H 0 0 1 0 0 0 1 0 1 1 0 0 1 0 1 1 A-1/0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 (B): Byte mode (W): Word mode 13 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Write Device erasure and programming are accomplished via the command register. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The command register itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the falling edge of WE or CE, whichever happens later; while data is latched on the rising edge of WE or CE, whichever happens first. Standard microprocessor write timings are used. Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters. Sector Protection The MBM29DL800TA/BA feature hardware sector protection. This feature will disable both program and erase operations in any number of sectors (0 through 21). The sector protection feature is enabled using programming equipment at the user’s site. The devices are shipped with all sectors unprotected. Alternatively, Fujitsu may program and protect sectors in the factory prior to shiping the device. To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE, (suggest VID = 11.5 V), CE = VIL, and A0 = A6 = VIL, A1 = VIH. The sector addresses (A18, A17, A16, A15, A14, A13, and A12) should be set to the sector to be protected. Tables 6 and 7 define the sector address for each of the twenty two (22) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same. Sector addresses must be held constant during the WE pulse. See Figures 16 and 25 for sector protection waveforms and algorithm. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 with CE and OE at VIL and WE at VIH. Scanning the sector addresses (A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise the devices will read 00H for unprotected sector. In this mode, the lower order addresses, except for A0, A1, and A6 are DON’T CARES. Address locations with A1 = VIL are reserved for Autoselect manufacturer and device codes. A-1 requires to apply to VIL on byte mode. It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performing a read operation at the address location XX02H, where the higher order addresses (A18, A17, A16, A15, A14, A13, and A12) are the desired sector address will produce a logical “1” at DQ0 for a protected sector. See Tables 5.1 and 5.2 for Autoselect codes. Temporary Sector Unprotection This feature allows temporary unprotection of previously protected sectors of the MBM29DL800TA/BA devices in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage (12 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once the 12 V is taken away from the RESET pin, all the previously protected sectors will be protected again. See Figures 17 and 26. 14 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 RESET Hardware Reset The MBM29DL800TA/BA devices may be reset by driving the RESET pin to VIL. The RESET pin has a pulse requirement and has to be kept low (VIL) for at least 500 ns in order to properly reset the internal state machine. Any operation in the process of being executed will be terminated and the internal state machine will be reset to the read mode 20 µs after the RESET pin is driven low. Furthermore, once the RESET pin goes high, the devices require an additional tRH before it will allow read access. When the RESET pin is low, the devices will be in the standby mode for the duration of the pulse and all the data output pins will be tri-stated. If a hardware reset occurs during a program or erase operation, the data at that particular location will be corrupted. Please note that the RY/BY output signal should be ignored during the RESET pulse. See Figure 12 for the timing diagram. Refer to Temporary Sector Unprotection for additional functionality. 15 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Table 6 Sector Address Tables (MBM29DL800TA) Sector Address Bank Sector Bank Address Sector Size (Kbytes/ Kwords) (×8) Address Range (×16) Address Range A18 A17 A16 A15 A14 A13 A12 SA0 0 0 0 0 X X X 64/32 00000H to 0FFFFH 00000H to 07FFFH SA1 0 0 0 1 X X X 64/32 10000H to 1FFFFH 08000H to 0FFFFH SA2 0 0 1 0 X X X 64/32 20000H to 2FFFFH 10000H to 17FFFH SA3 0 0 1 1 X X X 64/32 30000H to 3FFFFH 18000H to 1FFFFH SA4 0 1 0 0 X X X 64/32 40000H to 4FFFFH 20000H to 27FFFH SA5 0 1 0 1 X X X 64/32 50000H to 5FFFFH 28000H to 2FFFFH SA6 0 1 1 0 X X X 64/32 60000H to 6FFFFH 30000H to 37FFFH SA7 0 1 1 1 X X X 64/32 70000H to 7FFFFH 38000H to 3FFFFH SA8 1 0 0 0 X X X 64/32 80000H to 8FFFFH 40000H to 47FFFH SA9 1 0 0 1 X X X 64/32 90000H to 9FFFFH 48000H to 4FFFFH SA10 1 0 1 0 X X X 64/32 A0000H to AFFFFH 50000H to 57FFFH SA11 1 0 1 1 X X X 64/32 B0000H to BFFFFH 58000H to 5FFFFH SA12 1 1 0 0 X X X 64/32 C0000H to CFFFFH 60000H to 67FFFH SA13 1 1 0 1 X X X 64/32 D0000H to DFFFFH 68000H to 6FFFFH SA14 1 1 1 0 0 0 X 16/8 E0000H to E3FFFH 70000H to 71FFFH 0 1 X SA15 1 1 1 0 32/16 E4000H to E7FFFH, 72000H to 73FFFH, E8000H to EBFFFH 74000H to 75FFFH Bank 2 1 0 X SA16 1 1 1 0 1 1 0 8/4 EC000H to EDFFFH 76000H to 76FFFH SA17 1 1 1 0 1 1 1 8/4 EE000H to EFFFFH 77000H to 77FFFH SA18 1 1 1 1 0 0 0 8/4 F0000H to F1FFFH 78000H to 78FFFH SA19 1 1 1 1 0 0 1 8/4 F2000H to F3FFFH 79000H to 79FFFH 0 1 X SA20 1 1 1 1 Bank 1 SA21 1 1 1 1 1 0 X 1 1 X 32/16 F4000H to F7FFFH, 7A000H to 7BFFFH, F8000H to FBFFFH 7C000H to 7DFFFH 16/8 FC000H to FFFFFH 7E000H to 7FFFFH Note: The address range is A18: A-1 if in byte mode (BYTE = VIL). The address range is A18: A0 if in word mode (BYTE = VIH). 16 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Table 7 Sector Address Tables (MBM29DL800BA) Sector Address Bank Sector Bank Address Sector Size (Kbytes/ Kwords) (×8) Address Range (×16) Address Range A18 A17 A16 A15 A14 A13 A12 SA21 1 1 1 1 X X X 64/32 F0000H to FFFFFH 78000H to 7FFFFH SA20 1 1 1 0 X X X 64/32 E0000H to EFFFFH 70000H to 77FFFH SA19 1 1 0 1 X X X 64/32 D0000H to DFFFFH 68000H to 6FFFFH SA18 1 1 0 0 X X X 64/32 C0000H to CFFFFH 60000H to 67FFFH SA17 1 0 1 1 X X X 64/32 B0000H to BFFFFH 58000H to 5FFFFH SA16 1 0 1 0 X X X 64/32 A0000H to AFFFFH 50000H to 57FFFH SA15 1 0 0 1 X X X 64/32 90000H to 9FFFFH 48000H to 4FFFFH SA14 1 0 0 0 X X X 64/32 80000H to 8FFFFH 40000H to 47FFFH SA13 0 1 1 1 X X X 64/32 70000H to 7FFFFH 38000H to 3FFFFH SA12 0 1 1 0 X X X 64/32 60000H to 6FFFFH 30000H to 37FFFH SA11 0 1 0 1 X X X 64/32 50000H to 5FFFFH 28000H to 2FFFFH SA10 0 1 0 0 X X X 64/32 40000H to 4FFFFH 20000H to 27FFFH SA9 0 0 1 1 X X X 64/32 30000H to 3FFFFH 18000H to 1FFFFH SA8 0 0 1 0 X X X 64/32 20000H to 2FFFFH 10000H to 17FFFH SA7 0 0 0 1 1 1 X 16/8 1C000H to 1FFFFH 0E000H to 0FFFFH 1 0 X SA6 0 0 0 1 32/16 14000H to 17FFFH, 0A000H to 0BFFFH, 18000H to 1BFFFH 0C000H to 0DFFFH Bank 2 0 1 X SA5 0 0 0 1 0 0 1 8/4 12000H to 13FFFH 09000H to 09FFFH SA4 0 0 0 1 0 0 0 8/4 10000H to 11FFFH 08000H to 08FFFH SA3 0 0 0 0 1 1 1 8/4 0E000H to 0FFFFH 07000H to 07FFFH SA2 0 0 0 0 1 1 0 8/4 0C000H to 0DFFFH 06000H to 06FFFH 1 0 X SA1 0 0 0 0 Bank 1 SA0 0 0 0 0 0 1 X 0 0 X 32/16 08000H to 0BFFFH, 04000H to 05FFFH, 04000H to 07FFFH 02000H to 03FFFH 16/8 00000H to 03FFFH 00000H to 01FFFH Note: The address range is A18: A-1 if in byte mode (BYTE = VIL). The address range is A18: A0 if in word mode (BYTE = VIH). 