NUD4001 Product Preview High Current LED Driver This device is designed to replace discrete solutions for driving LEDs in low voltage DC applications 5V, 12V or 24V. An external resistor allows the circuit designer to set the drive current for different LED arrays. This discrete integration technology eliminates individual components by combining them into a single package, which results in a significant reduction of both system cost & board space. The device is a small surface mount package (SO–8). http://onsemi.com PIN CONFIGURATION AND SCHEMATIC Features • Supplies Constant LED Current for Varying Input Voltages. • External Resistor Allows Designer to Set Current – up to 350 mA. • Offered in Surface Mount Package Technology (SO−8). Benefits • • • • Maintains a Constant Light Output During Battery Drain. One Device Can Be Used for Many Different LED Products. Reduces Board Space & Component Count. Simplifies Circuit and System Designs. Vin Iout N/C Iout Current Set Point Rext Iout GND Iout Typical Applications • Portables: For Battery Back−up Applications, also Simple Ni−CAD • • 8 1 Battery Charging. Industrial: Low Voltage Lighting Applications and Small Appliances. Automotive: Tail Lights, Directional Lights, Back−up Light, Dome Light. SO−8 CASE 751 MARKING DIAGRAM PIN FUNCTION DESCRIPTIONS 8 Pin Symbol Description 1 Vin Positive input voltage to the device 2 N/C No connection 3 Rext An external resistor between Rext and Vin pins sets different current levels for different application needs 4 GND Ground 5, 6, 7, 8 Iout 4001 AYWW 1 4001 A Y W = Specific Device Code = Assembly Location = Year = Work Week The LEDs are connected from these pins to ground This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. ORDERING INFORMATION Device Package Shipping† NUD4001DR2 SO−8 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2003 December, 2003 − Rev. P0 1 Publication Order Number: NUD4001/D NUD4001 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Input Voltage Vin 60 V Output Current (For Vdrop ≤ 3.0 V), (Note 1) Iout 350 mA Output Voltage Vout 58 V Human Body Model (HBM) ESD 2000 V Symbol Value Unit Operating Ambient Temperature TA −40 to +125 °C Maximum Junction Temperature TJ 150 °C TSTG −55 to +150 °C PD 1.25 10 W mW/°C RJA 100 °C/W 1. Vdrop = Vin – 0.7 V − VLEDs THERMAL CHARACTERISTICS Characteristic Storage Temperature Total Power Dissipation (Note 2) Derating above 25°C (Fig. 3) Thermal Resistance Junction–to–Ambient (Note 2) 2. Mounted onto FR−4, 1” pad, 1 oz coverage. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Symbol Min Typ Max Unit Output Current1 (Vin = 12 V, Rext = 2.0 , VLEDs = 10 V) Iout1 − 350 − mA Output Current2 (Vin = 60 V, Rext = 70 , VLEDs = 10 V) Iout2 − 10 − mA Bias Current (Vin = 12 V, Rext = Open, VLEDs = 10 V) IBias − 5.0 − mA Voltage Overhead (Note 3) Vover 1.4 − − V Characteristic 3. Vover = Vin – VLEDs http://onsemi.com 2 NUD4001 TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) 1000 1.00 0.40 REXT, IOUT, mA 100 0.10 10 Safe Operating Area 1 100 10 0.01 1000 1 10 IOUT (mA) Figure 2. Voltage Across Driver (VDROP) vs. Output Current (IOUT) 2.0 1.5 1.0 0.5 0 25 30 VDROP (V) Figure 1. Output Current (IOUT) vs. External Resistor (REXT) PD, POWER DISSIPATION (W) 1 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Figure 3. Max Power Dissipation (PD) vs. Ambient Temperature (TA) http://onsemi.com 3 100 NUD4001 APPLICATION INFORMATION Design Guide NUD4001 Iout Vin 1. Determine Iout – LED’s current: a. ILED = 350 mA Iout N/C 2. Calculate Resistor Value for Rext: a. Rext = 0.7 V / Iout b. Rext = 0.7/0.350 = 2 ohms Rext Current Set Point GND Iout 3. Define Vin: a. Per Example in Fig 4, Vin = 12 V 12 V 4. Define VLED @ ILED per LED supplier’s data sheet: b. Per Example in Fig. 4, VLED = 3.5 V + 3.5 V + 3.5 V = 10.5 V Figure 4. 12 V Application (Series LED’s Array) 5. Calculate Vdrop across NUD4001: a. Vdrop = Vin – 0.7V – VLED b. Vdrop = 12.0 V – 0.7 V – 10.5 V c. Vdrop = 0.8 V 6. Calculate Power Dissipation (PD): a. PD = Vdrop * Iout b. PD = 0.8 V * 0.350 A c. PD = 280 mW 7. If PD > 1.25 W (or derated value based on ambient temperature, Fig. 3), then select the most appropriate recourse and repeat steps 1−6: a. Reduce Vin b. Reconfigure LED array to reduce Vdrop c. Reduce Iout by increasing Rext http://onsemi.com 4 Iout NUD4001 PACKAGE DIMENSIONS SO−8 CASE 751−07 ISSUE AA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 NUD4001 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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