MCP1701 2 µA Low Dropout Positive Voltage Regulator Features General Description • 2.0 µA Typical Quiescent Current • Input Operating Voltage Range up to 10.0V • Low Dropout Voltage: - 250 mV (typ) @ 100 mA - 500 mV (typ) @ 200 mA • High Output Current: 250 mA (VOUT = 5.0V) • High-Accuracy Output Voltage: ±2% (max) • Low Temperature Drift: ±100 ppm/°C (typ.) • Excellent Line Regulation: 0.2%/V (typ.) • Package Options: 3-Pin SOT-23A and 3-Pin SOT-89 • Short Circuit Protection • Standard Output Voltage Options: - 1.8V, 2.5V, 3.0V, 3.3V, 5.0V The MCP1701 is a family of CMOS low dropout (LDO), positive voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 µA of quiescent current (typ.). The input operating range is specified up to 10V, making it ideal for lithium-ion (one or two cells), 9V alkaline and other two and three primary cell battery-powered applications. Applications • • • • • • • • • • • • Battery-Powered Devices Battery-Powered Alarm Circuits Smoke Detectors CO2 Detectors Smart Battery Packs PDAs Low Quiescent Current Voltage Reference Cameras and Portable Video Equipment Pagers and Cellular Phones Solar-Powered Instruments Consumer Products Microcontroller Power Related Literature • AN765, “Using Microchip’s Micropower LDOs”, DS00765, Microchip Technology Inc., 2002 • AN766, “Pin-Compatible CMOS Upgrades to Bipolar LDOs”, DS00766, Microchip Technology Inc., 2002 © 2005 Microchip Technology Inc. The MCP1701 is capable of delivering 250 mA with an input-to-output voltage differential (dropout voltage) of 650 mV. The low dropout voltage extends the battery operating lifetime. It also permits high currents in small packages when operated with minimum VIN – VOUT differentials. The MCP1701 has a tight tolerance output voltage regulation of ±0.5% (typ.) and very good line regulation at ±0.2%. The LDO output is stable when using only 1 µF of output capacitance of either tantalum or aluminum-electrolytic style capacitors. The MCP1701 LDO also incorporates short circuit protection to ensure maximum reliability. Package options include the 3-pin SOT-23A and 3-pin SOT-89. Package Types 3-Pin SOT-23A VIN 3-Pin SOT-89 VIN 3 MCP1701 1 GND 2 VOUT MCP1701 1 2 3 GND VIN VOUT Note: 3-Pin SOT-23A is equivalent to the EIAJ SC-59. DS21874B-page 1 MCP1701 Functional Block Diagram MCP1701 VIN VOUT Short-Circuit Protection + – Voltage Reference GND Typical Application Circuits MCP1701 GND VOUT 3.3V IOUT 50 mA DS21874B-page 2 VIN VOUT VIN 9V Alkaline Battery CIN 1 µF Tantalum COUT 1 µF Tantalum © 2005 Microchip Technology Inc. MCP1701 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ........................................................ +12V Output Current (Continuous)..........PD/(VIN – VOUT)mA Output Current (peak) ..................................... 500 mA Output Voltage ............... (GND – 0.3V) to (VIN + 0.3V) Continuous Power Dissipation: 3-Pin SOT-23A ............................................ 150 mW 3-Pin SOT-89............................................... 