TI MSP430G2111IRSA16R

MSP430G2x11
MSP430G2x01
www.ti.com
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
•
•
•
•
Low Supply-Voltage Range: 1.8 V to 3.6 V
Ultralow Power Consumption
– Active Mode: 220 µA at 1 MHz, 2.2 V
– Standby Mode: 0.5 µA
– Off Mode (RAM Retention): 0.1 µA
Five Power-Saving Modes
Ultrafast Wake-Up From Standby Mode in Less
Than 1 µs
16-Bit RISC Architecture, 62.5-ns Instruction
Cycle Time
Basic Clock Module Configurations
– Internal Frequencies up to 16 MHz With
One Calibrated Frequency
– Internal Very Low Power Low-Frequency
(LF) Oscillator
– 32-kHz Crystal
– External Digital Clock Source
•
•
•
•
•
•
•
•
16-Bit Timer_A With Two Capture/Compare
Registers
Brownout Detector
On-Chip Comparator for Analog Signal
Compare Function or Slope A/D (See Table 1)
Serial Onboard Programming,
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
On-Chip Emulation Logic With Spy-Bi-Wire
Interface
For Family Members Details, See Table 1
Available in a 14-Pin Plastic Small-Outline Thin
Package (TSSOP), 14-Pin Plastic Dual Inline
Package (PDIP), and 16-Pin QFN
For Complete Module Descriptions, See the
MSP430x2xx Family User’s Guide (SLAU144)
DESCRIPTION
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.
The MSP430G2x01/11 series is an ultralow-power mixed signal microcontroller with a built-in 16-bit timer and ten
I/O pins. The MSP430G2x11 family members have a versatile analog comparator. For configuration details see
Table 1.
Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values,
and then process the data for display or for transmission to a host system.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
www.ti.com
Table 1. Available Options (1)
BSL
EEM
FLASH
(KB)
RAM
(B)
Timer_A
COMP_A+
CHANNEL
CLOCK
I/O
PACKAGE
TYPE (2)
MSP430G2211IRSA16
MSP430G2211IPW14
MSP430G2211IN14
-
1
2
128
1x TA2
8
LF, DCO, VLO
10
16-QFN
14-TSSOP
14-PDIP
MSP430G2201IRSA16
MSP430G2201IPW14
MSP430G2201IN14
-
1
2
128
1x TA2
-
LF, DCO, VLO
10
16-QFN
14-TSSOP
14-PDIP
MSP430G2111IRSA16
MSP430G2111IPW14
MSP430G2111IN14
-
1
1
128
1x TA2
8
LF, DCO, VLO
10
16-QFN
14-TSSOP
14-PDIP
MSP430G2101IRSA16
MSP430G2101IPW14
MSP430G2101IN14
-
1
1
128
1x TA2
-
LF, DCO, VLO
10
16-QFN
14-TSSOP
14-PDIP
MSP430G2001IRSA16
MSP430G2001IPW14
MSP430G2001IN14
-
1
0.5
128
1x TA2
-
LF, DCO, VLO
10
16-QFN
14-TSSOP
14-PDIP
DEVICE
(1)
(2)
2
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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MSP430G2x11
MSP430G2x01
www.ti.com
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Device Pinout, MSP430G2x01
N OR PW PACKAGE
(TOP VIEW)
DVCC
P1.0/TA0CLK/ACLK
1
14
2
13
P1.1/TA0.0
P1.2/TA0.1
P1.3
P1.4/SMCLK/TCK
3
12
6
9
P1.5/TA0.0/TMS
7
8
4
11
5
10
DVSS
XIN/P2.6/TA0.1
XOUT/P2.7
TEST/SBWTCK
RST/NMI/SBWTDIO
P1.7/TDO/TDI
P1.6/TA0.1/TDI/TCLK
NOTE: See port schematics in Application Information for detailed I/O information.
NC
DVSS
NC
DVCC
RSA PACKAGE
(TOP VIEW)
2
11
XOUT/P2.7
P1.2/TA0.1
3
10
TEST/SBWTCK
P1.3
4
9
RST/NMI/SBWTDIO
5
6
7
8
P1.7/TDO/TDI
P1.1/TA0.0
P1.6/TA0.1/TDI/TCLK
16 15 14 13
12
P1.5/TA0.0/TMS
1
P1.4/SMCLK/TCK
P1.0/TA0CLK/ACLK
XIN/P2.6/TA0.1
NOTE: See port schematics in Application Information for detailed I/O information.
Copyright © 2010, Texas Instruments Incorporated
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Device Pinout, MSP430G2x11
N OR PW PACKAGE
(TOP VIEW)
DVCC
P1.0/TA0CLK/ACLK/CA0
1
14
2
13
P1.1/TA0.0/CA1
P1.2/TA0.1/CA2
P1.3/CAOUT/CA3
P1.4/SMCLK/CA4/TCK
3
12
6
9
P1.5/TA0.0/CA5/TMS
7
8
4
11
5
10
DVSS
XIN/P2.6/TA0.1
XOUT/P2.7
TEST/SBWTCK
RST/NMI/SBWTDIO
P1.7/CAOUT/CA7/TDO/TDI
P1.6/TA0.1/CA6/TDI/TCLK
NOTE: See port schematics in Application Information for detailed I/O information.
NC
DVSS
NC
DVCC
RSA PACKAGE
(TOP VIEW)
16 15 14 13
11
XOUT/P2.7
P1.2/TA0.1/CA2
3
10
TEST/SBWTCK
P1.3/CAOUT/CA3
4
9
RST/NMI/SBWTDIO
5
6
7
8
P1.7/CAOUT/CA7/TDO/TDI
XIN/P2.6/TA0.1
2
P1.5/TA0.0/CA5/TMS
12
P1.1/TA0.0/CA1
P1.6/TA0.1/CA6/TDI/TCLK
1
P1.4/SMCLK/CA4/TCK
P1.0/TA0CLK/ACLK/CA0
NOTE: See port schematics in Application Information for detailed I/O information.
4
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MSP430G2x11
MSP430G2x01
www.ti.com
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Functional Block Diagram, MSP430G2x11
DVCC
XOUT
XIN
DVSS
P1.x
P2.x
8
2
Port P1
Port P2
8 I/O
Interrupt
capability
pullup/down
resistors
2 I/O
Interrupt
capability
pullup/down
resistors
ACLK
Clock
System
SMCLK
Flash
2KB
1KB
MCLK
16MHz
CPU
MAB
incl. 16
Registers
MDB
Emulation
2BP
RAM
128B
Comp_A+
Brownout
Protection
JTAG
Interface
8
Channels
Watchdog
WDT+
15-Bit
Timer0_A2
2 CC
Registers
Spy-Bi
Wire
RST/NMI
Functional Block Diagram, MSP430G2x01
XIN
XOUT
DVCC
DVSS
P1.x
P2.x
8
2
Port P1
Port P2
8 I/O
Interrupt
capability
pull-up/down
resistors
2 I/O
Interrupt
capability
pull-up/down
resistors
ACLK
Clock
System
SMCLK
MCLK
Flash
RAM
2KB
1KB
0.5KB
16MHz
CPU
MAB
incl. 16
Registers
MDB
Emulation
2BP
JTAG
Interface
Brownout
Protection
128B
Watchdog
WDT+
15-Bit
Timer0_A2
2 CC
Registers
Spy-Bi
Wire
RST/NMI
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Table 2. Terminal Functions
TERMINAL
NO.