17 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Table 8 Command Sequence Read/Reset Read/Reset Word Byte Word Byte Bus Write Cycles Req’d 1 3 Word 3 Autoselect Byte Program Chip Erase Sector Erase Word Byte Word Byte Word Byte Erase Suspend Erase Resume Set to Fast Mode Word Fast Program *1 Word Reset from Fast Mode *1 Word Extended Sector Protect*2 Byte Byte Byte Word Byte 4 6 6 1 1 3 2 2 4 MBM29DL800TA/BA Command Definitions First Bus Second Bus Third Bus Fourth Bus Fifth Bus Sixth Bus Write Cycle Write Cycle Write Cycle Read/Write Write Cycle Write Cycle Cycle Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data XXXH F0H — — — 555H 2AAH 555H AAH 55H AAAH 555H AAAH (BA) 555H 2AAH 555H AAH 55H (BA) AAAH 555H AAAH 555H 2AAH 555H AAH 55H AAAH 555H AAAH 555H 2AAH 555H AAH 55H AAAH 555H AAAH 555H 2AAH 555H AAH 55H AAAH 555H AAAH BA B0H — — — BA 30H — — — 555H 2AAH 555H AAH 55H AAAH 555H AAAH XXXH A0H PA PD — XXXH BA XXXH F0H 90H — BA XXXH *3 XXXH 60H SPA 60H SPA — — — — — — — F0H RA RD — — — — 90H — — — — — — A0H PA PD — — — — 555H 2AAH 555H AAH 55H 10H AAAH 555H AAAH 555H 2AAH 80H AAH 55H SA 30H AAAH 555H — — — — — — — — — — — — — — 80H 20H — — — — — — — — — — — — — — — — — — — — 40H SPA SD — — — — *1: This command is valid while Fast Mode. *2: This command is valid while RESET=VID. *3: This data "00H" is also acceptable. Notes: 1. Address bits A12 to A18 = X = “H” or “L” for all address commands except or Program Address (PA), Sector Address (SA), and Bank Address (BA). 2. Bus operations are defined in Tables 2 and 3. 3. RA = Address of the memory location to be read PA = Address of the memory location to be programmed Addresses are latched on the falling edge of the write pulse. SA = Address of the sector to be erased. The combination of A18, A17, A16, A15, A14, A13, and A12 will uniquely select any sector. BA = Bank Address (A16 to A18) 4. RD = Data read from location RA during read operation. PD = Data to be programmed at location PA. Data is latched on the falling edge of write pulse. 5. SPA =Sector address to be protected. Set sector address (SA) and (A6, A1, A0) = (0, 1, 0). SD = Sector protection verify data. Output 01H at protected sector addresses and output 00H at unprotected sector addresses. 6. The system should generate the following address patterns: Word Mode: 555H or 2AAH to addresses A0 to A11 Byte Mode: AAAH or 555H to addresses A–1 and A0 to A11 7. Both Read/Reset commands are functionally equivalent, resetting the device to the read mode. 18 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Command Definitions Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the devices to the read mode. Some commands are required Bank Address (BA) input. When command sequences are inputed to bank being read, the commands have priority than reading. Table 8 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. Moreover both Read/Reset commands are functionally equivalent, resetting the device to the read mode. Please note that commands are always written at DQ0 to DQ7 and DQ8 to DQ15 bits are ignored. Read/Reset Command In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to Read/Reset mode, the Read/ Reset operation is initiated by writing the Read/Reset command sequence into the command register. Microprocessor read cycles retrieve array data from the memory. The devices remain enabled for reads until the command register contents are altered. The devices will automatically power-up in the Read/Reset state. In this case, a command sequence is not required to read data. Standard microprocessor read cycles will retrieve array data. This default value ensures that no spurious alteration of the memory content occurs during the power transition. Refer to the AC Read Characteristics and Waveforms for the specific timing parameters. Autoselect Command Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacture and device codes must be accessible while the devices reside in the target system. PROM programmers typically access the signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto the address lines is not generally desired system design practice. The device contains an Autoselect command operation to supplement traditional PROM programming methodology. The operation is initiated by writing the Autoselect command sequence into the command register. The Autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains the bank address (BA) and the Autoselect command. Then the manufacture and device codes can be read from the bank, and an actual data of memory cell can be read from the another bank. Following the command write, a read cycle from address (BA)00H retrieves the manufacture code of 04H. A read cycle from address (BA)01H for ×16((BA)02H for ×8) returns the device code (MBM29DL800TA = 4AH and MBM29DL800BA = CBH for ×8 mode; MBM29DL800TA = 224AH and MBM29DL800BA = 22CBH for ×16 mode). (See Tables 5.1 and 5.2.) All manufacturer and device codes will exhibit odd parity with DQ7 defined as the parity bit. Sector state (protection or unprotection) will be informed by address (BA)02H for ×16 ((BA)04H for ×8). Scanning the sector addresses (A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” at device output DQ0 for a protected sector. The programming verification should be performed by verify sector protection on the protected sector. (See Tables 2 and 3.) The manufacture and device codes can be allowed reading from selected bank. To read the manufacture and device codes and sector protection status from non-selected bank, it is necessary to write Read/Reset command sequence into the register and then Autoselect command should be written into the bank to be read. If the software (program code) for Autoselect command is stored into the Frash memory, the device and manufacture codes should be read from the other bank where is not contain the software. 19 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 To terminate the operation, it is necessary to write the Read/Reset command sequence into the register, and also to write the Autoselect command during the operation, execute it after writing Read/Reset command sequence. Byte/Word Programming The devices are programmed on a byte-by-byte (or word-by-word) basis. Programming is a four bus cycle operation. There are two “unlock” write cycles. These are followed by the program set-up command and data write cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is latched on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever happens first) begins programming. Upon executing the Embedded Program Algorithm command sequence, the system is not required to provide further controls or timings. The device will automatically provide adequate internally generated program pulses and verify the programmed cell margin. The system can determine the status of the program operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or RY/BY. The Data Polling and Toggle Bit must be performed at the memory location which is being programmed. The automatic programming operation is completed when the data on DQ7 is equivalent to data written to this bit at which time the devices return to the read mode and addresses are no longer latched. (See Table 9, Hardware Sequence Flags.) Therefore, the devices require that a valid address to the devices be supplied by the system at this particular instance of time. Hence, Data Polling must be performed at the memory location which is being programmed. Any commands written to the chip during this period will be ignored. If hardware reset occurs during the programming operation, it is impossible to guarantee the data are being written. Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success according to the data polling algorithm but a read from Read/Reset mode will show that the data is still “0”. Only erase operations can convert “0”s to “1”s. Figure 21 illustrates the Embedded ProgramTM Algorithm using typical command strings and bus operations. Chip Erase Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the chip erase command. Chip erase does not require the user to program the device prior to erase. Upon executing the Embedded Erase Algorithm command sequence the devices will automatically program and verify the entire memory for an all zero data pattern prior to electrical erase (Preprogram function). The system is not required to provide any controls or timings during these operations. The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or RY/BY. The chip erase begins on the rising edge of the last CE or WE, whichever happens first in the command sequence and terminates when the data on DQ7 is “1” (See Write Operation Status section.) at which time the device returns to read the mode. Chip Erase Time; Sector Erase Time × All sectors + Chip Program Time (Preprogramming) Figure 22 illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations. 20 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Sector Erase Sector erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the Sector Erase command. The sector address (any address location within the desired sector) is latched on the falling edge of CE or WE whichever happens later, while the command (Data=30H) is latched on the rising edge of CE or WE which happens first. After time-out of 50 µs from the rising edge of the last sector erase command, the sector erase operation will begin. Multiple sectors may be erased concurrently by writing the six bus cycle operations on Table 8. This sequence is followed with writes of the Sector Erase command to addresses in other sectors desired to be concurrently erased. The time between writes must be less than 50 µs otherwise that command will not be accepted and erasure will start. It is recommended that processor interrupts be disabled during this time to guarantee this condition. The interrupts can be re-enabled after the last Sector Erase command is written. A time-out of 50 µs from the rising edge of last CE or WE whichever happens first will initiate the execution of the Sector Erase command(s). If another falling edge of CE or WE, whichever happens first occurs within the 50 µs time-out window the timer is reset. (Monitor DQ3 to determine if the sector erase timer window is still open, see section DQ3, Sector Erase Timer.) Any command other than Sector Erase or Erase Suspend during this time-out period will reset the devices to the read mode, ignoring the previous command string. Resetting the devices once execution has begun will corrupt the data in the sector. In that case, restart the erase on those sectors and allow them to complete. (Refer to the Write Operation Status section for Sector Erase Timer operation.) Loading the sector erase buffer may be done in any sequence and with any number of sectors (0 to 21). Sector erase does not require the user to program the devices prior to erase. The devices automatically program all memory locations in the sector(s) to be erased prior to electrical erase (Preprogram function). When erasing a sector or sectors the remaining unselected sectors are not affected. The system is not required to provide any controls or timings during these operations. The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or RY/BY. The sector erase begins after the 50 µs time out from the rising edge of CE or WE whichever happens first for the last sector erase command pulse and terminates when the data on DQ7 is “1” (See Write Operation Status section.) at which time the devices return to the read mode. Data polling and Toggle Bit must be performed at an address within any of the sectors being erased. Multiple Sector Erase Time; [Sector Erase Time + Sector Program Time (Preprogramming)] × Number of Sector Erase In case of multiple sector erase across bank boundaries, a read from bank (read-while-erase) can not performe. Figure 22 illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations. Erase Suspend/Resume The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads from or programs to a sector not being erased. This command is applicable ONLY during the Sector Erase operation which includes the time-out period for sector erase. The Erase Suspend command will be ignored if written during the Chip Erase operation or Embedded Program Algorithm. Writting the Erase Suspend command (B0H) during the Sector Erase time-out results in immediate termination of the time-out period and suspension of the erase operation. Writing the Erase Resume command (30H) resumes the erase operation. The bank addresses of sector being erasing or suspending should be set when writting the Erase Suspend or Erase Resume command. 21 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum of 20 µs to suspend the erase operation. When the devices have entered the erase-suspended mode, the RY/ BY output pin will be at Hi-Z and the DQ7 bit will be at logic “1”, and DQ6 will stop toggling. The user must use the address of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation has been suspended. Further writes of the Erase Suspend command are ignored. When the erase operation has been suspended, the devices default to the erase-suspend-read mode. Reading data in this mode is the same as reading from the standard read mode except that the data must be read from sectors that have not been erase-suspended. Successively reading from the erase-suspended sector while the device is in the erase-suspend-read mode will cause DQ2 to toggle. (See the section on DQ2.) After entering the erase-suspend-read mode, the user can program the device by writing the appropriate command sequence for Program. This program mode is known as the erase-suspend-program mode. Again, programming in this mode is the same as programming in the regular Program mode except that the data must be programmed to sectors that are not erase-suspended. Successively reading from the erase-suspended sector while the devices are in the erase-suspend-program mode will cause DQ2 to toggle. The end of the erasesuspended Program operation is detected by the RY/BY output pin, Data polling of DQ7 or by the Toggle Bit I (DQ6) which is the same as the regular Program operation. Note that DQ7 must be read from the Program address while DQ6 can be read from any address within bank being erase-suspended. To resume the operation of Sector Erase, the Resume command (30H) should be written to the bank being erase