PHILIPS PCF2111CT

INTEGRATED CIRCUITS
DATA SHEET
PCF21xxC family
LCD drivers
Product specification
Supersedes data of 1995 May 03
File under Integrated Circuits, IC12
1997 Mar 28
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAMS
6
PINNING
6.1
6.2
6.3
PCF2100C
PCF2111C
PCF2112C
7
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
7.4
7.5
7.6
7.7
PCF2100C
PCF2111C
PCF2112C
Bus control logic
Timing
Input circuitry
Expansion
8
LIMITING VALUES
9
HANDLING
10
DC CHARACTERISTICS
11
AC CHARACTERISTICS
12
PACKAGE OUTLINES
13
SOLDERING
13.1
13.1.1
13.1.2
13.2
13.2.1
13.2.2
13.2.3
Plastic dual in-line packages
By dip or wave
Repairing soldered joints
Plastic small outline packages
By wave
By solder paste reflow
Repairing soldered joints (by hand-held
soldering iron or pulse-heated solder tool)
14
DEFINITIONS
15
LIFE SUPPORT APPLICATIONS
1997 Mar 28
2
Philips Semiconductors
Product specification
LCD drivers
1
PCF21xxC family
FEATURES
2
• Supply voltage 2.25 to 6.0 V
GENERAL DESCRIPTION
The PCF21xxC family are single-chip, silicon gate CMOS
LCD driver circuits. A 3-line bus (CBUS) structure enables
serial data transfer with microcontrollers. All inputs are
CMOS/NMOS compatible.
• Low current consumption
• Serial data input
• CBUS control
The devices have the same function and performance as
those of the PCF21xx family, which they supersede.
The maximum operating voltage required is reduced from
6.5 to 6.0 V.
• One-point built-in oscillator
• Stand-alone or expanded system
• Power-on reset clear
• LCD segments
– 40 (PCF2100C)
– 64 (PCF2111C)
– 32 (PCF2112C)
• Multiplex rate
– 1 : 2 (PCF2100C)
– 1 : 2 (PCF2111C)
– 1 : 1 (PCF2112C)
• Word length
– 22 bits (PCF2100C)
– 34 bits (PCF2111C)
– 34 bits (PCF2112C).
3
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2.25
−
6.0
V
outputs open; CBUS inactive
−
20
50
µA
outputs open; CBUS inactive;
Tamb = 25 °C
−
20
30
µA
power dissipation per output
−
−
100
mW
Tamb
operating ambient temperature
−40
−
+85
°C
Tstg
storage temperature
−65
−
+150
°C
VDD
supply voltage
IDD1
supply current 1
IDD2
supply current 2
PO
4
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
PCF2100CP
DIP28
plastic dual in-line package; 28 leads (600 mil)
SOT117-1
PCF2100CT
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
PCF2111CP
DIP40
plastic dual in-line package; 40 leads (600 mil)
SOT129-1
PCF2111CT
VSO40
plastic very small outline package; 40 leads
SOT158-1
PCF2112CP
DIP40
plastic dual in-line package; 40 leads (600 mil)
SOT129-1
PCF2112CT
VSO40
plastic very small outline package; 40 leads
SOT158-1
1997 Mar 28
DESCRIPTION
3
VERSION
Philips Semiconductors
Product specification
LCD drivers
5
PCF21xxC family
BLOCK DIAGRAMS
handbook, full pagewidth
40-SEGMENT LCD
BP1
BP2
26
S1 to S20
25
24 to 5
BACKPLANE AND SEGMENT DRIVERS
ANALOG
VOLTAGE
VDD
2
A
28
DLEN
1
CLB
27
DATA
BUS
CONTROL
B
LATCHES
AND
DRIVER CONTROL
OSCILLATOR
AND
DIVIDER
C
O
3
OSC
R
SHIFT
REGISTER
680
pF
PCF2100C
O
1 MΩ
4
V SS
MLD286
Fig.1 Block diagram; PCF2100C.
handbook, full pagewidth
64-SEGMENT LCD
BP1
38
BP2
S1 to S32
37
36 to 5
BACKPLANE AND SEGMENT DRIVERS
ANALOG
VOLTAGE
2
DLEN
CLB
DATA
A
40
1
39
BUS
CONTROL
B
LATCHES
AND
DRIVER CONTROL
OSCILLATOR
AND
DIVIDER
3
VDD
C
O
OSC
R
SHIFT
REGISTER
PCF2111C
1997 Mar 28
4
O
4
V SS
MLD285
Fig.2 Block diagram; PCF2111C.
