MC74AC374, MC74ACT374 Octal D−Type Flip−Flop with 3−State Outputs The MC74AC374/74ACT374 is a high−speed, low−power octal D−type flip−flop featuring separate D−type inputs for each flip−flop and 3−state outputs for bus−oriented applications. A buffered Clock (CP) and Output Enable (OE) are common to all flip−flops. http://onsemi.com Features • • • • • • • • • • Buffered Positive Edge−Triggered Clock 3−State Outputs for Bus−Oriented Applications Outputs Source/Sink 24 mA See MC74AC273 for Reset Version See MC74AC377 for Clock Enable Version See MC74AC373 for Transparent Latch Version See MC74AC574 for Broadside Pinout Version See MC74AC564 for Broadside Pinout Version with Inverted Outputs ′ACT374 Has TTL Compatible Inputs Pb−Free Packages are Available VCC O7 D7 D6 O6 O5 D5 D4 O4 CP 20 19 18 17 16 15 14 13 12 11 PDIP−20 N SUFFIX CASE 738 1 SOIC−20W DW SUFFIX CASE 751D 1 TSSOP−20 DT SUFFIX CASE 948E 1 SOEIAJ−20 M SUFFIX CASE 967 1 1 2 3 4 5 6 7 8 9 10 DEVICE MARKING INFORMATION OE O0 D0 D1 O1 O2 D2 D3 O3 GND See general marking information in the device marking section on page 6 of this data sheet. Figure 1. Pinout: 20 Lead Packages Conductors (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. PIN ASSIGNMENT PIN FUNCTION D0−D7 Data Inputs CP Clock Pulse Input CP OE 3−State Output Enable Input OE O0−O7 3−State Outputs D0 D1 D2 D3 D4 D5 D6 D7 O0 O1 O2 O3 O4 O5 O6 O7 Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 8 1 Publication Order Number: MC74AC374/D MC74AC374, MC74ACT374 FUNCTIONAL DESCRIPTION The MC74AC374/74ACT374 consists of eight edge− triggered flip−flops with individual D−type inputs and 3−state true outputs. The buffered clock and buffered Output Enable are common to all flip−flops. The eight flip−flops will store the state of their individual D inputs that meet the setup and hold time requirements on the LOW−to−HIGH Clock (CP) transition. With the Output Enable (OE) LOW, the contents of the eight flip−flops are available at the outputs. When the OE is HIGH, the outputs go to the high impedance state. Operation of the OE input does not affect the state of the flip−flops. TRUTH TABLE Inputs Dn H L X Outputs CP OE On X L L H H L Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance = LOW-to-HIGH Transition D0 D1 D2 D3 D4 D5 D6 D7 CP CP Q D Q CP Q D Q CP Q D Q CP Q D Q CP Q D Q CP Q D Q CP Q D Q CP Q D Q OE O0 O1 NOTE: O2 O3 O4 O5 O6 O7 That this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C VOUT IIN Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC74AC374, MC74ACT374 RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Supply Voltage Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 DC Input Voltage, Output Voltage (Ref. to GND) 0 Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) Unit V VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 V ns/V ns/V °C TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS 74AC Symbol Parameter VCC (V) 74AC TA = +25°C Typ VIH VIL VOH VOL TA = −40°C to +85°C Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Low Level Output Voltage IOUT = −50 mA V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND IOZ Maximum 3-State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min mA VIN = VCC or GND IOLD IOHD †Minimum Dynamic Output Current ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC374, MC74ACT374 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) Symbol Parameter VCC* (V) 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Fig. No. Min Typ Max Min Max fmax Maximum Clock Frequency 3.3 5.0 60 100 110 155 − − 60 100 − − MHz 3−3 tPLH Propagation Delay CP to On 3.3 5.0 3.0 2.5 11 8.0 13.5 9.5 1.5 1.5 15.5 10.5 ns 3−6 tPHL Propagation Delay CP to On 3.3 5.0 2.5 2.0 10 7.0 12.5 9.0 2.0 1.5 14 10 ns 3−6 tPZH Output Enable Time 3.3 5.0 3.0 2.0 9.5 7.0 11.5 8.5 1.5 1.0 13 9.5 ns 3−7 tPZL Output Enable Time 3.3 5.0 2.5 2.0 9.0 6.5 11.5 8.5 1.5 1.0 13 9.