MSB709−RT1 Preferred Device PNP General Purpose Amplifier Transistor Surface Mount Features http://onsemi.com • Pb−Free Package is Available COLLECTOR 3 MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit Collector − Base Voltage V(BR)CBO −60 Vdc Collector − Emitter Voltage V(BR)CEO −45 Vdc Emitter − Base Voltage V(BR)EBO −7.0 Vdc IC −100 mAdc IC(P) −200 mAdc Symbol Max Unit PD 200 mW Junction Temperature TJ 150 °C Storage Temperature Tstg −55 ~ +150 °C Collector Current − Continuous Collector Current − Peak 2 BASE 1 EMITTER MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Power Dissipation Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 3 2 1 SC−59 CASE 318D AR M G G AR = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 6 1 Publication Order Number: MSB709−RT1/D MSB709−RT1 ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Min Max Unit Collector − Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0) V(BR)CEO −45 − Vdc Collector − Base Breakdown Voltage (IC = 10 mAdc, IE = 0) V(BR)CBO −60 − Vdc Emitter − Base Breakdown Voltage (IE = 10 mAdc, IE = 0) V(BR)EBO −7.0 − Vdc Collector − Base Cutoff Current (VCB = 45 Vdc, IE = 0) ICBO − −0.1 mAdc Collector − Emitter Cutoff Current (VCE = 10 Vdc, IB = 0) ICEO − −100 nAdc DC Current Gain (Note 1) (VCE = 10 Vdc, IC = 2.0 mAdc) hFE1 210 340 − Collector − Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) − −0.5 Vdc 1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%. ORDERING INFORMATION Package Shipping † SC−59 3000 Units / Reel SC−59 (Pb−Free) 3000 Units / Reel Device MSB−709RT1 MSB−709RT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MSB709−RT1 PACKAGE DIMENSIONS SC−59 CASE 318D−04 ISSUE G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3 HE 2 E 1 DIM A A1 b c D E e L HE b e MILLIMETERS NOM MAX 1.15 1.30 0.06 0.10 0.43 0.50 0.14 0.18 2.90 3.10 1.50 1.70 1.90 2.10 0.40 0.60 2.80 3.00 C A A1 MIN 1.00 0.01 0.35 0.09 2.70 1.30 1.70 0.20 2.50 L SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.4 0.094 1.0 0.039 0.8 0.031 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MIN 0.039 0.001 0.014 0.003 0.106 0.051 0.067 0.008 0.099 INCHES NOM 0.045 0.002 0.017 0.005 0.114 0.059 0.075 0.016 0.110 MAX 0.051 0.004 0.020 0.007 0.122 0.067 0.083 0.024 0.118 MSB709−RT1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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