E2A0025-16-X0 ¡ Semiconductor MSM7547 ¡ Semiconductor This version: Jan. 1998 MSM7547 Previous version: Nov. 1996 Voice Signal Level Control LSI GENERAL DESCRIPTION The MSM7547 is an LSI for Audio Signal Level adjustment for telephone set, etc. Conventionally, its circuit has been made within individual unit, such as amplifiers, resistors and switches. However, using this LSI allows for simple mounting and economically small space. FEATURES Receiving system • Built-in electrical volume Digital control (3 bit / 8 step) • For transmission voice, with side tone route available. • Mute function available. Transmitting system • Built-in operational amplifier for transmission signal level adjustment. • Mute function available. • Single +5 V power supply • Package: 16-pin plastic SOP (SOP16-P-300-1.27-K) (Product name : MSM7547MS-K) APPLICATION Cellular handset, cordless telephone and etc. 1/7 ¡ Semiconductor MSM7547 BLOCK DIAGRAM 56 kW ATT – + RAUD i 10 kW o – + 200 kW ATT0 ATT1 ATT2 ATTE SG RCV1 AN2 SG ATT0 ATT1 ATT2 ATTE – + 150 kW RCV2 SG AO3 AN3 MIC – – A CO B + + TAUD VDD 200 kW SG GND SG PIN CONFIGURATION (TOP VIEW) TAUD 1 16 VDD AN2 2 15 AO3 NC 3 14 MIC RCV2 4 13 AN3 RCV1 5 12 ATTE NC 6 11 ATT2 RAUD 7 10 ATT1 9 GND 8 ATT0 16-Pin Plastic SOP NC : No connect pin 2/7 ¡ Semiconductor MSM7547 PIN DESCRIPTION Pin No. Name I/O 1 TAUD O 2 AN2 I 3 NC — Description Output pin of transmitting voice. Input pin of RCV1 signal. Gain control should be connected by a resistor between AN2 pin RCV2 pin. No Connection. Output pin of receiving voice. 4 RCV2 O Gain control should be connected by a resistor between AN2 and RCV2 pin. RCV2 signal is opposite to phase to RCV1 signal. RCV1 O 6 NC — 7 RAUD I 8 GND — 5 Output pin of receiving voice. RCV1 signal is opposite phase to RCV2 signal. No Connection. Receive voice input. Ground (0 V). Volume control. 9 ATT0 10 ATT1 11 ATT2 I ATT2 ATT1 ATT0 Loss level (dB) 0 0 0 0 ±0.3 0 0 1 –2 ±0.3 0 1 0 –4 ±0.3 0 1 1 –7 ±0.3 1 0 0 –10 ±0.3 1 0 1 –13 ±0.3 1 1 0 –16 ±0.3 1 1 1 –19 ±0.3 Mute signal input. 12 ATTE I H : Mute mode L : Operating mode Gain control and frequency responce control. 13 AN3 I 14 MIC I 15 AO3 O 16 VDD — Gain control should be controlled by a resistor between AN3 and AO3. Please refer to follow Fig. 1. Microphone signal input. Gain control and frequency responce control. Gain control should be controlled by a resistor between AN3 and AO3. Power supply (+5 V). 3/7 ¡ Semiconductor MSM7547 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min. Max. Unit Power Supply Voltage VDD –0.3 +7.0 V Digital Input Voltage VIND –0.3 VDD + 0.3 V Analog Input Voltage VINA –0.3 VDD + 0.3 V Storage Temperature TSTG –55 +150 °C RECOMMENDED OPERATING CONDITIONS Symbol Condition Min. Typ. Max. Unit Operating Temperature Parameter Ta — –20 25 70 °C Power Supply Voltage VDD VDD +4.75 +5.0 +5.25 V RLA1 TAUD 600 — — W RLA2 Except TAUD pin. 5 — — kW Analog Output Load Resistance 1 Analog Output Load Resistance 2 4/7 ¡ Semiconductor MSM7547 ELECTRICAL CHARACTERISTICS DC Characteristics ( fi = 1 kHz, Ta = –20°C to 70°C, VDD = 5 V ±5% ) Parameter Symbol Power Supply Current IDD Low Level Input Voltage High Level Input Voltage Condition Min. Typ. Max. Unit — — 3.0 6.0 mA 0 — 1.5 V 3.5 — VDD V –10 — +10 mA — — 2.0 VP-P — 200 — kW 2.0 — — VP-P 2.0 — — VP-P ATT0 to ATT2 VIL ATTE ATT0 to ATT2 VIH ATTE Digital Input Leakage IIL VI = GND Current IIH VI = VDD Analog Input Voltage Level Analog Input Resistance Analog Output Level Range1 Analog Output Level Range2 RAUD, MIC VIA AN2, AN3 RAUD RIA V01 V02 MIC RCV1, RCV2, AO3 RL = 5 kW (to SG level) TAUD RL = 600 W (to SG level) Analog Interface Characteristics Parameter RX-AUDIO Path Gain Symbol ( fi = 1 kHz, Ta = –20°C to 70°C, VDD = 5 V ±5% ) Condition Min. Typ. Max. Unit +14 +15 +16 dB 40 — — dB 40 — — dB –1.0 0 +1.0 dB –9.5 –8.5 –7.5 dB –0.3 0 +0.3 dB RAUD-RCV1 VRXA ATT = 0 dB ATTE = L RAUD-RCV1 RX-AUDIO Loss Level (Mute) LRXA RAUD = –20 dBV ATTE = 0 dB ATTE = LÆH TX-AUDIO Loss Level TX-AUDIO Path Gain MIC Path Gain ATT Establish Error MIC-TAUD LTXA MIC = –20 dBV ATTE = LÆH MIC-TAUD LTXA AO3 and AN3 are connected. 600 W load resistance VRTA VATG MIC-RCV1 AO3 and AN3 are connected. RAUD-RCV1 ATT0 to ATT2 5/7 ¡ Semiconductor MSM7547 APPLICATION CIRCUIT MSM7547MS-K +5 V Transmit voice data R1 R2 C1 1 TAUD VDD 16 2 AN2 AO3 15 3 NC MIC 14 C2 C3 Receive voice data 4 RCV2 AN3 13 5 RCV1 ATTE 12 6 NC ATT2 11 7 RAUD ATT1 10 8 GND ATT0 R1 > 5 kW R2 > 5 kW C1 = 50 pF C2 > 1 µF C3 > 0.1 µF C3 In the Reverse Type C5 R4 Analog input C4 9 R3 AO3 AN3 MIC _ + R4 > 5 kW R3 > 5 kW C4 > 1 µF C5 = 50 pF Gain = R4/R3 In the Same Phase Type C6 Analog input MIC AN3 C8 AO3 R6 R5 + _ R5 > 5 kW R6 > 5 kW C6 > 0.1 µF C7 > 1 µF C8 = 50 pF Gain = 1 + (R5/R6) C7 6/7 ¡ Semiconductor MSM7547 PACKAGE DIMENSIONS (Unit : mm) SOP16-P-300-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin Cu alloy Solder plating 5 mm or more 0.21 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 7/7