SEMICONDUCTOR TECHNICAL DATA The MC10134 is a dual multiplexer with clocked D type latches. Each latch may be clocked separately by holding the common clock in the low state, and using the clock enable inputs for the clocking function. If the common clock is to be used to clock the latch, the clock enable (CE) inputs must be in the low state. In this mode, the enable inputs perform the function of controlling the common clock (CC). The data select inputs determine which data input is enabled. A high (H) level on the A0 input enables data input D12 and a low (L) level on the A0 input enables data input D11. A high (H) level on the A1 input enables data input D22 and a low (L) level on the A1 input enables data input D21. Any change on the data input will be reflected at the outputs while the clock is low. The outputs are latched on the positive transition of the clock. While the clock is in the high state, a change in the information present at the data inputs will not affect the output information. L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 PD = 225 mW typ/pkg (No Load) tpd = 3.0 ns typ tr, tf = 2.5 ns typ (20%–80%) DIP PIN ASSIGNMENT LOGIC DIAGRAM A0 6 A1 11 D11 4 1 16 VCC2 Q1 2 15 Q2 Q1 3 14 Q2 D11 4 13 D21 D12 5 12 D22 Q1 A0 6 11 A1 15 Q2 CC 7 10 CEO VEE 8 9 CE1 2 D12 5 CEO 10 CC VCC1 3 7 CE1 9 D21 13 Q1 14 Q2 D22 12 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 TRUTH TABLE C A0 D11 D12 L L L X Qn+1 L L L H X H L H X L L L H X H H H X X X Qn C = CE + C C 3/93 Motorola, Inc. 1996 3–17 REV 5 MC10134 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Power Supply Drain Current Input Current Symbol Pin Pi Under Test IE 8 60 IinH 4 5 6 7 10 460 460 425 460 425 IinL 4* 0.5 –30°C Min +25°C Max Min Typ +85°C Max Unit 55 60 mAdc 290 290 265 290 265 290 290 265 290 265 µAdc Max 0.5 Min µAdc 0.3 Output Voltage Logic 1 VOH 2 2 –1.060 –1.060 –0.890 –0.890 –0.960 –0.960 –0.810 –0.810 –0.890 –0.890 –0.700 –0.700 Vdc Output Voltage Logic 0 VOL 2 2 –1.890 –1.890 –1.675 –1.675 –1.850 –1.850 –1.650 –1.650 –1.825 –1.825 –1.615 –1.615 Vdc Threshold Voltage Logic 1 VOHA 2 2 –1.080 –1.080 Threshold Voltage Logic 0 VOLA 2 2 Switching Times –0.980 –0.980 –1.655 –1.655 –0.910 –0.910 –1.630 –1.630 Vdc –1.595 –1.595 (50Ω Load) ns Propagation Delay Data Clock Select t4+2+ t10–2+ t6+2+ 2 2 2 1.0 1.0 1.0 Setup Time Data Select tsetup tsetup 2 2 2.5 3.5 2.5 3.5 2.5 3.5 Hold Time Data Select thold thold 2 2 1.5 1.0 1.5 1.0 1.5 1.0 Rise Time (20 to 80%) t2+ 2 1.5 3.7 1.5 3.5 1.5 3.8 2 1.5 3.7 1.5 3.5 1.5 3.8 Fall Time (20 to 80%) t2– * All other inputs tested in the same manner. MOTOROLA Vdc 3.5 6.0 4.8 3–18 1.0 1.0 1.0 3.3 5.7 4.6 1.0 1.0 1.0 3.6 6.3 5.0 MECL Data DL122 — Rev 6 MC10134 ELECTRICAL CHARACTERISTICS (continued) TEST VOLTAGE VALUES (Volts) Characteristic @ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE –30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2 Symbol Pin Under Test IE 8 IinH 4 5 6 7 10 Power Supply Drain Current Input Current TEST VOLTAGE APPLIED TO PINS LISTED BELOW VIHmax VILmin VIHAmin VILAmax 4 5 6 7 10 VEE (VCC) Gnd 8 1, 16 8 8 8 1, 16 1, 16 1, 16 IinL 4* 4 8 1, 16 Output Voltage Logic 1 VOH 2 2 4 5,6 6,7,10 7,10 8 8 1, 16 1, 16 Output Voltage Logic 0 VOL 2 2 6 4,6,7,10 5,7,10 8 8 1, 16 1, 16 2 2 6 6,7,10 7,10 8 8 1, 16 1, 16 2 2 6 6,7,10 7,10 4 5 8 8 1, 16 1, 16 Threshold Voltage Threshold Voltage Switching Times Propagation Delay Setup Time Hold Time Logic 1 VOHA Logic 0 VOLA (50Ω Load) 4 5 +1.11 V +0.31 V Pulse In Pulse Out –3.2 V +2.0 V Data Clock Select t4+2+ t10–2+ t6+2+ 2 2 2 4 5 6,7,10 7 7,10 4 10 6 2 2 2 8 8 8 1, 16 1, 16 1, 16 Data Select tsetup tsetup 2 2 5 6,7 7,11 4,10 6,10 2 2 8 8 1, 16 1, 16 Data Select thold thold 2 2 5 6,7 7,11 4,10 6,10 2 2 8 8 1, 16 1, 16 Rise Time (20 to 80%) t2+ 2 6,7,10 4 2 8 1, 16 Fall Time (20 to 80%) t2– 2 6,7,10 4 2 8 1, 16 * All other inputs tested in the same manner. Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner. MECL Data DL122 — Rev 6 3–19 MOTOROLA MC10134 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 3–20 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10134 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 3–21 MC10134/D MOTOROLA