500 mW † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. PIN FUNCTION TABLE Symbol Description GND Ground Terminal VOUT Regulated Voltage Output VIN Unregulated Supply Input ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25°C. Parameters Sym Min Typ Max Output Voltage Regulation VOUT VR - 2% VR±0.5% VR + 2% V Maximum Output Current IOUTMAX 250 — — mA 200 — — VOUT = 4.0V 150 — — VOUT = 3.3V 150 — — VOUT = 3.0V 125 — — VOUT = 2.5V 110 — — VOUT = 1.8V Load Regulation (Note 3) Dropout Voltage ΔVOUT/ VOUT VIN - VOUT % Conditions IOUT = 40 mA (Note 1) VOUT = 5.0V (VIN = VR + 1.0V) VOUT = 5.0V, 1 mA ≤ IOUT ≤ 100 mA -1.60 ±0.8 +1.60 -2.25 ±1.1 +2.25 VOUT = 4.0V, 1 mA ≤ IOUT ≤ 100 mA -2.72 ±1.3 +2.72 VOUT = 3.3V, 1 mA ≤ IOUT ≤ 80 mA -3.00 ±1.5 +3.00 VOUT = 3.0V, 1 mA ≤ IOUT ≤ 80 mA -3.60 ±1.8 +3.60 VOUT = 2.5V, 1 mA ≤ IOUT ≤ 60 mA -1.60 ±0.8 +1.60 — 400 630 — 400 630 IOUT = 200 mA, VR = 4.0V — 400 700 IOUT = 160 mA, VR = 3.3V — 400 700 IOUT = 160 mA, VR = 3.0V — 400 700 IOUT = 120 mA, VR = 2.5V — 180 300 IOUT = 20 mA, VR = 1.8V VOUT = 1.8V, 1 mA ≤ IOUT ≤ 30 mA mV IOUT = 200 mA, VR = 5.0V IQ — 2.0 3.0 µA ΔVOUT•100 — 0.2 0.3 %/V VIN — — 10 V TCVOUT — ±100 — ppm/° C IOUT = 40 mA, -40°C ≤ TA ≤ +85°C (Note 2) TR — 200 — µsec 10% VR to 90% VR, VIN = 0V to VR +1V, RL = 25Ω resistive Input Quiescent Current Line Regulation Units VIN = VR + 1.0V IOUT = 40 mA, (VR +1) ≤ VIN ≤ 10.0V ΔVIN•VOUT Input Voltage Temperature Coefficient of Output Voltage Output Rise Time 1: 2: 3: VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V. The input voltage VIN = VR + 1.0V, IOUT = 40 mA. TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = Highest voltage measured over the temperature range. VOUT-LOW = Lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. © 2005 Microchip Technology Inc. DS21874B-page 3 MCP1701 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise specified, TA = +25°C. Parameters Sym Min Typ Max Units Conditions Specified Temperature Range (I) TA -40 — +85 °C Storage Temperature Range TA -40 — +125 °C θJA — 335 — °C/W Minimum trace width single layer application — 230 — °C/W Typical FR4, 4-layer application — 52 — °C/W Typical, when mounted on 1 square inch of copper Temperature Ranges Package Thermal Resistances Thermal Resistance, 3L-SOT-23A Thermal Resistance, 3L-SOT-89 DS21874B-page 4 θJA © 2005 Microchip Technology Inc. MCP1701 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.65 2.60 2.55 2.50 2.45 2.40 2.35 2.30 2.25 2.20 2.15 2.10 2.05 2.00 1.95 VR = 1.8V Supply Current (µA) Supply Current (µA) Notes: Unless otherwise specified, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. +25°C 0°C -40°C 2 3 4 5 6 7 8 9 2.10 2.05 2.00 1.95 1.90 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 1.45 1.40 1.35 1.30 1.25 1.20 10 +25°C +85°C 0°C -40°C VIN = 4.0V VR = 3.0V 0 20 40 60 VR = 3.0V +25°C +85°C -40°C 3 4 5 6 7 8 9 2.75 2.70 2.65 2.60 2.55 2.50 2.45 2.40 2.35 2.30 2.25 2.20 2.15 2.10 2.05 2.00 10 0°C -40°C 20 40 60 +25°C +85°C 2.25 -40°C 2.10 1.95 1.80 1.65 1.50 5 6 7 8 9 10 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 100 120 140 160 180 200 VR = 5.0V VR = 1.8V VR = 3.0V VIN = VR + 1V IOUT = 0 µA -40 -20 Input Voltage (V) FIGURE 2-3: Supply Current vs. Input Voltage (VR = 5.0V). © 2005 Microchip Technology Inc. 80 VIN = 6.0V VR = 5.0V FIGURE 2-5: Supply Current vs. Load Current (VR = 5.0V). Supply Current (µA) Supply Current (µA) 2.70 2.40 160 +85°C 0 VR = 5.0V 2.55 140 Load Current (mA) FIGURE 2-2: Supply Current vs. Input Voltage (VR = 3.0V). 