NAME
14
N, PW
I/O
DESCRIPTION
16
RSA
P1.0/
General–purpose digital I/O pin
TA0CLK/
ACLK/
2
1
I/O
Timer0_A, clock signal TACLK input
ACLK signal output
CA0
Comparator_A+, CA0 input (1)
P1.1/
General–purpose digital I/O pin
TA0.0/
3
2
I/O
Timer0_A, capture: CCI0A input, compare: Out0 output
Comparator_A+, CA1 input (1)
CA1
P1.2/
General–purpose digital I/O pin
TA0.1/
4
3
I/O
Timer0_A, capture: CCI1A input, compare: Out1 output
Comparator_A+, CA2 input (1)
CA2
P1.3/
General–purpose digital I/O pin
CA3/
5
4
I/O
Comparator_A+, CA3 input (1)
CAOUT
Comparator_A+, output (1)
P1.4/
General–purpose digital I/O pin
SMCLK/
CA4/
6
5
I/O
SMCLK signal output
Comparator_A+, CA4 input (1)
TCK
JTAG test clock, input terminal for device programming and test
P1.5/
General–purpose digital I/O pin
TA0.0/
7
CA5/
6
I/O
Timer0_A, compare: Out0 output
Comparator_A+, CA5 input (1)
TMS
JTAG test mode select, input terminal for device programming and test
P1.6/
General–purpose digital I/O pin
TA0.1/
8
CA6/
7
I/O
Timer0_A, compare: Out1 output
Comparator_A+, CA6 input (1)
TDI/TCLK
JTAG test data input or test clock input during programming and test
P1.7/
General–purpose digital I/O pin
CA7/
CAOUT/
9
8
I/O
TDO/TDI (2)
CA7 input (1)
Comparator_A+, output (1)
JTAG test data output terminal or test data input during programming and test
XIN/
Input terminal of crystal oscillator
P2.6/
13
12
I/O
TA0.1
General–purpose digital I/O pin
Timer0_A, compare: Out1 output
XOUT/
12
P2.7
11
I/O
RST/
Output terminal of crystal oscillator (3)
General–purpose digital I/O pin
Reset
NMI/
10
9
I
SBWTDIO
TEST/
Nonmaskable interrupt input
Spy–Bi–Wire test data input/output during programming and test
Selects test mode for JTAG pins on Port 1. The device protection fuse is connected to TEST.
11
10
I
DVCC
1
16
NA
Supply voltage
DVSS
14
14
NA
Ground reference
-
15
NA
Not connected
SBWTCK
NC
(1)
(2)
(3)
6
Spy–Bi–Wire test clock input during programming and test
MSP430G2x11 only
TDO or TDI is selected via JTAG instruction.
If XOUT/P2.7 is used as an input, excess current will flow until P2SEL.7 is cleared. This is due to the oscillator output driver connection
to this pad after reset.
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Table 2. Terminal Functions (continued)
TERMINAL
NO.
NAME
QFN Pad
I/O
14
N, PW
16
RSA
-
Pad
NA
Copyright © 2010, Texas Instruments Incorporated
DESCRIPTION
QFN package pad connection to VSS recommended.
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator, respectively. The remaining
registers are general-purpose registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
The instruction set consists of the original 51
instructions with three formats and seven address
modes and additional instructions for the expanded
address range. Each instruction can operate on word
and byte data.
Instruction Set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 3 shows examples of the three types of
instruction formats; Table 4 shows the address
modes.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
SR/CG1/R2
Constant Generator
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 3. Instruction Word Formats
Dual operands, source-destination
e.g., ADD R4,R5
R4 + R5 –-> R5
Single operands, destination only
e.g., CALL R8
PC –>(TOS), R8–> PC
Relative jump, un/conditional
e.g., JNE
Jump-on-equal bit = 0
Table 4. Address Mode Descriptions (1)
(1)
8
ADDRESS MODE
S
D
SYNTAX
EXAMPLE
OPERATION
Register
✓
✓
MOV Rs,Rd
MOV R10,R11
R10 – –> R11
Indexed
✓
✓
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
M(2+R5) – –> M(6+R6)
Symbolic (PC relative)
✓
✓
MOV EDE,TONI
Absolute
✓
✓
MOV &MEM,&TCDAT
Indirect
✓
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) – –> M(Tab+R6)
Indirect autoincrement
✓
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) – –> R11
R10 + 2– –> R10
Immediate
✓
MOV #X,TONI
MOV #45,TONI
#45 – –> M(TONI)
M(EDE) – –> M(TONI)
M(MEM) – –> M(TCDAT)
S = source, D = destination
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Operating Modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
• Low-power mode 1 (LPM1)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– DCO's dc generator is disabled if DCO not used in active mode
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK and SMCLK are disabled
– DCO's dc generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK and SMCLK are disabled
– DCO's dc generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK and SMCLK are disabled
– DCO's dc generator is disabled
– Crystal oscillator is stopped
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Interrupt Vector Addresses
The interrupt vectors and the power-up starting address are located in the address range 0FFFFh to 0FFC0h.
The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
If the reset vector (located at address 0FFFEh) contains 0FFFFh (e.g., flash is not programmed) the CPU will go
into LPM4 immediately after power-up.
Table 5. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
Power-Up
External Reset
Watchdog Timer+
Flash key violation
PC out-of-range (1)
PORIFG
RSTIFG
WDTIFG
KEYV (2)
NMI
Oscillator fault
Flash memory access violation
NMIIFG
OFIFG
ACCVIFG (2) (3)
COMP_A+
CAIFG (4) (5)
Watchdog Timer+
WDTIFG
Timer_A2
Timer_A2
I/O Port P2 (two flags)
I/O Port P1 (eight flags)
See
(1)
(2)
(3)
(4)
(5)
(6)
10
(6)
TACCR0 CCIFG
(4)
TACCR1 CCIFG, TAIFG (2) (4)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
31, highest
(non)-maskable
(non)-maskable
(non)-maskable
0FFFCh
30
0FFFAh
29
0FFF8h
28
0FFF6h
27
maskable
0FFF4h
26
maskable
0FFF2h
25
maskable
0FFF0h
24
0FFEEh
23
0FFECh
22
0FFEAh
21
0FFE8h
20
P2IFG.6 to P2IFG.7 (2) (4)
maskable
0FFE6h
19
(2) (4)
maskable
0FFE4h
18
0FFE2h
17
0FFE0h
16
0FFDEh to
0FFC0h
15 to 0, lowest
P1IFG.0 to P1IFG.7
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or from
within unused address ranges.