680
pF
1 MΩ
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
handbook, full pagewidth
32-SEGMENT LCD
BP
S1 to S32
38
36 to 5
BACKPLANE AND SEGMENT DRIVERS
ANALOG
VOLTAGE
2
DLEN
CLB
DATA
40
1
39
BUS
CONTROL
LATCHES
AND
DRIVER CONTROL
OSCILLATOR
AND
DIVIDER
3
VDD
C
O
OSC
R
SHIFT
REGISTER
PCF2112C
1997 Mar 28
5
O
4
V SS
MLD287
Fig.3 Block diagram; PCF2112C.
1.5
nF
1 MΩ
Philips Semiconductors
Product specification
LCD drivers
6
PCF21xxC family
PINNING
6.1
PCF2100C
SYMBOL
PIN
DESCRIPTION
CLB
1
clock burst input (CBUS)
VDD
2
supply voltage
OSC
3
oscillator input
VSS
4
supply voltage ground
S20
5
LCD driver output 20
S19
6
LCD driver output 19
S18
7
LCD driver output 18
S17
8
LCD driver output 17
S16
9
S15
handbook, halfpage
CLB 1
28 DLEN
V DD 2
27 DATA
OSC 3
26 BP1
LCD driver output 16
V SS 4
25 BP2
10
LCD driver output 15
S20 5
24 S1
S14
11
LCD driver output 14
S19 6
23 S2
S13
12
LCD driver output 13
S18 7
S12
13
LCD driver output 12
S11
14
LCD driver output 11
S10
15
LCD driver output 10
S9
16
LCD driver output 9
S8
17
LCD driver output 8
S7
18
S6
22 S3
PCF2100C
S17 8
21 S4
S16 9
20 S5
S15 10
19 S6
S14 11
18 S7
LCD driver output 7
S13 12
17 S8
19
LCD driver output 6
S12 13
16 S9
S5
20
LCD driver output 5
S11 14
15 S10
S4
21
LCD driver output 4
S3
22
LCD driver output 3
S2
23
LCD driver output 2
S1
24
LCD driver output 1
BP2
25
backplane driver output 2
BP1
26
backplane driver output 1
DATA
27
data input line (CBUS)
DLEN
28
data input line enable (CBUS)
1997 Mar 28
MLD295
Fig.4 Pin configuration; SOT117-1 and SOT136-1.