2.85 120 +25°C Input Voltage (V) 3.00 100 FIGURE 2-4: Supply Current vs. Load Current (VR = 3.0V). Supply Current (µA) Supply Current (µA) FIGURE 2-1: Supply Current vs. Input Voltage (VR = 1.8V). 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 80 Load Current (mA) Input Voltage (V) 0 20 40 60 80 100 Temperature (°C) FIGURE 2-6: Temperature. Supply Current vs. DS21874B-page 5 MCP1701 Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 1.85 IOUT = 0.1 mA 1.83 VIN = 2.8V Output Voltage (V) Output Voltage (V) 1.84 +25°C 1.83 +85°C 1.82 0°C 1.81 1.80 -40°C 1.79 1.78 2 3 4 5 6 7 8 9 +25°C 1.82 +85°C 1.81 1.80 0°C 1.79 -40°C 1.78 1.77 10 0 10 20 Input Voltage (V) +85°C 3.01 0°C -40°C 2.99 80 90 3.04 3.02 +25°C +85°C 3.00 0°C 2.98 -40°C 2.96 2.98 2.97 2.94 4.0 5.0 6.0 7.0 8.0 9.0 10.0 0 15 30 Input Voltage (V) 5.10 5.09 5.08 5.07 5.06 5.05 5.04 5.03 5.02 5.01 5.00 4.99 4.98 4.97 4.96 45 60 75 90 105 120 135 150 Load Current (mA) FIGURE 2-8: Output Voltage vs. Input Voltage (VR = 3.0V). FIGURE 2-11: Output Voltage vs. Load Current (VR = 3.0V). 5.07 IOUT = 0.1 mA VIN = 6.0V +25°C 5.05 +25°C Output Voltage (V) Output Voltage (V) 70 VIN = 4.0V Output Voltage (V) Output Voltage (V) +25°C 3.00 60 3.06 IOUT = 0.1 mA 3.02 50 FIGURE 2-10: Output Voltage vs. Load Current (VR = 1.8V). 3.04 3.03 40 Load Current (mA) FIGURE 2-7: Output Voltage vs. Input Voltage (VR = 1.8V). 3.05 30 +85°C 0°C 5.03 +85°C 5.01 0°C 4.99 4.97 4.95 -40°C -40°C 4.93 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 Input Voltage (V) FIGURE 2-9: Output Voltage vs. Input Voltage (VR = 5.0V). DS21874B-page 6 0 25 50 75 100 125 150 175 200 225 250 Load Current (mA) FIGURE 2-12: Output Voltage vs. Load Current (VR = 5.0V). © 2005 Microchip Technology Inc. MCP1701 Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. Dropout Voltage (V) 0.7 VR = 1.8V 0.6 VIN=0V to 2.8V 0.5 0.4 +85°C 0°C 0.3 -40°C 0.2 RLOAD = 25 ohms COUT = 1 µF Tantalum 0.1 VR=1.8V 0.0 0 10 20 30 40 50 60 70 80 90 Load Current (mA) FIGURE 2-13: Dropout Voltage vs. Load Current (VR = 1.8V). FIGURE 2-16: (VR = 1.8V). Start-up From VIN 0 0.6 Dropout Voltage (V) VR = 3.0V 0.5 VIN=0V to 4.0V 0.4 0.3 +85°C 0°C 0.2 -40°C RLOAD = 25 ohms COUT = 1 µF Tantalum 0.1 0 0 15 30 45 60 75 90 105 120 135 150 VR=3.0V Load Current (mA) FIGURE 2-14: Dropout Voltage vs. Load Current (VR = 3.0V). 0.8 FIGURE 2-17: (VR = 3.0V). Start-up From VIN VR = 5.0V Dropout Voltage (V) 0.7 0.6 VIN=0V to 6.0V 0.5 +85°C 0.4 0°C 0.3 -40°C 0.2 0.1 0.0 0 25 50 75 100 125 150 175 200 225 250 VR=5.0V RLOAD = 25 ohms COUT = 1 µF Tantalum Load Current (mA) FIGURE 2-15: Dropout Voltage vs. Load Current (VR = 5.0V). © 2005 Microchip Technology Inc. FIGURE 2-18: (VR = 5.0V). Start-up From VIN DS21874B-page 7 MCP1701 Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 0.00 Line Regulation (%/V) Load Regulation (%) 0.15 VR = 1.8V IOUT = 1 to 30mA -0.05 -0.10 -0.15 -0.20 VIN = 6.0V VIN = 4.0V -0.25 -0.30 VIN = 2.8V -0.35 -0.40 VR = 1.8V VIN = 2.8V to 10V 0.14 IOUT = 90 mA 0.13 IOUT = 40 mA 0.12 IOUT = 1 mA 0.11 IOUT = 10 mA 0.10 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 -40 -30 -20 -10 0 Temperature (°C) FIGURE 2-22: Line Regulation vs. Temperature (VR = 1.8V). FIGURE 2-19: