Quality and Continuous Improvement Reliability Qualification Report Device Qualification Date: 10/16/2002 PCN: Laura Rivers Scott Savage Reliability Engineer Reliability Manager 602 244 5474 602 244 4848 1) Introduction: Qualification of NUF2221W1T2 series of devices designed for applications requiring Line Termination, EMI Filtering and ESD Protection.These are intented for use in upstream USB ports, Cellular phones, Wireless equipment and computer applications. Offering an integrated solution, offering better ESD protection than available from a discete implemetation because of reduced parasitic inductances, in a small package (SC88/SOT363) reducing PCB space and cost. ESD Ratings: Jedec MM Class C, Jedec HBM 3B. Compliant with IEC61000-4-2 (Level 4) 8KV (contact) 15KV (air) 2) Device Description: Qual ID 1564 Wafer Fab Site ISMF Seremban, Malaysia Device NUF2221W1T2 Assembly Site SBN Seremban, Malaysia Line Source ZLU22N Final Test Site AIT BATAM, IDN Batam, Indonesia Parent Tech ZENER Reliability Lab SBN Seremban, Malaysia Technology ZENER Package SC88/SOT363 Max. Current 100mA Die Size 670 X 500 Max. Voltage 7V Flag Size 1.1mm X 0.625mm Polarity PN Related Qualification Report(s): This series of devices is qualified by similarity based upon the NZMM7V04T4, rel report # 0450 , for die technology and the NL27WZU04DFT2, rel report# 1242, for package technology. Full characterization of the NUF2221W1T2 has also been completed. NUF2221W1T2_1564_2002.pdf Product Reliability Engineering Services 1 Quality and Continuous Improvement 3) Qualification Results Analysis: no anomalies were observed. 4) Conclusion: The NUF2221W1T2 and NUF2xx1W1T2 series of devices have been found to meet or exceed all qualification requirements, by similarity, according to ON Semiconductor Product Qualification Process, 12MRB17722C. These devices are fully qualified. NUF2221W1T2_1564_2002.pdf Product Reliability Engineering Services 2 Quality and Continuous Improvement Reliability Customer Report Package Qualification Date: 02/19/01 PCN: n/a Chuck Reed/Laura Rivers Thomas Grzybowski Reliability Engineer Reliability Manager 602 244 5474 602-244-4331 1) Introduction: This product is being developed for a Motorola cellular phone application. The device has 21 zener diodes and 9 resistors. The FAB facility is ISMF and assembly is Amkor. 2) Device Descriptions: Qual ID 0450 Wafer Fab Site ISMF Device NZMM7V0T4 Assembly Site Amkor (ATP4) Line Source ZLDMC7V0 Final Test Site Amkor (ATK1) Parent Tech ZENER Reliability Lab FET TESTER Technology ZENER Package 24 MLP2 52nd St., Phoenix, AZ Max. Current Max. Voltage Die Size 53 MILS X 53 MILS Flag Size Polarity PN Qual ID 0477 Wafer Fab Site ISMF Device NZMM7V0T4 Assembly Site Amkor (ATP4) Line Source ZLDMC7V0 Final Test Site Amkor (ATK1) Parent Tech ZENER Reliability Lab FET TESTER Technology ZENER Package 24 MLP2 52nd St., Phoenix, AZ Max. Current Max. Voltage Die Size 53 MILS X 53 MILS Flag Size Polarity PN NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 1 Quality and Continuous Improvement 2) Device Descriptions continued: Qual ID 0668 Wafer Fab Site ISMF Device NZMM7V0T4 Assembly Site Amkor (ATP4) Line Source ZLDMC7V0 Final Test Site Amkor (ATK1) Parent Tech ZENER Reliability Lab FET TESTER Technology ZENER Package 24 MLP2 52nd St., Phoenix, AZ Max. Current Max. Voltage Die Size 53 MILS X 53 MILS Flag Size Polarity PN Qual ID 0669 Wafer Fab Site ISMF Device NZMM7V0T4 Assembly Site Amkor (ATP4) Line Source ZLDMC7V0 Final Test Site Amkor (ATK1) Parent Tech ZENER Reliability Lab FET TESTER Technology ZENER Package 24 MLP2 52nd St., Phoenix, AZ Max. Current Max. Voltage Die Size 53 MILS X 53 MILS Flag Size Polarity PN Qual ID n/a Wafer Fab Site Device Assembly Site Line Source Final Test Site Parent Tech Reliability Lab Technology Max. Current Max. Voltage Package Die Size Flag Size Polarity Qual ID n/a Wafer Fab Site Device Assembly Site Line Source Final Test Site Parent Tech Reliability Lab Technology Max. Current Max. Voltage Package Die Size Flag Size Polarity Qual ID n/a Wafer Fab Site Device Assembly Site Line Source Final Test Site Parent Tech Reliability Lab Technology Max. Current Max. Voltage Package Die Size Flag Size Polarity NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 2 Quality and Continuous Improvement 3) Qualification Results Analysis: Life and environmental tests passed with zero qualification related failures. 4) Conclusion: The 24 pin EMI filter qualification of the NZMM7V0T4 product meets or exceeds reliability qualification test requirements per 12MSB17722C issue B. Zero devices in any subgroup experienced failure due to the standard testing. This qualifies other dice in the family such as: NZF220DFT1 and NZF220TT1. NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 4 Quality and Continuous Improvement 5) Test Description & Condition: Auto Autoclave AUTOCLAVE Autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing Auto-PC Autoclave - PC AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing Bond Pull Bond Pull Strength BOND PULL STRENGTH The purpose of this test is to determine bond pull strength of wire to die, substrate, or package header connections. The wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. Test Conditions: TA = 25°C Common Failure Modes: Parametric shifts, open, and/or intermittent Common Failure Mechanisms: Corrosion or contaminants from foreign material within the package. Silicon or metalization defects. Bond Shear Bond Shear BOND SHEAR The purpose of this test is to determine bond shear strength of wire to die, substrate, or package header connections. The wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. Test Conditions: TA = 25°C Common Failure Modes: Parametric shifts, open, and/or intermittent Common Failure Mechanisms: Corrosion or contaminants from foreign material within the package. Silicon or metalization defects. DPA Destructive Physical Analysis DESTRUCTIVE PHYSICAL ANALYSIS The purpose of this test is to determine conformance with applicable design and process requirements. Test Conditions: TA = 25°C Common Failure Modes: Electrical, mechanical and physical failures Common Failure Mechanisms: Various material and manufacturing defects. DPA-H3TRB Destructive Physical Analysis H3TRB DESTRUCTIVE PHYSICAL ANALYSIS The purpose of this test is to determine conformance with applicable design and process requirements. Test Conditions: TA = 25°C Common Failure Modes: Electrical, mechanical and physical failures Common Failure Mechanisms: Various material and manufacturing defects. NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 5 Quality and Continuous Improvement 5) Test Description & Condition continued: DPA-H3TRB Destructive -PC Physical Analysis H3TRB-PC DESTRUCTIVE PHYSICAL ANALYSIS The purpose of this test is to determine conformance with applicable design and process requirements. Test Conditions: TA = 25°C Common Failure Modes: Electrical, mechanical and physical failures Common Failure Mechanisms: Various material and manufacturing defects. DPA-TC-PC Destructive Physical Analysis TC-PC DESTRUCTIVE PHYSICAL ANALYSIS The purpose of this test is to determine conformance with applicable design and process requirements. Test Conditions: TA = 25°C Common Failure Modes: Electrical, mechanical and physical failures Common Failure Mechanisms: Various material and manufacturing defects. DPATC Destructive Physical Analysis TC DESTRUCTIVE PHYSICAL ANALYSIS The purpose of this test is to determine conformance with applicable design and process requirements. Test Conditions: TA = 25°C Common Failure Modes: Electrical, mechanical and physical failures Common Failure Mechanisms: Various material and manufacturing defects. ESD Electrostatic Discharge ELECTROSTATIC DISCHARGE The purpose of this test is to measure the relative ability of the part to withstand accidental electrostatic discharge. Both the Human Body Model and the Machine Model are used in testing. Devices are divided into groups and tested at specified increments across the ESD test range (per JEDEC). Data is recorded and devices are rated at the highest level at which they passed. If devices show no failures at the max increment, they are rated as being greater than (>) that voltage. If devices fail at some lower increment, they are rated as being equal (=) to that voltage. H3TRB High Humidity HIGH HUMIDITY HIGH TEMPERATURE BIAS High Temperature This test designed to measure the moisture resistance of plastic encapsulated devices. A Reverse Bias bias is applied to create an electrolytic cell necessary to accelerate corrosion of the die metallization. With time, this is a catastrophically