6
Philips Semiconductors
Product specification
LCD drivers
6.2
PCF21xxC family
PCF2111C
SYMBOL
PIN
DESCRIPTION
CLB
1
clock burst input (CBUS)
VDD
2
supply voltage
OSC
3
oscillator input
VSS
4
supply voltage ground
S32
5
LCD driver output 32
S31
6
LCD driver output 31
S30
7
LCD driver output 30
S29
8
LCD driver output 29
S28
9
S27
handbook, halfpage
CLB
1
40 DLEN
LCD driver output 28
V DD
2
39 DATA
10
LCD driver output 27
OSC
3
38 BP1
S26
11
LCD driver output 26
V SS
4
37 BP2
S25
12
LCD driver output 25
S32
5
36 S1
S24
13
LCD driver output 24
S31 6
35 S2
S23
14
LCD driver output 23
S30
7
34 S3
S22
15
LCD driver output 22
S21
16
LCD driver output 21
S29
8
33 S4
S20
17
LCD driver output 20
S28
9
32 S5
S19
18
LCD driver output 19
S27 10
S18
19
LCD driver output 18
S26 11
30 S7
S17
20
LCD driver output 17
S25 12
29 S8
S16
21
LCD driver output 16
S24 13
28 S9
S15
22
LCD driver output 15
S23 14
27 S10
S14
23
LCD driver output 14
S13
24
LCD driver output 13
S22 15
26 S11
S12
25
LCD driver output 12
S21 16
25 S12
S11
26
LCD driver output 11
S20 17
24 S13
S10
27
LCD driver output 10
S19 18
23 S14
S9
28
LCD driver output 9
S18 19
22 S15
S8
29
LCD driver output 8
S17 20
21 S16
S7
30
LCD driver output 7
S6
31
LCD driver output 6
S5
32
LCD driver output 5
S4
33
LCD driver output 4
S3
34
LCD driver output 3
S2
35
LCD driver output 2
S1
36
LCD driver output 1
BP2
37
backplane driver output 2
BP1
38
backplane driver output 1
DATA
39
data input line (CBUS)
DLEN
40
data input line enable (CBUS)
31 S6
PCF2111C
MLD291
1997 Mar 28
Fig.5 Pin configuration; SOT129-1 and SOT158-1.
7
Philips Semiconductors
Product specification
LCD drivers
6.3
PCF21xxC family
PCF2112C
SYMBOL
PIN
DESCRIPTION
CLB
1
clock burst input (CBUS)
VDD
2
supply voltage
OSC
3
oscillator input
VSS
4
supply voltage ground
S32
5
LCD driver output 32
S31
6
LCD driver output 31
S30
7
LCD driver output 30
S29
8
LCD driver output 29
S28
9
S27
handbook, halfpage
CLB
1
40 DLEN
LCD driver output 28
V DD
2
39 DATA
10
LCD driver output 27
OSC
3
38 BP
S26
11
LCD driver output 26
V SS
4
37 n.c.
S25
12
LCD driver output 25
S32
5
36 S1
S24
13
LCD driver output 24
S31 6
35 S2
S23
14
LCD driver output 23
S30
7
34 S3
S22
15
LCD driver output 22
S21
16
LCD driver output 21
S29
8
33 S4
S20
17
LCD driver output 20
S28
9
32 S5
S19
18
LCD driver output 19
S27 10
S18
19
LCD driver output 18
S26 11
30 S7
S17
20
LCD driver output 17
S25 12
29 S8
S16
21
LCD driver output 16
S24 13
28 S9
S15
22
LCD driver output 15
S23 14
27 S10
S14
23
LCD driver output 14
S13
24
LCD driver output 13
S22 15
26 S11
S12
25
LCD driver output 12
S21 16
25 S12
S11
26
LCD driver output 11
S20 17
24 S13
S10
27
LCD driver output 10
S19 18
23 S14
S9
28
LCD driver output 9
S18 19
22 S15
S8
29
LCD driver output 8
S17 20
21 S16
S7
30
LCD driver output 7
S6
31
LCD driver output 6
S5
32
LCD driver output 5
S4
33
LCD driver output 4
S3
34
LCD driver output 3
S2
35
LCD driver output 2
S1
36
LCD driver output 1
n.c.
37
not connected
BP
38
backplane driver output
DATA
39
data input line (CBUS)
DLEN
40
data input line enable (CBUS)
31 S6
PCF2112C
MLD292
1997 Mar 28
Fig.6 Pin configuration; SOT129-1 and SOT158-1.
8
Philips Semiconductors
Product specification
LCD drivers
7
PCF21xxC family
FUNCTIONAL DESCRIPTION
7.3
An LCD segment or LED output is activated when the
corresponding DATA bit is HIGH.
7.1
When DATA bit 33 is HIGH, the latches are loaded.
CLB pulse 35 transfers data from the shift register to the
selected latches.
PCF2100C
7.4
When DATA bit 21 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 21 LOW, the B-latches (BP2) are
loaded. CLB pulse 23 transfers data from the shift register
to the selected latches.
