FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 09-Jan-2006 SUBJECT: ON Semiconductor Final Product/Process Change Notification #15303 TITLE: Final PCN for Assembly Transfer of SC88 and SC88A Logic Devices SBN to Leshan EFFECTIVE DATE: 10-Feb-2006 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Assembly Site AFFECTED PRODUCT DIVISION(S): Analog Power Division ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Ken Fergus <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Edwin Soto <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is a Final Product Change Notice to make customers aware that the ON Semiconductor facility in Leshan, China has been qualified as a manufacturing source for the SC88 (SOT363) and SC88A (SOT353) packages for the listed devices. Initial PCN 14209 announcing this expansion was issued in July of 2005, and a FPCN 15095 was issued in October 2005 covering devices that had completed reliability testing at that time. This FPCN completes the notification for all devices which were listed on the original IPCN 14029. Leshan is an ISO-9001/QS9000 certified factory. Issue Date: Jan. 9, 2005 Rev.08-24-05 Page 1 of 3 Final Product/Process Change Notification #15303 RELIABILITY DATA SUMMARY: Reliability Test Results: Reliability Results: NLAS3157DFT2G Reliability Report Test Conditions Results (Rej / SS) PC 24 hours bake@125C+ 168hr, 0/168, 0/168, 0/168 85C/85%RH+ 3X IR @ 260 deg C +1flux immersion + alcohol + DI H2O rinse. AC - PC TC - PC 121 deg C/100% RH/15psig Post PC Electrical 0/84, 0/84, 0/84 96 Hrs 0/84, 0/84, 0/84 Ta=-65/+150deg.C, Air to air, Dwell = 10 min. Post PC Electrical 0/84, 0/84, 0/84 500 Cycles 0/84, 0/84, 0/84 NLAS4157DFT2G Reliability Report Test Conditions Results (Rej / SS) PC 24 hours bake@125degC+ 168hr, 0/168, 0/168, 0/168 85C/85%RH+ 3X IR @ 260degC +1flux immersion + alcohol + DI H2O rinse AC - PC 121degC/100% RH/15psig Post PC Electrical 0/84, 0/84, 0/84 96 Hrs 0/84, 0/84, 0/84 TC Ta=-65/+150deg.C, Air to air, Dwell = 10 min Initial Electrical 0/84, 0/84, 0/84 500 Cycles 0/84, 0/84, 0/84 TC - PC Ta=-65/+150deg.C, Air to air, Dwell = 10 min Post PC Electrical 0/84, 0/84, 0/84 500 Cycles 0/84, 0/84, 0/84 DPA Virgin Units 0/5, 0/5, 0/5 ELECTRICAL CHARACTERISTIC SUMMARY: All product performance meets current datasheet specifications. Data is available upon request. CHANGED PART IDENTIFICATION: Parts with a date code of ww06 2006 may be shipped from either site. Assembly site traceability will be standard per ON Semi. Issue Date: Jan. 9, 2005 Rev.08-24-05 Page 2 of 3 Final Product/Process Change Notification #15303 AFFECTED DEVICE LIST: PART NL27WZ04DFT2 NL27WZ04DFT2G NL27WZ06DFT2 NL27WZ06DFT2G NL27WZ07DFT2 NL27WZ04DFT1G NL27WZ07DFT2G NL27WZ14DFT2 NL27WZ14DFT2G NL27WZ16DFT2 NL27WZ16DFT2G NL27WZ17DFT2 NL27WZ17DFT2G NL27WZU04DFT2 NL27WZU04DFT2G NL7SZ18DFT2 NL7SZ18DFT2G NL7SZ19DFT2 NL7SZ19DFT2G NLAS4157DFT2G NLASB3157DFT2 NLASB3157DFT2G NLV17SZ07DFT2 NSVMBT3904DW1T1 NSVMBT3904DW1T1G NSVUMC2NT1 NSVUMC2NT1G NUF2015W1T2G NUF2240W1T1 NUF2240W1T1G SBC846BDW1T1 SBC846BDW1T1G SBC846BPDW1T1 SBC846BPDW1T1G SSVBC847BDW1T1 SSVBC847BDW1T1G SSVBC847BPDW1T1 SSVBC847BPDW1T1G SSVBC847CDW1T1 SSVBC847CDW1T1G SSVBC856BDW1T1 SSVBC856BDW1T1G SSVMUN5313DW1T1 SSVMUN5313DW1T1G Issue Date: Jan. 9, 2005 Rev.08-24-05 Page 3 of 3