INTEGRATED CIRCUITS DATA SHEET TDA8541 1 W BTL audio amplifier Product specification Supersedes data of 1997 Feb 19 File under Integrated Circuits, IC01 1998 Apr 01 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 FEATURES GENERAL DESCRIPTION • Flexibility in use The TDA8541(T) is a one channel audio power amplifier for an output power of 1 W with an 8 Ω load at a 5 V supply. The circuit contains a BTL amplifier with a complementary PNP-NPN output stage and standby/mute logic. The TDA8541T comes in an 8 pin SO package and the TDA8541 in an 8 pin DIP package. • Few external components • Low saturation voltage of output stage • Gain can be fixed with external resistors • Standby mode controlled by CMOS compatible levels • Low standby current • No switch-on/switch-off plops APPLICATIONS • High supply voltage ripple rejection • Portable consumer products • Protected against electrostatic discharge • Personal computers • Outputs short-circuit safe to ground, VCC and across the load • Telephony. • Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage Iq quiescent current Istb standby current Po output power THD total harmonic distortion SVRR supply voltage ripple rejection CONDITIONS MIN. 2.2 TYP. 5 MAX. 18 UNIT V − 8 12 mA − − 10 µA THD = 10%; RL = 8 Ω; VCC = 5 V 1 1.2 − W Po = 0.5 W − 0.15 − % 50 − − dB VCC = 5 V ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA8541T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA8541 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 1998 Apr 01 2 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 BLOCK DIAGRAM PINNING SYMBOL PIN MODE 1 operating mode select (standby, mute, operating) SVR 2 half supply voltage, decoupling ripple rejection IN+ 3 positive input handbook, halfpage TDA8541 − IN− IN+ 4 3 5 − + OUT− R VCC 6 R 20 kΩ SVR − − 8 OUT+ 20 kΩ MODE IN− 4 negative input OUT− 5 negative loudspeaker terminal VCC 6 supply voltage GND 7 ground OUT+ 8 positive loudspeaker terminal + 2 1 DESCRIPTION handbook, halfpage STANDBY/MUTE LOGIC MODE 1 SVR 2 8 OUT+ 7 GND TDA8541 7 IN+ 3 6 VCC IN− 4 5 OUT− GND MGB972 MGB971 Fig.2 Pin configuration. Fig.1 Block diagram. FUNCTIONAL DESCRIPTION Mode select pin The TDA8541(T) is a BTL audio power amplifier capable of delivering 1 W output power to an 8 Ω load at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range from 6 dB to 30 dB by external feedback resistors. The device is in standby mode (with a very low current consumption) if the voltage at the MODE pin is >(VCC − 0.5 V), or if this pin is floating. At a MODE voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1.5 V and VCC − 1.5 V the amplifier is in mute condition. The mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor. Power amplifier The power amplifier is a Bridge Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of an NPN power transistor. The total voltage loss is <1 V and with a 5 V supply voltage and an 8 Ω loudspeaker an output power of 1 W can be delivered. 1998 Apr 01 3 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +18 V VI input voltage −0.3 VCC + 0.3 V IORM repetitive peak output current − 1 A Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Vpsc AC and DC short-circuit safe voltage − 10 V Ptot total power dissipation SO8 − 0.8 W DIP8 − 1.2 W operating non-operating QUALITY SPECIFICATION In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference Handbook”. The handbook can be ordered using the code 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS VALUE UNIT TDA8541T (SO8) 160 K/W TDA8541 (DIP8) 100 K/W thermal resistance from junction to ambient in free air DC CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage operating 2.2 5 18 V Iq quiescent current RL = ∞; note 1 − 8 12 mA Istb standby current VMODE = VCC − − 10 µA VO DC output voltage note 2 − 2.2 − V VOUT+ − VOUT− differential output voltage offset − − 50 mV IIN+, IIN− input bias current − − 500 nA VMODE input voltage mode select V IMODE input current mode select operating 0 − 0.5 mute 1.5 − VCC − 1.5 V standby VCC − 0.5 − VCC V 0 < VMODE < VCC − 20 µA − Notes 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. 