7.2
PCF2112C
Bus control logic
The following tests are carried out by the bus control logic:
1. Test on leading zero
2. Test on number of DATA bits
3. Test of disturbed DLEN and DATA signals during
transmission.
PCF2111C
When DATA bit 33 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 33 LOW, the B-latches (BP2) are
loaded. CLB pulse 35 transfers data from the shift register
to the selected latches.
If one of the test conditions is not fulfilled, no action follows
the load condition (load pulse with DLEN LOW) and the
driver is ready to receive new data.
handbook,
full pagewidth
DLEN
CLB
1
2
3
4
5
6
7
8
32
20
33
21
test leading zero
34
22
35
23
PCF2111C and PCF2112C
PCF2100C
load pulse
DATA
bit number 0
output
1
S1
2
S2
3
S3
4
S4
5
S5
6
S6
7
S7
31
S31
32
S32
33
PCF2111C and PCF2112C
1
S1
2
S2
3
S3
4
S4
5
S5
6
S6
7
S7
19
S19
20
S20
21
PCF2100C
leading zero
load bit
Fig.7 CBUS data format.
1997 Mar 28
9
MLD296
Philips Semiconductors
Product specification
LCD drivers
7.5
PCF21xxC family
Timing
OFF / OFF
ON / OFF
OFF / ON
ON / ON
VDD
0.5 (VDD
VSS )
BP1
VSS )
BP2
VSS
VDD
0.5 (VDD
VSS
VDD
SX
VSS
VDD VSS
0.5 (VDD VSS )
0
0.5 (VDD
(VDD
VSS )
VSS )
BP1
SX
BP2
SX
VDD VSS
0.5 (VDD VSS )
0
0.5 (VDD
(VDD
VSS )
VSS )
1
f LCD
Fig.8 Timing diagram for PCF2100C and PCF2111C.
handbook, halfpage
OFF
ON
VDD
BP
VSS
VDD
Segment X
(SX)
VSS
VDD
VSS
0
(VDD
BP
VSS )
1
f LCD
Fig.9 Timing diagram for PCF2112C.
1997 Mar 28
SX
10
MLD299
MLD294
Philips Semiconductors
Product specification
LCD drivers
7.6
PCF21xxC family
Input circuitry
BUS DRIVER
handbook, halfpage
PCF21XXC
VDD2
VDD
R
100 kΩ
VSS
VSS
MLD284
VSS line is common. In systems where it is expected that VDD2 > VDD1 + 0.5 V, a resistor should be inserted to reduce the current flowing through the
input protection. Maximum input current ≤40 µA.
Fig.10 Input circuitry.
7.7
Expansion
handbook, full pagewidth
LCD
BP1
BP2
S1 to S32
BP1
BP2
S1 to S32
BP1
BP2
S1 to S32
VDD
DLEN
CLB
DLEN
PCF2111C
DATA
MASTER
OSC
CLB
VSS
DLEN
PCF2111C
DATA
OSC
CLB
VSS
SLAVE1
DATA
CLB
DLEN1
DLEN2
DLEN3
PCF2111C
DATA
OSC
VSS
SLAVE1
MLD293
By connecting OSC to VSS the BP pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of
several members of the PCF21xxC family up to the BP drive capability of the master. The PCF2112C can only function as a master for other PCF2112Cs.
Fig.11 Expansion possibility (using PCF2111C).
1997 Mar 28
11
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD
supply voltage
−0.5
VI
input voltage DLEN, CLB, DATA and OSC
VSS − 0.5 VDD + 0.5 V
VO
output voltage BP1, BP2 and S1 to S32
VSS − 0.5 VDD + 0.5 V
+8.0
V
IDD, ISS
supply current
−50
+50
mA
II
DC input current
−20
+20
mA
IO
DC output current
−25
+25
mA
Ptot
total power dissipation per package
−
500
mW
PO
power dissipation per output
−
100
mW
Tstg
storage temperature
−65
+150
°C
note 1
Note
1. Derate by 7.7 mW/K when Tamb > 60 °C.
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices. See “Handling MOS devices”.