Load Regulation vs. Temperature (VR = 1.8V). -0.30 Line Regulation (%/V) Load Regulation (%) 0.13 VR = 3.0V IOUT = 1 to 80 mA -0.35 -0.40 -0.45 VIN = 6.0V -0.50 -0.55 -0.60 VIN = 4.0V VIN = 10.0V -0.65 -0.70 0.12 IOUT = 1 mA 0.11 0.10 IOUT = 10 mA 0.09 0.08 0.07 IOUT = 150 mA VR = 3.0V VIN = 4.0V to 10V 0.06 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 -40 -30 -20 -10 0 Temperature (°C) 10 20 30 40 50 60 70 80 90 Temperature (°C) FIGURE 2-20: Load Regulation vs. Temperature (VR = 3.0V). FIGURE 2-23: Line Regulation vs. Temperature (VR = 3.0V). 0.0 0.17 VR = 5.0V IOUT = 1 to 100 mA -0.1 Line Regulation (%/V) Load Regulation (%) 10 20 30 40 50 60 70 80 90 Temperature (°C) -0.2 -0.3 VIN = 7.0V VIN = 6.0V -0.4 VIN = 10.0V -0.5 VR = 5.0V VIN = 6.0V to 10V 0.16 0.15 IOUT = 1 mA 0.14 IOUT = 10 mA 0.13 0.12 0.11 0.10 IOUT = 100 mA IOUT = 250 mA 0.09 -0.6 0.08 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) FIGURE 2-21: Load Regulation vs. Temperature (VR = 5.0V). DS21874B-page 8 90 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (°C) FIGURE 2-24: Line Regulation vs. Temperature (VR = 5.0V). © 2005 Microchip Technology Inc. MCP1701 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. SOT-23A Pin No. SOT-89 1 1 GND Ground Terminal 2 3 VOUT Regulated Voltage Output 3 2 VIN Unregulated Supply Input 3.1 Name Function Ground Terminal (GND) Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2 µA, typ.) flows out of this pin, there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load. 3.2 Regulated Voltage Output (VOUT) Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close as possible to the LDO VOUT pin. The current flowing out of this pin is equal to the DC load current. © 2005 Microchip Technology Inc. 3.3 Unregulated Supply Input (VIN) Connect the input supply voltage and the positive side of the input capacitor to VIN. Like all low dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. The input capacitor should be physically located as close as possible to the VIN pin. For most applications, 1 µF of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low equivalent series resistence characteristics of the ceramic will yield better noise and PSRR performance at high frequency. The current flow into this pin is equal to the DC load current, plus the LDO bias current (2 µA, typ.). DS21874B-page 9 MCP1701 4.0 DETAILED DESCRIPTION The MCP1701 is a low quiescent current, precision, fixed-output voltage LDO. Unlike bipolar regulators, the MCP1701 supply current does not increase proportionally with load current. 4.1 Output Capacitor A minimum of 1 µF output capacitor is required. The output capacitor should have an ESR greater than 0.1Ω and less than 5Ω, plus a resonant frequency above 1 MHz. Larger output capacitors can be used to improve supply noise rejection and transient response. Care should be taken when increasing COUT to ensure that the input impedance is not high enough to cause high input impedance oscillation. 4.2 Input Capacitor A 1 µF input capacitor is recommended for most applications when the input impedance is on the order of 10Ω. Larger input capacitance may be required for stability when operating from a battery input, or if there is a large distance from the input source to the LDO. When large values of output capacitance are used, the input capacitance should be increased to prevent high source impedance oscillations. 