NTC SMD Thermistors With Nickel Barrier Termination NB 21 - NB 23 Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. They are widely used for temperature compensation but can also achieve temperature control of printed circuits. A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. NB 21 IEC SIZE : 0603 Types NB 23 IEC SIZE : 0402 1.0 ± 0.1 (0.04 ± 0.004) 1.6 (.063) 0.2 (.008) 0.40 ± 0.1 (0.02 ±0.004) 0.8 (.031) ±0.2 (.008) DIMENSIONS: millimeters (inches) 0.8 (.031) ±0.2 (.008) 0.60 (0.024) max 0.2 (.008) min 0.25 (0.10) min 0.2 (.008) min Terminations 0.25 (0.10) min Nickel Barrier Marking On packaging only Climatic category 40/125/56 Operating temperature -55°C to +150°C Tolerance on Rn (25°C) ±5%, ±10%, ±20% Maximum dissipation at 25°C Thermal dissipation factor Thermal time constant 0.07 W 0.06 W 1 mW/°C 0.8 mW/°C 4s 3s Resistance - Temperature characteristics: pages 36 to 40. APPLICATIONS • • • • • • • • • LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems Temperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits HOW TO ORDER 14 NB 21 K0 0103 M BB Type Material Code K (See tables page 15) Resistance 10,000 Ω Tolerance M (±20%) J (±5%) K (±10%) Suffix: Packaging – –: Bulk BB: Cardboard tape (180mm diam. reel) BF: Cardboard tape (1/2 reel) BD: Cardboard tape (330mm diam. reel) NTC SMD Thermistors With Nickel Barrier Termination NB 21 - NB 23 TABLE OF VALUES NB 23 IEC SIZE : 0402 NB 21 IEC SIZE : 0603 Types NB 21 KC 0 470 NB 21 KC 0 101 NB 21 KC 0 471 Rn at 25°C (Ω) 47 100 470 Material Code KC B (K) (B/B (1) ± 5% (2) ± 3% 3470 ± 5% 3910 ± 3% ) at 25°C (%/°C) Types Rn at 25°C (Ω) Material Code B (K) (B/B (1) ± 5% (2) ± 3% ) at 25°C (%/°C) NB 23 NC 0 103 10,000 NC 4080 ± 3% – 4.6 – 3.9 NB 23 RC 0 103 10,000 RC 4340 ± 3% – 4.7 – 4.4 NB 23 NC 0 153 NB 23 NC 0 223 15,000 22,000 NC 4080 ± 3% – 4.6 NB 23 RC 0 223 NB 23 RC 0 333 22,000 33,000 RC 4340 ± 3% – 4.7 NB 23 NE 0 473 47,000 NE 4100 ± 3% – 4.6 NB 23 RC 0 473 NB 23 RC 0 683 NB 23 RC 0 104 47,000 68,000 100,000 RC 4340 ± 3% – 4.7 NB 21 MC 0 102 1,000 MC NB 21 J 0 0472 4,700 J 3480 ± 3% – 3.9 NB 21 J 5 0682 NB 21 J 5 0103 6,800 10,000 J5 3480 ± 3% 3480 ± 3% – 3.9 – 3.9 NB 21 K 0 0103 NB 21 K 0 0153 10,000 15,000 K 3630 ± 3% – 4.0 NB 21 L 0 0223 22,000 L 3790 ± 3% – 4.2 NB 21 M 0 0333 NB 21 M 0 0473 33,000 47,000 M 3950 ± 3% – 4.4 NB 21 L 2 0683 68,000 L2 3805 ± 3% – 4.1 NB 21 N 0 0683 68,000 N 4080 ± 3% – 4.6 NB 21 N 5 0104 100,000 N5 4160 ± 3% – 4.7 NB 21 P 0 0154 150,000 P 4220 ± 3% – 4.7 NB 21 Q 0 0334 NB 21 Q 0 0474 330,000 470,000 Q 4300 ± 3% – 4.7 15 Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION 5.5 (.217) ±0.2 (.008) Max 3° 30µ ± 5µ T K Designation Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Symbol W T P0 D0 Distance Distance (center to center) Distance (center to center) Sizes of the NC 12 (0805) cavities E F P2 A0 B0 K Value 8 0.4 max. 4 1.5 -0 1.75 3.5 2 1.5 2.4 1.4 max. NC 20 (1206) A0 B0 K 1.95 