ESD in accordance with “MIL STD 883C, Method 3015”.
1997 Mar 28
12
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
10 DC CHARACTERISTICS
VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
supply voltage
IDD
supply current
VPOR
power-on reset voltage level
2.25
−
6.0
V
note 1; see Fig.13
−
20
50
µA
note 1; Tamb = 25 °C;
see Fig.13
−
20
30
µA
note 2
−
1.0
1.6
V
−
−
0.8
V
Inputs CLB, DATA and DLEN
VIL
LOW level input voltage
VIH
HIGH level input voltage
2.0
−
−
V
ILI
input leakage current
VI = VSS or VDD
−
−
±1
µA
Ci
input capacitance
note 3
−
−
10
pF
oscillator start-up current
VI = VSS
0.5
1.2
5.0
µA
Input OSC
Iosc
LCD outputs
VBP
DC voltage of backplane drivers
−
±20
−
mV
ZO(BP)
backplane driver output impedance
note 4; VDD = 5 V
−
0.5
5.0
kΩ
ZO(S)
segment driver output impedance
note 4; VDD = 5 V
−
1
7
kΩ
Notes
1. Outputs open; CBUS inactive.
2. Resets all logic, when VDD < VPOR.
3. Periodically sampled (not 100% tested).
4. Outputs measured one at a time.
1997 Mar 28
13
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
11 AC CHARACTERISTICS
VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; all timing values are referenced to VIH
and VIL levels with an input voltage swing of VSS to VDD; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Inputs CLB, DATA and DLEN (see Fig.12)
tSUDA
data set-up time
3
−
−
µs
tHDDA
data hold time
3
−
−
µs
tSUEN
enable set-up time
1
−
−
µs
tSUDI
disable set-up time
2
−
−
µs
tSULD
load pulse set-up time
2.5
−
−
µs
tBUSY
busy time
3
−
−
µs
tWH
CLB HIGH time
1
−
−
µs
tWL
CLB LOW time
5
−
−
µs
tCLB
CLB cycle time
10
−
−
µs
tr
rise time
−
−
10
µs
tf
fall time
−
−
10
µs
LCD timing (see Figs. 12, 14, 15, 16 and 17)
fLCD
LCD frame frequency
PCF2100C, PCF2111C
PCF2112C
60
75
100
Hz
CO = 1.5 nF
30
35
50
Hz
tBS
transfer time with test loads
VDD = 5 V
−
20
100
µs
tPLCD
driver delay time with test loads
VDD = 5 V
−
20
100
µs
1997 Mar 28
14
1997 Mar 28
t WL
V IH min
t WH
SUDA
leading zero
t
t SUEN
tr
1
V IL max
V IL max
t CLB
tf
IL max
t WL
t HDDA
V
V IH min
t SUDA
tr
2
(1) Load pulse 23 for PCF2100C (see Fig.7).
(2) Load pulse 35 for PCF2111C and PCF2112C (see Fig.7).
DATA
CLB
DLEN
V
IH min
data S1
tf
t HDDA
IL max
load bit
22
34
15
BP (PCF2112C)
VDD
2
SX
t SULD
V IL max
IH min
BP1, BP2
(except PCF 2112C)
t SUDI
V
disable
t BS
load pulse
23 (1)
35 (2)
t PCLD
t BUSY
MLD297
(V DD = 5 V)
(V DD = 5 V)
(V DD = 5 V)
0.5 V
0.5 V
0.5 V
0.5 V
0.5 V
0.5 V
LCD drivers
Fig.12 CBUS timing.
V
V IH min
handbook, full pagewidth
enable
Philips Semiconductors
Product specification
PCF21xxC family
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
MLD283
20
MLD282
80
handbook, halfpage
handbook, halfpage
f LCD
(1)
I DD
(Hz)
(2)
(µA)
16
78
(3)
(1)
(2)
(3)
typ
typ
76
74
12
72
8
70
0
2
4
6
V DD (V)
8
0
2
4
6
VDD (V)
8
(1) Tamb = −40 °c.
