PHILIPS TDA7073AT

INTEGRATED CIRCUITS
DATA SHEET
TDA7073A; TDA7073AT
Dual BTL power driver
Product specification
Supersedes data of 1994 July
File under Integrated Circuits, IC01
1999 Aug 30
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
FEATURES
GENERAL DESCRIPTION
• No external components
The TDA7073A/AT are dual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systems with a single supply. They are specially designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.
• Very high slew rate
• Single power supply
• Short-circuit proof
• High output current (0.6 A)
• Wide supply voltage range
Missing Current Limiter (MCL)
• Low output offset voltage
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
• Suited for handling PWM signals up to 176 kHz
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VP
positive supply voltage range
Gv
voltage gain
IP
total quiescent current
SR
CONDITIONS
MIN.
TYP.
MAX.
UNIT
3.0
5.0
18
V
32.5
33.5
34.5
dB
−
8
16
mA
slew rate
−
12
−
V/µs
VP = 5 V; RL = ∞
IO
output current
−
−
0.6
A
Ibias
input bias current
−
100
300
nA
fco
cut-off frequency
−
1.5
−
MHz
−3 dB
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA7073A
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
TDA7073AT
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
1999 Aug 30
2
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
BLOCK DIAGRAM
VP
handbook, full pagewidth
5
I + i
positive input 1
negative input 1
16
2
Ι
1
I – i
13
I – i
negative input 2
negative output 1
SHORT - CIRCUIT AND
THERMAL PROTECTION
TDA7073A
TDA7073AT
positive input 2
positive output 1
12
negative output 2
6
ΙΙ
7
I + i
9
positive output 2
3, 4, 8, 11, 15
10
14
MCD382 - 1
ground 2
ground 1
Fig.1 Block diagram.
1999 Aug 30
3
n.c.
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
PINNING
SYMBOL
PIN
DESCRIPTION
IN1−
1
negative input 1
IN1+
2
positive input 1
n.c.
3
not connected
n.c.
4
not connected
VP
5
positive supply voltage
IN2+
6
positive input 2
IN2−
7
negative input 2
n.c.
8
not connected
OUT2+
9
positive output 2
GND2
10
ground 2
n.c.
11
not connected
OUT2−
12
negative output 2
OUT1−
13
negative output 1
GND1
14
ground 1
n.c.
15
not connected
OUT1+
16
positive output 1
handbook, halfpage
1
16
OUT1+
IN1+
2
15
n.c.
n.c.
3
14
GND1
n.c.
4
13
OUT1 –
IN2 +
6
11
n.c.
IN2 –
7
10
GND2
n.c.
8
9
OUT2 +
VP
TDA7073A
TDA7073AT 12 OUT2 –
5
MCD381
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
feedback at 33.5 dB and the devices operate in a wide
supply voltage range (3 to 18 V). The devices can supply
a maximum output current of 0.6 A. The outputs can be
short-circuited over the load, to the supply and to ground
at all input conditions. The differential inputs can handle
common mode input voltages from ground level up to
(VP − 2.2 V with a maximum of 10 V). The devices have a
very high slew rate. Due to the large bandwidth, they can
handle PWM signals up to 176 kHz.
The TDA7073A/AT are dual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systems with a single supply. They are particular designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.
Because of the BTL configuration, the devices can supply
a bi-directional DC current in the load, with only a single
supply voltage. The voltage gain is fixed by internal
1999 Aug 30
IN1–
4
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
positive supply voltage range
−
18
V
IORM
repetitive peak output current
−
1
A
IOSM
non repetitive peak output current
−
1.5
A
Ptot
total power dissipation
TDA7073A
Tamb < 25 °C
−
2.5
W
TDA7073AT
Tamb < 25 °C
−
1.32
W
Tstg
storage temperature range
−55
+150
°C
Tvj
virtual junction temperature
−
150
°C
Tsc
short-circuit time
−
1
hr
see note 1
Note
1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.
