NL27WZ02 Dual 2−Input NOR Gate The NL27WZ02 is a high performance dual 2−input NOR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ02 Chip Complexity: FET = 112 Pb−Free Package is Available http://onsemi.com MARKING DIAGRAM 8 8 1 L3 M G G US8 US SUFFIX CASE 493 L3 M G 1 = Specific Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. A1 B1 Y2 GND 8 1 2 7 6 3 5 4 VCC PIN ASSIGNMENT Y1 B2 A2 Pin Function 1 A1 2 B1 3 Y2 4 GND 5 A2 6 B2 7 Y1 8 VCC Figure 1. Pinout FUNCTION TABLE Output Input A1 w1 B1 A2 Y1 Y2 B2 Figure 2. Logic Symbol Y=A+B A B Y L L H L H L H L L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 May, 2006 − Rev. 8 1 Publication Order Number: NL27WZ02/D NL27WZ02 MAXIMUM RATINGS Parameter Symbol Value Unit VCC *0.5 to )7.0 V DC Input Voltage VI *0.5 to )7.0 V DC Output Voltage VO *0.5 to )7.0 V VI < GND IIK *50 mA VO < GND IOK *50 mA DC Supply Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current IO $50 mA DC Supply Current per Supply Pin ICC $100 mA DC Ground Current per Ground Pin IGND $100 mA Storage Temperature Range TSTG *65 to )150 °C Lead Temperature, 1 mm from Case for 10 Seconds TL 260 °C Junction Temperature under Bias TJ )150 °C Thermal Resistance (Note 1) qJA 250 °C/W Power Dissipation in Still Air at 85°C PD 250 mW MSL Level 1 FR UL 94 V−0 @ 0.125 in VESD > 2000 > 200 N/A Moisture Sensitivity Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Symbol Min Max Unit Operating Data Retention Only VCC 1.65 1.5 5.5 5.5 V VI 0 5.5 V (HIGH or LOW State) VO 0 VCC V TA *40 )85 °C Dt/DV 0 0 0 0 20 20 10 5 ns/V Input Voltage (Note 5) Output Voltage Operating Free−Air Temperature Input Transition Rise or Fall Rate VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NL27WZ02 DC ELECTRICAL CHARACTERISTICS Parameter Condition Symbol Min 0.75 VCC 0.7 VCC High−Level Input Voltage VIH 1.65 2.3 to 5.5 Low−Level Input Voltage VIL 1.65 2.3 to 5.5 High−Level Output Voltage VIN = VIL or VIH IOH = −100 mA IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOH 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA VOL 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current VIN = VCC or GND IIN Quiescent Supply Current VIN = VCC or GND ICC *405C v TA v 855C TA = 255C VCC (V) Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.5 2.1 2.4 2.7 2.5 4.0 0.0 0.08 0.20 0.22 0.28 0.38 0.42 Unit V 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.90 2.20 2.40 2.30 3.80 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 $0.1 $1.0 mA 5.5 1.0 10 mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns Condition Symbol (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF tPLH tPHL 1.8 $ 0.15 2.0 7.4 9.5 2.0 9.7 ns 2.5 $ 0.20 1.2 3.3 5.4 1.2 5.8 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 $ 0.30 0.8 1.2 2.6 3.2 3.9 4.8 0.8 1.2 4.3 5.2 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 $ 0.50 0.5 0.8 1.9 2.5 3.1 3.7 0.5 0.8 3.3 4.0 Parameter Propagation Delay (Figure 3 and 4) *405C v TA v 855C TA = 255C VCC CAPACITIVE CHARACTERISTICS Parameter Condition Symbol Typical Unit Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CIN 2.5 pF Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC CPD 9.0 11.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ02 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% INPUT 10% 10% tPHL OUTPUT GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Device Nomenclature Device Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Technology Device Function Package Suffix Package Shipping† NL 2 7 WZ 02 US US8 3000/Tape & Reel NL27WZ02US NL27WZ02USG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZ02 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D 0.10 (0.004) M DIM A B C D F G H J K L M N P R S U V N R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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