3.55 1.5 max. A1 B1 B0 F R = 0.3 (.012) Max. The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. (.008) Hole 1 (.039) +0.2 -0 Cover Tape Max 3° Super 8 Plastic Tape Packaging: D0 P2 E P0 Max 3° Max 3° A0 Direction of unreeling Tolerance ±0.2 ±0.1 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NC - NB 12 NC 20 - NB 20 16 Suffix BA BE BA BE Qty Per Reel 4000 2000 3000 1500 W Upper side Bottom side Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION 8mm Paper Tape Packaging: 10 PITCHES CUMULATIVE TOLERANCE ON TAPE 0.20mm (0.008) P0 The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. BOTTOM COVER TAPE D0 T P2 E1 TOP COVER TAPE F W E2 B0 G T1 T1 Designation Symbol W T P0 Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Value 8 1.1 max. 4 1.5 -0/+0.1 1.75 3.5 2 0.10 max. 6.25 min. 0.75 min. 4 2 D0 Distance Distance (center to center) Distance (center to center) Cover tape thickness Distance Distance Component pitch 0805/0603 0402 CAVITY SIZE SEE NOTE 1 A0 CENTER LINES OF CAVITY E1 F P2 T1 E2 G P1 P1 User Direction of Feed Tolerance -.0.1/+0.3 ±0.1 ±0.1 ±0.1 ±0.05 ±0.05 ±0.1 ±0.1 +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) Upper side Bottom side + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NB - NC 12 NB 21 NB 23 Suffix BB BF BB BF Qty Per Reel 4000 2000 10000 5000 17 Surface Mounting Guide Chip Thermistor – Application Notes STORAGE Wave Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. 300 Preheat Solder Temp. SOLDERABILITY / LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. P/N Termination Type AgPdPt Nickel Barrier NC NB Solder Tin/Lead 60/40 60/40 Solder Temp ºC 260 ± 5 260 ± 5 T 200 230ºC to 250ºC 150 100 50 0 Immersion Time Seconds 15 max 30 ± 1 NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. Natural Cooling 250 1 to 2 min 3 sec. max (Preheat chips before soldering) T/maximum 150°C a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. Reflow 300 D2 RECOMMENDED SOLDERING PAD LAYOUT Natural Cooling Preheat Solder Temp. 250 200 D5 REFLOW SOLDERING 100 50 Case Size 0 1min 1min Temperature °C 0402 NB23 0603 NB21 0805 NB12 1206 NB20 D1 D2 D3 D4 D5 1.70 (.067) 2.30 (.091) 3.00 (.118) 4.00 (.157) 0.60 (.024) 0.80 (.031) 1.00 (.039) 1.00 (.039) 0.50 (.020) 0.70 (.028) 1.00 (.039) 2.00 (.079) 0.60 (.024) 0.80 (0.31) 1.00 (.039) 1.00 (.039) 0.50 (.020) 0.75 (.030) 1.25 (.049) 2.50 (.098) WAVE SOLDERING 50 100 150 • Pre-heating: 150°C ±15°C / 60-90s • Max. Peak Gradient: 2.5°C/s • Peak Temperature: 245°C ±5°C • Time at >230°C: 40s Max. 18 P/N 10 sec. max (Minimize soldering time) 300 250 200 150 100 50 0 0 D3 D4 Dimensions in mm (inches) 220ºC to 250ºC 150 D1 200 250 Time (s) 300 Case Size P/N 0603 NB21 0805 NB12 1206 NB20 D1 D2 D3 D4 D5 3.10 (.122) 4.00 (.157) 5.00 (.197) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.70 (.028) 1.00 (.039) 2.00 (.079) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.75 (.030) 1.25 (.049) 1.60 (.063)