ONSEMI MC74ACT541DWR2G

MC74AC540, MC74ACT540,
MC74AC541, MC74ACT541
Octal Buffer/Line Driver
with 3−State Outputs
The MC74AC540/74ACT540 and MC74AC541/74ACT541 are
octal buffer/line drivers designed to be employed as memory and
address drivers, clock drivers and bus oriented transmitter/receivers.
The MC74AC541/74ACT541 is a noninverting option of the
MC74AC540/74ACT540.
These devices are similar in function to the
MC74AC240/74ACT240 and MC74AC244/74ACT244 while
providing flow−through architecture (inputs on opposite side from
outputs). This pinout arrangement makes these devices especially
useful as output ports for microprocessors, allowing ease of layout and
greater PC board density.
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PDIP−20
N SUFFIX
CASE 738
1
SOIC−20W
DW SUFFIX
CASE 751D
Features
• 3−State Outputs
• Inputs and Outputs Opposite Side of Package, Allowing Easier
•
•
•
•
•
1
Interface to Microprocessors
Outputs Source/Sink 24 mA
MC74AC540/74ACT540 Provides Inverted Outputs
MC74AC541/74ACT541 Provides Noninverted Outputs
′ACT540 and ′ACT541 Have TTL Compatible Inputs
Pb−Free Packages are Available
TSSOP−20
DT SUFFIX
CASE 948E
1
SOEIAJ−20
M SUFFIX
CASE 967
1
TRUTH TABLE
Inputs
Outputs
OE1
OE2
D
L
H
X
L
L
X
H
L
H
X
X
L
′540
′541
L
Z
Z
H
H
Z
Z
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 8
1
Publication Order Number:
MC74AC540/D
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
OE1
GND
1
20
VCC
2
19
OE2
3
OE1
1
20
VCC
2
19
OE2
18
3
18
4
17
4
17
5
16
5
16
6
15
6
15
7
14
7
14
8
13
8
13
9
12
9
12
10
11
10
11
GND
Figure 1. MC74AC540/74ACT540
Figure 2. MC74AC541/74ACT541
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
−0.5 to +7.0
V
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
DC Output Voltage (Referenced to GND)
VCC
DC Supply Voltage (Referenced to GND)
VIN
VOUT
−0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
IIN
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
tr, tf
Parameter
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
Supply Voltage
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
ns/V
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
DC CHARACTERISTICS
VIL
VOH
VOL
74AC
TA = −40°C to +85°C
VCC
(V)
Typ
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
Symbol
VIH
74AC
TA = +25°C
Parameter
Maximum Low Level
Output Voltage
Guaranteed Limits
Unit
Conditions
IOUT = −50 mA
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
IOZ
Maximum
3-State
Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
IOLD
IOHD
ICC
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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3
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C to +85°C
CL = 50 pF
VCC*
(V)
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
Data to Output (′AC540)
3.3
5.0
1.5
1.5
5.5
4.0
7.5
6.0
1.0
1.0
8.0
6.5
ns
3−5
tPHL
Propagation Delay
Data to Output (′AC540)
3.3
5.0
1.5
1.5
5.0
4.0
7.0
5.5
1.0
1.0
7.5
6.0
ns
3−5
tPZH
Output Enable Time
(′AC540)
3.3
5.0
3.0
2.0
8.5
6.5
11
8.5
2.5
2.0
12
9.5
ns
3−7
tPZL
Output Enable Time
(′AC540)
3.3
5.0
2.5
2.0
7.5
6.0
10
7.5
2.0
1.5
11
8.5
ns
3−8
tPHZ
Output Disable Time
(′AC540)
3.3
5.0
2.5
1.5
8.5
7.5
13
10.5
1.5
1.0
14
11
ns
3−7
tPLZ
Output Disable Time
(′AC540)
3.3
5.0
2.0
1.5
7.0
6.0
10
8.0
2.0
1.5
11
9.0
ns
3−8
tPLH
Propagation Delay
Data to Output (′AC541)
3.3
5.0
2.0
1.5
5.5
4.0
8.0
6.0
1.5
1.0
9.0
6.5
ns
3−5
tPHL
Propagation Delay
Data to Output (′AC541)
3.3
5.0
2.0
1.5
5.5
4.0
8.0
6.0
1.5
1.0
8.5
6.5
ns
3−5
tPZH
Output Enable Time
(′AC541)
3.3
5.0
3.0
2.0
8.0
6.0
11.5
8.5
3.0
1.5
12.5
9.5
ns
3−7
tPZL
Output Enable Time
(′AC541)
3.3
5.0
2.5
1.5
7.0
5.5
10
7.5
2.5
1.0
11.5
8.5
ns
3−8
tPHZ
Output Disable Time
(′AC541)
3.3
5.0
3.5
2.0
9.0
7.0
12.5
9.5
2.5
1.0
14
10.5
ns
3−7
tPLZ
Output Disable Time
(′AC541)
3.3
5.0
2.5
2.0
6.5
5.5
9.5
7.5
2.0
1.0
10.5
8.5
ns
3−8
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
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4
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
DC CHARACTERISTICS
74ACT
Symbol
Parameter
74ACT
TA = +25°C
VCC
(V)
Typ
TA = −40°C to +85°C
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
Maximum
3-State
Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
VOL
IIN
DICCT
IOZ
IOLD
IOHD
ICC