destructive test. Test Conditions: TA = 85°C, rh = 85% Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing H3TRB-PC High Humidity HIGH HUMIDITY HIGH TEMPERATURE BIAS + MOISTURE LEVEL PRECONDITIONING High Temperature This test designed to measure the moisture resistance of plastic encapsulated devices. A Reverse Bias-PC bias is applied to create an electrolytic cell necessary to accelerate corrosion of the die metallization. With time, this is a catastrophically destructive test. Test Conditions: TA = 85°C, rh = 85% Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 6 Quality and Continuous Improvement 5) Test Description & Condition continued: HTRB High Temperature HIGH TEMPERATURE REVERSE BIAS Reverse Bias The purpose of this test is to align mobile ions by means of temperature and voltage stress to form a high-current leakage path between two or more junctions. Test Conditions: TA = 150°C Common Failure Modes: Parametric shifts in leakage and gain Common Failure Mechanisms: Ionic contamination on the surface or under the metallization of the die IOL Intermittent Operational Life INTERMITTENT OPERATIONAL LIFE The purpose of this test is the same as Operating Life in addition to checking the integrity of both wire and die bonds by means of thermal stressing. Test Conditions: TA = 25°C, Ton = Toff = 2 minutes, delta Tj => 100°C Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Foreign material, crack and bulk die defects, metallization, wire and die bond defects IOL-PC Intermittent Operational Life PC INTERMITTENT OPERATIONAL LIFE + MOISTURE LEVEL PRECONDITIONING The purpose of this test is the same as Operating Life in addition to checking the integrity of both wire and die bonds by means of thermal stressing. Test Conditions: TA = 25°C, Ton = Toff = 2 minutes, delta Tj => 100°C Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Foreign material, crack and bulk die defects, metallization, wire and die bond defects MSL 1 Moisture Level 1 MOISTURE LEVEL PRECONDITIONING These tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. These tests detect mold compound delamination from the die and leadframe. The failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@220°C + 1X Flux Immersion + DI Rinse TC Temperature Cycle TEMPERATURE CYCLING The purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. This testing will also expose excessive thermal mismatch between materials. Test Conditions: TA = -65°C to 150°C, air to air Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Wire bond, cracked or lifted die and package failure TC-PC Temperature Cycle - PC TEMPERATURE CYCLING + MOISTURE LEVEL PRECONDITIONING The purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. This testing will also expose excessive thermal mismatch between materials. Test Conditions: TA = -65°C to 150°C, air to air Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Wire bond, cracked or lifted die and package failure NZMM7V0T4_0450F_2001.pdf Product Reliability Engineering Services 7 Test Summary Test Name Test Conditions & Bias Lot ID Auto TA = +121°C, RH = 100%, PSIG = 15, N/A 0450A 0 Hr. 30 0 0450A 96 Hr. 30 0 0477B 0 Hr. 77 0 0477B 96 Hr. 77 0 0668A 0 Hr. 77 0 0668A 96 Hr. 77 0 0669A 0 Hr. 77 0 0669A 96 Hr. 77 0 0477A 0 Hr. 76 0 0477A 96 Hr. 76 0 0668A 0 Hr. 77 0 0668A 96 Hr. 77 0 0669A 0 Hr. 68 0 0669A 96 Hr. 68 0 Auto-PC After MSL-1 pre-conditioning: TA = +121°C, RH = 100%, PSIG = 15, N/A Interval SS Rej Bond Pull Cond. C or D; pre- or post mold, N/A 0477A Results 5 0 Bond Shear Cond. C or D; pre- or post mold, N/A 0477A Results 5 0 DPA-H3TRB- Random Sample of Good H3TRB devices per CDF-AEC-Q101-004 Section 4, N/A PC NZMM7V0T4_0669F_2000.pdf Results 2 0 0668A Results 2 0 0669A Results 2 0 0477A Comment Product Reliability Engineering Services Appendix A 1 Test Summary Test Name Test Conditions & Bias Lot ID Interval SS Rej DPA-TC Random Sample of Good Temp Cycle devices per CDF-AEC-Q101-004 Section 4, N/A 0450A Results 2 0 0477A Results 2 0 DPA-TC-PC Random Sample of Good Temp Cycle devices per CDF-AEC-Q101-004 Section 4, N/A 0477A Results 2 0 Elect Dis As Specified, N/A 0477A Results 20 0 ESD MM, N/A 0477A Results 5 0 H3TRB TA = +85°C, RH = 85%, +4.8 volts to pins 1-24 in parallel, to ground connection. Note: pin 1 = pin 24 and pin 3 = pin 22. 0450A 0 Hr. 29 0 0450A 504 Hr. 29 0 0450A 1008 Hr. 29 0 0477A 0 Hr. 71 0 0477A 504 Hr. 71 0 0477A 1008 Hr. 71 0 0668A 0 Hr. 77 0 0668A 504 Hr. 77 0 0668A 1008 Hr. 77 0 0669A 0 Hr. 77 0 0669A 504 Hr. 77 0 0669A 1008 Hr. 77 0 NZMM7V0T4_0669F_2000.pdf Comment Product Reliability Engineering Services Appendix A 2 Test Summary Test Name Test Conditions & Bias Lot ID Interval H3TRB-PC After MSL-1 pre-conditioning: TA = +85°C; RH = 85%, +4.8 volts to pins 1-24 in parallel, to ground connection. 0477A 0 Hr. 59 0 0477A 504 Hr. 59 0 0477A 1008 Hr. 59 0 77 0 0668A 1008 Hr. 77 0 0669A 0 Hr. 77 0 77 0 0450A 0 Hr. 28 0 0450A 504 Hr. 28 0 0450A 1008 Hr. 28 0 0477A 0 Hr. 77 0 0477A 504 Hr. 77 0 0477A 1008 Hr. 77 0 0668A 0 Hr. 77 0 0668A 504 Hr. 77 0 0668A 1008 Hr. 77 0 0669A 0 Hr. 77 0 0668A 0669A HTRB TA = +150°C, +4.8 volts to pins 1-24 in parallel, to ground connection. NZMM7V0T4_0669F_2000.pdf 0 Hr. 504 Hr. SS Rej Comment Product Reliability Engineering Services Appendix A 3 Test Summary Test Name IOL IOL-PC MSL 1 Test Conditions & Bias TA = +25°C, delta Tj => 100°C, 2 minutes on/off, Delta Tj of 100C Lot ID Interval SS Rej 0669A 504 Hr. 77 0 0669A 1008 Hr. 77 0 0450A 0 Cyc. 29 0 0450A 7500 Cyc. 29 0 0450A 15000 Cyc. 20 0 0477B 0 Cyc. 72 0 0477B 7500 Cyc. 72 0 0477B 15000 Cyc. 72 0 By similarity with MMUN1001LT1, 3 lots. 0 Cyc. 249 0 By similarity with MMUN1001LT1, 3 lots. 10000 Cyc. 249 0 0477A 0 Cyc. 75 0 0477A 7500 Cyc. 75 0 0477A 15000 Cyc. 75 0 0477A 0 Hr. 307 0 0477A Readout 307 0 0668A 0 Hr. 320 0 0668A Readout 320 0 After MSL-1 pre-conditioning: TA = +25°C, delta Tj => 100°C, 2 minutes on/off, 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@220°C + 1X Flux Immersion + DI Rinse, N/A NZMM7V0T4_0669F_2000.pdf Comment Product Reliability Engineering Services Appendix A 4 Test Summary Test Name TC TC-PC Test Conditions & Bias Air to Air; -65°C to +150°C, N/A After MSL-1 pre-conditioning: Air to Air; -65°C to +150°C, N/A NZMM7V0T4_0669F_2000.pdf Lot ID Interval SS Rej 0669A 0 Hr. 320 0 0669A Readout 320 0 0450A 0 Cyc. 30 0 0450A 500 Cyc. 30 0 0450A 1000 Cyc. 30 0 0477A 0 Cyc. 77 0 0477A 500 Cyc. 77 0 0477A 1000 Cyc. 77 0 0668A 0 Cyc. 77 0 0668A 500 Cyc. 77 0 0668A 1000 Cyc. 77 0 0669A 0 Cyc. 77 0 0669A 500 Cyc. 77 0 0669A 1000 Cyc. 77 0 0477A 0 Cyc. 77 0 0477A 500 Cyc. 77 0 0477A 1000 Cyc. 77 0 Comment Product Reliability Engineering Services Appendix A 5 Test Summary Test Name TC-PC Test Conditions & Bias Lot ID Interval CONTINUED 0668A 0 Cyc. Rej 76 0 0668A 500 Cyc. 76 0 0668A 1000 Cyc. 76 0 0669A 0 Cyc. 77 0 0669A 500 Cyc. 77 0 77 0 0669A 1000 Cyc. NZMM7V0T4_0669F_2000.pdf SS Comment Product Reliability Engineering Services Appendix A 6 Electrical Characterization *Note: No parametric limits have been negotiated for low/high (-55C/+150C) temperatures. Parameter Spec Min Max Reading Min Max X Bar Sigma Cp Cpk 6.74 0.0163 82 15.1 3.61E-10 1.15E-10 2909 2907 25 Degrees C initial Vz @ 1mA, (Volts) 6V 8V Ir @ 3V, (Amperes) n/a 1 UA Vz @ 1mA, (Volts) 6V 8V Ir @ 3V, (Amperes) n/a 1 UA Vz @ 1mA - - - Ir @ 3V - - - 6.68 -1.45E-10 6.78 1.59E-09 25 Degrees C final 6.69 1.92E-10 6.78 6.74 0.0152 88 16.4 1.14E-09 2.70E-09 123 123 - - - - - - - - - - 4.68E-08 High Spec Temp Extreme +150C 8x20 surge to destruction study with all diodes in parallel. The highest peak power survived [by all units] was 251W. The highest current survived [by all units] was 18.3A. 1. 2. 3. 4. 5. 290.70 W 251.37 W 262.60 W 260.24 W 254.33 W Wire bond tests – Visual 45 pcs Pass – Wire pull 45 wires 1.72 Cpk – Ball shear 45 balls 1.69 Cpk Reliability Summary TEST PTH PTH-PC H3TRB H3TRB-PC H3TRB-PC-DPA HTRB TC TC-PC TC-PC-DPA IOL ESD SURGE BOND SHEAR WIRE PULL Date: 11/15/2000 Motorola Part # NZMM7V0T4 Supplier: ON Semiconductor CONDITIONS Samples/Fail 121C @ 2 atmospheres, saturated (100% RH), t = 96 hours. Ditto PTH after MSL-1 preconditioning. Ta=85°C; RH=85%; +4.8 volts to pins 1-24 in parallel to ground; t=500 hours. Ditto H3TRB after MSL-1 preconditioning. H3TRB-PC survivors. Ta=150°C; +4.8 volts to pins 1-24 in parallel to ground, t=500 hours. Air to Air; -65°C to +150°C, 500 cycles Ditto TC after MSL-1 preconditioning. TC-PC survivors Delta Tj>=100C, 7500 cycles, Ton=Toff=2 minutes. Machine Model, >2KV (units passed >30KV) >50W (units passed >250W) 10 bonds from at least 5 units. (45 bonds were sheared.) 