Multiple source flags
(non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
Interrupt flags are located in the module.
Devices with COMP_A+ only
The interrupt vectors at addresses 0FFDEh to 0FFC0h are not used in this device and can be used for regular program code if
necessary.
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Special Function Registers (SFRs)
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
not allocated to a functional purpose are not physically present in the device. Simple software access is provided
with this arrangement.
Legend
rw:
rw-0,1:
rw-(0,1):
Bit can be read and written.
Bit can be read and written. It is reset or set by PUC.
Bit can be read and written. It is reset or set by POR.
SFR bit is not present in device.
Table 6. Interrupt Enable Register 1 and 2
Address
7
6
00h
WDTIE
OFIE
NMIIE
ACCVIE
Address
5
4
1
0
ACCVIE
NMIIE
3
2
OFIE
WDTIE
rw-0
rw-0
rw-0
rw-0
Watchdog Timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog Timer is configured in
interval timer mode.
Oscillator fault interrupt enable
(Non)maskable interrupt enable
Flash access violation interrupt enable
7
6
5
4
3
2
1
0
01h
Table 7. Interrupt Flag Register 1 and 2
Address
7
6
5
02h
WDTIFG
OFIFG
PORIFG
RSTIFG
NMIIFG
Address
4
3
2
1
0
NMIIFG
RSTIFG
PORIFG
OFIFG
WDTIFG
rw-0
rw-(0)
rw-(1)
rw-1
rw-(0)
Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCC power-on or a reset condition at the RST/NMI pin in reset mode.
Flag set on oscillator fault.
Power-On Reset interrupt flag. Set on VCC power-up.
External reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCC power-up.
Set via RST/NMI pin
7
6
5
4
3
2
1
0
03h
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Memory Organization
Table 8. Memory Organization
MSP430G2001
MSP430G2011
MSP430G2101
MSP430G2111
MSP430G2201
MSP430G2211
Size
512B
1kB
2kB
Main: interrupt vector
Flash
0xFFFF to 0xFFC0
0xFFFF to 0xFFC0
0xFFFF to 0xFFC0
Main: code memory
Flash
0xFFFF to 0xFE00
0xFFFF to 0xFC00
0xFFFF to 0xF800
Information memory
Size
256 Byte
256 Byte
256 Byte
Flash
010FFh to 01000h
010FFh to 01000h
010FFh to 01000h
Memory
RAM
Size
Peripherals
128B
128B
128B
027Fh to 0200h
027Fh to 0200h
027Fh to 0200h
16–bit
01FFh to 0100h
01FFh to 0100h
01FFh to 0100h
8–bit
0FFh to 010h
0FFh to 010h
0FFh to 010h
0Fh to 00h
0Fh to 00h
0Fh to 00h
8–bit SFR
Flash Memory
The flash memory can be programmed via the Spy-Bi-Wire/JTAG port or in-system by the CPU. The CPU can
perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
64 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually or as a group with segments 0 to n. Segments A to D are also
called information memory.
• Segment A contains calibration data. After reset segment A is protected against programming and erasing. It
can be unlocked but care should be taken not to erase this segment if the device-specific calibration data is
required.
12
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Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144).
Oscillator and System Clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal very-low-power low-frequency oscillator and an internal digitally controlled oscillator (DCO).
The basic clock module is designed to meet the requirements of both low system cost and low power
consumption. The internal DCO provides a fast turn-on clock source and stabilizes in less than 1µs. The basic
clock module provides the following clock signals:
• Auxiliary clock (ACLK), sourced either from a 32768-Hz watch crystal or the internal LF oscillator.
• Main clock (MCLK), the system clock used by the CPU.
• Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
Table 9. DCO Calibration Data
(Provided From Factory In Flash Information Memory Segment A)
DCO FREQUENCY
1 MHz
CALIBRATION
REGISTER
SIZE
CALBC1_1MHZ
byte
010FFh
CALDCO_1MHZ
byte
010FEh
ADDRESS
Brownout
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and
power off.
Digital I/O
There is one 8-bit I/O port implemented—port P1—and two bits of I/O port P2:
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt condition is possible.
• Edge-selectable interrupt input capability for all the eight bits of port P1 and the two bits of port P2.
• Read/write access to port-control registers is supported by all instructions.
• Each I/O has an individually programmable pull-up/pull-down resistor.
WDT+ Watchdog Timer
The primary function of the watchdog timer (WDT+) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be disabled or configured as an interval timer and can
generate interrupts at selected time intervals.
