User’s Guide NHD-320240WG-COTFH-VZ#-010-80 LCM (Liquid Crystal Display Graphic Module) RoHS Compliant NHD320240WGC OTFHVZ#010-80: Newhaven Display 320 x 240 Dots W= Version Line G= Display Type- Graphic Model Serial Number White LED B/L FSTN (+) Transflective, 6:00 View, Wide Temperature (-20 ~ +70c) With built in Negative Voltage, Rohs Backlight A(+5V)=PIN19, K=PIN20, Intel 8080 interface mode For product support, contact Newhaven Display International 2511 Technology Drive, #101 Elgin, IL 60124 Tel: (847) 844-8795 Fax: (847) 844-8796 April 17, 2008 RECORDS OF REVISION VERSION DATE 0 2006.06.23 REVISED PAGE NO. DOC. FIRST ISSUE SUMMARY First issue Contents 1.Module classification information 2.Precautions in Use of LCM 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Description 8.Contour Drawing & Block Diagram 9. Display Control Instruction 10.Reliability 11. Backlight Information 12.Inspection specification 13.Material List of Components for RoHs 第 3 頁，共 20 頁 3 1.Module Classification Information NHD 320240 W G － C0 T F H – VZ#-010-80 c f d e ghij 9 c Brand：Newhaven Display d Display Font：320 * 240 Dots e Factory Line: W f Display Type：H→Character Type, G→Graphic Type, C→ Color, X→Tab Type g Model / Serial number: C0 Æ With RA8835 Controller h Backlight Type： N→Without backlight T→White LED B→EL, Blue green A→LED, Amber D→EL, Green R→LED, Red W→EL, White O→LED, Orange F→CCFL, White G→LED, Green Y→LED, Yellow Green i LCD Mode： B→TN Positive, Gray T→FSTN Negative N→TN Negative, Y→STN Positive, Yellow Green G→STN Positive, Gray M→STN Negative, Blue F→FSTN Positive j LCD Polarize Type/ A→Reflective, N.T, 6:00 Temperature range/ D→Reflective, N.T, 12:00 View direction G→Reflective, W. T, 6:00 H→Transflective, W.T,6:00 J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00 B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00 E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00 9 Special Code K→Transflective, W.T,12:00 C→Transmissive, N.T,6:00 #: RoHS ; V: Built in Negative voltage Z: NT7086 Driver Control RA8835 -010: Backlight A(+5V)=PIN19, K=PIN20 -80: Intel 8080 Interface mode Newhaven Display International, LLC NHD-320240WG-C0TFH-VZ#-010-80 2.Precautions in Use of LCD Module (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD Module. (3)Don’t disassemble the LCM. (4)Don’t operate it above the absolute maximum rating. (5)Don’t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. 3.General Specification ITEM STANDARD VALUE UNIT Number of dots 320x240 dots Outline dimension 148.02 (W)x 120.24(H)x 15.6max(T) mm View area 120.14(W)x 92.14(H) mm Active area 115.18(W)x 86.38(H) mm Dot size 0.34(W)x 0.34(H) mm Dot pitch 0.36(W)x 0.36(H) mm LCD type View direction Backlight FSTN Positive , Transflective 6 o’clock LED , White 第 5 頁，共 20 頁 4.Absolute Maximum Ratings ITEM SYMBOL MIN. TYP. MAX. UNIT Operating Temperature TOP -20 － +70 ℃ Storage Temperature TST -30 － +80 ℃ Input Voltage VI 0 － Vdd V Supply Voltage For Logic VDD 0 － 6.5 V Supply Voltage For LCD VDD-VEE 0 － 32 V SYMBOL CONDITION MIN. TYP. MAX. UNIT VDD-VSS － 4.5 5.0 5.5 V Ta=-20℃ － － 25.0 V Ta=25℃ － 23.8 － V Ta=70℃ 23.0 － － V 5.Electrical Characteristics ITEM Logic Voltage Supply Voltage For LCD VDD-VO Input High Volt. VIH － 0.5VDD － VDD V Input Low Volt. VIL － 0 － 0.2VDD V Output High Volt. VOH － 2.4 － － V Output Low Volt. VOL － － － 0.4 V Supply Current IDD － 95.0 100.0 110.0 mA 第 6 頁，共 20 頁 6.Optical Characteristics ITEM SYMBAL CONDITION MIN MAX UNIT (V)θ CR≧2 30 － 60 deg. (H)φ CR≧2 -45 － 45 deg. CR － － 5 － － T rise － － 200 300 ms T fall － － 150 200 ms View Angle Contrast Ratio Response Time Definitions ■View Angles ( Visual angle direction ) Brightness at selected state ( BS ) Brightness at non-selected state ( Bns ) Selected state CR = φ X Brightness (%) Z ■Contrast Ratio Non-selected state Bs Bns Y Operating voltage for LCD driving θ ■Response time Nonselected Condition Selected Condition Nonselected Condition 90 % 100 % Brightness 6.1 TYP 10 % tr Rise Time td 第 7 頁，共 20 頁 Decay Time ( fall time tf ) 7.Interface Description JM (left) short , for 8080 MPU family Pin No. Symbol Level Description 1 VSS 0V 2 VDD 5.0V 3 VO 4 /RD H/L Active Low=Read data 5 /WR H/L /WR signal input to select the write mode Active Low = Write