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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5
V
V
IOUT = −50 mA
*VIN = VIL or VIH
IOH −24 mA
−24 mA
IOUT = 50 mA
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol
Parameter
VCC*
(V)
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
Data to Output (′ACT540)
5.0
1.0
−
7.0
1.0
7.5
ns
3−5
tPHL
Propagation Delay
Data to Output (′ACT540)
5.0
1.0
−
8.0
1.0
8.5
ns
3−5
tPZH
Output Enable Time
(′ACT540)
5.0
1.0
−
10.5
1.0
11.5
ns
3−7
tPZL
Output Enable Time
(′ACT540)
5.0
1.0
−
9.5
1.0
10.5
ns
3−8
tPHZ
Output Disable Time
(′ACT540)
5.0
1.0
−
12.0
1.0
12.5
ns
3−7
tPLZ
Output Disable Time
(′ACT540)
5.0
1.5
−
9.0
1.0
10
ns
3−8
tPLH
Propagation Delay
Data to Output (′ACT541)
5.0
1.5
−
7.5
1.0
8.0
ns
3−5
tPHL
Propagation Delay
Data to Output (′ACT541)
5.0
1.5
−
7.5
1.0
8.0
ns
3−5
tPZH
Output Enable Time
(′ACT541)
5.0
2.0
−
10.0
1.0
11.0
ns
3−7
tPZL
Output Enable Time
(′ACT541)
5.0
1.5
−
9.5
1.0
10.5
ns
3−8
tPHZ
Output Disable Time
(′ACT541)
5.0
2.0
−
11.0
1.0
12.0
ns
3−7
tPLZ
Output Disable Time
(′ACT541)
5.0
2.0
−
9.0
1.0
10
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
30
pF
VCC = 5.0 V
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6
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
ORDERING INFORMATION
Device
Package
MC74AC540N
PDIP−20
MC74AC540NG
PDIP−20
(Pb−Free)
MC74ACT540N
PDIP−20
MC74ACT540NG
PDIP−20
(Pb−Free)
MC74AC540DW
SOIC−20
MC74AC540DWG
SOIC−20
(Pb−Free)
MC74AC540DWR2
SOIC−20
MC74AC540DWR2G
SOIC−20
(Pb−Free)
MC74ACT540DW
SOIC−20
MC74ACT540DWG
SOIC−20
(Pb−Free)
MC74ACT540DWR2
SOIC−20
MC74ACT540DWR2G
SOIC−20
(Pb−Free)
MC74ACT540DTR2
TSSOP−20*
MC74ACT540DTR2G
TSSOP−20*
MC74ACT540MEL
SOEIAJ−20
MC74ACT540MELG
SOEIAJ−20
(Pb−Free)
MC74AC541N
PDIP−20
MC74AC541NG
PDIP−20
(Pb−Free)
MC74ACT541N
PDIP−20
MC74ACT541NG
PDIP−20
(Pb−Free)
MC74AC541DW
SOIC−20
MC74AC541DWG
SOIC−20
(Pb−Free)
MC74AC541DWR2
SOIC−20
MC74AC541DWR2G
SOIC−20
(Pb−Free)
MC74ACT541DW
SOIC−20
MC74ACT541DWG
SOIC−20
(Pb−Free)
MC74ACT541DWR2
SOIC−20
MC74ACT541DWR2G
SOIC−20
(Pb−Free)
Shipping†
18 Units / Rail
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
1000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
18 Units / Rail
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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7
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
ORDERING INFORMATION (continued)
Device
Package
MC74AC541DTR2
TSSOP−20*
MC74AC541DTR2G
TSSOP−20*
MC74ACT541DT
TSSOP−20*
MC74ACT541DTG
TSSOP−20*
MC74ACT541DTR2
TSSOP−20*
MC74ACT541DTR2G
TSSOP−20*
MC74AC541M
SOEIAJ−20
MC74AC541MG
SOEIAJ−20
(Pb−Free)
MC74AC541MEL
SOEIAJ−20
MC74AC541MELG
SOEIAJ−20
(Pb−Free)
MC74ACT541M
SOEIAJ−20
MC74ACT541MG
SOEIAJ−20
(Pb−Free)
MC74ACT541MEL
SOEIAJ−20
MC74ACT541MELG
SOEIAJ−20
(Pb−Free)
Shipping†
2500 / Tape & Reel
75 Units / Rail
2500 / Tape & Reel
40 Units / Rail
2000 / Tape & Reel
40 Units / Rail
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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8
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
20
20
20
20
AC
54x
ALYWG
G
AC54x
AWLYYWWG
MC74AC54xN
AWLYYWWG
SOEIAJ−20
1
74AC54x
AWLYWWG
1
1
1
20
20
20
20
ACT
54x
ALYWG
G
ACT54x
AWLYYWWG
MC74ACT54xN
AWLYYWWG
1
1
1
x
= 0 or 1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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9
74ACT54x
AWLYWWG
1
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
−A−
20
11
1
10
B
L
C
−T−
K
SEATING
PLANE
M
N
E
G
F
J
D
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
M
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
18X
e
A1
SEATING
PLANE
C
T
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10
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
L
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60 0.252
0.260
B
4.30
4.50 0.169
0.177
C
−−−
1.20
−−−
0.047
D
0.05
0.15 0.002
0.006
F
0.50
0.75 0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20 0.004
0.008
J1
0.09
0.16 0.004
0.006
K
0.19
0.30 0.007
0.012
K1
0.19
0.25 0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
20
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.15
0.25
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.006
0.010
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.032
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12
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MC74AC540/D