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Timer_A2
Timer_A2 is a 16-bit timer/counter with two capture/compare registers. Timer_A2 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A2 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 10. Timer_A2 Signal Connections – Devices With No Analog
INPUT PIN NUMBER
PW, N
RSA
DEVICE INPUT
SIGNAL
2 - P1.0
1 - P1.0
TACLK
MODULE
INPUT NAME
TACLK
ACLK
ACLK
SMCLK
SMCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN NUMBER
PW, N
RSA
2 - P1.0
1 - P1.0
TACLK
INCLK
3 - P1.1
2 - P1.1
TA0
CCI0A
3 - P1.1
2 - P1.1
ACLK (internal)
CCI0B
7 - P1.5
6 - P1.5
VSS
GND
4 - P1.2
3 - P1.2
CCR0
TA0
VCC
VCC
TA1
CCI1A
4 - P1.2
3 - P1.2
TA1
CCI1B
8 - P1.6
7 - P1.6
VSS
GND
13 - P2.6
12 - P2.6
VCC
VCC
CCR1
TA1
Table 11. Timer_A2 Signal Connections – Devices With COMP_A+
INPUT PIN NUMBER
PW, N
RSA
DEVICE INPUT
SIGNAL
MODULE
INPUT NAME
2 - P1.0
1 - P1.0
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
2 - P1.0
1 - P1.0
TACLK
INCLK
3 - P1.1
2 - P1.1
TA0
CCI0A
ACLK (internal)
CCI0B
VSS
GND
VCC
VCC
4 - P1.2
3 - P1.2
TA1
CCI1A
CAOUT
(internal)
CCI1B
VSS
GND
VCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
Timer
NA
CCR0
CCR1
TA0
TA1
OUTPUT PIN NUMBER
PW, N
RSA
3 - P1.1
2 - P1.1
7 - P1.5
6 - P1.5
4 - P1.2
3 - P1.2
8 - P1.6
7 - P1.6
13 - P2.6
12 - P2.6
Comparator_A+ (MSP430G2x11 only)
The primary function of the comparator_A+module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
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Peripheral File Map
Table 12. Peripherals With Word Access
MODULE
Timer_A
Flash Memory
Watchdog Timer+
REGISTER DESCRIPTION
REGISTER
NAME
OFFSET
Capture/compare register
TACCR1
0174h
Capture/compare register
TACCR0
0172h
Timer_A register
TAR
0170h
Capture/compare control
TACCTL1
0164h
Capture/compare control
TACCTL0
0162h
Timer_A control
TACTL
0160h
Timer_A interrupt vector
TAIV
012Eh
Flash control 3
FCTL3
012Ch
Flash control 2
FCTL2
012Ah
Flash control 1
FCTL1
0128h
Watchdog/timer control
WDTCTL
0120h
Table 13. Peripherals With Byte Access
MODULE
Comparator_A+
(MSP430G2x11 only)
Basic Clock System+
Port P2
Port P1
Special Function
REGISTER DESCRIPTION
REGISTER
NAME
OFFSET
Comparator_A+ port disable
CAPD
05Bh
Comparator_A+ control 2
CACTL2
05Ah
Comparator_A+ control 1
CACTL1
059h
Basic clock system control 3
BCSCTL3
053h
Basic clock system control 2
BCSCTL2
058h
Basic clock system control 1
BCSCTL1
057h
DCO clock frequency control
DCOCTL
056h
Port P2 resistor enable
P2REN
02Fh
Port P2 selection
P2SEL
02Eh
Port P2 interrupt enable
P2IE
02Dh
Port P2 interrupt edge select
P2IES
02Ch
Port P2 interrupt flag
P2IFG
02Bh
Port P2 direction
P2DIR
02Ah
Port P2 output
P2OUT
029h
Port P2 input
P2IN
028h
Port P1 resistor enable
P1REN
027h
Port P1 selection
P1SEL
026h
Port P1 interrupt enable
P1IE
025h
Port P1 interrupt edge select
P1IES
024h
Port P1 interrupt flag
P1IFG
023h
Port P1 direction
P1DIR
022h
Port P1 output
P1OUT
021h
Port P1 input
P1IN
020h
SFR interrupt flag 2
IFG2
003h
SFR interrupt flag 1
IFG1
002h
SFR interrupt enable 2
IE2
001h
SFR interrupt enable 1
IE1
000h
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Absolute Maximum Ratings (1)
Voltage applied at VCC to VSS
–0.3 V to 4.1 V
Voltage applied to any pin (2)
–0.3 V to VCC + 0.3 V
Diode current at any device pin
Storage temperature range, Tstg
(1)
±2 mA
(3)
Unprogrammed device
–55°C to 150°C
Programmed device
–40°C to 85°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
(2)
(3)
Recommended Operating Conditions
MIN
VCC
Supply voltage
VSS
Supply voltage
TA
Operating free-air temperature
(1)
(2)
MAX
During program execution
1.8
3.6
During flash program/erase
2.2
3.6
0
I version
Processor frequency (maximum MCLK frequency) (1) (2)
fSYSTEM
NOM
UNIT
V
V
–40
85
VCC = 1.8 V,
Duty cycle = 50% ± 10%
dc
4.15
VCC = 2.7 V,
Duty cycle = 50% ± 10%
dc
12
VCC ≥ 3.3 V,
Duty cycle = 50% ± 10%
dc
16
°C
MHz
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
Legend :
System Frequency −MHz
16 MHz
Supply voltage range
during flash memory
programming
12 MHz
Supply voltage range
during program execution
7.5 MHz
4.15 MHz
1.8 V
2.2 V
2.7 V
3.3 V 3.6 V
Supply Voltage −V
Note:
Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC
of 2.2 V.
Figure 1. Safe Operating Area
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Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
PARAMETER
IAM,1MHz
(1)
(2)
TEST CONDITIONS
TA
fDCO = fMCLK = fSMCLK = 1 MHz,
fACLK = 32768 Hz,
Program executes in flash,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 0, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
Active mode (AM)
current (1 MHz)
VCC
MIN
TYP
2.2 V
220
3V
300
MAX
UNIT
µA
370
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
Typical Characteristics – Active Mode Supply Current (Into VCC)
5.0
4.0
Active Mode Current − mA
Active Mode Current − mA
f DCO = 16 MHz
4.0
3.0
f DCO = 12 MHz
2.0
f DCO = 8 MHz
1.0
TA = 85 °C
3.0
TA = 25 °C
VCC = 3 V
2.0
TA = 85 °C
TA = 25 °C
1.0
f DCO = 1 MHz
0.0
1.5
2.0
2.5
3.0
3.5
VCC − Supply Voltage − V
Figure 2. Active Mode Current vs VCC, TA = 25°C
Copyright © 2010, Texas Instruments Incorporated
VCC = 2.2 V
4.0
0.0
0.0
4.0
8.0
12.0
16.0
f DCO − DCO Frequency − MHz
Figure 3. Active Mode Current vs DCO Frequency
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TA
VCC
Low-power mode 0
(LPM0) current (3)
fMCLK = 0 MHz,
fSMCLK = fDCO = 1 MHz,
fACLK = 32768 Hz,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 1, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
25°C
2.2 V
65
µA
ILPM2
Low-power mode 2
(LPM2) current (4)
fMCLK = fSMCLK = 0 MHz,
fDCO = 1 MHz,
fACLK = 32768 Hz,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 1, SCG0 = 0, SCG1 = 1,
OSCOFF = 0
25°C
2.2 V
22
µA
ILPM3,LFXT1
Low-power mode 3
(LPM3) current (4)
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK = 32768 Hz,
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 0
25°C
2.2 V
0.7
1.5
µA
ILPM3,VLO
Low-power mode 3
current, (LPM3) (4)
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK from internal LF oscillator (VLO),
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 0
25°C
2.2 V
0.5
0.7
µA
2.2 V
0.1
0.5
ILPM4
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK = 0 Hz,
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 1
25°C
Low-power mode 4
(LPM4) current (5)
85°C
2.2 V
0.8
1.5
ILPM0,1MHz
(1)
(2)
(3)
(4)
(5)
TEST CONDITIONS
MIN
(2)
TYP
MAX
UNIT
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF.
Current for brownout and WDT clocked by SMCLK included.
Current for brownout and WDT clocked by ACLK included.
Current for brownout included.