10 wires from at least 5 units. (45 wires were pulled.) NZMM7V0T4_0669F_2000.pdf 231/0 221/0 231/0 219/0 6/0 231/0 231/0 231/0 6/0 231/0 5/0 5/0 5/0 5/0 Product Reliability Engineering Services Appendix A 7 REL ID:= LOT ID:= Rel Test:= 450 a AC Test Number 4 12 13 22 33 41 45 53 63 Initial Test Name Min Max Mean StDev Cpk VZ(pin 4) 9.24 9.33 9.302 0.020069 -154.5015 VZ(pin 12) 9.25 9.33 9.304333 0.01888 -164.2755 VZ(pin 13) 9.25 9.33 9.306667 0.020229 -153.3584 Delta Vz(T4-T13) -0.0128 0.004 -0.003773 0.00417 0.301638 IR(pin 4) 1.02E-11 4.35E-11 2.43E-11 8.8E-12 -0.920435 IR(pin 12) 1.54E-11 5.11E-11 3.48E-11 8.21E-12 -1.410966 VF(pin 4) 2.1764 2.4092 2.294667 0.068845 -11.11025 VF(pin 12) 2.1652 2.4208 2.29708 0.075097 -10.19601 Vres(pins 12-13) 0.99344 1.048 1.012629 0.012391 -27.24093 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max -0.01 -0.01 -0.01 -0.01 0 0 0.0004 -0.0012 -3.39E-10 5.12E-12 -5.12E-11 1.41E-11 -0.002 0.0096 -0.008 0.0036 -0.00248 -0.0008 Delta Mean -0.006 -0.007 -0.006667 9.33E-05 -1.26E-10 -9.44E-12 0.000387 0.00076 -0.001212 Delta(%) Min -0.108225 -0.108108 0 -3.125 -3315.234 -333.3333 -0.091895 -0.369481 -0.249638 Delta(%) Max -0.107181 -0.107181 0 -30 11.76471 27.5646 0.398473 0.148711 -0.076336 Min Max 9.23 9.32 9.24 9.32 9.25 9.33 -0.0124 0.0028 -3.29E-10 4.86E-11 -3.58E-11 6.52E-11 2.1744 2.4188 2.1572 2.4244 0.99096 1.0472 Delta(%) Mean -0.064502 -0.075234 -0.071633 -2.472637 -518.5159 -27.16741 0.016851 0.033085 -0.119688 Qual Point Mean 9.296 9.297333 9.3 -0.00368 -1.02E-10 2.53E-11 2.295053 2.29784 1.011417 StDev 0.021909 0.020998 0.020172 0.004141 8.82E-11 2.59E-11 0.071759 0.078145 0.012507 Cpk -141.4341 -147.5902 -153.6808 0.296189 0.38447 -0.325931 -10.66094 -9.801632 -26.95707 REL ID:= LOT ID:= Rel Test:= 450 a H3TRB Test Number 4 12 13 22 33 41 45 53 63 Initial Test Name Min Max Mean StDev Cpk VZ(pin 4) 9.21 9.31 9.276333 0.025795 -119.8707 VZ(pin 12) 9.23 9.31 9.279667 0.022967 -134.6827 VZ(pin 13) 9.23 9.31 9.281667 0.022296 -138.7622 Delta Vz(T4-T13) -0.0224 0.0084 -0.004467 0.006739 0.220954 IR(pin 4) -6.4E-12 4.99E-11 2.14E-11 1.24E-11 -0.575756 IR(pin 12) 2.56E-12 5.12E-11 2.49E-11 1.05E-11 -0.791943 VF(pin 4) 2.0788 2.4008 2.277827 0.07161 -10.60286 VF(pin 12) 2.1088 2.4172 2.279627 0.069401 -10.94899 Vres(pins 12-13) 1.0036 1.0488 1.028547 0.012898 -26.58221 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 0 0 0 -0.01 -0.0004 0 -6.02E-11 -3.01E-11 -2.56E-12 4.35E-11 -0.0092 -0.0364 -0.0096 -0.048 -0.0008 -0.0012 Delta Mean -0.00254 -0.00208 -0.002356 -0.000182 -3.25E-11 -8.63E-12 -0.01724 -0.01688 -0.0012 Delta(%) Min 0 0 0 1.785714 940.625 -100 -0.442563 -0.455235 -0.079713 Delta(%) Max 0 0 -0.107411 0 -60.25641 85 -1.516161 -1.985769 -0.114416 Min Max 9.21 9.31 9.23 9.31 9.23 9.3 -0.0228 0.0084 -6.66E-11 1.98E-11 0 9.47E-11 2.0696 2.3644 2.0992 2.3692 1.0028 1.0476 Delta(%) Mean -0.027384 -0.02242 -0.025387 4.065101 -151.8821 -34.58783 -0.756863 -0.740474 -0.116666 Qual Point Mean 9.273793 9.277586 9.27931 -0.004648 -1.11E-11 1.63E-11 2.260587 2.262747 1.027347 StDev 0.025272 0.022465 0.023289 0.006853 2E-11 1.82E-11 0.072301 0.067454 0.012714 Cpk -122.3201 -137.6594 -132.8155 0.226092 0.185157 -0.298078 -10.42209 -11.18169 -26.93449 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) REL ID:= LOT ID:= Rel Test:= 450 a HTRB Initial Mean 9.283667 9.285 9.286333 -0.00384 2.39E-11 2.76E-11 2.281067 2.291387 1.021973 StDev 0.018473 0.019783 0.018659 0.005467 1.26E-11 1.24E-11 0.069591 0.073276 0.014083 Cpk -167.5147 -156.445 -165.8949 0.234132 -0.632669 -0.742245 -10.92604 -10.42357 -24.1899 Delta Delta(%) Delta Min Delta Max Mean Min 0 0.41 0.040126 0 0 0.42 0.040517 0 0 0.42 0.041598 0 -0.0036 0.0296 0.000985 31.03448 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Delta(%) Max 4.403867 4.511278 4.511278 246.6667 0 0 0 0 0 Min Max 9.23 9.31 9.23 9.31 9.24 9.31 -0.0116 0.012 6E-13 5.63E-11 1.28E-12 5.38E-11 2.124 2.3784 2.1016 2.4048 1.0012 1.0456 Min Max 9.23 9.72 9.23 9.73 9.24 9.73 -0.0152 0.0416 6E-13 5.63E-11 1.28E-12 5.38E-11 2.124 2.3784 2.1016 2.4048 1.0012 1.0456 Delta(%) Mean 0.432226 0.436373 0.447945 -25.64745 0 0 0 0 0 Qual Point Mean 9.323793 9.325517 9.327931 -0.002855 2.39E-11 2.76E-11 2.281067 2.291387 1.021973 StDev 0.113528 0.109564 0.10887 0.01011 1.26E-11 1.24E-11 0.069591 0.073276 0.014083 Cpk -27.37583 -28.3717 -28.55981 0.094135 -0.632669 -0.742245 -10.92604 -10.42357 -24.1899 477 a REL ID:= LOT ID:= Rel Test:= AC_PC StDev 0.019447 0.017041 0.018221 0.018799 9.14E-11 1.1E-10 0.034189 0.039899 0.023109 Cpk -117.3872 -134.0158 -125.3614 0.077836 -0.889065 -0.787276 -10.53773 -9.069914 -13.84929 Delta(%) Min 0 0 0 0 -55.79203 -566.5365 -0.349922 -0.272374 -0.103991 Delta(%) Max 0 0.145349 0 0 5265.207 4155.688 0.749574 0.50361 0.03882 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.8 6.88 6.8 6.88 6.8 6.89 -0.0492 0.0464 1.48E-10 5.58E-10 -3.07E-11 7.16E-10 1.0288 1.174 1.028 1.1912 0.92316 1.0304 Initial Mean 6.848571 6.851299 6.852468 -0.00439 2.44E-10 2.6E-10 1.080836 1.085631 0.960121 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 0 -8.28E-11 1.74E-10 -0.0036 -0.0028 -0.00096 Delta Mean -0.000414 -0.000509 0.000164 -0.000263 3.93E-10 7.84E-10 -0.00021 0.002464 -1.68E-05 Max Delta Max 0 0.01 0 0 2.94E-08 2.97E-08 0.0088 0.005999 0.0004 Min Max 6.8 6.88 6.8 6.89 6.8 6.89 -0.0492 0.0464 6.56E-11 2.99E-08 1.43E-10 3.05E-08 1.0252 1.1828 1.0252 1.197199 0.9222 1.0308 Delta(%) Mean -0.006038 -0.007433 0.002394 5.991903 161.0864 302.1515 -0.019439 0.22692 -0.001753 Qual Point Mean 6.848158 6.850789 6.852632 -0.004653 6.37E-10 1.04E-09 1.080626 1.088095 0.960104 StDev 0.019981 0.017871 0.018502 0.019005 3.41E-09 3.85E-09 0.03778 0.04275 0.023168 Cpk -114.2463 -127.7831 -123.459 0.081602 -0.062288 -0.090468 -9.534486 -8.484259 -13.81377 REL ID:= LOT ID:= Rel Test:= 477 a H3TRB StDev 0.020237 0.019091 0.019253 0.018272 5.7E-11 6.76E-11 0.035242 0.036306 0.026466 Cpk -112.7463417 -119.527096 -118.5469801 0.040086516 -1.242642362 -1.155301238 -10.30640601 -9.985752589 -12.43670901 Delta(%) Min 0 -14.45428 -16.49485 0.680272 -206.9884 -245.8583 0 0 -0.059867 Delta(%) Max -0.145137881 -0.144927536 0 2683.018868 87311.61239 90664.80263 0.330360093 0.326346106 -0.038528427 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.79 6.78 6.79 -0.0588 1.2E-10 -3.33E-11 1.0424 1.039199 0.9354 6.89 6.9 6.9 0.0424 4.02E-10 4.86E-10 1.2108 1.225999 1.035599 Initial Mean 6.844935 6.845584 6.847143 -0.002197 2.13E-10 2.34E-10 1.089667 1.087626 0.987463 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 -0.98 -1.12 -0.0004 -2.49E-10 8.19E-11 0 0 -0.00056 Delta Max -0.01 -0.01 0 1.1376 3.51E-07 4.41E-07 0.004 0.004001 -0.000399 Delta Mean -0.002987 -0.016883 -0.017792 0.01533 7.27E-09 1.02E-08 0.001179 0.00161 -0.000298 Max Min Max 6.79 6.88 5.8 6.89 5.67 6.9 -0.0592 1.18 -1.29E-10 3.51E-07 4.86E-11 4.41E-07 1.0424 1.2148 1.039199 1.23 0.93484 1.0352 Delta(%) Mean -0.043638 -0.246628 -0.259849 -697.6359 3418.209 4332.455 0.108221 0.148062 -0.030197 Qual Point Mean 6.841948 6.828701 6.829351 0.013132 7.48E-09 1.04E-08 1.090847 1.089236 0.987165 StDev 0.019402 0.12031 0.135388 0.135971 4.63E-08 6.27E-08 0.036195 0.037067 0.026228 Cpk -117.5501 -18.91967 -16.8143 -0.032194 -0.05386 -0.055224 -10.04589 -9.795209 -12.54579 REL ID:= LOT ID:= Rel Test:= 477 a HTRB Test Number 4 12 13 22 33 41 45 53 63 Test Name Min Max VZ(pin 4) 6.8 6.88 VZ(pin 12) 6.8 6.89 VZ(pin 13) 6.79 6.88 Delta Vz(T4-T13) -0.0428 0.044 IR(pin 4) 1.3E-10 3.98E-10 IR(pin 12) 1.28E-11 1.02E-09 VF(pin 4) 1.0324 1.1628 VF(pin 12) 1.0108 1.154 Vres(pins 12-13) 0.947 1.035599 Initial Mean 6.845065 6.843117 6.845455 -0.000192 2.14E-10 2.45E-10 1.082 1.079766 0.988604 StDev 0.017519 0.016957 0.018104 0.018241 5.71E-11 1.24E-10 0.027192 0.026294 0.022346 Cpk -130.2433 -134.5223 -126.0401 0.003512 -1.2469 -0.660285 -13.26372 -13.68842 -14.74688 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Mean 0.001169 0.001169 0.000779 -0.000213 1.38E-10 9.72E-11 0.011792 0.010753 0.008552 Delta(%) Min 0 0 0 0 24.62435 323.75 0.116234 0.633162 0.933474 Delta(%) Max 0.145349 0 0.145349 -2.727273 682.98 176.1071 1.823185 1.559792 0.772596 Delta Min 0 0 0 0 3.21E-11 4.14E-11 0.0012 0.0064 0.00884 Delta Max 0.01 0 0.01 -0.0012 2.72E-09 1.79E-09 0.0212 0.018 0.008001 Min Max 6.8 6.89 6.8 6.89 6.79 6.89 -0.0428 0.0428 1.63E-10 3.12E-09 5.42E-11 2.81E-09 1.0336 1.184 1.0172 1.172 0.95584 1.0436 Delta(%) Mean 0.017076 0.01708 0.011383 110.8108 64.7697 39.57765 1.089853 0.995888 0.865031 Qual Point Mean 6.846234 6.844286 6.846234 -0.000405 3.52E-10 3.43E-10 1.093792 1.090519 0.997156 StDev 0.017399 0.017504 0.018781 0.018244 4.33E-10 3.22E-10 0.034187 0.03221 0.022172 Cpk -131.1595 -130.3374 -121.5085 0.007403 -0.270652 -0.354583 -10.66489 -11.2855 -14.99104 REL ID:= LOT ID:= Rel Test:= 477 a TC StDev 0.015467 0.018261 0.020454 0.01852 5.98E-11 7.84E-11 0.019544 0.020987 0.021335 Cpk -147.487 -124.8834 -111.4524 -0.076389 -1.131223 -0.94718 -18.35251 -17.09762 -15.4766 Delta(%) Min -0.147059 -0.147275 0 -1.123596 -859.434 453.2006 1.771957 1.666021 0.239748 Delta(%) Max 0 0 0 0.925926 3.398016 3.100775 2.394568 2.202487 0.11592 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.8 6.87 6.79 6.87 6.79 6.88 -0.0356 0.0432 1.36E-10 4.56E-10 2.81E-11 6.24E-10 1.0384 1.1192 1.0324 1.126 0.951 1.0352 Initial Mean 6.843636 6.841429 6.838831 0.004244 2.03E-10 2.23E-10 1.076026 1.076473 0.990563 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max -0.01 0 -0.01 0 0 0 0.0004 0.0004 -1.17E-09 1.55E-11 1.27E-10 1.94E-11 0.0184 0.0268 0.0172 0.0248 0.00228 0.0012 Delta Mean -0.002208 -0.001039 -0.001169 3.64E-05 -2.12E-11 7.16E-12 0.022389 0.02201 0.001627 Max Min Max 6.79 6.87 6.78 6.87 6.79 6.88 -0.0352 0.0436 -1.03E-09 4.71E-10 1.56E-10 6.44E-10 1.0568 1.146 1.0496 1.1508 0.95328 1.0364 Delta(%) Mean -0.032261 -0.015186 -0.017091 0.856793 -10.46064 3.210569 2.080754 2.044678 0.164251 Qual Point Mean 6.841429 6.84039 6.837662 0.004281 1.82E-10 2.3E-10 1.098415 1.098483 0.99219 StDev 0.017525 0.018669 0.020384 0.018702 1.57E-10 7.53E-11 0.022575 0.026699 0.021391 Cpk -130.1234 -122.1347 -111.813 -0.076294 -0.386148 -1.018398 -16.21855 -13.7143 -15.46139 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 0.0024 -1.59E-09 -1.04E-10 0.0104 0.0076 0.00084 REL ID:= LOT ID:= Rel Test:= 477 a TC_PC Initial Mean 6.856104 6.860649 6.861039 -0.004421 2.42E-10 2.58E-10 1.106099 1.113839 0.96239 StDev 0.018364 0.015839 0.016826 0.015996 7.37E-11 8.94E-11 0.041869 0.044017 0.021807 Cpk -124.4454 -144.3788 -135.9207 0.092122 -1.093926 -0.963143 -8.805941 -8.434987 -14.71091 Delta Mean 0.001169 0.001169 0.000779 0.000197 4.9E-12 3.73E-12 0.016494 0.018369 0.0012 Delta(%) Min 0 0 0 -4.958678 -2069.744 -28877.78 0.998847 0.737864 0.090783 Delta(%) Max 0 0 0 -0.892857 195.4085 36.5502 0.793126 0.130081 0.193896 Max 6.81 6.89 6.82 6.9 6.82 6.89 -0.0484 0.0448 7.67E-11 4.94E-10 3.6E-13 6.88E-10 1.0412 1.2104 1.03 1.23 0.92528 1.031999 Delta Max 0 0 0 -0.0004 9.65E-10 2.51E-10 0.0096 0.0016 0.002001 Min Max 6.81 6.89 6.82 6.9 6.82 6.89 -0.046 0.0444 -1.51E-09 1.46E-09 -1.04E-10 9.4E-10 1.0516 1.22 1.0376 1.2316 0.92612 1.034 Delta(%) Mean 0.017048 0.017037 0.011357 -4.465335 2.024822 1.444238 1.491147 1.649151 0.124638 Qual Point Mean 6.857273 6.861818 6.861818 -0.004223 2.47E-10 2.62E-10 1.122592 1.132208 0.963589 StDev 0.018399 0.01502 0.01668 0.016112 2.59E-10 1.18E-10 0.038166 0.044275 0.021929 Cpk -124.2339 -152.2826 -137.1249 0.087374 -0.317362 -0.737936 -9.804461 -8.523996 -14.64689 REL ID:= LOT ID:= Rel Test:= 477 b AUTO Test Number 4 12 13 22 33 41 45 53 63 Initial Test Name Min Max Mean StDev Cpk VZ(pin 4) 6.78 6.88 6.844935 0.017368 -131.3721 VZ(pin 12) 6.78 6.88 6.846494 0.016604 -137.4447 VZ(pin 13) 6.79 6.87 6.847143 0.014406 -158.438 Delta Vz(T4-T13) -0.068 0.0448 -0.00241 0.014075 0.057086 IR(pin 4) 1.33E-10 4.58E-10 2.05E-10 6.78E-11 -1.004847 IR(pin 12) 1.6E-10 6.28E-10 2.24E-10 7.83E-11 -0.953507 VF(pin 4) 1.0348 1.1984 1.077823 0.030987 -11.59433 VF(pin 12) 1.0348 1.1496 1.076961 0.025729 -13.95269 Vres(pins 12-13) 0.95124 1.024799 0.982684 0.021911 -14.9495 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 0 0 0 0 -0.0008 0.0004 1.98E-11 1.62E-07 1.57E-11 1.91E-06 -0.002 0.0028 -0.0016 0.0212 0.0006 0 Delta Mean 0.001558 0.000909 0.001429 0.000218 1E-08 1.94E-07 0.000353 0.001855 1.82E-05 Delta(%) Min 0 0 0 1.176471 14.91096 9.842224 -0.193274 -0.154619 0.063076 Delta(%) Max 0 0 0 0.892857 35335.41 303489.6 0.233645 1.84412 0 Min Max 6.78 6.88 6.78 6.88 6.79 6.87 -0.0688 0.0452 1.52E-10 1.62E-07 1.75E-10 1.91E-06 1.0328 1.2012 1.0332 1.1708 0.95184 1.024799 Delta(%) Mean 0.022768 0.013278 0.020864 -9.051724 4908.524 86749.98 0.032767 0.172201 0.001857 Qual Point Mean 6.846494 6.847403 6.848571 -0.002192 1.02E-08 1.95E-07 1.078176 1.078815 0.982702 StDev 0.017974 0.016336 0.014022 0.013951 2.64E-08 3.55E-07 0.030025 0.028103 0.021837 Cpk -126.9695 -139.7243 -162.8054 0.05238 -0.129376 -0.182605 -11.96978 -12.79578 -15.00088 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 0.0004 -1.15E-10 -1.6E-10 -0.0616 -0.07224 0.00024 REL ID:= LOT ID:= Rel Test:= 477 b IOL Initial Mean 6.844416 6.846104 6.843506 0.00093 2.42E-10 2.62E-10 1.091745 1.091075 0.978807 StDev 0.017282 0.016635 0.017454 0.018618 5.15E-11 5.6E-11 0.026822 0.022968 0.017955 Cpk -132.0144 -137.1821 -130.6948 -0.016648 -1.564351 -1.560668 -13.56778 -15.83442 -18.17141 Delta Mean 0.208571 0.207662 0.208571 -0.000571 1.77E-10 2.69E-10 0.243776 0.197131 0.040764 Delta(%) Min 0 0 0 -0.628931 -98.06386 -100.8836 -5.911708 -6.869532 0.025293 Delta(%) Max 118.0233 118.0233 118.0233 -4.672897 356.4504 809.4727 308.0287 317.4958 144.9669 Max 6.79 6.88 6.78 6.88 6.8 6.88 -0.0636 0.0428 1.18E-10 3.78E-10 1.58E-10 4.1E-10 1.042 1.2256 1.0516 1.198 0.94888 1.021199 Delta Max 8.12 8.12 8.12 -0.002 1.35E-09 3.32E-09 3.7752 3.8036 1.480401 Min Max 6.79 15 6.78 15 6.8 15 -0.0632 0.0408 2.28E-12 1.73E-09 -1.4E-12 3.73E-09 0.9804 5.0008 0.97936 5.0016 0.94912 2.5016 Delta(%) Mean 3.047323 3.033292 3.047727 -61.45251 73.36256 102.6866 22.32902 18.06764 4.164625 Qual Point Mean 7.052987 7.053766 7.052078 0.000358 4.19E-10 5.32E-10 1.335521 1.288207 1.019571 StDev 1.306374 1.306226 1.306539 0.018468 3.5E-10 7.05E-10 0.972988 0.875381 0.244248 Cpk -1.799634 -1.800037 -1.799176 -0.00647 -0.399531 -0.25157 -0.457533 -0.490532 -1.391443 REL ID:= LOT ID:= Rel Test:= 668 a AC StDev 0.018623 0.017413 0.018878 0.015505 9.42E-11 1.09E-10 0.019124 0.016028 0.019054 Cpk -121.3346 -129.7705 -119.6829 -0.008922 -1.069431 -1.003264 -19.49977 -23.22135 -16.94778 Delta(%) Min 0 -0.148368 0 0 -72.30903 -5.343511 -0.074878 0 -0.025714 Delta(%) Max 0 0 0 15.53398 19207.87 15518425 0.203735 -0.0344 0 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.74 6.82 6.74 6.82 6.74 6.81 -0.034 0.0412 1.38E-10 6.57E-10 1.68E-10 6.55E-10 1.0684 1.178 1.0748 1.1628 0.93336 1.0156 Initial Mean 6.778875 6.77925 6.77825 0.000415 3.02E-10 3.27E-10 1.118755 1.11657 0.968793 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 -0.01 0 0 0 0 0.0064 -1E-10 1.26E-07 -8.96E-12 0.000102 -0.0008 0.0024 0 -0.0004 -0.00024 0 Delta Mean 0.001125 0.000625 0.001125 0.00017 1.76E-09 1.27E-06 -0.000695 -0.000725 5.1E-05 Max Min Max 6.74 6.82 6.73 6.82 6.74 6.81 -0.034 0.0476 3.83E-11 1.27E-07 1.59E-10 0.000102 1.0676 1.1804 1.0748 1.1624 0.93312 1.0156 Delta(%) Mean 0.016596 0.009219 0.016597 40.96386 583.1368 388997.3 -0.062119 -0.064925 0.005263 Qual Point Mean 6.78 6.779875 6.779375 0.000585 2.07E-09 1.27E-06 1.11806 1.115845 0.968843 StDev 0.018759 0.018106 0.019509 0.015782 1.42E-08 1.14E-05 0.019711 0.016539 0.018935 Cpk -120.4757 -124.8172 -115.8309 -0.012356 -0.048614 -0.037305 -18.90734 -22.48904 -17.05579 REL ID:= LOT ID:= Rel Test:= 668 a AC-PC StDev 0.009933 0.009209 0.009139 0.013781 9.41E-11 1.08E-10 0.016396 0.015543 0.017875 Cpk -227.861 -245.8581 -247.687 0.003507 -1.093937 -1.031747 -22.8663 -24.11016 -18.1532 Delta(%) Min 0 0 -0.14771 -1.265823 -2744.872 18.34239 0.254545 0.551158 -0.08992 Delta(%) Max 0.146843 0.439883 0.293686 0 3.64E+08 6.57E+08 30.48338 32.3852 -0.119048 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.76 6.81 6.77 6.82 6.77 6.81 -0.0316 0.0352 1.83E-10 6.23E-10 1.77E-10 7.85E-10 1.1 1.183599 1.088799 1.1672 0.93416 1.008 Initial Mean 6.79025 6.7925 6.791125 -0.000145 3.09E-10 3.35E-10 1.124765 1.124215 0.973483 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 -0.01 0.0004 -5.02E-09 3.24E-11 0.0028 0.006001 -0.00084 Delta Mean 0.001375 0.001125 0.00025 0.00019 2.83E-05 6.45E-05 0.05682 0.057155 -0.000686 Max Delta Max 0.01 0.03 0.02 0 0.002266 0.005155 0.360801 0.378 -0.0012 Min Max 6.76 6.82 6.77 6.85 6.76 6.83 -0.0312 0.0352 -4.84E-09 0.002266 2.09E-10 0.005155 1.1028 1.5444 1.0948 1.5452 0.93332 1.0068 Delta(%) Mean 0.02025 0.016562 0.003681 -131.0345 9174734 19287794 5.05172 5.083995 -0.07052 Qual Point Mean 6.791625 6.793625 6.791375 4.5E-05 2.83E-05 6.45E-05 1.181585 1.18137 0.972797 StDev 0.010607 0.01139 0.01188 0.013841 0.000253 0.000576 0.098522 0.101048 0.017847 Cpk -213.4252 -198.8192 -190.5623 -0.001084 -0.037279 -0.037327 -3.997692 -3.897051 -18.16895 REL ID:= LOT ID:= Rel Test:= Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Max Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 0 0 0 0 0 -0.0004 -6.7E-08 2.54E-07 -6.01E-08 2.71E-07 0 0.0004 -0.002 0.0168 -0.0018 -0.00496 6.75 6.81 6.75 6.82 6.75 6.81 -0.0348 0.0268 1.72E-10 9.29E-10 2.03E-10 7.74E-10 1.0836 1.174 1.076 1.1784 0.93716 1.0024 Initial Mean StDev 6.7875 0.012579 6.7875 0.012779 6.786375 0.01139 0.00101 0.011813 3.21E-10 1.09E-10 3.39E-10 1.02E-10 1.120415 0.019008 1.1174 0.02044 0.973321 0.014222 Delta Mean 0.000375 -0.000125 -0.000125 0.000175 -1.17E-08 6.22E-09 -0.00067 -0.00045 -0.001545 668 a H3TRB Cpk -179.8652 -177.0546 -198.6071 -0.028499 -0.981853 -1.112583 -19.64817 -18.22215 -22.8128 Delta(%) Delta(%) Delta(%) Min Max Mean 0 0 0.005525 0 0 -0.001842 0 0 -0.001842 0 -1.492537 17.32673 -39052.89 27326.58 -3637.962 -29568.71 34936.16 1832.248 0 0.034072 -0.059799 -0.185874 1.425662 -0.040263 -0.19207 -0.494812 -0.158735 Min Max 6.75 6.81 6.75 6.82 6.75 6.81 -0.0348 0.0264 -6.68E-08 2.55E-07 -5.99E-08 2.71E-07 1.0836 1.1744 1.074 1.1952 0.93536 0.99744 Qual Point Mean 6.787875 6.787375 6.78625 0.001185 -1.14E-08 6.56E-09 1.119745 1.11695 0.971776 StDev 0.013187 0.012703 0.011515 0.011902 3.72E-08 4.47E-08 0.019755 0.021846 0.014114 Cpk -171.5744 -178.0985 -196.4469 -0.033186 0.101837 -0.048942 -18.89408 -17.04257 -22.94998 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 -0.0004 1.13E-10 8.08E-11 -0.0012 -0.002 -0.00072 668 a REL ID:= LOT ID:= Rel Test:= H3TRB_PC Initial Mean 6.78925 6.788625 6.78825 -0.000145 2.99E-10 3.28E-10 1.12252 1.114545 0.98607 StDev 0.010527 0.010156 0.008827 0.011539 1.01E-10 1.11E-10 0.020148 0.017158 0.014711 Cpk -214.974 -222.8069 -256.3516 0.004189 -0.983935 -0.987966 -18.57146 -21.6531 -22.34333 Delta Mean 0.000375 0.00075 0.000625 0.000435 5.68E-09 9.58E-09 0.00023 7.51E-05 -0.000854 Delta(%) Min 0 0 0 1.639344 137.5 53.06176 -0.111649 -0.18622 -0.075828 Delta(%) Max 0 0 0 9.677419 66149.93 58770.47 0.985724 0.068823 -0.158641 Max 6.76 6.81 6.76 6.81 6.77 6.81 -0.0244 0.0248 8.19E-11 6.75E-10 1.52E-10 7.17E-10 1.0748 1.1768 1.074 1.1624 0.94952 1.0092 Delta Max 0 0 0 0.0024 4.47E-07 4.21E-07 0.0116 0.0008 -0.001601 Min Max 6.76 6.81 6.76 6.81 6.77 6.81 -0.0248 0.0272 1.95E-10 4.47E-07 2.33E-10 4.22E-07 1.0736 1.1884 1.072 1.1632 0.9488 1.007599 Delta(%) Mean 0.005523 0.011048 0.009207 -300 1899.515 2920.678 0.020491 0.006735 -0.086557 Qual Point Mean 6.789625 6.789375 6.788875 0.00029 5.98E-09 9.91E-09 1.12275 1.11462 0.985216 StDev 0.010487 0.010354 0.009 0.012036 5E-08 5.93E-08 0.021873 0.018195 0.014574 Cpk -215.804 -218.581 -251.4447 -0.008031 -0.039868 -0.055683 -17.11032 -20.41985 -22.53382 REL ID:= LOT ID:= Rel Test:= 668 a HTRB Test Number 4 12 13 22 33 41 45 53 63 Initial Test Name Min Max Mean StDev Cpk VZ(pin 4) 6.74 6.81 6.77275 0.017573 -128.4715 VZ(pin 12) 6.73 6.81 6.768625 0.0177 -127.4724 VZ(pin 13) 6.74 6.82 6.769875 0.018315 -123.2141 Delta Vz(T4-T13) -0.0344 0.0508 0.003075 0.015854 -0.064654 IR(pin 4) 3.57E-11 4.55E-09 2.93E-10 4.97E-10 -0.196674 IR(pin 12) 1.2E-10 2.06E-09 2.79E-10 2.19E-10 -0.425061 VF(pin 4) 1.064 1.168 1.114555 0.020069 -18.51233 VF(pin 12) 1.0628 1.1788 1.11491 0.021085 -17.62599 Vres(pins 12-13) 0.93228 0.99188 0.968517 0.01351 -23.89552 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 0 0 0 0 0 -0.0008 1.3E-10 -1.02E-10 1.13E-10 1.96E-09 -0.0092 0.0044 -0.0068 0.0108 0.00648 0.00892 Delta Mean -0.000125 0.00025 0.000375 -0.00021 4.42E-10 5E-10 -0.008435 -0.006415 0.007479 Delta(%) Min 0 0 0 0 363.7892 93.61702 -0.864662 -0.639819 0.69507 Delta(%) Max 0 0 0 -1.574803 -2.250945 94.85736 0.376712 0.916186 0.899302 Min Max 6.74 6.81 6.73 6.81 6.74 6.82 -0.0344 0.05 1.65E-10 4.45E-09 2.33E-10 4.02E-09 1.0548 1.1724 1.056 1.1896 0.93876 1.0008 Delta(%) Mean -0.001846 0.003694 0.005539 -6.829268 150.731 179.2179 -0.75681 -0.575383 0.772262 Qual Point Mean 6.772625 6.768875 6.77025 0.002865 7.36E-10 7.79E-10 1.10612 1.108495 0.975996 StDev 0.017983 0.017062 0.018279 0.015882 8.16E-10 7.49E-10 0.021897 0.024772 0.01397 Cpk -125.5349 -132.2381 -123.4628 -0.060129 -0.300719 -0.346691 -16.83807 -14.91571 -23.28827 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) REL ID:= LOT ID:= Rel Test:= 668 a TC Initial Mean 6.765625 6.765375 6.765 0.00124 2.22E-10 2.61E-10 1.11698 1.119775 0.957155 StDev 0.020429 0.01728 0.015508 0.018192 8.02E-11 1.05E-10 0.018991 0.021966 0.017681 Cpk -110.3949 -130.5064 -145.4063 -0.022721 -0.922248 -0.825086 -19.60557 -16.99245 -18.04443 Delta Delta(%) Delta Min Delta Max Mean Min 0 0.01 0.0035 0 0 0 0.00125 0 0 0 0.0015 0 -0.0012 0.0044 0.00176 2.325581 1.98E-11 1.03E-08 1.7E-10 146.8843 5.84E-12 1.92E-12 1.7E-11 5.071205 0.0104 0.2856 0.02482 0.977076 0.002 0.0104 0.004455 0.185322 0.00084 0.0008 0.001993 0.091352 Delta(%) Max 0.146843 0 0 9.734513 2197.045 0.242522 24.62069 0.877785 0.081251 Min Max 6.73 6.81 6.73 6.84 6.74 6.82 -0.0516 0.0452 1.35E-11 4.71E-10 1.15E-10 7.92E-10 1.0644 1.16 1.0792 1.1848 0.91952 0.9846 Min Max 6.73 6.82 6.73 6.84 6.74 6.82 -0.0528 0.0496 3.33E-11 1.08E-08 1.21E-10 7.94E-10 1.0748 1.4456 1.0812 1.1952 0.92036 0.9854 Delta(%) Mean 0.051732 0.018476 0.022173 141.9355 76.76788 6.525481 2.222068 0.397842 0.208221 Qual Point Mean 6.769125 6.766625 6.7665 0.003 3.92E-10 2.78E-10 1.1418 1.12423 0.959148 StDev 0.020635 0.01757 0.015598 0.018486 1.19E-09 1.13E-10 0.058428 0.02652 0.017087 Cpk -109.3465 -128.3718 -144.6038 -0.054094 -0.109596 -0.816229 -6.514034 -14.13056 -18.71122 REL ID:= LOT ID:= Rel Test:= 668 a TC_PC Test Number 4 12 13 22 33 41 45 53 63 Initial Test Name Min Max Mean StDev Cpk VZ(pin 4) 6.77 6.81 6.788875 0.009678 -233.8358 VZ(pin 12) 6.77 6.8 6.789 0.00773 -292.7704 VZ(pin 13) 6.76 6.81 6.788625 0.009513 -237.8806 Delta Vz(T4-T13) -0.028 0.032 0.00011 0.01221 -0.003003 IR(pin 4) 1.64E-10 9.13E-10 3.09E-10 1.12E-10 -0.91428 IR(pin 12) 2.05E-10 7.58E-10 3.22E-10 1.04E-10 -1.03603 VF(pin 4) 1.0924 1.1816 1.12113 0.016216 -23.04541 VF(pin 12) 1.0848 1.1608 1.11578 0.016298 -22.82078 Vres(pins 12-13) 0.94028 1.0136 0.976649 0.016666 -19.53377 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Delta(%) Delta(%) Delta(%) Delta Min Delta Max Mean Min Max Mean 0 0.02 0.01025 0 0.293686 0.150982 0 0.04 0.00725 0 0.588235 0.10679 0 0.03 0.00725 0 0.440529 0.106796 0.004 0.0032 0.00268 -14.28571 10 2436.364 3.07E-11 1.98E-07 7.27E-09 18.72559 21689.2 2357.426 -6.88E-08 2.83E-08 -8.45E-10 -33600 3734.987 -262.6112 0.0212 0.3516 0.09925 1.940681 29.75626 8.852679 0.0128 0.3332 0.08186 1.179941 28.70434 7.336574 0.0018 0.0008 0.001742 0.191432 0.078927 0.178416 Min Max 6.77 6.83 6.77 6.84 6.76 6.84 -0.024 0.0352 1.95E-10 1.99E-07 -6.86E-08 2.91E-08 1.1136 1.5332 1.0976 1.494 0.94208 1.0144 Qual Point Mean 6.799125 6.79625 6.795875 0.00279 7.58E-09 -5.23E-10 1.22038 1.19764 0.978392 StDev 0.011821 0.01226 0.013187 0.011925 2.92E-08 1.08E-08 0.107541 0.102401 0.016507 Cpk -191.7279 -184.7757 -171.7766 -0.077989 -0.086544 0.016101 -3.782691 -3.898525 -19.75652 REL ID:= LOT ID:= Rel Test:= 669 a AC StDev 0.011605 0.01085 0.011046 0.013637 1.45E-10 1.25E-10 0.019775 0.025808 0.017154 Cpk -193.6833 -207.1437 -203.4825 0.002933 -0.865921 -1.025702 -18.23732 -14.00403 -19.16204 Delta(%) Min 0 0 0 -2.105263 -36.95607 -14.3383 -0.075988 -0.037979 -0.050321 Delta(%) Max 0 0 0 0 1519.048 13937.31 39.35282 36.87943 0 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.71 6.76 6.72 6.77 6.72 6.77 -0.038 0.0296 1.94E-10 1.08E-09 2.39E-10 8.86E-10 1.0528 1.1496 1.0532 1.1844 0.95388 1.0168 Initial Mean 6.742875 6.7425 6.742875 -0.00012 3.77E-10 3.84E-10 1.08193 1.084235 0.986099 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0 0 0 0 0 0 0.0008 0 -7.17E-11 1.63E-08 -3.43E-11 1.23E-07 -0.0008 0.4524 -0.0004 0.4368 -0.00048 0 Delta Mean 0.0005 0.0015 0.000875 -0.00049 4.73E-10 7.72E-09 0.007315 0.007775 -2.65E-05 Max Min Max 6.71 6.76 6.72 6.77 6.72 6.77 -0.0372 0.0296 1.22E-10 1.74E-08 2.05E-10 1.24E-07 1.052 1.602 1.0528 1.6212 0.9534 1.0168 Delta(%) Mean 0.007415 0.022247 0.012977 408.3333 125.4237 2013.002 0.676109 0.717092 -0.00269 Qual Point Mean 6.743375 6.744 6.74375 -0.00061 8.5E-10 8.1E-09 1.089245 1.09201 0.986073 StDev 0.011577 0.010978 0.010952 0.013978 2.29E-09 2.06E-08 0.061636 0.065776 0.017236 Cpk -194.1544 -204.7818 -205.2599 0.014547 -0.124024 -0.131319 -5.890751 -5.534017 -19.07025 669 a REL ID:= LOT ID:= Rel Test:= AC_PC Initial Mean 6.739875 6.738625 6.73825 0.001815 3.54E-10 3.91E-10 1.08689 1.09448 0.983239 Cpk -157.3795 -155.1962 -142.7613 -0.035823 -0.419642 -0.873124 -14.13864 -15.64144 -19.88796 Test Number 4 12 13 22 33 41 45 53 63 Test Name Min Max VZ(pin 4) 6.7 6.77 VZ(pin 12) 6.7 6.77 VZ(pin 13) 6.7 6.78 Delta Vz(T4-T13) -0.04 0.0348 IR(pin 4) 1.84E-10 2.71E-09 IR(pin 12) 2.2E-10 1.15E-09 VF(pin 4) 1.0452 1.1508 VF(pin 12) 1.0496 1.1496 Vres(pins 12-13) 0.9528 1.0164 StDev 0.014275 