4.3 Overcurrent The MCP1701 internal circuitry monitors the amount of current flowing through the P-channel pass transistor. In the event of a short circuit or excessive output current, the MCP1701 will act to limit the output current. VIN VOUT Short Circuit Protection + – Voltage Reference GND FIGURE 4-1: DS21874B-page 10 Block Diagram. © 2005 Microchip Technology Inc. MCP1701 5.0 THERMAL CONSIDERATIONS 5.1 Power Dissipation The amount of power dissipated internal to the LDO linear regulator is the sum of the power dissipation within the linear pass device (P-channel MOSFET) and the quiescent current required to bias the internal reference and error amplifier. The internal linear pass device power dissipation is calculated as shown in Equation 5-1. EQUATION 5-1: PD (Pass Device) = (VIN – VOUT) x IOUT The internal power dissipation, as a result of the bias current for the LDO internal reference and error amplifier, is calculated as shown in Equation 5-2. EQUATION 5-2: To determine the junction temperature of the device, the thermal resistance from junction-to-ambient must be known. The 3-pin SOT-23 thermal resistance from junction-to-air (RθJA) is estimated to be approximately 335° C/W. The SOT-89 RθJA is estimated to be approximately 52° C/W when mounted on 1 square inch of copper. The RθJA will vary with physical layout, airflow and other application-specific conditions. The device junction temperature is determined by calculating the junction temperature rise above ambient, then adding the rise to the ambient temperature. EQUATION 5-5: JUNCTION TEMPERATURE – SOT-23 EXAMPLE: T J = PDMAX × R θJA + T A T J = 116.0 milliwatts × 335°C/W + 55°C T J = 93.9°C PD (Bias) = VIN x IGND The total internal power dissipation is the sum of PD (pass device) and PD (bias). EQUATION 5-3: PTOTAL = PD (Pass Device) + PD (Bias) EQUATION 5-6: JUNCTION TEMPERATURE – SOT-89 EXAMPLE: T J = 116.0 milliwatts × 52°C/W + 55°C T J = 61°C For the MCP1701, the internal quiescent bias current is so low (2 µA, typ.) that the PD (bias) term of the power dissipation equation can be ignored. The maximum power dissipation can be estimated by using the maximum input voltage and the minimum output voltage to obtain a maximum voltage differential between input and output. The next step would be to multiply the maximum voltage differential by the maximum output current. EQUATION 5-4: PD = (VINMAX – VOUTMIN) x IOUTMAX Given: VIN = 3.3V to 4.1V VOUT = 3.0V ± 2% IOUT = 1 mA to 100 mA TAMAX = 55°C PMAX = (4.1V – (3.0V x 0.98)) x 100 mA PMAX = 116.0 milliwatts © 2005 Microchip Technology Inc. DS21874B-page 11 MCP1701 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 3-Pin SOT-23A 1 1 2 2 4 1 3 4 represents first voltage digit 1V, 2V, 3V, 4V, 5V, 6V Ex: 3.xV = 2 3 3-Pin SOT-89 3 represents first decimal place voltage (x.0 - x.9) Ex: 3.4V = 3 E Symbol Voltage Symbol Voltage A B C D E x.0 x.1 x.2 x.3 x.4 F H K L M x.5 x.6 x.7 x.8 x.9 3 represents polarity 0 = Positive (fixed) 4 represents assembly lot number Legend: XX...X Y YY WW NNN e3 * Note: DS21874B-page 12 