(2) Tamb = +85 °c.
(3) Tamb = +25 °c.
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
Fig.13 Supply current as a function of supply
voltage.
Fig.14 Display frequency as a function of supply
voltage; CO = 680 pF (except PCF2112C).
MLD289
37
MLD281
10 3
handbook, halfpage
handbook, halfpage
f
LCD
(Hz)
f
(1)
36
LCD
(Hz)
(2)
typ
(2)
typ
(1)
102
35
(3)
34
33
0
2
4
10
10 1
6 V
8
DD (V)
1
C O (nF)
10
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
(1) RO = 1 MΩ.
(2) RO = 100 kΩ.
Fig.15 Display frequency as a function of supply
voltage; CO = 1.5 nF (only PCF2112C).
Fig.16 Display frequency as a function of RO and
CO; Tamb = 25 °C; VDD = 5 V.
1997 Mar 28
16
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
MLD288
2
handbook, halfpage
R
O
(kΩ)
handbook, halfpage
BP (PCF2112C), BP1, BP2
1.5
I L = 25 µA
typ
1
S1 to S32
(1)
(2)
I L = 15 µA
(3)
RS
(1)
(2) R
BP
(3)
0.5
MLD298
0
0
2
4
6 V
8
DD (V)
(1) Tamb = +85 °c.
(2) Tamb = +25 °c.
(3) Tamb = −40 °c.
Fig.18 Output resistance of backplane and
segments.
Fig.17 Test loads.
MLD290
18
handbook, halfpage
I OL
(mA)
(1)
16
(2)
typ
14
(3)
12
10
8
0
2
4
6
VDD (V)
8
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
Fig.19 LOW level output current as a function of
supply voltage (only PCF2112C).
1997 Mar 28
17
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
12 PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
1997 Mar 28
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
18
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
seating plane
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
21
40
pin 1 index
E
1
20
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
mm
4.7
0.51
4.0
1.70
1.14
0.53
0.38
0.36
0.23
52.50
51.50
inches
0.19
0.020
0.16
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
D
(1)
e
e1
L
ME
MH
w
Z (1)
max.
14.1
13.7
2.54
15.24
3.60
3.05
15.80
15.24
17.42
15.90
0.254
2.25
0.56
0.54
0.10
0.60
0.14
0.12
0.62
0.60
0.69
0.63
0.01
0.089
E
(1)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT129-1
051G08
MO-015AJ
1997 Mar 28
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
19
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
HE
v M A
Z
15
28
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
e
bp
0
detail X
w M
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.42
0.39
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT136-1
075E06
MS-013AE
1997 Mar 28
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
91-08-13
95-01-24
20
o
8
0o
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
VSO40: plastic very small outline package; 40 leads
SOT158-1
D
E
A
X
c
y
HE
v M A
Z
40
21
Q
A2
A
(A 3)
A1
θ
pin 1 index
Lp
L
1
detail X
20
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.70
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
12.3
11.8
2.25
1.7
1.5
1.15
1.05
0.2
0.1
0.1
0.6
0.3
0.012 0.096
0.017 0.0087 0.61
0.010
0.004 0.089
0.012 0.0055 0.60
0.30
0.29
0.03
0.48
0.46
0.067
0.089
0.059
inches
0.11
0.045
0.024
0.008 0.004 0.004
0.041
0.012
θ
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-01-24
SOT158-1
1997 Mar 28
EUROPEAN
PROJECTION
21
o
7
0o
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
13 SOLDERING
13.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
13.3.2
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
13.2
13.2.1
Wave soldering techniques can be used for all SO and
VSO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
13.2.2
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
13.3
13.3.1
13.3.3
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO and VSO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
VSO packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Mar 28
WAVE SOLDERING
22
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
14 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Short-form specification
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
15 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Mar 28
23
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417067/1200/02/pp24
Date of release: 1997 Mar 28
Document order number:
9397 750 01649