Typical Characteristics Low-Power Mode Supply Currents
3.00
2.50
2.75
2.25
ILPM4 – Low-Power Mode Current – µA
ILPM3 – Low-Power Mode Current – µA
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
2.50
2.25
2.00
1.75
1.50
Vcc = 3.6 V
1.25
Vcc = 3 V
1.00
Vcc = 2.2 V
0.75
0.50
Vcc = 1.8 V
0.25
0.00
-40
-20
0
20
40
60
TA – Temperature – °C
Figure 4. LPM3 Current vs Temperature
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2.00
1.75
1.50
1.25
Vcc = 3.6 V
1.00
Vcc = 3 V
0.75
Vcc = 2.2 V
0.50
0.25
0.00
-40
Vcc = 1.8 V
-20
0
20
40
60
80
TA – Temperature – °C
Figure 5. LPM4 Current vs Temperature
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Schmitt-Trigger Inputs – Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
VCC
MIN
RPull
Pullup/pulldown resistor
CI
Input capacitance
VIN = VSS or VCC
MAX
0.45 VCC
0.75 VCC
1.35
2.25
3V
For pullup: VIN = VSS
For pulldown: VIN = VCC
TYP
UNIT
V
0.25 VCC
0.55 VCC
3V
0.75
1.65
3V
0.3
1
V
3V
20
50
kΩ
35
5
V
pF
Leakage Current – Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.x)
(1)
(2)
TEST CONDITIONS
VCC
(1) (2)
High-impedance leakage current
MIN
3V
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
Outputs – Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VOH
High-level output voltage
I(OHmax) = –6 mA (1)
3V
VCC – 0.3
V
VOL
Low-level output voltage
I(OLmax) = 6 mA (1)
3V
VSS + 0.3
V
(1)
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
Output Frequency – Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fPx.y
Port output frequency
(with load)
Px.y, CL = 20 pF, RL = 1 kΩ
fPort_CLK
Clock output frequency
Px.y, CL = 20 pF (2)
(1)
(2)
(1) (2)
VCC
MIN
TYP
MAX
UNIT
3V
12
MHz
3V
16
MHz
A resistive divider with 2 × 0.5 kΩ between VCC and VSS is used as load. The output is connected to the center tap of the divider.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
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Typical Characteristics – Outputs
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW -LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOL TAGE
TYPICAL LOW -LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOL TAGE
50.0
VCC = 2.2 V
P1.7
TA = 25°C
25.0
TA = 85°C
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
I OL − Typical Low-Level Output Current − mA
I OL − Typical Low-Level Output Current − mA
30.0
VCC = 3 V
P1.7
40.0
TA = 85°C
30.0
20.0
10.0
0.0
0.0
2.5
TA = 25°C
VOL − Low-Level Output Voltage − V
0.5
1.0
Figure 6.
3.0
3.5
0.0
VCC = 2.2 V
P1.7
I OH − Typical High-Level Output Current − mA
I OH − Typical High-Level Output Current − mA
2.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0.0
−5.0
−10.0
−15.0
TA = 85°C
−20.0
TA = 25°C
0.5
1.0
1.5
2.0
VOH − High-Level Output Voltage − V
Figure 8.
20
2.0
Figure 7.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
−25.0
0.0
1.5
VOL − Low-Level Output Voltage − V
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2.5
VCC = 3 V
P1.7
−10.0
−20.0
−30.0
TA = 85°C
−40.0
TA = 25°C
−50.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH − High-Level Output Voltage − V
Figure 9.
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
POR/Brownout Reset (BOR) (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VCC(start)
See Figure 10
dVCC/dt ≤ 3 V/s
V(B_IT–)
See Figure 10 through Figure 12
dVCC/dt ≤ 3 V/s
1.35
V
Vhys(B_IT–)
See Figure 10
dVCC/dt ≤ 3 V/s
140
mV
td(BOR)
See Figure 10
t(reset)
Pulse length needed at RST/NMI pin to
accepted reset internally
(1)
0.7 × V(B_IT–)
V
2000
2.2 V/3 V
2
µs
µs
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level V(B_IT–) +
Vhys(B_IT–)is ≤ 1.8 V.
VCC
Vhys(B_IT−)
V(B_IT−)
VCC(start)
1
0
t d(BOR)
Figure 10. POR/Brownout Reset (BOR) vs Supply Voltage
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Typical Characteristics – POR/Brownout Reset (BOR)
VCC
3V
2
VCC(drop) − V
VCC = 3 V
Typical Conditions
t pw
1.5
1
VCC(drop)
0.5
0
0.001
1
1000
1 ns
t pw − Pulse Width − µs
1 ns
t pw − Pulse Width − µs
Figure 11. VCC(drop) Level With a Square Voltage Drop to Generate a POR/Brownout Signal
VCC
2
t pw
3V
VCC(drop) − V
VCC = 3 V
1.5
Typical Conditions
1
VCC(drop)
0.5
0
0.001
t f = tr
1
t pw − Pulse Width − µs
1000
tf
tr
t pw − Pulse Width − µs
Figure 12. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR/Brownout Signal
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Main DCO Characteristics
•
•
•
All ranges selected by RSELx overlap with RSELx + 1: RSELx = 0 overlaps RSELx = 1, ... RSELx = 14
overlaps RSELx = 15.
DCO control bits DCOx have a step size as defined by parameter SDCO.