data 6 A0 H/L R/W=L, A0=H: Command Write R/W=H, A0=H: Status Read 7~14 DB0~DB7 H/L Data bus 15 CS H/L Chip select ,Active L 16 RES H/L Controller reset signal, Active L 17 VEE -25V Negative voltage output (Optional) 18 FGND Ground Power supply for Logic (Variable) Driving voltage for LCD Frame Ground 19 A 5.0V Backlight supply 20 K 0V Backlight ground 第 8 頁，共 20 頁 A0=L: Data Write A0=L: Data Read 8.Contour Drawing & Block diagram 4.02 139.98 136.2 120.14(V A ) 115.18(A A ) 13.97 16.45 16.62 13.74 4.02 7.11 4.44 15.6M A X 10.5 86.38(AA) 92.14(VA) 105.4 112.2 120.24 0.5 X H -3P EQ 320*240 D ots 190.0±5.0 2.54 2 1 5.0 20 19 4- 23.5PTH 4- 26.0PA D 22.86 21.06 20- 21.0PTH 20- 21.8PA D 1.6 (P2.54*9) 148.02 L ED B /L 0.5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 V ss V dd Vo RD WR A0 DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS R ES V ee FG N D A K T he non-specified tolerance of dim ension is ±0.3 m m . 0.34 0.36 0.36 0.34 D O T SIZE SC A L E 10/1 Com161~240 Power ON Reset Com81~160 32K SRAM Com1~80 MPU Driver Controller Driver RA8835 Driver CL1 M FLM RD WR A0 DB0~DB7 CS RES 320X240 DOT VR 20K Bias and Power Circuit * Vdd Vo Vee N.V. Generator Internal contrast adjustment. Seg1~80 Seg81~160 Seg161~240 Seg241~320 Driver Driver Driver Driver CL2 DB0~DB3 Frame PAD *:6800 family or 8080family interface selectable. 第 9 頁，共 20 頁 FGND 9.Display Control Instruction PLEASE TO CONSUL RA8835 SPEC 第 10 頁，共 20 頁 10.RELIABILITY Content of Reliability Test (wide temperature, -20℃~70℃) Environmental Test Test Item Content of Test Test Condition Endurance test applying the high storage temperature for a long 80℃ time. 200hrs Low Temperature Endurance test applying the high storage temperature for a long -30℃ storage time. 200hrs High Temperature Endurance test applying the electric stress (Voltage & Current) 70℃ Operation and the thermal stress to the element for a long time. 200hrs Low Temperature Endurance test applying the electric stress under low temperature -20℃ Operation for a long time. High Temperature storage 200hrs The module should be allowed to stand at 60℃,90%RH max High Temperature/ Humidity Operation For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. Note 2 1,2 —— 1 60℃,90%RH 96hrs 1,2 The sample should be allowed stand the following 10 cycles of operation -20℃ 25℃ 70℃ Thermal shock resistance -20℃/70℃ 10 cycles 30min 5min —— 30min 1 cycle Total fixed amplitude : 15mm Vibration test Endurance test applying the vibration during transportation and Vibration Frequency : using. 3 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5kΩ Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF —— 1 time Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container. 第 11 頁，共 20 頁 11. Backlight Information Specification PARAMETER SYMBOL MIN TYP MAX UNIT TEST Supply Current ILED 160 200 mA VatPIN19=5.0V Supply Voltage V(PIN19) 4.8 5.0 5.1 V － Reverse Voltage VR － － 8 V － IV 260 280 － － － 50K Luminous Intensity Wave Length λp Life Time － Color White 130 CONDITION CD/M2 ILED=160mA － － nm ILED=160mA Hr. ILED=160mA Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). LED B\L Drive Method 1.Drive from 19,20 R 19 B/L 20 第 12 頁，共 20 頁 12. Inspection specification NO Item Criterion AQL 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. 01 Electrical Testing 02 Black or white 2.1 White and black spots on display ≦0.25mm, no more than three spots on LCD 2.5 white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 03 04 3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE Φ≦0.10 0.10＜Φ≦0.20 black 0.20＜Φ≦0.25 white 0.25＜Φ LCD spots, spots, contamination 3.2 Line type : (As following drawing) (non-display) Length Width --W≦0.02 L≦3.0 0.02＜W≦0.03 L≦2.5 0.03＜W≦0.05 --0.05＜W Polarizer bubbles If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Φ≦0.20 Acceptable Q TY Accept no dense 2 1 0 2.5 2 As round type Acceptable Q TY Accept no dense 3 0.50＜Φ≦1.00 2 1.00＜Φ 0 第 13 頁，共 20 頁 2.5 Acceptable Q TY Accept no dense 0.20＜Φ≦0.50 Total Q TY 0.65 3 2.5 NO Item 05 Scratches Criterion AQL Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels: Chipped 06 glass z: Chip thickness y: Chip width x: Chip length Z≦1/2t Not over viewing area x≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack: z: Chip thickness y: Chip width x: Chip length Z≦1/2t Not over viewing area x≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip. 