INTEGRATED CIRCUITS DATA SHEET PCB2032 Memory card IC Product Specification (Rev. 1997 Feb 03) 1997 Feb 03 Philips Semiconductors Product Specification Memory card IC PCB2032 CONTENTS 1 Features 2 General Description 3 Ordering Information 4 Block Diagram 5 Memory Configuration 5.1 5.1.1 5.1.2 5.1.3 5.1.3.1 5.1.3.2 5.2 5.3 5.4 5.4.1 5.4.2 5.4.3 5.4.4 5.4.5 Transmission Protocol Reset and Answer-to-Reset (ATR) Command Mode - IFD to IC Outgoing Data/Processing Mode - IC to IFD Processing Mode Outgoing Data Mode Clock Command format Description of Commands Read Main Memory Read Protection Memory Update/Write Commands Update Main Memory Write Protection Memory 6 RESET Modes 6.1 6.2 6.3 Reset Answer-To-Reset Power on Reset 7 Application INFORMATION 7.1 7.2 7.3 7.4 7.5 7.6 Memory Card ICS Application Identifier (AID) AP Proprietary AIDs ATR-file Short ATR 8 Limiting Values 9 DC Characteristics 10 AC Characteristics 11 Definitions 12 Life support applications Note: For mechanical information see separate documents “Wafer Specifications for Chip Card ICs” and “Module Specifications for Chip Card ICs” 1997 Feb 03 2 Philips Semiconductors Product Specification Memory card IC 1 PCB2032 2 FEATURES • Memory size of 256 x 8-bit EEPROM GENERAL DESCRIPTION The PCB2032 contains a 256 x 8-bit EEPROM with programmable write protection for each of the first 32 bytes. Reading of the whole memory is always possible. The memory can be written and erased byte by byte. • Byte-wise addressing of information • Irreversible byte-wise write protection of 32 bytes of main memory Each of the first 32 bytes can be write/erase protected by setting a Protection bit (EEPROM converted to ROM). If set once, the Protection bit cannot be erased. • Two-wire link protocol • Answer to RESET according to ISO 7816-3 • Programming time per byte 2.5 ms for erasing and 2.5 ms for writing Additionally, the PCB2032 allows for a verification procedure. The whole memory can be read always. • Minimum of 104 erase/write cycles • Data retention 10 years (min) • Contact configuration and serial interface according to ISO 7816 (synchronous transmission) • CMOS technology 3 ORDERING INFORMATION For details contact your local Philips Organisation. PACKAGE TYPE NUMBER NAME DESCRIPTION PCB2032 U wafer 5” wafer, unsawn; note 1 PCB2032 V module 6- or 8-contact Modules on 35 mm film; note 2 PCB2032 W FFC sawn wafer on film frame carrier 6” or 7”; note 1 Notes 1. See “Wafer Specifications for Chip Card ICs”. 2. See “Module Specifications for Chip Card ICs”. 1997 Feb 03 3 TEMPERATURE RANGE (°C) 0 to +70 Philips Semiconductors Product Specification Memory card IC 4 PCB2032 BLOCK DIAGRAM Fig.1 Block diagram PCB2032. 1997 Feb 03 4 Philips Semiconductors Product Specification Memory card IC 5 PCB2032 MEMORY CONFIGURATION The protection bits are used to inhibit alteration of data stored in the first 32 bytes of the Main Memory. The two states of the Protection bits are defined as: The IC contains 256 byte EEPROM of Main Memory, divided into a protected and main area. The protected Memory of 32 byte is located at the first address locations of the main area with the remaining 224 bytes. All protectable bytes have associated Protection Bits (32 bit/4 byte). HIGH = Write enabled LOW = Write disabled When a protection bit has been programmed to LOW a reset of that bit to HIGH is inhibited. Thus, information stored in the first 32 bytes of the Main Memory are protected against any alteration. All bytes of the two memory areas of PCB2032 can always be read out. 255 MAIN MEMORY AREA 32 31 32 BIT / 4 BYTE 31 MAIN MEMORY PROTECTION BYTEWISE FREEZABLE BITS 0 BY PROTECTION BITS 0 MSB LSB MAIN MEMORY PROTECTION BITS Fig.2 Memory mapping. 1997 Feb 03 5 Philips Semiconductors Product Specification Memory card IC 5.1 PCB2032 Transmission Protocol 5.1.1 RESET AND ANSWER-TO-RESET (ATR) The transmission protocol is a two-wire link protocol and is identical to the protocol type S=10 for synchronous transmission. The characteristics of synchronous transmission are part of ISO 7816-3. Reset of the IC complies with the synchronous parts of ISO 7816-3. The RESET can be given at any time during operation. The first 32 clock pulses will provide the Answer-to-Reset. (For details see Chapter 7.) All data changes on I/O are initiated by the falling edge of CLK. The IC discards any START/STOP condition during ATR. After having read the last bit an additional clock pulse is mandatory in order to set I/O to HIGH. Any further clock that follows now will not change the level on I/O. Fig.3 The activation, RESET and Answer-To-Reset phase. 