Modulation control bits MODx select how often fDCO(RSEL,DCO+1) is used within the period of 32 DCOCLK
cycles. The frequency fDCO(RSEL,DCO) is used for the remaining cycles. The frequency is an average equal to:
faverage =
32 × fDCO(RSEL,DCO) × fDCO(RSEL,DCO+1)
MOD × fDCO(RSEL,DCO) + (32 – MOD) × fDCO(RSEL,DCO+1)
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
Supply voltage
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
RSELx < 14
1.8
3.6
V
RSELx = 14
2.2
3.6
V
RSELx = 15
3
3.6
V
0.14
MHz
fDCO(0,0)
DCO frequency (0, 0)
RSELx = 0, DCOx = 0, MODx = 0
3V
fDCO(0,3)
DCO frequency (0, 3)
RSELx = 0, DCOx = 3, MODx = 0
3V
0.12
MHz
fDCO(1,3)
DCO frequency (1, 3)
RSELx = 1, DCOx = 3, MODx = 0
3V
0.15
MHz
fDCO(2,3)
DCO frequency (2, 3)
RSELx = 2, DCOx = 3, MODx = 0
3V
0.21
MHz
fDCO(3,3)
DCO frequency (3, 3)
RSELx = 3, DCOx = 3, MODx = 0
3V
0.3
MHz
fDCO(4,3)
DCO frequency (4, 3)
RSELx = 4, DCOx = 3, MODx = 0
3V
0.41
MHz
fDCO(5,3)
DCO frequency (5, 3)
RSELx = 5, DCOx = 3, MODx = 0
3V
0.58
MHz
fDCO(6,3)
DCO frequency (6, 3)
RSELx = 6, DCOx = 3, MODx = 0
3V
0.8
fDCO(7,3)
DCO frequency (7, 3)
RSELx = 7, DCOx = 3, MODx = 0
3V
fDCO(8,3)
DCO frequency (8, 3)
RSELx = 8, DCOx = 3, MODx = 0
3V
1.6
MHz
fDCO(9,3)
DCO frequency (9, 3)
RSELx = 9, DCOx = 3, MODx = 0
3V
2.3
MHz
fDCO(10,3)
DCO frequency (10, 3)
RSELx = 10, DCOx = 3, MODx = 0
3V
3.4
MHz
fDCO(11,3)
DCO frequency (11, 3)
RSELx = 11, DCOx = 3, MODx = 0
3V
4.25
MHz
fDCO(12,3)
DCO frequency (12, 3)
RSELx = 12, DCOx = 3, MODx = 0
3V
fDCO(13,3)
DCO frequency (13, 3)
RSELx = 13, DCOx = 3, MODx = 0
3V
fDCO(14,3)
DCO frequency (14, 3)
RSELx = 14, DCOx = 3, MODx = 0
3V
fDCO(15,3)
DCO frequency (15, 3)
RSELx = 15, DCOx = 3, MODx = 0
3V
15.25
MHz
fDCO(15,7)
DCO frequency (15, 7)
RSELx = 15, DCOx = 7, MODx = 0
3V
21
MHz
SRSEL
Frequency step between
range RSEL and
RSEL+1
SRSEL = fDCO(RSEL+1,DCO)/fDCO(RSEL,DCO)
3V
1.35
ratio
SDCO
Frequency step between
tap DCO and DCO+1
SDCO = fDCO(RSEL,DCO+1)/fDCO(RSEL,DCO)
3V
1.08
ratio
Measured at SMCLK output
3V
50
Duty cycle
Copyright © 2010, Texas Instruments Incorporated
0.06
0.8
MHz
1.5
4.3
7.3
7.8
8.6
MHz
MHz
MHz
13.9
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MHz
%
23
MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
www.ti.com
Calibrated DCO Frequencies – Tolerance
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
UNIT
1-MHz tolerance over temperature (1)
BCSCTL1= CALBC1_1MHz,
DCOCTL = CALDCO_1MHz,
calibrated at 30°C and 3 V
0°C to 85°C
3V
-3
±0.5
+3
%
1-MHz tolerance over VCC
BCSCTL1= CALBC1_1MHz,
DCOCTL = CALDCO_1MHz,
calibrated at 30°C and 3 V
30°C
1.8 V to 3.6 V
-3
±2
+3
%
1-MHz tolerance overall
BCSCTL1= CALBC1_1MHz,
DCOCTL = CALDCO_1MHz,
calibrated at 30°C and 3 V
-40°C to 85°C
1.8 V to 3.6 V
-6
±3
+6
%
(1)
This is the frequency change from the measured frequency at 30°C over temperature.
Wake-Up From Lower-Power Modes (LPM3/4) – Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tDCO,LPM3/4
DCO clock wake-up time from
LPM3/4 (1)
tCPU,LPM3/4
CPU wake-up time from LPM3/4 (2)
(1)
(2)
VCC
BCSCTL1= CALBC1_1MHz,
DCOCTL = CALDCO_1MHz
MIN
3V
TYP
MAX
UNIT
1.5
µs
1/fMCLK +
tClock,LPM3/4
The DCO clock wake-up time is measured from the edge of an external wake-up signal (e.g., port interrupt) to the first clock edge
observable externally on a clock pin (MCLK or SMCLK).
Parameter applicable only if DCOCLK is used for MCLK.
Typical Characteristics – DCO Clock Wake-Up Time From LPM3/4
DCO Wake Time − µs
10.00
RSELx = 0...11
RSELx = 12...15
1.00
0.10
0.10
1.00
10.00
DCO Frequency − MHz
Figure 13. DCO Wake-Up Time From LPM3 vs DCO Frequency
24
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fLFXT1,LF
LFXT1 oscillator crystal
frequency, LF mode 0, 1
fLFXT1,LF,logic
LFXT1 oscillator logic level
square wave input frequency, XTS = 0, XCAPx = 0, LFXT1Sx = 3
LF mode
OALF
Oscillation allowance for
LF crystals
CL,eff
Integrated effective load
capacitance, LF mode (2)
XTS = 0, LFXT1Sx = 0 or 1
10000
32768
XTS = 0, LFXT1Sx = 0,
fLFXT1,LF = 32768 Hz, CL,eff = 12 pF
200
1
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
11
Oscillator fault frequency,
LF mode (3)
XTS = 0, XCAPx = 0, LFXT1Sx = 3 (4)
UNIT
Hz
50000
Hz
kΩ
XTS = 0, XCAPx = 0
fFault,LF
(4)
1.8 V to 3.6 V
MAX
32768
500
LF mode
(3)
TYP
XTS = 0, LFXT1Sx = 0,
fLFXT1,LF = 32768 Hz, CL,eff = 6 pF
Duty cycle
(2)
MIN
1.8 V to 3.6 V
XTS = 0, Measured at P2.0/ACLK,
fLFXT1,LF = 32768 Hz
(1)
VCC
2.2 V
30
2.2 V
10
50
pF
70
%
10000
Hz
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TA
VCC
MIN
TYP
MAX
fVLO
VLO frequency
PARAMETER
-40°C to 85°C
3V
4
12
20
dfVLO/dT
VLO frequency temperature drift
-40°C to 85°C
3V
25°C
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
UNIT
kHz
0.5
%/°C
4
%/V
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK, INCLK
Duty cycle = 50% ± 10%
tTA,cap
Timer_A capture timing
TA0, TA1
Copyright © 2010, Texas Instruments Incorporated
VCC
MIN
TYP
MAX
fSYSTEM
3V
20
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UNIT
MHz
ns
25
MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
www.ti.com
Comparator_A+ (MSP430G2x11 only)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
I(DD)
CAON = 1, CARSEL = 0, CAREF = 0
3V
45
µA
I(Refladder/RefDiode)
CAON = 1, CARSEL = 0, CAREF = 1/2/3,
No load at CA0 and CA1
3V
45
µA
V(IC)
CAON = 1
3V
Common–mode input voltage
0
VCC-1
V
V(Ref025)
Voltage @ 0.25 VCC node
VCC
PCA0 = 1, CARSEL = 1, CAREF = 1,
No load at CA0 and CA1
3V
0.24
V(Ref050)
Voltage @ 0.5 VCC node
VCC
PCA0 = 1, CARSEL = 1, CAREF = 2,
No load at CA0 and CA1
3V
0.48
PCA0 = 1, CARSEL = 1, CAREF = 3,
No load at CA0 and CA1, TA = 85°C
3V
490
mV
3V
±10
mV
3V
0.7
mV
120
ns
1.5
µs
V(RefVT)
See Figure 14 and Figure 15
V(offset)
Offset voltage (1)
Vhys
Input hysteresis
t(response)
(1)
26
Response time
(low-high and high-low)
CAON = 1
TA = 25°C, Overdrive 10 mV,
Without filter: CAF = 0
TA = 25°C, Overdrive 10 mV,
With filter: CAF = 1
3V
The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A+ inputs on successive measurements. The
two successive measurements are then summed together.
