MC74AC245, MC74ACT245 Octal Bidirectional Transceiver with 3−State Inputs/Outputs The MC74AC245/74ACT245 contains eight non−inverting bidirectional buffers with 3−state outputs and is intended for bus−oriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active−HIGH) enables data from A ports to B ports; Receive (active−LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition. http://onsemi.com PDIP−20 N SUFFIX CASE 738 1 Features • • • • • Noninverting Buffers Bidirectional Data Path A and B Outputs Source/Sink 24 mA ′ACT245 has TTL Compatible Inputs Pb−Free Packages are Available SOIC−20W DW SUFFIX CASE 751D 1 PIN ASSIGNMENT TSSOP−20 DT SUFFIX CASE 948E PIN FUNCTION OE Output Enable Input T/R Transmit/Receive Input A0−A7 Side A 3−State Inputs or 3−State Outputs B0−B7 Side B 3−State Inputs or 3−State Outputs 1 SOEIAJ−20 M SUFFIX CASE 967 TRUTH TABLES 1 Inputs OE T/R L L H L H X Outputs ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Bus B Data to Bus A Bus A Data to Bus B High Z State DEVICE MARKING INFORMATION H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial See general marking information in the device marking section on page 7 of this data sheet. VCC OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 T/R A0 A1 A2 A3 A4 A5 A6 A7 GND Figure 1. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 7 1 Publication Order Number: MC74AC245/D MC74AC245, MC74ACT245 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C IIN Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Supply Voltage Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC245, MC74ACT245 DC CHARACTERISTICS Symbol Parameter 74AC 74AC TA = +25°C −40°C to +85°C TA = VCC (V) Typ VIH VIL VOH VOL IIN IOZT IOLD IOHD ICC Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Input Leakage Current 5.5 − ±0.1 Maximum 3-State Current 5.5 − 5.5 Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current IOUT = −50 mA V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND ±0.6 ±6.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80.0 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) 74AC Symbol Parameter VCC* TA = +25°C (V) CL = 50 pF 74AC TA = −40°C to +85°C Unit Fig. No. CL = 50 pF Min Typ Max Min Max tPLH Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.5 1.0 1.0 9.0 7.0 ns 3−5 tPHL Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.0 1.0 1.0 9.0 7.0 ns 3−5 tPZH Output Enable Time 3.3 5.0 2.5 1.5 7.0 5.0 11.5 8.5 2.0 1.0 12.5 9.0 ns 3−7 tPZL Output Enable Time 3.3 5.0 2.5 1.5 7.5 5.5 12.0 9.0 2.0 1.0 13.5 9.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 2.0 1.5 6.5 5.5 12.0 9.0 1.0 1.0 12.5 10.0 ns 3−7 tPLZ Output Disable Time 3.3 5.0 2.0 1.5 7.0 5.5 11.5 9.0 1.5 1.0 13.0 10.0 ns 3−8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter 74ACT 74ACT TA = +25°C −40°C to +85°C TA = VCC (V) Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3−State Current 5.5 − ±0.6 ±6.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80.0 mA VIN = VCC or GND VOL IIN DICCT IOZT IOLD IOHD ICC Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 V V IOUT = −50 mA *VIN = VIL or VIH IOH −24 mA −24 mA IOUT = 50 mA MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) 74ACT Symbol Parameter 74ACT VCC* TA = +25°C (V) CL = 50 pF TA = −40°C to +85°C Unit CL = 50 pF Fig. No. Min Typ Max Min Max 8.0 ns 3−5 tPLH Propagation Delay, An to Bn or Bn to An 5.0 1.5 4.0 7.5 1.5 tPHL Propagation Delay, An to Bn or Bn to An 5.0 1.5 4.0 8.0 1.0 9.0 ns 3−5 tPZH Output Enable Time 5.0 1.5 5.0 10 1.5 11.0 ns 3−7 tPZL Output Enable Time 5.0 1.5 5.5 10 1.5 12.0 ns 3−8 tPHZ Output Disable Time 5.0 1.5 5.5 10 1.0 11.0 ns 3−7 tPLZ Output Disable Time 5.0 2.0 5.0 10 1.5 11.0 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Value Parameter Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CI/O Input/Output Capacitance 15 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V http://onsemi.com 5 MC74AC245, MC74ACT245 ORDERING INFORMATION Device Package MC74AC245N PDIP−20 MC74AC245NG PDIP−20 (Pb−Free) MC74ACT245N PDIP−20 MC74ACT245NG PDIP−20 (Pb−Free) MC74AC245DW SOIC−20 MC74AC245DWG SOIC−20 (Pb−Free) MC74AC245DWR2 SOIC−20 MC74AC245DWR2G SOIC−20 (Pb−Free) MC74ACT245DW SOIC−20 MC74ACT245DWG SOIC−20 (Pb−Free) MC74ACT245DWR2 SOIC−20 MC74ACT245DWR2G SOIC−20 (Pb−Free) MC74AC245DT TSSOP−20* MC74AC245DTG TSSOP−20* MC74AC245DTR2 TSSOP−20* MC74AC245DTR2G TSSOP−20* MC74ACT245DT TSSOP−20* MC74ACT245DTG TSSOP−20* MC74ACT245DTR2 TSSOP−20* MC74ACT245DTR2G TSSOP−20* MC74AC245M SOEIAJ−20 MC74AC245MG SOEIAJ−20 (Pb−Free) MC74AC245MEL SOEIAJ−20 MC74AC245MELG SOEIAJ−20 (Pb−Free) MC74ACT245M SOEIAJ−20 MC74ACT245MG SOEIAJ−20 (Pb−Free) MC74ACT245MEL SOEIAJ−20 MC74ACT245MELG SOEIAJ−20 (Pb−Free) Shipping † 18 Units / Rail 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 40 Units / Rail 2000 / Tape & Reel 40 Units / Rail 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 6 MC74AC245, MC74ACT245 MARKING DIAGRAMS PDIP−20 SOIC−20W TSSOP−20 20 20 20 20 AC 245 ALYWG G AC245 AWLYYWWG MC74AC245N AWLYYWWG SOEIAJ−20 1 74AC245 AWLYWWG 1 1 1 20 20 20 20 ACT 245 ALYWG G ACT245 AWLYYWWG MC74ACT245N AWLYYWWG 1 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) http://onsemi.com 7 74ACT245 AWLYWWG 1 MC74AC245, MC74ACT245 PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. −A− 20 11 1 10 B L C −T− K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 M SOIC−20W DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 18X e A1 SEATING PLANE C T http://onsemi.com 8 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74AC245, MC74ACT245 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− L PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 −−− −−− 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MC74AC245, MC74ACT245 PACKAGE DIMENSIONS SOEIAJ−20 M SUFFIX CASE 967−01 ISSUE A 20 LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.81 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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