1997 Feb 03 6 Philips Semiconductors Product Specification Memory card IC 5.1.2 PCB2032 COMMAND MODE - IFD TO IC Between the last bit of a bit sequence transmitted from IFD to IC and the STOP condition, an additional clock pulse is mandatory in order to set I/O to HIGH. Any bit sequence transmitted from the interface device (IFD) to the IC is embedded between a START condition and a STOP condition: If not exactly 24 bits are transmitted from IFD, the IC responds with processing mode. START condition: • falling edge on I/O during CLK is HIGH STOP condition: • rising edge on I/O during CLK is HIGH Fig.4 The command phase. 5.1.3 • The IC discards any START/STOP condition during processing mode. OUTGOING DATA/PROCESSING MODE - IC TO IFD After the transmission of a bit sequence from interface device (IFD) to IC, two operational modes of the IC are to be distinguished. 5.1.3.1 • Any further clock that follows when processing mode is completed will not change the level on I/O. The IC only indicates the ‘End of Processing’ to the IFD. The IC provides no information about the result of the ‘processing’. Processing Mode • In this mode the IC is processing internally. No data bits are sent. • During processing the IC has to be clocked continuously by the IFD. In this phase the I/O is set to LOW by the IC. The IC signals the end of its internal processing by setting I/O to HIGH. 1997 Feb 03 7 Philips Semiconductors Product Specification Memory card IC 5.1.3.2 PCB2032 • The IC discards any START/STOP condition during outgoing data mode. Outgoing Data Mode • In this mode the IC sends data to the IFD. • Any further clock that follows when outgoing data mode is completed will not change the state on I/O. • The first data bit becomes valid on I/O after the first falling edge on CLK. After the last outgoing bit from the IC, an additional clock pulse is mandatory in order to set I/O to HIGH. This prepares the IC for a new START condition. Note: The number of outgoing bits is known by the IC and the IFD. Fig.5 The Output/Processing Mode 1997 Feb 03 8 Philips Semiconductors Product Specification Memory card IC 5.2 PCB2032 Clock 5.3 The frequency delivered by the IFD on CLK shall be in the range of 7 kHz to 50 kHz with a duty cycle between 40% and 60%. When switching frequencies, no pulse shall be shorter than 40% of the shorter period. Command format Each command consists of three bytes. The first byte (Control byte) defines the command to be executed. The second one defines the address in the EEPROM memory and the third one contains the Data byte. Table 1 Command format The LSB of transmitted bytes is always send first. CONTROL BYTE MSB BYTE ADDRESS LSB MSB DATA BYTE LSB MSB LSB Table 2 Coding of commands The control byte is coded according to the table below. CONTROL BYTE BYTE ADDRESS DATA BYTE 0x00-0xFF xx READ MAIN MEMORY outgoing COMMAND MODE MSB / LSB 0011.0000 0011.0001 -- -- reserved for PCF2042 − 0011.0010 -- -- not defined processing 0011.0011 -- -- reserved for PCF2042 − 0011.0100 xx xx READ PROTECTION MEMORY outgoing 0011.0101 -- -- not defined processing 0011.0110 -- -- not defined processing 0011.0111 -- -- not defined processing 0011.1000 0x00-0xFF data byte UPDATE MAIN MEMORY processing 0011.1001 -- -- reserved for PCF2042 − 0011.1010 -- -- not defined processing not defined processing WRITE PROTECTION MEMORY processing 0011.1011 -- -- 0011.1100 0x00-0x1F data byte 0011.1101 -- -- not defined processing 0011.1110 -- -- not defined processing 0011.1111 -- -- not defined processing Any faulty input condition from IFD to IC will force the following response after the stop condition: • the IC responds with processing mode, • the IC sets I/O to HIGH after 8 falling edges of CLK. 1997 Feb 03 9 Philips Semiconductors Product Specification Memory card IC 5.4 PCB2032 6 Description of Commands 5.4.1 6.1 READ MAIN MEMORY RESET MODES Reset The READ MAIN MEMORY command reads out the content of the Main Memory starting at the given byte address up to the end of the memory (address 255). The read access to the Main Memory is always possible. If RST is set to HIGH for at least 5 µs and if the IFD keeps CLK in low state during the reset pulse, the IC aborts any operation, sets the I/O line to HIGH and is then ready for further operations. 5.4.2 6.2 READ PROTECTION MEMORY The READ PROTECTION MEMORY command reads out the Protection Memory starting at address 0x00 up to the end of the memory (address 0x03). The read access to the Protection Memory is always possible. 