0.014473 0.015733 0.016889 2.81E-10 1.49E-10 0.025625 0.023324 0.01648 Test Number 4 12 13 22 33 41 45 53 63 Delta Delta(%) Delta(%) Delta(%) Test Name Delta Min Delta Max Mean Min Max Mean VZ(pin 4) 0 8.23 0.428859 0 121.5657 6.363014 VZ(pin 12) 0 8.23 0.73935 0 121.5657 10.97182 VZ(pin 13) 0 8.22 0.425927 0 121.2389 6.321036 Delta Vz(T4-T13) 0.0084 0.0244 0.002479 -21 70.11494 136.5659 IR(pin 4) -1.35E-09 1.95E-07 4.34E-09 -731.0547 7190.285 1224.681 IR(pin 12) -3.33E-10 5.15E-07 1.28E-08 -151.6464 44814.72 3284.183 VF(pin 4) 0.0028 3.8504 0.680665 0.267891 334.5846 62.62503 VF(pin 12) 0.012 3.852 0.782615 1.143293 335.0731 71.50567 Vres(pins 12-13) 0.0042 1.4852 0.142319 0.440806 146.1236 14.4745 Min Max 6.7 15 6.7 15 6.7 15 -0.0316 0.0592 -1.16E-09 1.98E-07 -1.14E-10 5.16E-07 1.048 5.0012 1.0616 5.0016 0.957 2.5016 Qual Point Mean 7.168734 7.477975 7.164177 0.004294 4.69E-09 1.32E-08 1.767555 1.877095 1.125558 StDev 1.820281 2.36048 1.821307 0.018002 2.49E-08 6.28E-08 1.435462 1.513495 0.433597 Cpk -1.312752 -1.055996 -1.311179 -0.079501 -0.062809 -0.070159 -0.41045 -0.413413 -0.865287 669 a REL ID:= LOT ID:= Rel Test:= H3TRB StDev 0.013499 0.010814 0.011092 0.014501 1.1E-10 1.13E-10 0.019451 0.025143 0.015704 Cpk -166.5529 -207.8408 -202.6641 -0.036778 -0.991364 -1.053806 -18.46156 -14.34165 -20.81513 Delta(%) Min 0.149477 0 0 1.538462 215.2699 0.84154 -0.26738 -0.26892 -0.147785 Delta(%) Max 0 0 0 -0.961538 21.16532 382.0415 -0.106082 0.034698 -0.15829 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.69 6.78 6.71 6.78 6.71 6.78 -0.026 0.0416 -5.63E-11 7.85E-10 2.23E-10 7.12E-10 1.0472 1.1312 1.0412 1.1528 0.94732 1.0108 Initial Mean 6.74475 6.742875 6.744 0.0016 3.29E-10 3.56E-10 1.077286 1.081772 0.980615 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min Delta Max 0.01 0 0 0 0 0 -0.0004 -0.0004 -1.21E-10 1.66E-10 1.88E-12 2.72E-09 -0.0028 -0.0012 -0.0028 0.0004 -0.0014 -0.0016 Delta Mean 0.001125 0.00075 0.00075 -2E-05 7.21E-12 7.32E-11 -0.001206 -0.000862 -0.001376 Max Min Max 6.7 6.78 6.71 6.78 6.71 6.78 -0.0264 0.0412 -1.78E-10 9.51E-10 2.25E-10 3.43E-09 1.0444 1.13 1.0384 1.1532 0.94592 1.0092 Delta(%) Mean 0.01668 0.011123 0.011121 -1.25 2.193106 20.56914 -0.111948 -0.079697 -0.14034 Qual Point Mean 6.745875 6.743625 6.74475 0.00158 3.36E-10 4.29E-10 1.07608 1.08091 0.979238 StDev 0.012798 0.011052 0.010905 0.014529 1.43E-10 3.87E-10 0.020226 0.025901 0.015559 Cpk -175.7051 -203.3996 -206.1625 -0.03625 -0.784415 -0.369426 -17.73454 -13.91072 -20.97971 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 0 -3.55E-10 -2.13E-10 -0.0012 -0.002399 -0.00124 669 a REL ID:= LOT ID:= Rel Test:= H3TRB_PC Initial Mean 6.74175 6.742875 6.742625 -0.00086 3.59E-10 3.86E-10 1.07629 1.082115 0.98566 StDev 0.010765 0.009704 0.010403 0.012697 1.15E-10 1.69E-10 0.017109 0.018055 0.016036 Cpk -208.7545 -231.6261 -216.0578 0.022578 -1.043961 -0.762313 -20.96963 -19.97845 -20.48868 Delta Mean 0.00225 0.00175 0.002375 0.00024 2.71E-10 2.17E-10 0.000415 0.00065 -0.00062 Delta(%) Min 0 0 0 0 -176.5572 -120.212 -0.114767 -0.228476 -0.130105 Delta(%) Max 0.295421 0.295421 0.443787 1.492537 1824.342 185.0496 15.87199 17.16602 -0.079365 Max 6.72 6.77 6.72 6.77 6.72 6.76 -0.0276 0.0268 2.01E-10 7.78E-10 1.77E-10 1.45E-09 1.0456 1.123999 1.049999 1.1348 0.95308 1.008 Delta Max 0.02 0.02 0.03 0.0004 1.42E-08 2.69E-09 0.178401 0.1948 -0.0008 Min Max 6.72 6.79 6.72 6.79 6.72 6.79 -0.0276 0.0272 -1.54E-10 1.5E-08 -3.58E-11 4.14E-09 1.0444 1.3024 1.0476 1.3296 0.95184 1.0072 Delta(%) Mean 0.033374 0.025953 0.035224 -27.90698 75.50342 56.04542 0.038563 0.060071 -0.062949 Qual Point Mean 6.744 6.744625 6.745 -0.00062 6.3E-10 6.03E-10 1.076705 1.082765 0.98504 StDev 0.012788 0.011577 0.012013 0.012581 1.67E-09 6.18E-10 0.0311 0.03391 0.016109 Cpk -175.7837 -194.1904 -187.1638 0.016427 -0.125896 -0.324959 -11.5403 -10.64358 -20.38271 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0.02 0.02 0.02 0 -1.39E-11 4.43E-11 -0.0024 -0.002 0.008 REL ID:= LOT ID:= Rel Test:= 669 a HTRB Initial Mean 6.737875 6.74025 6.739375 -0.00159 3.4E-10 3.81E-10 1.086795 1.087225 0.980061 StDev 0.015483 0.017573 0.016939 0.011923 7.42E-11 1.04E-10 0.021038 0.024419 0.012795 Cpk -145.0573 -127.855 -132.6167 0.044453 -1.526148 -1.220833 -17.21977 -14.84121 -25.53203 Delta Mean 0.000625 0.0005 0.000875 -0.00025 1.19E-09 6.32E-10 -0.0007 -0.000125 0.0085 Delta(%) Min 0.299401 0.299401 0.299401 0 -6.079665 19.10016 -0.228311 -0.190259 0.840831 Delta(%) Max 0 0 0 -7.142857 8361.372 782.1231 0.174581 1.128591 0.794066 Max 6.68 6.77 6.68 6.77 6.68 6.77 -0.0392 0.0224 2.29E-10 5.53E-10 2.32E-10 7.17E-10 1.0512 1.1456 1.0512 1.1696 0.95144 1.007599 Delta Max 0 0 0 -0.0016 4.62E-08 5.61E-09 0.002 0.0132 0.008001 Min Max 6.7 6.77 6.7 6.77 6.7 6.77 -0.0392 0.0208 2.15E-10 4.68E-08 2.76E-10 6.32E-09 1.0488 1.1476 1.0492 1.1828 0.95944 1.0156 Delta(%) Mean 0.009276 0.007418 0.012983 15.72327 351.2007 165.922 -0.064407 -0.011491 0.867292 Qual Point Mean 6.7385 6.74075 6.74025 -0.00184 1.53E-09 1.01E-09 1.086095 1.0871 0.988561 StDev 0.014504 0.016209 0.015909 0.011915 5.38E-09 1.18E-09 0.022405 0.026753 0.013319 Cpk -154.8603 -138.6242 -141.2237 0.051478 -0.09496 -0.284882 -16.15848 -13.54495 -24.74067 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min REL ID:= LOT ID:= Rel Test:= 669 a TC Initial Mean 6.729625 6.727875 6.72825 0.001075 3.79E-10 4.11E-10 1.101345 1.098505 0.989678 Cpk -136.0121 -135.8188 -154.928 -0.030211 -1.018684 -0.930786 -13.55797 -14.41927 -27.50083 Max 6.7 6.77 6.7 6.76 6.7 6.75 -0.0232 0.0284 2.27E-10 8.78E-10 2.46E-10 1.15E-09 1.049999 1.158 1.0488 1.1452 0.95696 1.0144 StDev 0.016493 0.016512 0.014476 0.011861 1.24E-10 1.47E-10 0.027077 0.025394 0.011996 Delta Delta(%) Delta(%) Delta Min Delta Max Mean Min Max 0 0.01 0.002375 0 0.14771 0 0 0.0015 0 0 0 0.02 0.001 0 0.296296 0.0012 0.0024 0.00151 -5.172414 8.450704 -9.64E-12 -6.4E-12 2.7E-13 -4.247444 -0.728863 -2.25E-10 4.77E-10 1.3E-11 -91.66667 41.42361 0.005601 0.23 0.028595 0.533429 19.86183 0.0036 0.3012 0.015355 0.343249 26.30108 0.0018 0.028 0.002381 0.188096 2.760252 Min Max 6.7 6.78 6.7 6.76 6.7 6.77 -0.022 0.0308 2.17E-10 8.72E-10 2.05E-11 1.63E-09 1.0556 1.388 1.0524 1.4464 0.95876 1.0424 Delta(%) Mean 0.035292 0.022295 0.014863 140.4651 0.071208 3.152952 2.596375 1.397803 0.240582 Qual Point Mean 6.732 6.729375 6.72925 0.002585 3.79E-10 4.24E-10 1.12994 1.11386 0.992059 StDev 0.017459 0.017455 0.015076 0.011683 1.28E-10 2.04E-10 0.052922 0.04997 0.013497 Cpk -128.5311 -128.511 -148.7874 -0.073755 -0.986782 -0.693545 -7.117051 -7.430143 -24.50026 REL ID:= LOT ID:= Rel Test:= 669 a TC_PC StDev 0.014007 0.015298 0.013632 0.015251 1.25E-10 1.42E-10 0.018962 0.019108 0.011942 Cpk -159.9209 -146.3871 -164.2742 -0.042838 -1.091899 -1.026467 -19.45068 -19.41545 -27.64191 Delta(%) Min 0 0 0 0 -100.0488 -96.32907 -0.11236 -0.186567 0.079681 Delta(%) Max 0 0 0 0.934579 42.55666 9.090909 21.72693 26.30679 0.079496 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Min 6.69 6.69 6.7 -0.0404 2.46E-10 2.44E-10 1.068 1.072 0.9538 6.75 6.76 6.76 0.0428 9.32E-10 1.13E-09 1.1488 1.155599 1.007599 Initial Mean 6.719875 6.718375 6.718 0.00196 4.11E-10 4.38E-10 1.10646 1.11297 0.990317 Test Number 4 12 13 22 33 41 45 53 63 Test Name VZ(pin 4) VZ(pin 12) VZ(pin 13) Delta Vz(T4-T13) IR(pin 4) IR(pin 12) VF(pin 4) VF(pin 12) Vres(pins 12-13) Delta Min 0 0 0 0 -2.46E-10 -2.35E-10 -0.0012 -0.002 0.00076 Delta Max 0 0 0 0.0004 3.97E-10 1.02E-10 0.249599 0.304001 0.000801 Delta Mean 0.001875 0.001625 0.001875 0.000665 3.72E-11 4.15E-11 0.01207 0.00786 0.000148 Max Min Max 6.69 6.75 6.69 6.76 6.7 6.76 -0.0404 0.0432 -1.2E-13 1.33E-09 8.96E-12 1.23E-09 1.0668 1.398399 1.07 1.4596 0.95456 1.0084 Delta(%) Mean 0.027902 0.024187 0.02791 33.92857 9.045965 9.471669 1.090869 0.706222 0.014898 Qual Point Mean 6.72175 6.72 6.719875 0.002625 4.48E-10 4.8E-10 1.11853 1.12083 0.990465 StDev 0.01385 0.015261 0.013547 0.015223 1.83E-10 1.94E-10 0.045741 0.053264 0.011927 Cpk -161.7695 -146.7752 -165.3439 -0.05748 -0.815688 -0.824766 -8.151217 -7.014251 -27.68046 Quality and Continuous Improvement Reliability Customer Report Family Qualification Date: 10/31/2001 PCN: Ken Fergus Mark Wasilewski Reliability Engineer Reliability Manager 602-244-7079 602-244-5114 1) Introduction: This report is a summary of reliability data for the Logic Two-Gate and Analog Switch devices in the SC88 package. Also included is 260 deg C IR preconditioning test results which will allow this package to utilize lead free plating in the future. Data References: 2) Device Description: Qual ID 1242 Wafer Fab Site Chartered Singapore Assembly Site Sbn Malaysia Line Source