SEMICONDUCTOR TECHNICAL DATA The MC10H334 is a Quad Bus Driver/Receiver with transmit and receiver latches. When disabled, (OE = high) the bus outputs will fall to –2.0 V. Data to be transmitted or received is passed through its respective latch when the respective latch enable (DLE and RLE) is at a low level. Information is latched on the positive transition of DLE and RLE. The parameters specified are with 25 Ω loading on the bus drivers and 50 Ω loads on the receivers. L SUFFIX CERAMIC PACKAGE CASE 732–03 P SUFFIX PLASTIC PACKAGE CASE 738–03 • Propagation Delay, 1.6 ns Typical Data–to–Output • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible FN SUFFIX PLCC CASE 775–02 DIP & PLCC PIN ASSIGNMENT MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc 0 to VEE Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 161 — 161 — 161 mA — — — 397 460 520 — — — 273 297 357 — — — 273 297 357 0.5 — 0.5 — 0.3 — µA Input Current High Pins 5,6,15,16 Pins 7,14 Pin 17 IinH Input Current Low IinL VOH High Output Voltage µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc AC PARAMETERS Propagation Delay Data–to–Bus Output DLE–to–Bus Output OE–to–Bus Output Bus–to–R0 RLE–to–R0 Data–to–Receiver R0 Rise Time Fall Time tpd tr tf ns 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 0.5 2.2 0.5 2.2 0.5 2.2 ns 0.5 2.2 0.5 2.2 0.5 2.2 ns 2–37 20 VCC03 BUS1 2 19 BUS2 BUS0 3 18 BUS3 VCC02 4 17 OE D1 5 16 D2 D0 6 15 D3 DLE 7 14 RLE R0 8 13 R3 R1 9 12 R2 10 11 VCC02 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Receiver outputs are terminated through a 50–ohm resistor to –2.0 volts dc. Bus outputs are terminated through a 25–ohm resistor to –2.0 volts dc. 3/93 Motorola, Inc. 1996 1 VEE VOL VIH Low Output Voltage VCC REV 5 MC10H334 LOGIC DIAGRAM 17 OE 7 DLE G 6 D0 D Q BUS0 3 5 D1 D Q BUS1 2 16 D2 D Q BUS2 19 15 D3 D Q BUS3 18 14 RLE 8 R0 Q D 9 R1 Q D 12 R2 Q D 13 R3 Q D 10 VEE RECEIVER LATCH 1 VCC 4 VCC01 11 VCC02 20 VCC03 MOTOROLA OUTPUT LATCH G DRIVER TRUTH TABLE RECEIVER TRUTH TABLE D DLE OE Busn+1 Bus RLE Rn+1 X X H –2.0 V Bus L Bus D L L D X H Rn X H L Busn 2–38 MECL Data DL122 — Rev 6 MC10H334 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–39 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H334 OUTLINE DIMENSIONS 20 11 1 10 L SUFFIX CERAMIC DIP PACKAGE CASE 732–03 ISSUE E NOTES: 1. LEADS WITHIN 0.010 DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. B A L C F DIM A B C D F G H J K L M N N H G D J K M INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040 SEATING PLANE P SUFFIX PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 0.25 (0.010) 20 PL 0.25 (0.010) 20 PL M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. 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