PC357NT Opaque*, Mini-tlat Package, General Purpose photocou~r PC357NT ■ ~ 1. Opaque type, mini-flat package 2. .3 . 4. * (Unit : mm) Dimandcms Pc357Nf 2.wf025 PC357NT (l-channel) Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%.) Current transfer ratio VCE=3V) ““ ‘y” (CTR : MIN. 50% at I,=5mA, Isolation voltage between input and output PC357NT” “ “vi,,, :3 750v,m. Employs double transfer mold technology r- Internal connection diagram 1. Hybrid substrates that require high density mounting 2. Programmable controllers (Ta= 25°C ) H Absduta Maximum Ratings Parameter Forward current *1 Peak forward current Input Reverse voltage Power dissipation Collector -emitter voltage Emitter -collector voltage output Collector current Collector power dissipation Total power dissipation * zIsolation voltage Operating temperature Storage temperature *J Soldering temperature Symbol IF Rating IFM 1 Unit mA A VR 6 v P 70 mW VCEO 35 6 v v 50 mA mW mW Vms VECO lC PC P,., Vi.< T “p, T,,~ Ts.i 50 150 170 3 750 –30 to +100 –40 to +125 260 Soldering area ,$ E 5 ., h ~ ‘c ‘c ‘c *I Pulse w,idth S 100 ps, Dlty ratio =().0()1 *2 40 to 60 °ARlI, A C f o r I m i n u t e *3 For 1() senconds “In h abwnce of confirmation by dwice wifimlim $=b, WAW bkw no msibilti h any *M tit cccur In quIwflt usng any 01 WARPS detices, Am in calakgs, tits Mk$ ,k Cmntact WARP I n order h ohtatn the la~st mIcm o f me devlw =fiMWn Wi3 M usma m WAWS kvce.” 1317 PC357NT ■ — Electro~l Characteristics (Ta =25°C ) Symbol Parameter VF Forward voltage IR Reverse current Input Terminal capacitance c, ICE() Collector dark current BVCEO Collector -emitter breakdown voltage output BVEco Emitter-collector breakdown voltage CTR w Current transfer ratio Collector -emitter saturationvoltage VCE(satl Transfer Iso]ation resistance RISO charac c, Floating capacitance teristics Ri~ time t, Response time Fall time tf Conditions IF= 20mA I 3 PC357N7T PC357N8T PC357N9T PC357NOT PC357NT 318 r) Aor B Bor C Cor D A. B or C B, Cor D A. B. Cor D A. B. C, D or No mark I MAX. 1.4 Unit PA pF A v — V=O, f=lkHz VCE=20V, IF=O 30 10 250 — — 10-7 Ic=O.lmA, 35 — — v 6 — — v IF=O IE=1OFA, IF=O I,=5mA, , VCE = 5V IF=20mA, Ic=lmA DC500V, 40 to 60%RH V=O, f=lMHz VCE=2V, Ic=2mA RL= 100 ~ 9 Current Transfer Ratio (CTR) Line-uPs Rank mark A B (. b TYP. 1.2 VR=4V *4 ~1 assificatirm table of current transfer ratio is shown below, Model No. PC357N1T PC357N2T Iwo 1 Pc357h’”PC357N4aT. PC357N5T FC357N6T MIN. — CTR (%) 80 to 160 130 to 260 ?nn +,, .“. L“ 400 300 to 600 80 to 260 130 to 400 I 200 to 600 130 to 600 80 to 600 50 to 600 1501-16001% — v 0.2 5X1O’Q — 1011 0.6 4 1.0 18 — 3 18 a pF Jls #s PC357NT 1 Forward ~ va. Ambiant Ambiant Tam~ra - 70 60 100 50 80 70 40 \ 60 30 40 20 , 20 10 n –30 o 25 50 75 100 125 n – 30 50 0 100 Ambient temperature T. (“C) Ambient temperature T, (C) m.3~Powar~ Vam 200 300 250 150 200 170 150 100 100 50 50 n -30 0 25 50 75 100 125 0 – 30 0 50 Ambient temperature T. (~) Ambient temwrature Ta (“C) Fig. 6 Forward Cum va. F~ Vottaga 10000 500 I [ 200 100 I [ Ta=75t I 50”C I i’:.+; I,**: ,,8 -. . ,,. . d 50 I 25°C Ot –25°C 20 10 5 k#’ 2 1 I 0 5 M]ty ratio ‘1-. -i 0.5 1.0 1.5 20 Forward voltage V 2.5 F 3.0 1 3.5 (V) 319 PC357NT Fig. 7curTant~ -Ve. Forward Cu& 500, I 50 40 30 $ : 200 1 1 1 1 111%1 1! 1 20 1 [1 10 1 I (1 I I 111111 “0,1 I 1 1 11! 1)11 10 F[]ward cument I I I I$IIU 100 0 0 IF (mA) 4 2 6 10 8 COllKtOr-emitter voltage VCE (V) Figmlo 150 () 16 014 ().12 o 0 30 0 20 80 60 40 100 – 30 0 20 -.12 ~ 5 ,0-11 – 30 . 1 A.’ ; A 1 , t , , I , , I () I I 20 I [ I I I 40 60 1 8(I .kmhirnt temperature T, (“C) 40 60 80 100 Ambient temyrature T. (‘C) Ambient temperature T. (‘C J mml.oad~nce r I 100 “0.01 01 1 Load resistance RI. (k ~ ) 10 50 PC357NT o o 3 6 9 12 15 Fnr\vard current 1 ~ (mA) ■ Temperature Profile of Soklem Renew (1) One time soldering reflow is recommended within the condition of temperature and time profile shown below. FC357NT +- f 3 0 s e c o n d s ,’ 230C 2WC 1 Wc 25C v ~ ------2 minutes I 1 I \ - - - - -1.5 minutes 1 minute j (2) When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold of the device. Keep the temperature on the package of the device within the condition of above (l). (3) As for other general cautions, refer to the chapter “Precautions for Use” (Page 78 to 93). 321