suspended. Any further writes of the Resume command at this point will be ignored. Another Erase Suspend command can be written after the chip has resumed erasing. Extended Command (1) Fast Mode MBM29DL800TA/BA has Fast Mode function. This mode dispenses with the initial two unclock cycles required in the standard program command sequence by writing Fast Mode command into the command register. In this mode, the required bus cycle for programming is two cycles instead of four bus cycles in standard program command. (Do not write erase command in this mode.) The read operation is also executed after exiting this mode. To exit this mode, it is necessary to write Fast Mode Reset command into the command register. The first cycle must contain the bank address. (Refer to the Figure 28 Extended algorithm.) The VCC active current is required even CE = VIH during Fast Mode. (2) Fast Programming During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program Algorithm is executed by writing program set-up command (A0H) and data write cycles (PA/PD). (Refer to the Figure 28 Extended algorithm.) (3) Extended Sector Protection In addition to normal sector protection, the MBM29DL800TA/BA has Extended Sector Protection as extended function. This function enable to protect sector by forcing VID on RESET pin and write a commnad sequence. Unlike conventional procedure, it is not necessary to force VID and control timing for control pins. The only RESET pin requires VID for sector protection in this mode. The extended sector protect requires VID on RESET pin. With this condition, the operation is initiated by writing the set-up command (60H) into the command register. Then, the sector addresses pins (A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set to the sector to be protected (recommend to set VIL for the other addresses pins), and write extended sector protect command (60H). A sector is typically protected in 150 µs. To verify programming of the protection circuitry, the sector addresses pins (A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set and write a command (40H). Following the command write, a logical “1” at device output DQ0 will produce for protected sector in the read operation. If the output data is logical “0”, please repeat to write extended sector protect command (60H) again. To terminate the operation, it is necessary to set RESET pin to VIH. 22 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Write Operation Status Detailed in Table 9 are all the status flags that can determine the status of the bank for the current mode operation. The read operation from the bank where is not operate Embedded Algorithm returns a data of memory cell. These bits offer a method for determining whether a Embedded Algorithm is completed properly. The information on DQ2 is address sensitive. This means that if an address from an erasing sector is consectively read, then the DQ2 bit will toggle. However, DQ2 will not toggle if an address from a non-erasing sector is consectively read. This allows the user to determine which sectors are erasing and which are not. The status flag is not output from bank (non-busy bank) not executing Embedded Algorithm. For example, there is bank (busy bank) which is now executing Embedded Algorithm. When the read sequence is [1] <busy bank>, [2] <non-busy bank>, [3] <busy bank>, the DQ6 is toggling in the case of [1] and [3]. In case of [2], the data of memory cell is outputted. In the erase-suspend read mode with the same read sequence, DQ6 will not be toggled in the [1] and [3]. In the erase suspend read mode, DQ2 is toggled in the [1] and [3]. In case of [2], the data of memory cell is outputted. Table 9 Hardware Sequence Flags DQ7 DQ6 DQ5 DQ3 DQ2 DQ7 Toggle 0 0 1 0 Toggle 0 1 Toggle (Note 1) 1 1 0 0 Toggle Data Data DQ7 Toggle 0 0 1 (Note 1) Embedded Program Algorithm DQ7 Toggle 1 0 1 Embedded Erase Algorithm Exceeded Time Limits Erase Erase Suspend Program Suspended (Non-Erase Suspended Sector) Mode 0 Toggle 1 1 N/A DQ7 Toggle 1 0 N/A Status Embedded Program Algorithm Embedded Erase Algorithm In Progress Erase Suspend Read (Erase Suspended Sector) Erase Erase Suspend Read Suspended (Non-Erase Suspended Sector) Mode Erase Suspend Program (Non-Erase Suspended Sector) Data Data Data Notes: 1. Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle. Reading from non-erase suspend sector address will indicate logic “1” at the DQ2 bit. 2. DQ0 and DQ1 are reserve pins for future use. 3. DQ4 is Fujitsu internal use only. 23 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 DQ7 Data Polling The MBM29DL800TA/BA devices feature Data Polling as a method to indicate to the host that the Embedded Algorithms are in progress or completed. During the Embedded Program Algorithm an attempt to read the devices will produce the complement of the data last written to DQ7. Upon completion of the Embedded Program Algorithm, an attempt to read the device will produce the true data last written to DQ7. During the Embedded Erase Algorithm, an attempt to read the device will produce a “0” at the DQ7 output. Upon completion of the Embedded Erase Algorithm an attempt to read the device will produce a “1” at the DQ7 output. The flowchart for Data Polling (DQ7) is shown in Figure 23. For programming, the Data Polling is valid after the rising edge of fourth write pulse in the four write pulse sequence. For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth write pulse in the six write pulse sequence. Data Polling must be performed at sector address within any of the sectors being erased and not a protected sector. Otherwise, the status may not be valid. If a program address falls within a protected sector, Data Polling on DQ7 is active for approximately 1 µs, then that bank returns to the read mode. After an erase command sequence is written, if all sectors selected for erasing are protected, Data Polling on DQ7 is active for approximately 100 µs, then the bank returns to read mode. Once the Embedded Algorithm operation is close to being completed, the MBM29DL800TA/BA data pins (DQ7) may change asynchronously while the output enable (OE) is asserted low. This means that the devices are driving status information on DQ7 at one instant of time and then that byte’s valid data at the next instant of time. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the Embedded Algorithm operation and DQ7 has a valid data, the data outputs on DQ0 to DQ6 may be still invalid. The valid data on DQ0 to DQ7 will be read on the successive read attempts. The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm or sector erase time-out. (See Table 9.) See Figure 9 for the Data Polling timing specifications and diagrams. DQ6 Toggle Bit I The MBM29DL800TA/BA also feature the “Toggle Bit I” as a method to indicate to the host system that the Embedded Algorithms are in progress or completed. During an Embedded Program or Erase Algorithm cycle, successive attempts to read (OE toggling) data from the devices will result in DQ6 toggling between one and zero. Once the Embedded Program or Erase Algorithm cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts. During programming, the Toggle Bit I is valid after the rising edge of the fourth write pulse in the four write pulse sequence. For chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth write pulse in the six write pulse sequence. The Toggle Bit I is active during the sector time out. In programming, if the sector being written to is protected, the toggle bit will toggle for about 2 µs and then stop toggling without the data having changed. In erase, the devices will erase all the selected sectors except for the ones that are protected. If all selected sectors are protected, the chip will toggle the toggle bit for about 100 µs and then drop back into read mode, having changed none of the data. Either CE or OE toggling will cause the DQ6 to toggle. In addition, an Erase Suspend/Resume command will cause the DQ6 to toggle. 