n/a Final Test Site Sbn Malaysia Parent Tech 0.6 micron Cmos Reliability Lab T.5 3rd. D Bldg. Phoenix, Az Device NL27WZU04DFT2 Technology Cmos Package SC-88 Max. Current Die Size 451 um X 911 um Max. Voltage Flag Size Polarity n/a Related Qualification Report(s): The following Standard Logic devices are qualified by similarity based on the data in this report: NL27WZ04DFT2, NL27WZ06DFT2, NL27WZ07DFT2, NL27WZ14DFT2, NL27WZ16DFT2, NL27WZU04DFT2, NLAST4599DFT2/4, NLAS4599DFT2/4. NL27WZU04DFT2_1242_2001.pdf Product Reliability Engineering Services 1 Quality and Continuous Improvement 3) Qualification Results Analysis: See attached reliability reports 4) Conclusion: Full qualification is granted for Logic Two-Gate and Analog Switches in the SC88 package. NL27WZU04DFT2_1242_2001.pdf Product Reliability Engineering Services 2 SBN ON SEMICONDUCTOR RELIABILITY REPORT DEVICE: NL27WZU04DFT2 PACKAGE: Case: 419B ASSEM. LINE: N/A FAB SITE: WAFER LINE: N/A ASSY. SITE: MFG. DATE: 0130 REQUESTOR: Reference no. , Style: 0537 N/A SBN site-1 TS Teo 48ON04308D TRACKING NUMBER: ZQ013001A-C PURPOSE: This qualification is to quality New Product Introduction of SC88 Logic which transferred from HANA to be assembled and tested in SBN. TEST PERFORMED: Environmental Tests Autoclave Temp Cycle Solder Heat HTS Life Tests N/A Note: with pre-cond process TEST RESULTS: Full reliability testing (without Preconditioning) of SC88 package qualification meets or exceeds the requirement set forth in the ON Semiconductor's Production Reliability Qualification Process Process (12MSB17722C). REVIEWED BY: APPROVED BY: TK Yew RELIABILITY ENGINEER DATE: Abdul Razak R & QA Manager August 24, 2001 *Test results contained herein are for information only. This report does not alter ON Semiconductor 's standard warranty or product specifications. ENVIRONMENTAL & LIFE TEST ACCEPTANCE CRITERIA Target device: NL27WZU04DFT2 FAILURE DEFINITION PARAMETER MEASUREMENT CONDITIONS INITIAL-ENDPOINTS MIN VIH Vcc=2.3V to 5.5V VIL Vcc=2.3V to 5.5V VOH VOH=VIN=VIL, VCC=2.3, IOH = 100uA VOL DELTA LIMITS MAX UNITS 0.8Vcc MAX BASE V - Initial 0.2Vcc V - Initial 2.1 V - Initial VOH=VIN=VIL, VCC=2.7, IOH = 100uA 2.4 V - Initial VOH=VIN=VIL,VCC=3.0, IOH = 100uA 2.7 V - Initial VOH=VIN=VIL,VCC=4.5, IOH = 100uA 4.0 V - Initial VOH=VIN=GND,VCC=2.3, IOH= - 8mA 1.9 V - Initial VOH=VIN=GND, VCC=2.7, IOH= - 12mA 2.2 V - Initial VOH=VIN=GND,VCC=3.0, IOH=-16mA 2.4 V - Initial VOH=VIN=GND, VCC=3.0, IOH= -24mA 2.3 V - Initial VOH=VIN=GND, VCC=4.5, IOH= -32mA 3.8 V - Initial VOL=VIN=VIH, VCC=2.3, IOL= 100uA 0.2 V - Initial VOL=VIN=VIH,VCC=2.7, IOL= 100uA 0.3 V - Initial VOL=VIN=VIH, VCC=3.0, IOL= 100uA 0.3 V - Initial VOL=VIN=VIH, VCC=4.5, IOL= 100uA 0.5 V - Initial VOL=VIN=VCC, VCC=2.3, IOL= 8mA 0.3 V - Initial VOL=VIN=VCC,VCC=2.7, IOL= 12mA 0.4 V - Initial VOL=VIN=VCC, VCC=3.0, IOL= 16mA 0.4 V - Initial VOL=VIN=VCC, VCC=3.0, IOL=24mA 0.55 V - Initial 48A Spec. No: 48AON04308D issue_no A ENVIRONMENTAL & LIFE TEST ACCEPTANCE CRITERIA Target device: NL27WZU04DFT2 FAILURE DEFINITION PARAMETER MEASUREMENT CONDITIONS INITIAL-ENDPOINTS MIN DELTA LIMITS MAX UNITS MAX BASE VOL VOL=VIN=VCC, VCC=4.5, IOL = 32mA 0.55 V - Initial IIN VIN=VCC or GND, VCC=5.5, ± 0.1 uA - Spec Width ICC VIN=VCC or GND,VCC=5.5, 1 uA - Spec Width 48A Spec. No: 48AON04308D issue_no A RELIABILITY REPORT ENVIRONMENTAL TEST SUMMARY NL27WZU04DFT2 TESTS TEST CONDITIONS REJECTS INTERVAL SAMPLE SIZE CAT. LIM. DEL. Autoclave 507 Ta=121°C, P=15psig, RH=100% 96hrs 231 0 0 0 Temp Cycle 501 Ta= -65/150°C, Air to Air, Dwell >10 min 500cyc 1000cyc 231 231 0 0 0 0 0 0 Solder Heat 504 Ta=260°C 1x 135 0 0 0 Ta=150°C 500hrs 1000hrs 231 231 0 0 0 0 0 0 HTS Note: without Precond Process RELIABILITY REPORT* REJECT SUMMARY PAGE ENVIRONMENTAL: No Reject found. LIFE TEST: CONCLUSION: Full reliability testing (without preconditioning) of SC88 package qualification meets or exceeds the requirement set forth in the ON Semiconductor’s Product Reliability Qualification Process (12MSB17722C) Quality and Continuous Improvement Reliability Customer Report Site Qualification Date: 02/16/01 PCN: N/A Lyle Stewart/Carolyn Anitllon Mark Wasilewski Reliability Engineer Reliability Manager 602-244-7519 602-244-5114 1) Introduction: Qualification of HANA SC88 Assembly and Test Process For NLAST4599 New Product Design NOTE: The “bold lettering” in the interval column of the test summary indicates the qualification points. 2) Device Description: Qual ID 0831 Wafer Fab Site Chartered Device NLAST4599DF Assembly Site Hana (B) Line Source AST4599 Final Test Site Hana (B) Parent Tech C-MOS Reliability Lab T.5 3rd. B Bldg. Technology 0.6 um CMOS Package SC-88 Max. Current 20mA Die Size 451 um X 911 um Max. Voltage 7V Flag Size 1113 um X 610 um Polarity INTEGRATED Related Qualification Report(s): The following Standard Logic Devices are qualified by similarity based on the data in this report: NL27WZ04DFT2, NL27WZ06DFT2, NL27WZ07DFT2, NL27WZ14DFT2, NL27WZ16DFT2, NL27WZU04DFT2, NLAS4599DFT2 NLAST4599DF_0831_2001.pdf Product Reliability Engineering Services 1 Quality and Continuous Improvement 3) Qualification Results Analysis: Zero qualification related failures were observed during reliabiltiy testing. 4) Conclusion: By successfully completing all reliability testing under the terms of ON Semiconductor Reliability Document 12MSB17722C, HANA has been granted full qualification to assemble and test Standard Logic SC88 product. NLAST4599DF_0831_2001.pdf Product Reliability Engineering Services 2 Quality and Continuous Improvement 5) Test Description & Condition: Auto Autoclave AUTOCLAVE Autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing Auto-PC Autoclave - PC AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing Bond Pull Bond Pull Strength BOND PULL STRENGTH The purpose of this test is to determine bond pull strength of wire to die, substrate, or package header connections. The wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. Test Conditions: TA = 25°C Common Failure Modes: Parametric shifts, open, and/or intermittent Common Failure Mechanisms: Corrosion or contaminants from foreign material within the package. Silicon or metalization defects. Bond Shear Bond Shear HAST Highly Accelerated HIGHLY ACCELERATED STRESS TEST Stress Test HAST uses a pressurized environment to produce extremely severe temperature, humidity and bias conditions. HAST accelerates the same failure mechanisms as High Humidity High Temperature Bias. Test Conditions: TA = 130°C, rh = 85%, p = 18.8 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing HAST-PC Highly Accelerated HIGHLY ACCELERATED STRESS TEST + MOISTURE LEVEL PRECONDITIONING Stress Test - PC HAST uses a pressurized environment to produce extremely severe temperature, humidity and bias conditions. HAST accelerates the same failure mechanisms as High Humidity High Temperature Bias. Test Conditions: TA = 130°C, rh = 85%, p = 18.8 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing NLAST4599DF_0831_2001.pdf BOND SHEAR The purpose of this test is to determine bond shear strength of wire to die, substrate, or package header connections. The wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. Test Conditions: TA = 25°C Common Failure Modes: Parametric shifts, open, and/or intermittent Common Failure Mechanisms: Corrosion or contaminants from foreign material within the package. Silicon or metalization defects. Product Reliability Engineering Services 3 Quality and Continuous Improvement 5) Test Description & Condition continued: HT Bake High Temperature HIGH TEMPERATURE BAKE Bake High temperature storage life testing is performed to accelerate failure mechanisms which are thermally activated through the application of extreme temperatures. Test Conditions: TA = 150°C Common Failure Modes: Parametric shifts in leakage and gain Common Failure Mechanisms: Bulk die and diffusion defects HTB High Temperature HIGH TEMPERATURE BAKE Bake High temperature storage life testing is performed to accelerate failure mechanisms which are thermally activated through the application of extreme temperatures. Test Conditions: TA = 175°C Common Failure Modes: Parametric shifts in leakage and gain Common Failure Mechanisms: Bulk die and diffusion defects HTOL High Temperature HIGH TEMPERATURE OPERATING LIFE Operating Life The purpose of this test is to evaluate the bulk stability of the die and to generate defects resulting from manufacturing aberrations that are manifested as time and stress-dependent failures. Test Conditions: TA = 145°C Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Foreign material, crack die, bulk die, metallization, wire and die bond defects MSL 1 Moisture