5.4.3 The Answer-to-reset is initiated according to ISO standard 7816-3. The four data bytes of the ATR are serially output to I/O with LSB first when 32 clock pulses are applied to CLK. The I/O is set to HIGH after an additional clock pulse (see Fig.3 and Chapter 5). UPDATE/WRITE COMMANDS 6.3 The EEPROM programming is defined as: Erase: change EEPROM byte from 0xXX to 0xFF Write: change EEPROM bits from HIGH to LOW (no changes from LOW to HIGH) If the data byte transmitted equals the current content of the addressed EEPROM byte, neither the Erase- nor the Write-cycle will be executed. The Erase-cycle as well as the Write-cycle takes 2.5 ms each. Before any data can be programmed at least one of the read commands or Answer-to-Reset must be given. UPDATE MAIN MEMORY The UPDATE MAIN MEMORY command programs the EEPROM cell addressed by ‘byte Address’ with the Data byte transmitted. The write attempt fails, if the addressed byte has been protected by the appropriate Protection bit. 5.4.5 WRITE PROTECTION MEMORY The WRITE PROTECTION MEMORY command programs the EEPROM protection bit addressed by ‘byte Address’, only if the Data byte transmitted equals the data content of the EEPROM byte to be protected. If the transmitted data byte does not match, the Protection bit will not be set. If the transmitted address is greater than 0x1F, the command is ignored. 1997 Feb 03 Power on Reset After applying the operating voltage VCC, the I/O goes to HIGH. Before any data can be programmed at least one of the read commands or Answer-to-Reset must be given. All other data changes require a complete Erase- and Write-cycle. 5.4.4 Answer-To-Reset 10 Philips Semiconductors Product Specification Memory card IC 7 PCB2032 APPLICATION INFORMATION • Personalization of Memory Card ICs Fig.6 ATR data structure. Abbreviations used in Figure 6: TD: Tag of discretionary data AID: Application Identifier TF: Tag of Filler AP: Application Personalizer Identifier TM: Tag manufacturer data ATR: Answer-To-Reset TT: Tag application template DIR: Directory VDT: ‘Versicherten‘ data template F: Filler The following data are unalterably programmed after final production test: H1,H2: ATR protocol bytes H1, H2, H3, H4, ICM, ICT H3,H4: ATR historical bytes ICCF: IC Card Fabricator Identifier ICCSN: IC Card Serial Number ICM: IC Manufacturer Identifier ICT: IC Type LA: Length of AID LD: Length discretionary data LF: Length of Filler LM: Length manufacturer data LT: Length application template TA: Tag of AID 1997 Feb 03 11 Philips Semiconductors Product Specification Memory card IC 7.1 PCB2032 Memory Card ICS 7.2 Application Identifier (AID) For the memory ICs a normal Answer to Reset (ATR) of 4 x 8 bit is used. The ATR identifies the card to the terminal. The ATR, ATR data and DIR data are programmed into byte 0 to 31 of the EEPROM memory. Main reason to have an application specific identifier within every card is that ATR enables to distinguish between different applications, which are using the same protocol, same silicon etc. All these bytes from address 0 up to address 31 (0x1F) in the memory can be turned into ROM by setting the according protection bits (see Chapter 5). So in case the AID is not correct for the applications the card is used for, the terminal should automatically reject the card, so any confusion or abuse get avoided. Once frozen these bytes can not be altered any more! The application identifier can be applied at GMD (Gesellschaft für Mathematik und Datensysteme), who handles the registration for all German applications with a length up to 16 byte. The memory card ATR looks as follows (see Fig.6): ATR header: H1 .. H4 4 bytes, which refer to the ISO 7816, Part 3 standard (address 0 .. 3) for Germany: H1 = protocol (here “0xA2” stands for 2-wire bus protocol/general purpose structure) c/o GMD, att. Mr. Bruno Struif H2 = memory organization, means number of data units and length of data units (e.g. for 2032 -> “13” stands for: 256 x 8 bit) H3, H4 are the so called historical data as defined in ISO7816, part 3 H3 = category indicator: DIR data exists Yes/No (here “0x10” = Yes) H4 = address of DIR data (here “0x91”, bit 8 set to “1” says address is valid, address = “0x11”, so points to the first byte of the DIR file) ID German National Registration Authority Rheinstrasse 75, 64295 Darmstadt, Germany For the international registration of RIDs (registrated application provider identifiers = AID) a provider should according to ISO 7816, part 5, chapter 7 - apply to the standard body of his related country. So every country should have such an organization like the GMD in Germany, which signs responsible. In the absence of such body or organization the secretariat of the ISO technical body is responsible for the assignment. 