24 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 The system can use DQ6 to determine whether a sector is actively erasing or is erase-suspended. When a bank is actively erasing (that is, the Embedded Erase Algorithm is in progress), DQ6 toggles. When a bank enters the Erase Suspend mode, DQ6 stops toggling. Successive read cycles during the erase-suspend-program cause DQ6 to toggle. To operate toggle bit function properly, CE or OE must be high when bank address is changed. See Figure 10 for the Toggle Bit I timing specifications and diagrams. DQ5 Exceeded Timing Limits DQ5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under these conditions DQ5 will produce a “1”. This is a failure condition which indicates that the program or erase cycle was not successfully completed. Data Polling is the only operating function of the devices under this condition. The CE circuit will partially power down the device under these conditions (to approximately 2 mA). The OE and WE pins will control the output disable functions as described in Tables 2 and 3. The DQ5 failure condition may also appear if a user tries to program a non blank location without erasing. In this case the devices lock out and never complete the Embedded Algorithm operation. Hence, the system never reads a valid data on DQ7 bit and DQ6 never stops toggling. Once the devices have exceeded timing limits, the DQ5 bit will indicate a “1.” Please note that this is not a device failure condition since the devices were incorrectly used. If this occurs, reset the device with command sequence. DQ3 Sector Erase Timer After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase command sequence. If Data Polling or the Toggle Bit I indicates the device has been written with a valid erase command, DQ3 may be used to determine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by Data Polling or Toggle Bit I. If DQ3 is low (“0”), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent Sector Erase command. If DQ3 were high on the second status check, the command may not have been accepted. See Table 9: Hardware Sequence Flags. DQ2 Toggle Bit II This toggle bit II, along with DQ6, can be used to determine whether the devices are in the Embedded Erase Algorithm or in Erase Suspend. Successive reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase Algorithm. If the devices are in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause DQ2 to toggle. When the devices are in the erase-suspended-program mode, successive reads from the byte address of the non-erase suspended sector will indicate a logic “1” at the DQ2 bit. DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or Erase, or Erase Suspend Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized as follows: 25 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 For example, DQ2 and DQ6 can be used together to determine if the erase-suspend-read mode is in progress. (DQ2 toggles while DQ6 does not.) See also Table 9 and Figure 19. Furthermore, DQ2 can also be used to determine which sector is being erased. When the device is in the erase mode, DQ2 toggles if this bit is read from an erasing sector. To operate toggle bit function properly, CE or OE must be high when bank address is changed. DQ7 DQ6 DQ2 DQ7 Toggle 1 Erase 0 Toggle Toggle (Note) Erase-Suspend Read (Erase-Suspended Sector) 1 1 Toggle DQ7 Toggle 1 (Note) Mode Program Erase-Suspend Program Note: Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle. Reading from nonerase suspend sector address will indicate logic “1” at the DQ2 bit. RY/BY Ready/Busy The MBM29DL800TA/BA provide a RY/BY open-drain output pin as a way to indicate to the host system that the Embedded Algorithms are either in progress or has been completed. If the output is low, the devices are busy with either a program or erase operation. If the output is high, the devices are ready to accept any read/ write or erase operation. When the RY/BY pin is low, the devices will not accept any additional program or erase commands. If the MBM29DL800TA/BA are placed in an Erase Suspend mode, the RY/BY output will be high. During programming, the RY/BY pin is driven low after the rising edge of the fourth write pulse. During an erase operation, the RY/BY pin is driven low after the rising edge of the sixth write pulse. The RY/BY pin will indicate a busy condition during the RESET pulse. Refer to Figure 11 and 12 for a detailed timing diagram. The RY/BY pin is pulled high in standby mode. Since this is an open-drain output, RY/BY pins can be tied together in parallel with a pull-up resistor to VCC. Byte/Word Configuration The BYTE pin selects the byte (8-bit) mode or word (16-bit) mode for the MBM29DL800TA/BA devices. When this pin is driven high, the devices operate in the word (16-bit) mode. The data is read and programmed at DQ0 to DQ15. When this pin is driven low, the devices operate in byte (8-bit) mode. Under this mode, the DQ15/A-1 pin becomes the lowest address bit and DQ8 to DQ14 bits are tri-stated. However, the command bus cycle is always an 8-bit operation and hence commands are written at DQ0 to DQ7 and the DQ8 to DQ15 bits are ignored. Refer to Figures 13, 14 and 15 for the timing diagram. Data Protection The MBM29DL800TA/BA are designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transitions. During power up the devices automatically reset the internal state machine in the Read mode. Also, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific multi-bus cycle command sequences. The devices also incorporate several features to prevent inadvertent write cycles resulting form VCC power-up and power-down transitions or system noise. 26 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Low VCC Write Inhibit To avoid initiation of a write cycle during VCC power-up and power-down, a write cycle is locked out for VCC less than 2.3 V (typically 2.4 V). If VCC < VLKO, the command register is disabled and all internal program/erase circuits are disabled. Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the VCC level is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to prevent unintentional writes when VCC is above 2.3 V. If Embedded Erase Algorithm is interrupted, there is possibility that the erasing sector(s) cannot be used. Write Pulse “Glitch” Protection Noise pulses of less than 5 ns (typical) on OE, CE, or WE will not initiate a write cycle. Logical Inhibit Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a write cycle CE and WE must be a logical zero while OE is a logical one. Power-Up Write Inhibit Power-up of the devices with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of WE. The internal state machine is automatically reset to the read mode on power-up. 27 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ ABSOLUTE MAXIMUM RATINGS Storage Temperature .................................................................................................. –55°C to +125°C Ambient Temperature with Power Applied .................................................................. –40°C to +85°C Voltage with respect to Ground All pins except A9, OE, RESET (Note 1) ................... –0.5 V to VCC+0.5 V VCC (Note 1) ................................................................................................................ –0.5 V to +5.5 V A9, OE, and RESET (Note 2) ...................................................................................... –0.5 V to +13.0 V Notes: 1. Minimum DC voltage on input or I/O pins are –0.5 V. During voltage transitions, inputs may negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on output and I/O pins are VCC +0.5 V. During voltage transitions, outputs may positive overshoot to VCC +2.0 V for periods of up to 20 ns. 2. Minimum DC input voltage on A9, OE and RESET pins are –0.5 V. During voltage transitions, A9, OE and RESET pins may negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC input voltage on A9, OE and RESET pins are +13.0 V which may positive overshoot to 14.0 V for periods of up to 20 ns. when VCC is applied. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING RANGES Ambient Temperature (TA) ........................................................................................... –40°C to +85°C VCC Supply Voltages MBM29DL800TA/BA-70 ........................................................................................... +3.0 V to +3.6 V MBM29DL800TA/BA-90/-12..................................................................................... +2.7 V to +3.6 V Operating ranges define those limits between which the functionality of the devices are guaranteed. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 28 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ MAXIMUM OVERSHOOT 20 ns 20 ns +0.6 V –0.5 V –2.0 V 20 ns Figure 1 Maximum Negative Overshoot Waveform 20 ns V CC +2.0 V V CC +0.5 V +2.0 V 20 ns Figure 2 20 ns Maximum Positive Overshoot Waveform 1 20 ns +14.0 V +13.0 V V CC +0.5 V 20 ns 20 ns *: This waveform is applied for A9, OE, and RESET. Figure 3 Maximum Positive Overshoot Waveform 2 29 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ DC CHARACTERISTICS Parameter Symbol Parameter Description Test Conditions Max. Unit ILI Input Leakage Current VIN = VSS to VCC, VCC = VCC Max. –1.0 +1.0 µA ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC Max. –1.0 +1.0 µA ILIT A9, OE, RESET Inputs Leakage Current VCC = VCC Max. A9, OE, RESET = 12.5 V — 35 µA CE = VIL, OE = VIH, f=10 MHz ICC1 Byte 18 — Word mA 20 VCC Active Current (Note 1) CE = VIL, OE = VIH, f=5 MHz Byte 8 — Word mA 10 ICC2 VCC Active Current (Note 2) CE = VIL, OE = VIH — 35 mA ICC3 VCC Current (Standby) VCC = VCC Max., CE = VCC ± 0.3 V, RESET = VCC ± 0.3 V — 5 µA ICC4 VCC Current (Standby, Reset) VCC = VCC Max., RESET = VSS ± 0.3 V — 5 µA ICC5 VCC = VCC Max., CE = VSS ± 0.3 V, VCC Current RESET = VCC ± 0.3 V (Automatic Sleep Mode) (Note 3) VIN = VCC ± 0.3 V or VSS ± 0.3 V — 5 µA VCC Active Current (Note 5) (Read-While-Program) Byte — 45 ICC6 CE = VIL, OE = VIH Word — 45 VCC Active Current (Note 5) (Read-While-Erase) Byte — 45 CE = VIL, OE = VIH Word — 45 ICC8 VCC Active Current (Erase-Suspend-Program) CE = VIL, OE = VIH — 35 mA VIL Input Low Level — –0.5 0.6 V VIH Input High Level — 2.0 VCC+0.3 V VID Voltage for Autoselect and Sector Protection (A9, OE, RESET) (Note 4) — 11.5 12.5 V VOL Output Low Voltage Level IOL = 4.0 mA, VCC = VCC Min. — 0.45 V IOH = –2.0 mA, VCC = VCC Min. 2.4 — V VCC–0.4 — V 2.3 2.5 V ICC7 VOH1 Output High Voltage Level VOH2 VLKO Notes: 1. 2. 3. 4. 5. 30 Min. Low VCC Lock-Out Voltage IOH = –100 µA — mA mA The ICC current listed includes both the DC operating current and the frequency dependent component. ICC active while Embedded Algorithm (program or erase) is in progress. Automatic sleep mode enables the low power mode when address remain stable for 300 ns. Applicable for only VCC applying. Embedded Algorithm (program or erase) is in progress. (@5 MHz) MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ AC CHARACTERISTICS • Read Only Operations Characteristics Parameter Symbols Description JEDEC Standard tAVAV tRC Read Cycle Time tAVQV tACC tELQV -70 -90 (Note) (Note) Test Setup -12 (Note) Unit — Min. 70 90 120 ns Address to Output Delay CE = VIL OE = VIL Max. 70 90 120 ns tCE Chip Enable to Output Delay OE = VIL Max. 90 90 120 ns tGLQV tOE Output Enable to Output Delay — Max. 30 35 50 ns tEHQZ tDF Chip Enable to Output High-Z — Max. 25 30 30 ns tGHQZ tDF Output Enable to Output High-Z — Max. 25 30 30 ns tAXQX tOH Output Hold Time From Addresses, CE or OE, Whichever Occurs First — Min. 0 0 0 ns — tREADY RESET Pin Low to Read Mode — Max. 20 20 20 µs — tELFL tELFH CE or BYTE Switching Low or High — Max. 5 5 5 ns Note: Test Conditions: Output Load: 1 TTL gate and 30 pF (MBM29DL800TA/BA-70) 1 TTL gate and 100 pF (MBM29DL800TA/BA-90/-12) Input rise and fall times: 5 ns Input pulse levels: 0.0 V to 3.0 V Timing measurement reference level Input: 1.5 V Output:1.5 V 3.3 V IN3064 or Equivalent 2.7 kΩ Device Under Test 6.2 kΩ CL Diodes = IN3064 or Equivalent Notes: CL = 30 pF including jig capacitance (MBM29LV800TA/BA-90) CL = 100 pF including jig capacitance (MBM29LV800TA/BA-10/-12) Figure 4 Test Conditions 31 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 • Write/Erase/Program Operations Parameter Symbols MBM29DL800TA/BA Description JEDEC Standard tAVAV tWC Write Cycle Time tAVWL tAS — Unit -70 -90 -12 Min. 70 90 120 ns Address Setup Time Min. 0 0 0 ns tASO Address Setup Time to OE Low During Toggle Bit Polling Min. 15 15 15 ns tWLAX tAH Address Hold Time Min. 45 45 50 ns — tAHT Address Hold Time from CE or OE High During Toggle Bit Polling Min. 0 0 0 ns tDVWH tDS Data Setup Time Min. 35 45 50 ns tWHDX tDH Data Hold Time Min. 0 0 0 ns Min. 0 0 0 ns tOEH Output Enable Hold Time Read — Toggle and Data Polling Min. 10 10 10 ns — tCEPH CE High During Toggle Bit Polling Min. 20 20 25 ns — tOEPH OE High During Toggle Bit Polling Min. 20 20 25 ns tGHWL tGHWL Read Recover Time Before Write Min. 0 0 0 ns tGHEL tGHEL Read Recover Time Before Write Min. 0 0 0 ns tELWL tCS CE Setup Time Min. 0 0 0 ns tWLEL tWS WE Setup Time Min. 0 0 0 ns tWHEH tCH CE Hold Time Min. 0 0 0 ns tEHWH tWH WE Hold Time Min. 0 0 0 ns tWLWH tWP Write Pulse Width Min. 35 45 50 ns tELEH tCP CE Pulse Width Min. 35 45 50 ns tWHWL tWPH Write Pulse Width High Min. 25 25 30 ns tEHEL tCPH CE Pulse Width High Min. 25 25 30 ns tWHWH1 tWHWH1 Byte Programming Operation Typ. 8 8 8 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 1) Typ. 1 1 1 sec — tVCS VCC Setup Time Min. 50 50 50 µs — tVIDR Rise Time to VID (Note 2) Min. 500 500 500 ns — tVLHT Voltage Transition Time (Note 2) Min. 4 4 4 µs — tWPP Write Pulse Width (Note 2) Min. 100 100 100 µs — tOESP OE Setup Time to WE Active (Note 2) Min. 4 4 4 µs (Continued) 32 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 (Continued) Parameter Symbols MBM29DL800TA/BA Description JEDEC Standard — tCSP CE Setup Time to WE Active (Note 2) — tRB — Unit -70 -90 -12 Min. 4 4 4 µs Recover Time From RY/BY Min. 0 0 0 ns tRP RESET Pulse Width Min. 500 500 500 ns — tRH RESET Hold Time Before Read Min. 200 200 200 ns — tFLQZ BYTE Switching Low to Output High-Z Max. 30 35 50 ns — tFHQV BYTE Switching High to Output Active Min. 30 35 50 ns — tBUSY Program/Erase Valid to RY/BY Delay Max. 90 90 90 ns — tEOE Delay Time from Embedded Output Enable Max. 30 35 50 ns Notes: 1. This does not include the preprogramming time. 2. This timing is for Sector Protection operation. 