MX27L2000 2M-BIT [256Kx8] CMOS EPROM FEATURES • • • • • • • 256Kx 8 organization Wide power supply range, 2.7V DC to 3.6V DC +12.5V programming voltage Fast access time: 120/150/200/250 ns Totally static operation Completely TTL compatible Operating current:20mA @ 3.6V, 5MHz • Standby current: 20uA • Package type: - 32 pin plastic DIP 32 pin SOP 32 pin PLCC 8x20mm 32-lead TSOP(I) 8x14mm 32-lead TSOP(I) 8x13.4mm 32-lead TSOP(I) GENERAL DESCRIPTION The MX27L2000 is a 3V only, 2M-bit, One Time Programmable Read Only Memory. It is organized as 256K words by 8 bits per word, operates from a single + 3 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27L2000 supports a intelligent fast programming algorithm which can result in programming time of less than one minute. PIN CONFIGURATIONS BLOCK DIAGRAM A7 32 CE PGM A17 1 NC VCC A16 4 VPP 5 A15 30 29 A13 A8 A3 25 MX27L2000 A0~A17 ADDRESS A11 A2 OE A1 A10 INPUTS 21 20 Q5 Q4 Q3 17 Q7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 P/N: PM0372 MX27L2000 Y-SELECT . . . . . . . X-DECODER . . . . 2M BIT CELL MAXTRIX . VCC VSS 32 TSOP(I) (8x20mm,8x14mm,8x13.4mm) A11 A9 A8 A13 A14 A17 PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 Q0~Q7 Q6 13 14 Y-DECODER . . CE A0 Q0 . . A9 9 OUTPUT BUFFERS A14 A5 A4 CONTROL LOGIC OE A6 GND VCC PGM A17 A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 A12 32 PLCC 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Q2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27L2000 VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND Q1 32 PDIP/SOP This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead SOP and 32 lead PLCC and 32 lead TSOP(I) packages. PIN DESCRIPTION 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 1 SYMBOL PIN NAME A0~A17 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin REV. 2.9, JAN. 22, 2002 MX27L2000 FUNCTIONAL DESCRIPTION AUTO IDENTIFY MODE THE PROGRAMMING OF THE MX27L2000 The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27L2000. When the MX27L2000 is delivered, or it is erased, the chip has all 2M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27L2000 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. FAST PROGRAMMING Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L2000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. READ MODE The MX27L2000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. PROGRAM INHIBIT MODE Programming of multiple MX27L2000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L2000 may be common. A TTL low-level program pulse applied to an MX27L2000 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27L2000. A high-level CE input inhibits the other MX27L2000s from being programmed. STANDBY MODE The MX27L2000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27L2000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE, at VIL, PGM at VIH, and VPP at its programming voltage. REV. 2.9, JAN. 22, 2002 P/N: PM0372 2 MX27L2000 TWO-LINE OUTPUT CONTROL FUNCTION SYSTEM CONSIDERATIONS To accommodate multiple memory connections, a twoline control function is provided to allow for: During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. MODE SELECT TABLE PINS MODE CE OE PGM A0 A9 VPP OUTPUTS Read VIL VIL X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2H Device Code(3) VIL X VIH VH VCC 20H VIL NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A17 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. REV. 2.9, JAN. 22, 2002 P/N: PM0372 3 MX27L2000 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED REV. 2.9, JAN. 22, 2002 P/N: PM0372 4 MX27L2000 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27L2000-12/15. REV. 2.9, JAN. 22, 2002 P/N: PM0372 5 MX27L2000 NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC+0.5V VCC to Ground Potential -0.5V to 7.0V V9 & VPP -0.5V to 13.5V NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27L2000 Operating Temperature Commercial -12- 15 -20 -25 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C - - 2.7V to 3.6V 2.7V to 3.6V Industrial Vcc Power Supply -40°C to 85°C -40°C to 85°C 2.7V to 3.6V 2.7V to 3.6V DC CHARACTERISTICS SYMBOL PARAMETER VOH Output High Voltage VOL Output Low Voltage VIH Input High Voltage VIL MIN. MAX. UNIT 2.4 CONDITIONS V IOH = -0.4mA, VCC=3.0V 0.4 V IOL = 2.1mA, VCC=3.0V 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V 2.7V < VCC < 3.6V ILI Input Leakage Current -10 10 uA VIN = 0 to 3.6V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 20 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 0.25 mA CE = VIH ICC1 VCC Active Current 20 mA CE = VIL, f=5MHz, Iout = 0mA, VCC=3.6V IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = VCC CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V REV. 2.9, JAN. 22, 2002 P/N: PM0372 6 MX27L2000 AC CHARACTERISTICS SYMBOL PARAMETER 27L2000-12 27L2000-15 27L2000-20 MIN MIN. MAX. MIN. MAX. 27L2000-25 MAX. MIN. MAX. UNIT CONDITIONS tACC Address to Output Delay 120 150 200 250 ns CE = OE =VIL tCE Chip Enable to Output Delay 120 150 200 250 ns OE = VIL 120 ns CE = VIL 70 ns tOE Output Enable to Output Delay tDF OE High to Output Float, 50 0 65 35 0 50 100 0 60 0 or CE High to Output Floa tOH Output Hold from Address, 0 0 0 0 ns CE or OE which ever occurred first DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER VOH Output High Voltage VOL Output Low Voltage VIH Input High Voltage VIL MIN. MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V 2.4 VIN = 0 to 3.6V CE=PGM=VIL,OE=VIH AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. MAX. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2 us tOE Data valid from OE 130 UNIT ns us 105 150 us ns REV. 2.9, JAN. 22, 2002 P/N: PM0372 7 MX27L2000 WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORM PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tOES tPW tOE Max VIH OE VIL REV. 2.9, JAN. 22, 2002 P/N: PM0372 8 MX27L2000 ORDERING INFORMATION PLASTIC PACKAGE OPERATING PART NO. ACCESS TIME STANDBY OPERATING CURRENT MAX. CURRENT MAX. TEMPERATURE PACKAGE (ns) (mA) (uA) MX27L2000PC-12 120 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-12 120 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-12 120 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-15 150 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-15 150 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-15 150 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-20 200 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-20 200 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-20 200 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-25 250 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-25 250 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-25 250 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-12 120 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-12 120 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-12 120 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-15 150 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-15 150 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-15 150 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-20 200 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-20 200 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-20 200 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-25 250 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-25 250 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-25 250 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000T2C-12 120 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-15 150 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-20 200 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-25 250 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-12 120 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-15 150 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-20 200 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-25 250 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T3C-12 120 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-15 150 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-20 200 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-25 250 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) REV. 2.9, JAN. 22, 2002 P/N: PM0372 9 MX27L2000 OPERATING PART NO. ACCESS TIME STANDBY OPERATING CURRENT MAX. CURRENT MAX. TEMPERATURE PACKAGE (ns) (mA) (uA) MX27L2000T3I-12 120 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-15 150 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-20 200 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-25 250 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000QC-12 120 20 20 0°C to 70°C 32 PLCC MX27L2000QC-15 150 20 20 0°C to 70°C 32 PLCC MX27L2000QC-20 200 20 20 0°C to 70°C 32 PLCC MX27L2000QC-25 250 20 20 0°C to 70°C 32 PLCC MX27L2000QI-12 120 20 20 -40°C to 85°C 32 PLCC MX27L2000QI-15 150 20 20 -40°C to 85°C 32 PLCC MX27L2000QI-20 200 20 20 -40°C to 85°C 32 PLCC MX27L2000QI-25 250 20 20 -40°C to 85°C 32 PLCC REV. 2.9, JAN. 22, 2002 P/N: PM0372 10 MX27L2000 PACKAGE INFORMATION 32-PIN PLASTIC DIP(600 mil) REV. 2.9, JAN. 22, 2002 P/N: PM0372 11 MX27L2000 32-PIN PLASTIC SOP (450 mil) REV. 2.9, JAN. 22, 2002 P/N: PM0372 12 MX27L2000 32-PIN TSOP (8 x 20mm) REV. 2.9, JAN. 22, 2002 P/N: PM0372 13 MX27L2000 32-PIN TSOP (8 x 14mm) REV. 2.9, JAN. 22, 2002 P/N: PM0372 14 MX27L2000 32-PIN TSOP (8 x 13.4mm) REV. 2.9, JAN. 22, 2002 P/N: PM0372 15 MX27L2000 32-PIN PLCC REV. 2.9, JAN. 22, 2002 P/N: PM0372 16 MX27L2000 REVISION HISTORY Revision No. Description Page 2.0 Eliminate Interactive Programming Mode. AC driving levels changed from 2.4V/0.4V to 3V/0V. 2.1 IPP 100uA --> 10uA 2.2 Add 120/150ns speed grades. 2.3 Corrected errors in the DC/AC Operating Conditions for Read Operation 2.4 Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages 2.5 Change TSOP Orientation 2.6 Cancel Ceramic DIP package type P1,2,9,11 2.7 To modify Package Information P10~14 2.8 Cancel "Ultraviolet Erasable" wording in General Description P1 2.9 To added 32-pin PLCC information P1,10,16 Date 5/29/1997 8/07/1997 12/24/1997 2/5/1998 2/24/1998 4/09/1998 MAR/01/2000 JUL/19/2001 AUG/20/2001 JAN/22/2002 REV. 2.9, JAN. 22, 2002 P/N: PM0372 17 MX27L2000 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.