ONSEMI NL27WZ02USG

NL27WZ02
Dual 2−Input NOR Gate
The NL27WZ02 is a high performance dual 2−input NOR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ02
Chip Complexity: FET = 112
Pb−Free Package is Available
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MARKING
DIAGRAM
8
8
1
L3 M G
G
US8
US SUFFIX
CASE 493
L3
M
G
1
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
A1
B1
Y2
GND
8
1
2
7
6
3
5
4
VCC
PIN ASSIGNMENT
Y1
B2
A2
Pin
Function
1
A1
2
B1
3
Y2
4
GND
5
A2
6
B2
7
Y1
8
VCC
Figure 1. Pinout
FUNCTION TABLE
Output
Input
A1
w1
B1
A2
Y1
Y2
B2
Figure 2. Logic Symbol
Y=A+B
A
B
Y
L
L
H
L
H
L
H
L
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 8
1
Publication Order Number:
NL27WZ02/D
NL27WZ02
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VCC
*0.5 to )7.0
V
DC Input Voltage
VI
*0.5 to )7.0
V
DC Output Voltage
VO
*0.5 to )7.0
V
VI < GND
IIK
*50
mA
VO < GND
IOK
*50
mA
DC Supply Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
IO
$50
mA
DC Supply Current per Supply Pin
ICC
$100
mA
DC Ground Current per Ground Pin
IGND
$100
mA
Storage Temperature Range
TSTG
*65 to )150
°C
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
°C
Junction Temperature under Bias
TJ
)150
°C
Thermal Resistance (Note 1)
qJA
250
°C/W
Power Dissipation in Still Air at 85°C
PD
250
mW
MSL
Level 1
FR
UL 94 V−0 @ 0.125 in
VESD
> 2000
> 200
N/A
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
Min
Max
Unit
Operating
Data Retention Only
VCC
1.65
1.5
5.5
5.5
V
VI
0
5.5
V
(HIGH or LOW State)
VO
0
VCC
V
TA
*40
)85
°C
Dt/DV
0
0
0
0
20
20
10
5
ns/V
Input Voltage (Note 5)
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
NL27WZ02
DC ELECTRICAL CHARACTERISTICS
Parameter
Condition
Symbol
Min
0.75 VCC
0.7 VCC
High−Level Input
Voltage
VIH
1.65
2.3 to 5.5
Low−Level Input
Voltage
VIL
1.65
2.3 to 5.5
High−Level Output
Voltage
VIN = VIL or VIH
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
VOH
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
Low−Level Output
Voltage
VIN = VIH or VOH
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
VOL
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
Input Leakage
Current
VIN = VCC or GND
IIN
Quiescent Supply
Current
VIN = VCC or GND
ICC
*405C v TA v 855C
TA = 255C
VCC
(V)
Typ
Max
Min
Max
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.5
2.1
2.4
2.7
2.5
4.0
0.0
0.08
0.20
0.22
0.28
0.38
0.42
Unit
V
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.90
2.20
2.40
2.30
3.80
V
V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
0 to 5.5
$0.1
$1.0
mA
5.5
1.0
10
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
Condition
Symbol
(V)
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
tPLH
tPHL
1.8 $ 0.15
2.0
7.4
9.5
2.0
9.7
ns
2.5 $ 0.20
1.2
3.3
5.4
1.2
5.8
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 $ 0.30
0.8
1.2
2.6
3.2
3.9
4.8
0.8
1.2
4.3
5.2
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
5.0 $ 0.50
0.5
0.8
1.9
2.5
3.1
3.7
0.5
0.8
3.3
4.0
Parameter
Propagation Delay
(Figure 3 and 4)
*405C v TA v 855C
TA = 255C
VCC
CAPACITIVE CHARACTERISTICS
Parameter
Condition
Symbol
Typical
Unit
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CIN
2.5
pF
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
CPD
9.0
11.0
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ02
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
VCC
90%
50%
50%
INPUT
10%
10%
tPHL
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
ORDERING INFORMATION
Device Nomenclature
Device
Logic
Circuit
Indicator
No. of
Gates per
Package
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Package
Shipping†
NL
2
7
WZ
02
US
US8
3000/Tape & Reel
NL27WZ02US
NL27WZ02USG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ02
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
K
D
0.10 (0.004)
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NL27WZ02/D