33 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ SWITCHING WAVEFORMS • Key to Switching Waveforms WAVEFORM INPUTS OUTPUTS Must Be Steady Will Be Steady May Change from H to L Will Be Changing from H to L May Change from L to H Will Be Changing from L to H “H” or “L” Any Change Permitted Changing State Unknown Does Not Apply Center Line is HighImpedance “Off” State t RC Addresses Addresses Stable t ACC CE t OE t DF OE t OEH WE t CE Outputs High-Z Figure 5.1 34 Output Valid AC Waveforms for Read Operations High-Z MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 t RC Addresses Addresses Stable t ACC CE t RH t RP t RH t CE RESET t OH High-Z Outputs Figure 5.2 Output Valid AC Waveforms for Hardware Reset/Read Operations 35 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Data Polling 3rd Bus Cycle Addresses 555H t WC PA t AS PA t RC t AH CE t CH t CS t CE OE t GHWL t WP t WPH t OE t WHWH1 WE t OH t DS t DH Data Notes: 1. 2. 3. 4. 5. 6. A0H DQ 7 D OUT D OUT PA is address of the memory location to be programmed. PD is data to be programmed at byte address. DQ7 is the output of the complement of the data written to the device. DOUT is the output of the data written to the device. Figure indicates last two bus cycles out of four bus cycle sequence. These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.) Figure 6 36 PD Alternate WE Controlled Program Operations MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 3rd Bus Cycle Addresses Data Polling PA 555H t WC t AS PA t AH WE t WS t WH OE t GHEL t CP t CPH t WHWH1 CE t DS t DH Data Notes: 1. 2. 3. 4. 5. 6. A0H PD DQ 7 D OUT PA is address of the memory location to be programmed. PD is data to be programmed at byte address. DQ7 is the output of the complement of the data written to the device. DOUT is the output of the data written to the device. Figure indicates last two bus cycles out of four bus cycle sequence. These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.) Figure 7 Alternate CE Controlled Program Operations 37 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Addresses 2AAH 555H t WC t AS 555H 555H 2AAH SA t AH CE t CS t CH OE t GHWL t WP t WPH WE t DS AAH Data t DH 55H 80H AAH 55H 10H/ 30H t VCS V CC Notes: 1. SA is the sector address for Sector Erase. Addresses = 555H (Word), AAAH (Byte) for Chip Erase. 2. These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.) Figure 8 38 AC Waveforms Chip/Sector Erase Operations MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 CE t CH t OE t DF OE t OEH WE t CE * DQ7 Data DQ7 = Valid Data DQ7 High-Z t WHWH1 or 2 DQ0 to DQ6 Data DQ0 to DQ6 = Output Flag t BUSY DQ0 to DQ6 Valid Data High-Z t EOE RY/BY * : DQ7 = Valid Data (The device has completed the Embedded operation). Figure 9 AC Waveforms for Data Polling during Embedded Algorithm Operations 39 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Address tAHT tASO tAHT tAS CE tCEPH WE tOEPH tOEH tOEH OE tDH DQ 6/DQ2 tOE Toggle Data Data tCE Toggle Data Toggle Data * Stop Toggling Output Valid tBUSY RY/BY * : DQ6 stops toggling (The device has completed the Embedded operation). Figure 10 40 AC Waveforms for Toggle Bit I during Embedded Algorithm Operations MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 CE The rising edge of the last write pulse WE Entire programming or erase operations RY/BY t BUSY Figure 11 RY/BY Timing Diagram during Program/Erase Operations WE RESET tRP t RB RY/BY tREADY Figure 12 RESET/RY/BY Timing Diagram 41 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 CE BYTE Data Output (DQ0 to DQ7) DQ0 to DQ14 tELFH DQ15/A-1 Data Output (DQ0 to DQ14) tFHQV DQ15 A-1 Figure 13 Timing Diagram for Word Mode Configuration CE BYTE DQ0 to DQ14 tELFL DQ15/A-1 Data Output (DQ0 to DQ7) Data Output (DQ0 to DQ14) DQ15 A-1 tFLQZ Figure 14 Timing Diagram for Byte Mode Configuration The falling edge of the last write signal CE or WE Input Valid BYTE tSET (tAS) Figure 15 42 tHOLD (tAH) BYTE Timing Diagram for Write Operations MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 A18, A17, A16 A15, A14 A13, A12 SAX SAY A0 A1 A6 12 V 3V A9 t VLHT 12 V 3V OE t VLHT t VLHT t VLHT t WPP WE t OESP t CSP CE Data 01H t VCS t OE VCC SAX : Sector Address for initial sector SAY : Sector Address for next sector Note: A-1 is VIL on byte mode. Figure 16 AC Waveforms for Sector Protection 43 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 VCC tVIDR tVCS tVLHT VID 3V 3V RESET CE WE tVLHT tVLHT Program or Erase Command Sequence RY/BY Unprotection period Figure 17 Address Temporary Sector Unprotection Timing Diagram Read Command Read Command Read Read tRC tWC tRC tWC tRC tRC BA2 (PA) BA1 BA2 (PA) BA2 (555H) BA1 tAS BA1 tACC tAH tAS tAHT tCE CE tOE tCEPH OE tGHWL tDF tOEH tWP WE tDS DQ tDH tDF is read from sector. Note: DQ2 Valid Validthe erase-suspended Valid Valid Output Intput (A0H) Output Intput (PD) Valid Output Status Note: This is example of Read for Bank 1 and Embedded Algorithm (program) for Bank 2. BA1: Address of Bank 1. BA2: Address of Bank 2. Figure 18 44 Back-to-back Read/Write Timing Diagram MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Enter Embedded Erasing WE Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Read Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete DQ6 DQ2 Toggle DQ2 and DQ6 with OE or CE Note: DQ2 is read from the erase-suspended sector. Figure 19 DQ2 vs. DQ6 45 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 VCC tVCS RESET tVLHT tVIDR Add SPAX SPAX SPAY A0 A1 A6 CE OE tWP TIME-OUT WE Data 60H 60H 40H 01H tOE SPAX : Sector Address to be protected SPAY : Next Sector Address to be protected TIME-OUT : Time-Out window = 150 µs (min) Figure 20 46 Extended Sector Protection Timing Diagram 60H MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 EMBEDDED ALGORITHMS Start Write Program Command Sequence (See below) Data Polling Device No Increment Address Last Address ? Yes Programming Completed Program Command Sequence* (Address/Command): 555H/AAH 2AAH/55H 555H/A0H Program Address/Program Data * : The sequence is applied for × 16 mode. The addresses differ from × 8 mode. Figure 21 Embedded ProgramTM Algorithm 47 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 EMBEDDED ALGORITHMS Start