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 3.0 2.0 10.5 8.0 12.5 11 2.0 2.0 14.5 12.5 ns 3−7 tPLZ Output Disable Time 3.3 5.0 2.0 1.5 8.0 6.5 11.5 8.5 1.0 1.0 12.5 10 ns 3−8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. AC OPERATING REQUIREMENTS Symbol VCC* (V) Parameter Typ 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Fig. No. Guaranteed Minimum ts Setup Time, HIGH or LOW Dn to CP 3.3 5.0 2.0 1.0 5.5 4.0 6.0 4.5 ns 3−9 th Hold Time, HIGH or LOW Dn to CP 3.3 5.0 −1.0 0 1.0 1.5 1.0 1.5 ns 3−9 3.3 5.0 4.0 2.5 5.5 4.0 6.0 4.5 ns 3−6 CP Pulse Width HIGH or LOW *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. tw http://onsemi.com 4 MC74AC374, MC74ACT374 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3-State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOZ IOLD IOHD ICC Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current IOUT = −50 mA *VIN = VIL or VIH IOH −24 mA −24 mA V IOUT = 50 mA V *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) Symbol Parameter VCC* (V) 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Fig. No. Min Typ Max Min Max 5.0 100 160 − 90 − MHz 3−3 Propagation Delay CP to On 5.0 2.0 8.5 10 2.0 11.5 ns 3−6 tPHL Propagation Delay CP to On 5.0 2.0 8.0 9.5 1.5 11 ns 3−6 tPZH Output Enable Time 5.0 2.0 8.0 9.5 1.5 10.5 ns 3−7 fmax Maximum Clock Frequency tPLH tPZL Output Enable Time 5.0 1.5 8.0 9.0 1.5 10.5 ns 3−8 tPHZ Output Disable Time 5.0 1.5 8.5 11.5 1.0 12.5 ns 3−7 tPLZ Output Disable Time 5.0 1.5 7.0 8.5 1.0 10 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 5 MC74AC374, MC74ACT374 AC OPERATING REQUIREMENTS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Typ Guaranteed Minimum Unit Fig. No. ts Setup Time, HIGH or LOW Dn to CP 5.0 1.0 5.0 5.5 ns 3−9 th Hold Time, HIGH or LOW Dn to CP 5.0 0 1.5 1.5 ns 3−9 5.0 2.5 5.0 5.0 ns 3−6 CP Pulse Width HIGH or LOW *Voltage Range 5.0 V is 5.0 V ±0.5 V. tw CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 80 pF VCC = 5.0 V MARKING DIAGRAMS PDIP−20 SOIC−20W TSSOP−20 20 20 20 1 1 1 20 20 20 74AC374 AWLYWWG 1 20 ACT 374 ALYWG G ACT374 AWLYYWWG MC74ACT374N AWLYYWWG 20 AC 374 ALYWG G AC374 AWLYYWWG MC74AC374N AWLYYWWG SOEIAJ−20 1 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) http://onsemi.com 6 74ACT374 AWLYWWG 1 MC74AC374, MC74ACT374 ORDERING INFORMATION Device Package MC74AC374N PDIP−20 MC74AC374NG PDIP−20 (Pb−Free) MC74ACT374N PDIP−20 MC74ACT374NG PDIP−20 (Pb−Free) MC74AC374DW SOIC−20 MC74AC374DWG SOIC−20 (Pb−Free) MC74AC374DWR2 SOIC−20 MC74AC374DWR2G SOIC−20 (Pb−Free) MC74ACT374DW SOIC−20 MC74ACT374DWG SOIC−20 (Pb−Free) MC74ACT374DWR2 SOIC−20 MC74ACT374DWR2G SOIC−20 (Pb−Free) MC74AC374DTR2 TSSOP−20* MC74AC374DTR2G TSSOP−20* MC74ACT374DTR2 TSSOP−20* MC74ACT374DTR2G TSSOP−20* MC74AC374MEL SOEIAJ−20 MC74AC374MELG SOEIAJ−20 (Pb−Free) MC74ACT374MEL SOEIAJ−20 MC74ACT374MELG SOEIAJ−20 (Pb−Free) Shipping † 18 Units / Rail 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 2500 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 7 MC74AC374, MC74ACT374 PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. −A− 20 11 1 10 B L C −T− K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 M SOIC−20W DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 18X e A1 SEATING PLANE C T http://onsemi.com 8 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74AC374, MC74ACT374 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− L PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 −−− −−− 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MC74AC374, MC74ACT374 PACKAGE DIMENSIONS SOEIAJ−20 M SUFFIX CASE 967−01 ISSUE A 20 LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.81 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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