7.3 AP The terminal reads the ATR and if H3 = 0x10, the DIR address is read in H4 and the terminal then jumps to DIR (H1 .. H4 must always be read!). The application personalizer identifier is optional. DIR data: For very small applications or pilot projects not registered AIDs can be used. Bits 5 to 8 of the first AID byte at address “0x15” must be set to logic 1. This means, the AID has to start with “F”, to indicate, that it is not registered. 7.4 The whole ATR is TLV (tag/length/value) coded. This means there are always three entries: Tag indicates position of any of the entries or identifier, all these tags are given by ISO Length gives length of the entry in number of data units (bytes) Value is the contents of the entry or identifier Major constraint with unregistered AIDs: there is no guarantee that application IDs do not overlap! 7.5 ATR-file The ATR-file is coded in the same way as the DIR-file, as already explained above, and contains information about the IC manufacturer, the IC-type (so for instance 0x05 stands for PCx2032, 0x15 stands for PCF2042) and the serial number of the card. So in the DIR file there is first of all a tag TT for the application template followed by the length (LT), then comes the application identifier (AID), also leaded by the AID-tag (TA) and AID-length (LA). The last part of the DIR file is the application personalizer ID, which also has this structure. 1997 Feb 03 Proprietary AIDs 12 Philips Semiconductors Product Specification Memory card IC 7.6 PCB2032 Short ATR The ATR within the PCF2006 payphone/debit card IC is just a so called “short ATR”. It is 16 bytes long and is stored in the lower partition of the memory (this ATR is not defined by ISO). Main purpose is also to identify the card to the terminal. The codes currently used have to be applied and are assigned an organization called ProElectron. The whole procedure and the contents bases on an agreement of the main smart card IC manufacturer and system providers. Contents of the ATR reflects the following information: • IC manufacturer • IC type • Card maker • application code The code is not transparent, but can be traced back. The major target is here as well to distinguish between different applications. All IC maker now are members at ProElectron and are accordingly prepared, the card manufacturers have not got active yet. (The number itself might be given to preference, but there is no guarantee.) The total memory area from address 0 to 23 is write protected and read only when delivered. PS programs the ATR, Fab data and fab key (transport code, 24 bit) during final test and sets all bits in card data and some of the count data to “1”. 1997 Feb 03 13 Philips Semiconductors Product Specification Memory card IC PCB2032 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD Supply voltage -0.3 +6.0 V VI Input voltage -0.3 +6.0 V Ptot Power dissipation Tstg Storage temperature range -40 70 mW +125 °C 9 DC CHARACTERISTICS According to ISO 7816-3; Tamb = 0 to +70°C SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage 4.5 5.5 V IDD supply current - 10 mA VIH input voltage HIGH (I/O, CLK, RST) 3.5 VDD V VIL input voltage LOW (I/O, CLK, RST) 0 0.8 V IIH input current HIGH (I/O, CLK, RST) - 50 µA IIL output current LOW (I/O) VIL = 0.4 V, note 1 0.5 - mA VLI leakage current (CLK, RST) VIL = VDD, note 1 - ±10 µA I leakage current HIGH (I/O) VIH = VDD, note 1 - 10 µA Note 1. Open drain output. 1997 Feb 03 14 Philips Semiconductors Product Specification Memory card IC PCB2032 10 AC CHARACTERISTICS Tamb = 0 to +70°C SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT fCLCL External clock frequency - 7 52 tCHCX Clock high period - 8.6 - µs kHz rCLK Clock pulse ratio at 52 kHz 40 60 % tCLCH Clock rise time - - 1 µs tCHCL Clock fall time - - 1 µs tHD; STA Hold time for START condition - 4 - µs tSU; STA Set-up time for START condition - 4 - µs tHD; DAT Data hold time - 1 - µs tSU; DAT Data set-up time - 1 - µs tSU; STO Set-up time for STOP condition - 4 - µs tRES RESET pulse width - 14 - µs tE EEPROM erase time at 51.2 kHz 2.5 - ms tW EEPROM write time at 51.2 kHz 2.5 - ms tR EEPROM data retention time Tamb = 55 °C NE/W EEPROM endurance (number of erase/write cycles) tE = 2.5 ms; tW = 2.5 ms C I/O; RESET; CLK pin capacitive Tamb = 25 °C 1997 Feb 03 15 10.0 - yrs 10000 - cycles - 10 pF Philips Semiconductors Product Specification Memory card IC PCB2032 11 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 12 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Feb 03 16 Philips Semiconductors Product Specification Memory card IC PCB2032 NOTES 1997 Feb 03 17