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Typical Characteristics – Comparator_A+
650
650
VCC = 2.2 V
V(RefVT) – Reference Voltage – mV
V(RefVT) – Reference Voltage – mV
VCC = 3 V
600
Typical
550
500
450
400
-45
600
Typical
550
500
450
400
-25
-5
15
35
55
75
TA – Free-Air Temperature – °C
95
-45
115
Figure 14. V(RefVT) vs Temperature, VCC = 3 V
-25
-5
15
35
55
75
TA – Free-Air Temperature – °C
95
115
Figure 15. V(RefVT) vs Temperature, VCC = 2.2 V
Short Resistance – kW
100
VCC = 1.8 V
VCC = 2.2 V
VCC = 3 V
10
VCC = 3.6 V
1
0
0.2
0.4
0.6
0.8
1
VIN/VCC – Normalized Input Voltage – V/V
Figure 16. Short Resistance vs VIN/VCC
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
VCC
MIN
TYP
MAX
UNIT
VCC(PGM/ERASE)
Program and erase supply voltage
2.2
3.6
V
fFTG
Flash timing generator frequency
257
476
kHz
IPGM
Supply current from VCC during program
2.2 V/3.6 V
1
5
mA
IERASE
Supply current from VCC during erase
2.2 V/3.6 V
1
7
mA
tCPT
Cumulative program time (1)
2.2 V/3.6 V
10
ms
tCMErase
Cumulative mass erase time
2.2 V/3.6 V
20
4
Program/erase endurance
10
ms
5
10
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
(2)
30
tFTG
tBlock,
0
Block program time for first byte or word
(2)
25
tFTG
tBlock,
1-63
Block program time for each additional byte or
word
(2)
18
tFTG
tBlock,
End
Block program end-sequence wait time
(2)
6
tFTG
tMass Erase
Mass erase time
(2)
10593
tFTG
tSeg Erase
Segment erase time
(2)
4819
tFTG
(1)
(2)
100
years
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
These values are hardwired into the Flash Controller's state machine (tFTG = 1/fFTG).
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
V(RAMh)
(1)
28
RAM retention supply voltage
TEST CONDITIONS
(1)
CPU halted
MIN
1.6
MAX
UNIT
V
This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
JTAG and Spy-Bi-Wire Interface – Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V/3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V/3 V
0.025
15
µs
tSBW,En
Spy-Bi-Wire enable time
(TEST high to acceptance of first clock edge (1))
2.2 V/3 V
1
µs
tSBW,Ret
Spy-Bi-Wire return to normal operation time
2.2 V/3 V
15
100
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V/3 V
25
90
kΩ
fTCK
TCK input frequency (2)
RInternal
Internal pulldown resistance on TEST
(1)
(2)
60
µs
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before
applying the first SBWCLK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse (1) – Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
VFB
Voltage level on TEST for fuse blow
IFB
Supply current into TEST during fuse blow
tFB
Time to blow fuse
(1)
TEST CONDITIONS
TA = 25°C
MIN
MAX
UNIT
2.5
6
V
7
V
100
mA
1
ms
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
Copyright © 2010, Texas Instruments Incorporated
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
www.ti.com
APPLICATION INFORMATION
Port P1 Pin Schematic: P1.0 to P1.3, Input/Output With Schmitt Trigger – MSP430G2x01
PxSEL.y
PxDIR.y
1
Direction
0: Input
1: Output
0
PxREN.y
PxSEL.y
PxOUT.y
0
From Timer
1
DVSS
0
DVCC
1
1
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
Interrupt
Edge
Select
PxSEL.y
PxIES.y
Table 14. Port P1 (P1.0 to P1.3) Pin Functions – MSP430G2x01
PIN NAME (P1.x)
x
P1.0/
TA0CLK/
CONTROL BITS/SIGNALS
P1DIR.x
P1SEL.x
P1.x (I/O)
I: 0; O: 1
0
TA0CLK
0
1
ACLK
ACLK
1
1
P1.1/
P1.x (I/O)
I: 0; O: 1
0
1
1
TA0.0
0
FUNCTION
1
TA0.CCI0A
TA0.0
P1.2/
P1.x (I/O)
TA0.1
2
P1.3
3
TA0.CCI1A
TA0.1
30
P1.x (I/O)
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0
1
I: 0; O: 1
0
1
1
0
1
I: 0; O: 1
0
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MSP430G2x11
MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Port P1 Pin Schematic: P1.4 to P1.7, Input/Output With Schmitt Trigger – MSP430G2x01
PxSEL.y
PxDIR.y
1
Direction
0: Input
1: Output
0
PxREN.y
PxSEL.y
PxOUT.y
DVSS
0
DVCC
1
1
0
From Module
1
P1.4/SMCLK/TCK
P1.5/TA0.0/TMS
P1.6/TA0.1/TDI/TCLK
P1.7/TDO/TDI
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
Interrupt
Edge
Select
PxSEL.y
PxIES.y
From JTAG
To JTAG
Table 15. Port P1 (P1.4 to P1.7) Pin Functions – MSP430G2x01
PIN NAME (P1.x)
x
P1.4/
FUNCTION
P1SEL.x
JTAG Mode
CAPD.y
I: 0; O: 1
0
0
0
SMCLK
1
1
0
0
TCK
TCK
x
x
1
0
P1.5/
P1.x (I/O)
I: 0; O: 1
0
0
0
SMCLK/
TA0.0/
P1.x (I/O)
CONTROL BITS / SIGNALS
P1DIR.x
4
TA0.0
1
1
0
0
TMS
TMS
x
x
1
0
P1.6/
P1.x (I/O)
I: 0; O: 1
0
0
0
TA0.1/
5
TA0.1
1
1
0
0
TDI/TCLK
TDI/TCLK
x
x
1
0
P1.7/
P1.x (I/O)
I: 0; O: 1
0
0
0
TDO/TDI
x
x
1
0
TDO/TDI
6
7
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Port P1 Pin Schematic: P1.0 to P1.3, Input/Output With Schmitt Trigger – MSP430G2x11
To Comparator
from Comparator
PxSEL.y
PxDIR.y
1
Direction
0: Input
1: Output
0
PxREN.y
PxSEL.y
PxOUT.y
ACLK
DVSS
0
DVCC
1
1
0
1
Bus
Keeper
EN
P1.0/TA0CLK/ACLK/CA0
P1.1/TA0.0/CA1
P1.2/TA0.1/CA2
P1.3/CAOUT/CA3
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
PxSEL.y
PxIES.y
32
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Interrupt
Edge
Select
Copyright © 2010, Texas Instruments Incorporated
MSP430G2x11
MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Table 16. Port P1 (P1.0 to P1.3) Pin Functions – MSP430G2x11
PIN NAME (P1.x)
x
FUNCTION
CONTROL BITS / SIGNALS
P1DIR.x
P1SEL.x