2. The DC output voltage with respect to ground is approximately 0.5 × VCC. 1998 Apr 01 4 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 AC CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT THD = 10% 1 1.2 − W THD = 0.5% 0.6 0.9 − W Po = 0.5 W − 0.15 0.3 % note 1 6 − 30 dB − 100 − kΩ − − 100 µV 50 − − dB note 4 40 − − dB note 5 − − 200 µV Po output power THD total harmonic distortion Gv closed loop voltage gain Zi differential input impedance Vno noise output voltage note 2 SVRR supply voltage ripple rejection note 3 Vo output voltage in mute condition Notes 1. Gain of the amplifier is 2 × R2/R1 in test circuit of Fig.3. 2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of RS = 0 Ω at the input. 3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise. 1998 Apr 01 5 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 TEST AND APPLICATION INFORMATION SE application Test conditions Tamb = 25 °C if not specially mentioned, VCC = 7.5 V, f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The SE application diagram is shown in Fig.13. For Tamb = 60 °C the maximum total power dissipation is: The capacitor value of C3 in combination with the load impedance determines the low frequency behaviour. The total harmonic distortion as a function of frequency was measured with low-pass filter of 80 kHz. The value of capacitor C2 influences the behaviour of the SVRR at low frequencies, increasing the value of C2 increases the performance of the SVRR. 150 – 60 ---------------------- = 0.9 W . 100 General remark The thermal resistance = 100 K/W for the DIP8 envelope; the maximum sine wave power dissipation for Tamb = 25 °C is: 150 – 25 ---------------------- = 1.25 W . 100 The frequency characteristic can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 kΩ); this creates a low-pass filter. BTL application Tamb = 25 °C if not specially mentioned, VCC = 5 V, f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The BTL application diagram is shown in Fig.3. The quiescent current has been measured without any load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C2 influences the behaviour of the SVRR at low frequencies, increasing the value of C2 increases the performance of the SVRR. The figure of the mode select voltage (Vms) as a function of the supply voltage shows three areas; operating, mute and standby. It shows, that the DC-switching levels of the mute and standby respectively depends on the supply voltage level. 1998 Apr 01 6 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 BTL APPLICATION handbook, full pagewidth VCC C1 R2 R1 56 kΩ IN− 1 µF 11 kΩ IN+ Vin SVR C2 47 µF MODE 100 µF 100 nF 6 4 OUT− 5 3 RL TDA8541 OUT+ 2 8 1 7 GND MBH881 R2 Gain = 2 × -------R1 Fig.3 BTL application. MGD876 15 MGD877 10 handbook, halfpage handbook, halfpage Iq (mA) THD (%) (1) 10 1 5 10−1 10−2 10−2 0 0 4 8 12 20 16 VCC (V) 1 Po (W) f = 1 kHz, Gv = 20 dB. (1) VCC = 5 V, RL = 8 Ω. (2) VCC = 9 V, RL = 16 Ω. RL = ∞. Fig.4 Iq as a function of VCC. 1998 Apr 01 10−1 (2) Fig.5 THD as a function of Po. 7 10 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD878 10 MGD879 −20 handbook, halfpage handbook, halfpage THD (%) SVRR (dB) 1 −40 (1) (2) (1) (2) 10−1 −60 10−2 10 103 102 104 f (Hz) (3) −80 10 105 102 103 104 f (Hz) 105 VCC = 5 V, 8 Ω, Rs = 0 Ω, Vi = 100 mV. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB. Po = 0.5 W, Gv = 20 dB. (1) VCC = 5 V, RL = 8 Ω. (2) VCC = 9 V, RL = 16 Ω. Fig.6 THD as a function of frequency. Fig.7 SVRR as a function of frequency. MGD880 2.5 MGD881 2 handbook, halfpage handbook, halfpage Po (W) 2 P (W) 1.5 (1) (2) 1.5 (1) (2) 1 1 0.5 0.5 0 0 0 4 8 VCC (V) 12 0 8 VCC (V) 12 (1) RL = 8 Ω. (2) RL = 16 Ω. THD = 10%. (1) RL = 8 Ω. (2) RL = 16 Ω. Fig.9 Fig.8 Po as a function of VCC. 1998 Apr 01 4 8 Worst case power dissipation as a function of VCC. Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD882 1.6 MGD883 10 o (V) 1 handbook, halfpage handbook, V halfpage P (W) (1) 1.2 10−1 10−2 0.8 (1) (2) (3) (2) 10−3 10−4 0.4 10−5 10−6 10−1 0 0 0.5 1 1.5 2 Po (W) 2.5 Fig.10 P as a function of Po. MGL070 16 Vms (V) 12 standby 8 mute 4 operating 0 8 12 VP (V) 16 Fig.12 Vms as a function of VP. 1998 Apr 01 Vms (V) Fig.11 Vo as a function of Vms. handbook, halfpage 4 10 Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V. (2) VCC = 5 V. (3) VCC = 12 V. Sine wave of 1 kHz. (1) VCC = 9 V, RL = 16 Ω. (2) VCC = 5 V, RL = 8 Ω. 0 1 9 102 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 SE APPLICATION handbook, full pagewidth VCC C1 R2 R1 110 kΩ IN− 1 µF 11 kΩ IN+ Vin SVR C2 47 µF MODE 100 µF 100 nF 6 4 C3 OUT− 5 3 TDA8541 470 µF 2 8 1 RL OUT+ 7 GND MBH882 R2 Gain = -------R1 Fig.13 SE application. MGD884 10 MGD885 10 handbook, halfpage handbook, halfpage THD (%) THD (%) 1 1 (1) (1) (2) 10−1 10−1 (3) (2) (3) 10−2 10−2 10−1 1 Po (W) 10−2 10 10 f = 1 kHz, Gv = 20 dB. (1) VCC = 7.5 V, RL = 4 Ω. (2) VCC = 9 V, RL = 8 Ω. (3) VCC = 12 V, RL = 16 Ω. 103 104 f (Hz) 105 Po = 0.5 W, Gv = 20 dB. (1) VCC = 7.5 V, RL = 4 Ω. (2) VCC = 9 V, RL = 8 Ω. (3) VCC = 12 V, RL = 16 Ω. Fig.14 THD as a function of Po. 1998 Apr 01 102 Fig.15 THD as a function of frequency. 10 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD886 −20 MGD887 2 handbook, halfpage handbook, halfpage Po (W) SVRR (dB) 1.6 −40 (1) (3) (2) 1.2 (1) 0.8 (2) −60 (3) −80 10 102 0.4 103 104 f (Hz) 0 105 0 VCC = 7.5 V, RL = 4 Ω, Rs = 0 Ω, Vi = 100mV. (1) Gv = 24 dB. (2) Gv = 20 dB. (3) Gv = 0 dB. 4 8 12 VCC (V) 16 (1) THD = 10%, RL = 4 Ω. (2) THD = 10%, RL = 8 Ω. (3) THD = 10%, RL = 16 Ω. Fig.16 SVRR as a function of frequency. Fig.17 Po as a function of VCC. MGD888 1.6 MGD889 1.2 handbook, halfpage handbook, halfpage P (W) (1) P (W) (2) 1.2 0.8 (3) (1) (2) (3) 0.8 0.4 0.4 0 0 0 4 8 12 VCC (V) 16 0 (1) RL = 4 Ω. (2) RL = 8 Ω. (3) RL = 16 Ω. 0.8 1.2 Po (W) 1.6 (1) VCC = 7.5 V, RL = 4 Ω. (2) VCC = 12 V, RL = 16 Ω. (3) VCC = 9 V, RL = 8 Ω. Fig.18 Worst case power dissipation as a function of VCC. 1998 Apr 01 0.4 Fig.19 Power dissipation as a function of Po. 11 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 handbook, full pagewidth a. Top view. 6.8 kΩ MS 6.8 kΩ 1 IN 1 µF 11 kΩ 8 TDA8541 4 5 OUT+ OUT− 56 kΩ 100 nF 47 µF 100 µF +VP MBH920 b. Component side. Fig.20 Printed-circuit board layout (BTL and SE). 1998 Apr 01 12 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1998 Apr 01 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 13 o 8 0o Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1998 Apr 01 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 14 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Apr 01 15 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Apr 01 16 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 NOTES 1998 Apr 01 17 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 NOTES 1998 Apr 01 18 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 NOTES 1998 Apr 01 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/00/05/pp20 Date of release: 1998 Apr 01 Document order number: 9397 750 03352