Customer-specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. MCP1701 3-Lead Plastic Small Outline Transistor (CB) (SOT23) E E1 2 B p1 n D p 1 α c A φ β A1 L Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L f Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A2 B a b MIN .040 .039 .000 .102 .059 .106 .014 0 .004 .014 0 0 INCHES* NOM 3 .038 .076 .046 .043 .002 .110 .063 .114 .018 5 .006 .016 5 5 MAX .051 .047 .004 .118 .071 .122 .022 10 .010 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 1.16 1.01 1.00 1.10 0.01 0.06 2.60 2.80 1.50 1.60 2.70 2.90 0.35 0.45 0 5 0.10 0.15 0.35 0.40 0 5 0 5 MIN MAX 1.30 1.20 0.10 3.00 1.80 3.10 0.55 10 0.25 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. EIAJ SC-59 Equivalent Drawing No. C04-104 © 2005 Microchip Technology Inc. DS21874B-page 13 MCP1701 3-Lead Plastic Small Outline Transistor (MB) (SOT89) H E B1 3 B D D1 p1 2 p 1 B1 L E1 A C Units Dimension Limits p Pitch Outside lead pitch (basic) Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Foot Length Lead Thickness Lead 2 Width Leads 1 & 3 Width p1 A H E E1 D D1 L c B B1 INCHES MIN MAX .059 BSC .118 BSC .055 .063 .155 .167 .090 .102 .084 .090 .173 .181 .064 .072 .035 .047 .014 .017 .017 .022 .014 .019 MILLIMETERS* MIN MAX 1.50 BSC 3.00 BSC 1.40 1.60 3.94 4.25 2.29 2.60 2.13 2.29 4.40 4.60 1.62 1.83 0.89 1.20 0.35 0.44 0.44 0.56 0.36 0.48 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: TO-243 Drawing No. C04-29 DS21874B-page 14 © 2005 Microchip Technology Inc. MCP1701 APPENDIX A: REVISION HISTORY Revision B (May 2005) The following is the list of modifications: 1. 2. Removed T0-92 device from entire data sheet. Added Appendix A: Revision History. Revision A (March 2004) • Original Release of this Document. © 2005 Microchip Technology Inc. DS21874B-page 15 MCP1701 NOTES: DS21874B-page 16 © 2005 Microchip Technology Inc. MCP1701 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X- XX X X X/ XX Tape Output Feature Tolerance Temp. Package and Reel Voltage Code Examples: a) MCP1701T-1802I/CB: 1.8V LDO Positive Voltage Regulator, SOT-23A-3 pkg. b) MCP1701T-1802I/MB: 1.8V LDO Positive Voltage Regulator, SOT89-3 pkg. c) MCP1701T-2502I/CB: 2.5V LDO Positive Voltage Regulator, SOT-23A-3 pkg. 3.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. Device: MCP1701: 2 µA Low Dropout Positive Voltage Regulator Tape and Reel: T Output Voltage: 18 = 1.8V “Standard” 25 = 2.5V “Standard” 30 = 3.0V “Standard” 33 = 3.3V “Standard” 50 = 5.0V “Standard” *Contact factory for other output voltage options. d) MCP1701T-3002I/CB: e) MCP1701T-3002I/MB: 3.0V LDO Positive Voltage Regulator, SOT89-3 pkg. Extra Feature Code: 0 = Fixed f) MCP1701T-3302I/CB: Tolerance: 2 = 2.0% (Standard) g) Temperature: I = -40°C to +85°C MCP1701T-3302I/MB: 3.3V LDO Positive Voltage Regulator, SOT89-3 pkg. h) MCP1701T-5002I/CB: Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 i) MCP1701T-5002I/MB: 5.0V LDO Positive Voltage Regulator, SOT89-3 pkg. = Tape and Reel © 2005 Microchip Technology Inc. 3.3V LDO Positive Voltage Regulator, SOT-23A-3 pkg. 5.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. DS21874B-page 17 MCP1701 NOTES: DS21874B-page 18 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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