CAPD.y
P1.0/
P1.x (I/O)
I: 0; O: 1
0
0
TA0CLK/
TA0.TACLK
0
1
0
ACLK
1
1
0
CA0
CA0
x
x
1 (y = 0)
P1.1/
P1.x (I/O)
I: 0; O: 1
0
0
TA0.0/
TA0.0
1
1
0
TA0.CCI0A
0
1
0
ACLK/
0
1
CA1
CA1
P1.2/
P1.x (I/O)
TA0.1/
2
CA2
P1.3/
CAOUT/
CA3
x
x
1 (y = 1)
I: 0; O: 1
0
0
TA0.1
1
1
0
TA0.CCI1A
0
1
0
CA2
x
x
1 (y = 2)
P1.x (I/O)
3
I: 0; O: 1
0
0
CAOUT
1
1
0
CA3
x
x
1 (y = 3)
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Port P1 Pin Schematic: P1.4 to P1.7, Input/Output With Schmitt Trigger – MSP430G2x11
To Comparator
from Comparator
CAPD.y
PxSEL.y
PxDIR.y
1
Direction
0: Input
1: Output
0
PxREN.y
PxSEL.y
PxOUT.y
From Module
DVSS
0
DV CC
1
1
0
1
P1.4/SMCLK/CA4/TCK
P1.5/TA0.0/CA5/TMS
P1.6/TA0.1/CA6/TDI/TCLK
P1.7/CAOUT/CA7/TDO/TDI
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
PxSEL.y
PxIES.y
Interrupt
Edge
Select
From JTAG
To JTAG
34
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Table 17. Port P1 (P1.4 to P1.7) Pin Functions – MSP430G2x11
PIN NAME (P1.x)
x
FUNCTION
CONTROL BITS / SIGNALS
P1DIR.x
P1SEL.x
JTAG Mode
CAPD.y
0
P1.4/
P1.x (I/O)
I: 0; O: 1
0
0
SMCLK/
SMCLK
1
1
0
0
CA4
x
x
0
1 (y = 4)
TCK
TCK
x
x
1
0
P1.5/
P1.x (I/O)
I: 0; O: 1
0
0
0
TA0.0/
TA0.0
1
1
0
0
CA5
x
x
0
1 (y = 5)
CA4/
CA5/
4
5
TMS
TMS
P1.6/
P1.x (I/O)
TA0.1/
CA6/
6
x
x
1
0
I: 0; O: 1
0
0
0
TA0.1
1
1
0
0
CA6
x
x
0
1 (y = 6)
TDI/TCLK
TDI/TCLK
x
x
1
0
P1.7/
P1.x (I/O)
I: 0; O: 1
0
0
0
CAOUT/
CAOUT
1
1
0
0
CA7
x
x
0
1 (y = 7)
TDO/TDI
x
x
1
0
CA7/
TDO/TDI
7
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MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
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Port P2 Pin Schematic: P2.6, Input/Output With Schmitt Trigger – MSP430G2x01 and
MSP430G2x11
XOUT/P2.7
LF off
PxSEL.6
PxSEL.7
BCSCTL3.LFXT1Sx = 11
LFXT1CLK
0
PxSEL.6
PxDIR.y
1
0
1
Direction
0: Input
1: Output
PxREN.y
PxSEL.6
PxOUT.y
0
from Module
1
DV SS
0
DV CC
1
1
Bus
Keeper
EN
XIN/P2.6/TA0.1
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
PxSEL.y
PxIES.y
Interrupt
Edge
Select
Table 18. Port P2 (P2.6) Pin Functions – MSP430G2x01 and MSP430G2x11
PIN NAME (P2.x)
x
XIN
P2.6
TA0.1
36
FUNCTION
XIN
6
P2.x (I/O)
Timer0_A3.TA1
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CONTROL BITS / SIGNALS
P2DIR.x
P2SEL.6
P2SEL.7
0
1
1
I: 0; O: 1
0
x
1
1
x
Copyright © 2010, Texas Instruments Incorporated
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MSP430G2x01
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SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
Port P2 Pin Schematic: P2.7, Input/Output With Schmitt Trigger – MSP430G2x01 and
MSP430G2x11
XIN/P2.6/TA0.1
LF off
PxSEL.6
PxSEL.7
BCSCTL3.LFXT1Sx = 11
LFXT1CLK
0
PxSEL.7
PxDIR.y
1
0
from P2.6/XIN
1
Direction
0: Input
1: Output
PxREN.y
PxSEL.7
PxOUT.y
0
from Module
1
DVSS
0
DV CC
1
1
Bus
Keeper
EN
XOUT/P2.7
PxIN.y
To Module
PxIE.y
PxIRQ.y
EN
Q
Set
PxIFG.y
Interrupt
Edge
Select
PxSEL.y
PxIES.y
Table 19. Port P2 (P2.7) Pin Functions – MSP430G2x01 and MSP430G2x11
CONTROL BITS / SIGNALS
PIN NAME (P2.x)
XOUT
P2.7
x
7
FUNCTION
XOUT
P2.x (I/O)
Copyright © 2010, Texas Instruments Incorporated
P2DIR.x
P2SEL.6
P2SEL.7
P2SEL.7
1
1
1
I: 0; O: 1
0
x
Submit Documentation Feedback
37
MSP430G2x11
MSP430G2x01
SLAS695C – FEBRUARY 2010 – REVISED JULY 2010
www.ti.com
REVISION HISTORY
REVISION
38
DESCRIPTION
SLAS695
Limited Product Preview release
SLAS695A
Updated Product Preview
Changes throughout for sampling
SLAS695B
Updated Product Preview
SLAS695C
Production Data release
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
MSP430G2001IN14
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
MSP430G2001IPW14R
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
MSP430G2001IRSA16R
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2001IRSA16T
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2101IN14
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
MSP430G2101IPW14
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
MSP430G2101IPW14R
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
MSP430G2101IRSA16R
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2101IRSA16T
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2111IN14
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
MSP430G2111IPW14
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
MSP430G2111IPW14R
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
MSP430G2111IRSA16R
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2111IRSA16T
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2201IN14
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
MSP430G2201IPW14
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
MSP430G2201IPW14R
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Jun-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
MSP430G2201IRSA16R
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Contact TI Distributor
or Sales Office
MSP430G2201IRSA16T
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
MSP430G2211IPW14R
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
MSP430G2211IRSA16R
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
MSP430G2211IRSA16T
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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