第 14 頁，共 20 頁 2.5 NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : y: Chip width x: Chip length y≦0.5mm x≦1/8a 6.2.2 Non-conductive portion: 06 z: Chip thickness 0 ＜ z≦t Glass crack 2.5 y: Chip width x: Chip length z: Chip thickness y≦ L x≦1/8a 0 ＜ z≦t ☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y≦1/3L 第 15 頁，共 20 頁 x: length x≦a NO Item 07 Cracked glass 08 09 10 Backlight elements Bezel PCB、COB Criterion AQL The LCD with extensive crack is not acceptable. 2.5 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn＇t light or color wrong. 0.65 2.5 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 2.5 0.65 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB 2.5 0.65 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 X Y 11 Soldering X * Y<=2mm2 11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB. 第 16 頁，共 20 頁 2.5 2.5 2.5 0.65 NO Item Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin AQL 2.5 (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 0.65 12.3 No contamination, solder residue or solder balls on product. 2.5 12.4 The IC on the TCP may not be damaged, circuits. 2.5 12.5 The uppermost edge of the protective strip on the interface pin 2.5 must be present or look as if it cause the interface pin to sever. General 12 appearance 12.6 The residual rosin or tin oil of soldering (component or chip 2.5 component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 2.5 12.8 Pin type must match type in specification sheet. 0.65 12.9 LCD pin loose or missing pins. 0.65 12.10 Product packaging must the same as specified on packaging 0.65 specification sheet. 12.11 Product dimension and structure must conform to product specification sheet. 第 17 頁，共 20 頁 0.65 13 Material List of Components for RoHs 1. Newhaven Display hereby declares that all of or part of products (with the mark “#”in code), including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit A：The Harmful Material List Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs Limited 100 1000 1000 1000 1000 1000 Value ppm ppm ppm ppm ppm ppm Above limited value is set up according to RoHS. 2.Process for RoHS requirement： (1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp.： Reflow：250℃,30 seconds Max.； Connector soldering wave or hand soldering：320℃, 10 seconds max. (3) Temp. curve of reflow, max. Temp.：235±5℃； Recommended customer’s soldering temp. of connector：280℃, 3 seconds. 第 18 頁，共 20 頁 Newhaven LCM Sample Estimate Feedback Sheet Module Number： 1、Panel Specification： 1. Panel Type： Page: 1 □ Pass □ NG , 2. View Direction： □ Pass □ NG , 3. Numbers of Dots： □ Pass □ NG , 4. View Area： □ Pass □ NG , 5. Active Area： □ Pass □ NG , 6. Operating Temperature： □ Pass □ NG , 7. Storage Temperature： □ Pass □ NG , 8. Others： 2、Mechanical Specification： 1. PCB Size： □ Pass □ NG , 2. Frame Size： □ Pass □ NG , 3. Material of Frame： □ Pass □ NG , 4. Connector Position： □ Pass □ NG , 5. Fix Hole Position： □ Pass □ NG , 6. Backlight Position： □ Pass □ NG , 7. Thickness of PCB： □ Pass □ NG , 8. Height of Frame to PCB： □ Pass □ NG , 9. Height of Module： □ Pass □ NG , 10. Others： □ Pass □ NG , 3、Relative Hole Size： 1. Pitch of Connector： □ Pass □ NG , 2. Hole size of Connector： □ Pass □ NG , 3. Mounting Hole size： □ Pass □ NG , 4. Mounting Hole Type： □ Pass □ NG , 5. Others： □ Pass □ NG , 4、Backlight Specification： 1. B/L Type： □ Pass □ NG , 2. B/L Color： □ Pass □ NG , 3. B/L Driving Voltage (Reference for LED Type)： □ Pass 4. B/L Driving Current： □ Pass □ NG , 5. Brightness of B/L： □ Pass □ NG , 6. B/L Solder Method： □ Pass □ NG , 7. Others： □ Pass □ NG , ＞＞ Go to page 2 ＜＜ 第 19 頁，共 20 頁 Newhaven □ NG , Newhaven Module Number： 5、Electronic Characteristics of Module： 1. Input Voltage： □ Pass Page: 2 □ NG , 2. Supply Current： □ Pass □ NG , 3. Driving Voltage for LCD： □ Pass □ NG , 4. Contrast for LCD： □ Pass □ NG , 5. B/L Driving Method： □ Pass □ NG , 6. Negative Voltage Output： □ Pass □ NG , 7. Interface Function： □ Pass □ NG , 8. LCD Uniformity： □ Pass □ NG , 9. ESD test： □ Pass □ NG , Others： □ Pass □ NG , 10. 6、Summary： Sales signature： Customer Signature： Date： 第 20 頁，共 20 頁 / /