Write Erase Command Sequece (See below) Data Polling or Toggle Bit Successfully Completed Erasure Completed Chip Erase Command Sequence* (Address/Command): Individual Sector/Multiple Sector* Erase Command Sequence (Address/Command): 555H/AAH 555H/AAH 2AAH/55H 2AAH/55H 555H/80H 555H/80H 555H/AAH 555H/AAH 2AAH/55H 2AAH/55H 555H/10H Sector Address/30H Sector Address/30H Additional sector erase commands are optional. Sector Address/30H * : The sequence is applied for × 16 mode. The addresses differ from × 8 mode. Figure 22 48 Embedded EraseTM Algorithm MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Start Read (DQ 0 to DQ 7) Addr. = VA DQ 7 = Data? VA = Byte address for programming = Any of the sector addresses within the sector being erased during sector erase or multiple sector erases operation = Any of the sector addresses within the sector not being protected during chip erase Yes No No DQ 5 = 1? Yes Read (DQ 0 to DQ 7) Addr. = VA DQ 7 = Data? Yes No Fail Pass Note: DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. Figure 23 Data Polling Algorithm 49 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Start Read (DQ 0 to DQ 7) Addr. = VA DQ 6 = Toggle ? VA = Bank address being executed Embedded Algorithm. No Yes No DQ 5 = 1? Yes Read (DQ 0 to DQ 7) Addr. = VA DQ 6 = Toggle ? No Yes Fail Pass Note: DQ6 is rechecked even if DQ5 = “1” because DQ6 may stop toggling at the same time as DQ5 changing to “1” . Figure 24 50 Toggle Bit Algorithm MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Start Setup Sector Addr. (A18, A17, A16, A15, A14, A13, A12) PLSCNT = 1 OE = V ID, A 9 = V ID, A 6 = CE = V IL, RESET = V IH A 0 = V IL, A 1 = V IH Activate WE Pulse Time out 100 µs Increment PLSCNT WE = V IH, CE = OE = V IL (A 9 should remain V ID) Read from Sector (Addr. = SA, A 0 = V IL, A 1 = V IH, A 6 = V IL)* No No PLSCNT = 25? Yes Remove V ID from A 9 Write Reset Command Data = 01H? Yes Yes Protect Another Sector? No Device Failed Remove V ID from A 9 Write Reset Command Sector Protection Completed * : A-1 is V IL on byte mode. Figure 25 Sector Protection Algorithm 51 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 Start RESET = VID (Note 1) Perform Erase or Program Operations RESET = VIH Temporary Sector Unprotection Completed (Note 2) Notes: 1. All protected sectors are unprotected. 2. All previously protected sectors are protected once again. Figure 26 52 Temporary Sector Unprotection Algorithm MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 FAST MODE ALGORITHM Start RESET = VID Wait to 4 µs Device is Operating in Temporary Sector Unprotection Mode No Extended Sector Protection Entry? Yes To Setup Sector Protection Write XXXH/60H PLSCNT = 1 To Sector Protection Write SPA/60H (A0 = VIL, A1 = VIH, A6 = VIL) Time Out 150 µs Increment PLSCNT To Verify Sector Protection Write SPA/40H (A0 = VIL, A1 = VIH, A6 = VIL) Setup Next Sector Address Read from Sector Address (A0 = VIL, A1 = VIH, A6 = VIL) No No PLSCNT = 25? Yes Data = 01H? Yes Remove VID from RESET Write Reset Command Protection Other Sector ? No Yes Remove VID from RESET Write Reset Command Device Failed Sector Protection Completed Figure 27 Extended Sector Protection Algorithm 53 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 FAST MODE ALGORITHM Start 555H/AAH Set Fast Mode 2AAH/55H 555H/20H XXXH/A0H Program Address/Program Data Data Polling Device Verify Byte? No In Fast Program Yes Increment Address No Last Address ? Yes Programming Completed (BA) XXXH/90H Reset Fast Mode XXXH/F0H * : The sequence is applied for × 16 mode. The addresses differ from × 8 mode. Figure 28 54 Embedded ProgramTM Algorithm for Fast Mode MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ ERASE AND PROGRAMMING PERFORMANCE Limits Parameter Unit Comments Min. Typ. Max. Sector Erase Time — 1 10 sec Word Programming Time — 16 360 µs Byte Programming Time — 8 300 µs Chip Programming Time — 8.4 25 sec 100,000 — — cycles Program/Erase Cycle Excludes programming time prior to erasure Excludes system-level overhead Excludes system-level overhead — ■ TSOP(I) PIN CAPACITANCE Parameter Symbol Parameter Description Test Setup CIN Input Capacitance VIN = 0 COUT Output Capacitance VOUT = 0 CIN2 Control Pin Capacitance VIN = 0 Typ. Max. Unit 6 7.5 pF 8.5 12 pF 8 10 pF Typ. Max. Unit 6 7.5 pF 8.5 12 pF 8 10 pF Note: Test conditions TA = 25°C, f = 1.0 MHz ■ FBGA PIN CAPACITANCE Parameter Symbol Parameter Description Test Setup CIN Input Capacitance VIN = 0 COUT Output Capacitance VOUT = 0 CIN2 Control Pin Capacitance VIN = 0 Note: Test conditions TA = 25°C, f = 1.0 MHz 55 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 ■ PACKAGE DIMENSIONS 48-pin plastic TSOP(I) (FPT-48P-M19) * Resin Protrusion. (Each Side: 0.15 (.006)Max) LEAD No. 1 48 Details of "A" part INDEX 0.15(.006) MAX 0.35(.014) MAX "A" 0.15(.006) 24 0.25(.010) 25 * 12.00±0.20 20.00±0.20 (.787±.008) * 18.40±0.20 (.724±.008) (.472±.008) 11.50REF (.460) +0.10 1.10 –0.05 +.004 .043 –.002 (Mounting height) (Mounting height) 0.50(.0197) TYP 0.10(.004) 0.15±0.05 (.006±.002) 19.00±0.20 (.748±.008) C 0.05(0.02)MIN (STAND OFF) 0.20±0.10 (.008±.004) 0.10(.004) M 0.50±0.10 (.020±.004) Dimensions in mm (inches) 1996 FUJITSU LIMITED F48029S-2C-2 48-pin plastic TSOP(I) (FPT-48P-M20) * Resin Protrusion. (Each Side: 0.15 (.006)Max) EAD No. 1 48 Details of "A" part INDEX 0.15(.006) MAX 0.35(.014) MAX "A" 0.15(.006) 24 0.25(.010) 25 19.00±0.20 (.748±.008) 0.50±0.10 (.020±.004) 0.15±0.10 (.006±.002) 0.10(.004) 0.20±0.10 (.008±.004) 0.50(.0197) TYP 0.10(.004) M 0.05(0.02)MIN (STAND OFF) +0.10 1.10 –0.05 * 18.40±0.20 (.724±.008) 20.00±0.20 (.787±.008) C 1996 FUJITSU LIMITED F48030S-2C-2 11.50(.460)REF +.004 .043 –.002 (Mounting height) (Mounting height) * 12.00±0.20(.472±.008) Dimensions in mm (inches) (Continued) 56 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 (Continued) 48-pin plastic FBGA (BGA-48P-M02) Note: The actual shape of corners may differ from the dimension. 9.00±0.20(.354±.008) (Mounting height) 5.60(.221) 1.20(.047)MAX (Mounting height) 0.35±0.10(.014±.004) (Stand off) 0.80(.031)NOM 6 INDEX 6.00±0.20 (.236±.008) 5 0.80(.031) NOM 4.00(.157) 4 3 2 1 H G F E D Ø0.40±0.10 (.016±.004) C B A Ø0.08(.003) M 0.10(.004) C 1997 FUJITSU LIMITED B48002S-1C-2 Dimensions in mm (inches) (Continued) 57 MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 (Continued) 48-pin plastic FBGA (BGA-48P-M12) Note: The actual shape of corners may differ from the dimension. +0.15 9.00±0.20(.354±.008) +.006 1.05 –0.10 .041 –.004 (Mounting height) 0.38±0.10(.015±.004) (Stand off) 5.60(.221) 0.80(.031)TYP 6 5 INDEX 6.00±0.20 (.236±.008) 4 4.00(.157) 3 2 1 H C0.25(.010) G F E D 48-Ø0.45±0.10 (48-.018±.004) C B A Ø0.08(.003) M 0.10(.004) C 58 1998 FUJITSU LIMITED B480012S-2C-2 Dimensions in mm (inches) MBM29DL800TA-70/-90/-12/MBM29DL800BA-70/-90/-12 FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: 81(44) 754-3763 Fax: 81(44) 754-3329 http://www.fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www.fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have an inhereut chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. http://www.fmap.com.sg/ F9904 FUJITSU LIMITED Printed in Japan 59