Level 1 Phys Dim Physical Dimensions Solder Solderability NLAST4599DF_0831_2001.pdf MOISTURE LEVEL PRECONDITIONING These tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. These tests detect mold compound delamination from the die and leadframe. The failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@235°C + 1X Flux Immersion + DI Rinse SOLDERABILITY The purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage or shelf life. Test Conditions: Steam aging = 8 hours Common Failure Modes: Pin holes, dewetting, non-wetting Common Failure Mechanisms: Poor plating, contaminated leads Product Reliability Engineering Services 4 Quality and Continuous Improvement 5) Test Description & Condition continued: TC Temperature Cycle TEMPERATURE CYCLING The purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. This testing will also expose excessive thermal mismatch between materials. Test Conditions: TA = -65°C to 150°C, air to air Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Wire bond, cracked or lifted die and package failure TC-PC Temperature Cycle - PC TEMPERATURE CYCLING + MOISTURE LEVEL PRECONDITIONING The purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. This testing will also expose excessive thermal mismatch between materials. Test Conditions: TA = -65°C to 150°C, air to air Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Wire bond, cracked or lifted die and package failure NLAST4599DF_0831_2001.pdf Product Reliability Engineering Services 5 Test Summary Test Name Test Conditions & Bias Lot ID HT Bake TA = +150°C, N/A 0831A 0 Hr. HT Bake HT Bake HTOL TA = +150°C, Use High Temp Solder per best Lab practice TA = +150°C, Use High Temp Solder per best Lab practice TA = +145°C, Vcc = 5.0V Interval 0 168 Hr. 84 0 504 Hr. 84 0 84 0 168 Hr. 84 0 504 Hr. 84 0 84 0 168 Hr. 84 0 504 Hr. 84 0 84 0 84 0 84 0 84 0 84 0 84 0 84 0 84 0 0831B 0 Hr. 0831C 0 Hr. 0831A 0 Hr. 0831B 0 Hr. 504 Hr. 0831C 0 Hr. 504 Hr. TA = +130°C, RH = 85%, PSIG = 18.8, Vcc = 5.0V 0831A 0 Hr. 96 Hr. NLAST4599_0831_2001.pdf Rej 84 504 Hr. HAST SS Comment Product Reliability Engineering Services Appendix A 1 Test Summary Test Name Test Conditions & Bias Lot ID Interval HAST TA = +130°C, RH = 85%, PSIG = 18.8, N/A 0831B 0 Hr. 0 84 0 84 0 84 0 84 0 73 0 84 0 84 0 84 0 84 0 252 0 Readout 252 0 Readout 252 0 252 0 Readout 252 0 Readout 252 0 252 0 0831C 0 Hr. 96 Hr. TA = +130°C, RH = 85%, PSIG = 18.8, Vcc = 5.0V 0831A 0 Hr. 96 Hr. 0831B 0 Hr. 96 Hr. 0831C 0 Hr. 96 Hr. MSL 1 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@235°C + 1X Flux Immersion + DI Rinse + Visual, N/A 0831A 0 Hr. 0831B 0 Hr. 0831C 0 Hr. NLAST4599_0831_2001.pdf Rej 84 96 Hr. HAST-PC SS Comment Product Reliability Engineering Services Appendix A 2 Test Summary Test Name Test Conditions & Bias Lot ID Interval SS Rej Readout 252 0 Readout 252 0 Phys Dim Case Outline, N/A 0831A Results 10 0 Solder 8 Hours steam aging prior to testing; 1 hour gold plated leads, N/A 0831A Results 10 0 TC Air to Air; -65°C to +150°C, N/A 0831A 0 Cyc. 84 0 75 0 84 0 84 0 84 0 84 0 84 0 74 0 84 0 84 0 84 0 84 0 500 Cyc. 0831B 0 Cyc. 500 Cyc. 0831C 0 Cyc. 500 Cyc. TC-PC Air to Air; -65°C to +150°C, N/A 0831A 0 Cyc. 500 Cyc. 0831B 0 Cyc. 500 Cyc. 0831C 0 Cyc. 500 Cyc. NLAST4599_0831_2001.pdf Comment Product Reliability Engineering Services Appendix A 3 Quality and Continuous Improvement Reliability Customer Report Package Qualification Date: 10/08/2001 PCN: Laura Rivers Mark Wasilewski Reliability Engineer Reliability Manager 602-244-5114 1) Introduction: Qualification of Pb-Free Solder for the SC88 and SC88A packages with 100% Sn plating. Solder used was Sn/Ag/Cu. The data for this report was used to qualify the SC88 because the metal to pkg ratio is at it worst case in the SC88A. Therefore the delamination, etc will be less in the SC88. This also qualifies the SC70 packages. This is for all technologies. 2) Device Description: Qual ID 1008 Wafer Fab Site Device MSQA6V1W5T2 Assembly Site SBN Seremban Malaysia Line Source ZK6V1QA Final Test Site Sbn Seremban Malaysia Parent Tech ZENER Reliability Lab FET TESTER Phoenix, AZ, USA Technology Zener Package SC-88A Max. Current Die Size 27 X 26 Max. Voltage Flag Size Polarity PN Related Qualification Report(s): Packages qualified for Pb-free based upon this report are; SC70, SC88, SC88A for all technologies. MSQA6V1W5T2_1008_2001.pdf Product Reliability Engineering Services 1 Quality and Continuous Improvement 3) Qualification Results Analysis: no anomalies observed. 4) Conclusion: All testing was successfully performed in accordance with ON Semiconductor qualification specification 12MSB17722C and a 260 C MSL 1 preconditioning profile for Pb-free products. SC70, SC88 and SC88A are now considered fully qualified for Pb-free processing per the qualification process shown in this report. MSQA6V1W5T2_1008_2001.pdf Product Reliability Engineering Services 2 Quality and Continuous Improvement 5) Test Description & Condition: MSL 1 Moisture Level 1 MOISTURE LEVEL PRECONDITIONING These tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. These tests detect mold compound delamination from the die and leadframe. The failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@260°C + 1X Flux Immersion + DI Rinse Auto-PC Autoclave - PC AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing TC-PC Temperature Cycle - PC TEMPERATURE CYCLING + MOISTURE LEVEL PRECONDITIONING The purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. This testing will also expose excessive thermal mismatch between materials. Test Conditions: TA = -65°C to 150°C, air to air Common Failure Modes: Parametric shifts and catastrophic Common Failure Mechanisms: Wire bond, cracked or lifted die and package failure Solder Solderability SOLDERABILITY The purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage or shelf life. Test Conditions: Steam aging = 8 hours Common Failure Modes: Pin holes, dewetting, non-wetting Common Failure Mechanisms: Poor plating, contaminated leads SAT-PC Scanning Acoustic SOLDERABILITY Tomography The purpose of this test is to measure the ability of device leads/terminals to be soldered (SAT) - PC after an extended period of storage or shelf life. Test Conditions: Steam aging = 8 hours Common Failure Modes: Pin holes, dewetting, non-wetting Common Failure Mechanisms: Poor plating, contaminated leads SAT-PC Scanning Acoustic AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Tomography Autoclave is an environmental test which measures device resistance to moisture penetration (SAT) - PC and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing MSQA6V1W5T2_1008_2001.pdf Product Reliability Engineering Services 3 Quality and Continuous Improvement 5) Test Description & Condition continued: SAT-PC Scanning Acoustic AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Tomography Autoclave is an environmental test which measures device resistance to moisture penetration (SAT) - PC and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing SAT-PC Scanning Acoustic AUTOCLAVE + MOISTURE LEVEL PRECONDITIONING Tomography Autoclave is an environmental test which measures device resistance to moisture penetration (SAT) - PC and the resultant effects of galvanic corrosion. Autoclave is a highly accelerated and destructive test. Typical Test Conditions: TA = 121°C, rh = 100%, p = 15 psig Common Failure Modes: Parametric shifts, high leakage and/or catastrophic Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing MSQA6V1W5T2_1008_2001.pdf Product Reliability Engineering Services 4 Test Summary Test Name Test Conditions & Bias Lot ID Interval MSL1 10TC + 24Hr Bake@125°C + 168Hr 85/85 + 3 IR@260°C + 1X Flux Immersion + DI Rinse - amount for pre conditioned tests. 1008A,B,C Results Auto-PC TA = +121°C, RH = 100%, PSIG = 15, N/A 1008A,B,C SS Rej all 0 0 Hr. 240 0 96 Hr. 240 0 SAT SAT shall be performed on 7 units from each group at Zero hours processing 1008A,B,C Results 21 0 SAT SAT shall be performed on 7 units from each group after 3X IR reflow 1008A,B,C Results 21 0 SAT SAT shall be performed on 7 units fromeach group after 500 cycles Temp cycle 1008A,B,C Results 21 0 SAT SAT shall be performed on 7 units from each group after 1000 cycles Temp cycle 1008A,B,C Results 21 0 Solder 8 Hours steam aging prior to testing; solderability shall be tested at 260 C using Sn/Ag/Cu solder 1008A,B,C Results 30 0 TC-PC Air to Air; -65°C to +150°C, N/A (ss includes samples for SAT) 1008A,B,C 0 Cyc. 324 0 500 Cyc. 324 0 1000 Cyc. 324 0 90 0 Solder Heat All groups, A,B,C shall be tested at 260 C. MSQA6V1W5T2_1008_2001.pdf 1008A,B,C Results Comment Product Reliability Engineering Services Appendix A 1