PL IA NT CO M *R oH S Features Applications ■ Tip & ring line protection with two devices Used as a secondary overcurrent protection device in: ■ Customer Premise Equipment (CPE) ■ Central Office (CO) ■ Subscriber Line Interface Cards (SLIC) ■ ■ ■ ■ in one surface mount package High voltage surge capabilities Assists in meeting ITU-T K.20/K.21/K.45 specifications as well as Telcordia GR-1089 intra-building RoHS compliant* Agency recognition: MF-SD/250 Series - Telecom PTC Resettable Fuses Electrical Characteristics Model MF-SD013/250 Max. Interrupt Ratings Max. Operating Voltage Volts Volts (V) Amps (A) 60 250 3.0 Ihold Itrip Initial Resistance Amperes at 23 °C Hold Trip Ohms at 23 °C Min. Max. 0.13 2.0 0.26 7.0 1 Hour (R1) Post-Trip Resistance* Ohms at 23 °C Max. 10.0 Nominal Time to Trip Amps at 23 °C Seconds at 23 °C 1 2.5 Tripped Power Dissipation Watts at 23 °C Typ. 1.5 * R1 value is measured 24 hours post reflow. Resistance matched in housing: 1.0 ohm measured 24 hours after reflow installation. Environmental Characteristics Operating Temperature.................................... -45 °C to +85 °C Maximum Device Surface Temperature in Tripped State ............................................ 125 °C Passive Aging .................................................. +85 °C, 1000 hours................................................±15 % typical resistance change ..................................................................... +60 °C, 1000 hours................................................±15 % typical resistance change Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours ..............................±15 % typical resistance change Thermal Shock ................................................ MIL-STD-202F, Method 107G,...............................±10 % typical resistance change +125 °C to -55 °C,10 times ±15 % typical resistance change Solvent Resistance .......................................... MIL-STD-202, Method 215B ..................................No change Lead Solderability ............................................ ANSI/J-STD-002 Flammability .................................................... IEC 695-2-2 ...........................................................No Flame for 60 secs. Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A ........No change Test Procedures And Requirements For Model MF-SD/250 Series Test Test Conditions Accept/Reject Criteria Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description Resistance ....................................................... In still air @ 23 °C .............................................Rmin ≤ R ≤ Rmax Time to Trip ...................................................... At specified current, Vmax, 23 °C .....................T ≤ max. time to trip (seconds) Hold Current .................................................... 30 min. at Ihold .................................................No trip Primary Test Test Conditions Protection Mains Power Contact - ITU-T K.20, K.21 ........ 230 V rms, 10 ohms, t = 15 min........................None Power Induction - ITU-T K.20, K.21................. 600V rms, 600 ohms, t = 0.2 seconds ..............None Power Induction - ITU-T K.20, K.21................. 600 V rms, 600 ohms, t = 1 second. .................GDT Lightning Surge - ITU-T K.20, K.21 ................. 1.5 KV, 10/700 μs .............................................None Lightning Surge ............................................... 4.0 KV, 10/700 μs .............................................GDT UL File Number ........................................... E 174545S Thermal Derating Chart -Ihold (Amps) Model MF-SD013/250 Ambient Operating Temperature -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C 0.21 0.18 0.16 0.13 0.10 0.09 0.08 0.07 0.05 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SD/250 Series - Telecom PTC Resettable Fuses Product Dimensions Recommended Pad Layout 8.90 (.350) MAX. 7.2 (.283) MAX. 1 10.2 (402) MAX. DIMENSIONS: MAX. 8.90 (.350) MM (INCHES) 2 3 6.3 (.248) 3.9 (.154) 4 2.4 (.094) 0.5 (.020) 2 PLCS. 3.9 (.154) 7.2 MAX. (.283) 8.2 (.323) 2.4 (.094) 3.2 (.126) 2.0 (.079) Packaging: TAPE & REEL = 400 pcs. per reel Typical Time to Trip at 23 ˚C Schematic 1000 1 2 3 4 Time to Trip (Seconds) 100 10 Typical Part Marking 1 MANUFACTURER'S TRADEMARK 0.1 PART IDENTIFICATION S D013 0.01 0 0.5 1 1.5 2 2.5 3 How to Order Fault Current (Amps) MF - SD 013/250 - 2 Solder Reflow Recommendations 300 Preheating Soldering Cooling Temperature (°C) 250 200 150 100 50 0 160–220 10–20 Time (seconds) 120 Solder reflow: • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0.25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework: • A device should not be reworked. Multifuse® Product Designator Series SD = Surface Mount Dual Package Hold Current, Ihold 013 (0.13 Amps) Max. Interrupt Voltage, V 250 = 250 Volts Packaging - 2 = Tape and Reel* *Packaged per EIA481-2 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SD/250 Series - Telecom PTC Resettable Fuses Storage Recommendations The recommended long term storage conditions for Multifuse® Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are exceeded. Devices stored in this manner have an indefinite shelf life. Packaging Dimensions MF-SD/250 Series per EIA 481-2 24.0 ± 0.5 (0.945 ± 0.020) 4.0 (0.157) 16.0 (0.630) 2.0 (0.079) 7.5 ± 0.2 (0.295 ± 0.008) 9.0 ± 0.2 (0.354 ± 0.008) 1.5 (0.059) 11.5 (0.453) 1.75 (0.069) 0.5 ± 0.15 (0.020 ± 0.006) 10.0 ± 0.2 (0.394 ± 0.008) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P P2 A0 B0 D F E t K0 Leader min. Trailer min. D P2 E P0 T -0.4 (-.016) 330 -2/+0 (12.99 -.079/+0) DIA. F W B0 P A0 K0 DIMENSIONS: MF-SD/250, REV. D 08/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) 24.4 (.961) MIN. 30.4 (1.197) MAX. 13.2 +0.2/-0 (.520 +.008/-0 100 ± 1.5 (3.94 ± .059) DIA.