THERMAL CHARACTERISTICS
SYMBOL
Rth (j-a)
PARAMETER
CONDITIONS
VALUE
UNIT
from junction to ambient
TDA7073A
in free air; note 1
50
K/W
TDA7073AT
in free air; note 2
95
K/W
Notes
1. TDA7073A: VP = 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.36 A and
Ptot = 2 × 0.76 W = 1.52 W; Tamb (max) = 150 − 1.52 × 50 = 74 °C.
2. TDA7073AT: VP = 5 V; RL = 16 Ω; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.18 A and
Ptot = 2 × 0.38 W = 0.76 W; Tamb (max) = 150 − 0.76 × 95 = 77 °C.
1999 Aug 30
5
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
CHARACTERISTICS
VP = 5 V; f = 1 kHz; Tamb = 25 °C; unless otherwise specified (see Fig.3). TDA7073A: RL = 8 Ω; TDA7073AT: RL = 16 Ω.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
positive supply voltage range
3.0
5.0
18
V
IORM
repetitive peak output current
−
−
0.6
A
IP
total quiescent current
VP = 5 V; RL = ∞;
note 1
−
8
16
mA
∆VOUT
output voltage swing
note 2
5.2
5.8
−
V
THD
total harmonic distortion
TDA7073A
VOUT = 1 V (RMS)
−
0.3
−
%
TDA7073AT
VOUT = 1 V (RMS)
−
0.1
−
%
32.5
33.5
34.5
dB
−
75
150
µV
Gv
voltage gain
Vno(rms)
noise output voltage (RMS value)
B
bandwidth
−
−
1.5
MHz
SVRR
supply voltage ripple rejection
note 4
38
55
−
dB
∆V16-13,12-9
DC output offset voltage
RS = 500 Ω
−
−
100
mV
VI(CM)
DC common mode voltage range
note 5
0
−
2.8
V
CMRR
DC common mode rejection ratio
note 6
−
100
−
dB
ZI
input impedance
−
100
−
kΩ
Ibias
input bias current
−
100
300
nA
α
channel separation
40
50
−
dB
∆GV
channel unbalance
−
−
1
dB
SR
slew rate
−
12
−
V/µs
note 3
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The output voltage swing is typically limited to 2 × (VP − 2.1 V) (see Fig.4).
3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 Ω.
4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The DC common mode voltage range is limited to (VP − 2.2 V with a maximum of 10 V).
6. The common mode rejection ratio is measured at Vref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz.
1999 Aug 30
6
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
APPLICATION INFORMATION
(1)
VP = 5 V
handbook, full pagewidth
220 µF
100 nF
5
I + i
16
2
driver signal 1
Rs
(2)
RL
Ι
500 Ω
1
13
I – i
12
TDA7073A
TDA7073AT
SERVO SYSTEM
6
driver signal 2
Rs
Vref
I – i
(2)
RL
ΙΙ
500 Ω
7
I + i
9
3, 4, 8, 11, 15
14
10
n.c.
MCD383
ground
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL can be: focus, tracking, sled function or spindle motor.
Fig.3 Test and application diagram.
1999 Aug 30
7
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
+ (VP – 2.1) V
handbook, full pagewidth
0V
MCD380
– (VP – 2.1) V
Fig.4 Typical output voltage swing over RL.
1999 Aug 30
8
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1999 Aug 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
9
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
HE
y
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT162-1
075E03
MS-013AA
1999 Aug 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
10
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
1999 Aug 30
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
11
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
suitable(2)
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
REFLOW(1) DIPPING
−
suitable
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
−
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
not suitable(3)
suitable
−
PLCC(4), SO, SOJ
suitable
suitable
−
suitable
−
suitable
−
recommended(4)(5)
LQFP, QFP, TQFP
not
SSOP, TSSOP, VSO
not recommended(6)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Aug 30
12
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
NOTES
1999 Aug 30
13
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
NOTES
1999 Aug 30
14
Philips Semiconductors
Product specification
Dual BTL power driver
TDA7073A; TDA7073AT
NOTES
1999 Aug 30
15
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Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 67
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/03/pp16
Date of release: 1999
Aug 30
Document order number:
9397 750 06375