MC10H136 Universal Hexadecimal Counter Description The MC10H136 is a high speed synchronous hexadecimal counter. This 10H part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in counting frequency and no increase in power-supply current. http://onsemi.com MARKING DIAGRAMS* Features • Counting Frequency, 250 MHz Minimum • Power Dissipation, 625 mW Typical • Improved Noise Margin 150 mV 16 MC10H136L AWLYYWW (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K Compatible • Pb−Free Packages are Available* 1 CDIP−16 L SUFFIX CASE 620A 16 MC10H136P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 1 1 20 10H136G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 8 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Publication Order Number: MC10H136/D MC10H136 Table 1. FUNCTION SELECT TABLE CIN X L H L H X S1 L L L H H H S2 L H H L L H Operating Mode Preset (Program) Increment (Count Up) Hold Count Decrement (Count Down) Hold Count Hold (Stop Count) Table 2. SEQUENTIAL TRUTH TABLE* INPUTS OUTPUTS S1 S2 D0 D1 D2 D3 Carry Clock Q0 Q1 Q2 Q3 Carry In ** Out L L L L L H H H L H L H H H L L H L H L H L H L L X X X L X X X H X X X H X X X X L L L H H H H L H L H L L H H H H H H H H H H L H H L X X X X X X H H X X X X X X X X X X X L X X X X X X X L X X X X H H X X L H H H H H H H H H H H L H L H H H H H H L L H H H H L L L L H H H H L L L L H H H H L H H L H L L L L VCC1 1 16 VCC2 Q2 2 15 Q1 Q3 3 14 Q0 COUT 4 13 CLOCK D3 5 12 D0 D2 6 11 D1 S2 7 10 CIN VEE 8 9 S1 Pin assignment is for Dual−in−Line Package. Figure 1. Pin Assignment * Truth table shows logic states assuming inputs vary in sequence shown from top to bottom. ** A clock H is defined as a clock input transition from a low to a high logic level. Table 3. MAXIMUM RATINGS Symbol Characteristic Rating Unit VEE Power Supply (VCC = 0) −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10H136 Table 4. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol IE IinH Characteristic 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 165 − 150 − 165 mA Input Current High Pins 5, 6, 11, 12, 13 Pin 9 Pin 7 Pin 10 − − − − 430 670 535 380 − − − − 275 420 335 240 − − − − 275 420 335 240 0.5 − 0.5 − 0.3 − mA mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. http://onsemi.com 3 MC10H136 Table 5. AC CHARACTERISTICS 0° Symbol tpd tset thold fcount Characteristic 25° 75° Min Max Min Max Min Max 0.7 1.0 2.3 4.8 0.7 1.0 2.4 4.9 0.7 1.0 2.5 5.0 0.7 2.5 0.7 2.6 0.7 2.7 Set-up Time Data (D0 to C) Select (S to C) Carry In (Cin to C) (C to Cin) 2.0 3.5 2.0 0 − − − − 2.0 3.5 2.0 0 − − − − 2.0 3.5 2.0 0 − − − − Hold Time Data (C to D0) Select (C to S) Carry In (C to Cin) (Cin to C) 0 −0.5 0 2.2 − − − − 0 −0.5 0 2.2 − − − − 0 −0.5 0 2.2 − − − − Propagation Delay Clock to Q Clock to Carry Out Carry in to Carry Out Unit ns ns ns Counting Frequency 250 − 250 − 250 − MHz tr Rise Time 0.5 2.3 0.5 2.4 0.5 2.5 ns tf Fall Time 0.5 2.3 0.5 2.4 0.5 2.5 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. S1 9 S2 7 Carry In 10 T T Q0 T Q1 Q0 C T Q1 T C T Q3 T T Q3 TTC T Q2 T T Q2 T C Clock 13 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 12 D0 14 Q0 11 D1 15 Q1 6 D2 2 Q2 NOTE: FLIP-FLOPS WILL TOGGLE WHEN ALL T INPUTS ARE LOW. Figure 2. Logic Diagram http://onsemi.com 4 5 D3 3 Q3 4 Carry Out MC10H136 APPLICATION INFORMATION The MC10H136 is a high speed synchronous counter that operates at 250 MHz. Counter operating modes include count up, count down, pre-set and hold count. This device allows the designer to use one basic counter for many applications. The S1, S2, control lines determine the operating modes of the counter. In the pre-set mode, a clock pulse is necessary to load the counter with the information present on the data inputs (D0, D1, D2, and D3). Carry out goes low on the terminal count or when the counter is being pre-set. ORDERING INFORMATION Package Shipping † MC10H136FN PLLC−20 46 Units / Rail MC10H136FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H136FNR2 PLLC−20 500 / Tape & Reel MC10H136FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H136L CDIP−16 25 Unit / Rail MC10H136P PDIP−16 25 Unit / Rail MC10H136PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC10H136 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 6 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H136 PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. M L 16X 0.25 (0.010) E M DIM A B C D E F G H K L M N J T B F C K T N MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 SEATING PLANE G 16X 0.25 (0.010) M D T A PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C L S −T− H INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC10H136 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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