LITTELFUSE PGB102ST23WR

PulseGuard ® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS
Pb
PGB1 Series Lead-Free SOT23 ESD Suppressor
Product Overview
PulseGuard ESD Suppressors help protect sensitive electronic
equipment against electrostatic discharge (ESD). They supplement the
on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important.
Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI, and DVI can benefit from this new technology. PulseGuard
suppressors use polymer composite materials to suppress fast-rising
ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E),
while adding virtually no capacitance to the circuit.
Features
• Lead-Free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• 2-lines of protection
• Bi-directional
• Withstands multiple ESD strikes
• Standard JEDEC SOT23 outline
• Compatible with pick-and-place processes
• Available in 3,000 piece reels
Reference Dimensions:
2.24 (.088")
Reflow
Solder
Typical Applications
•
•
•
•
•
•
•
Sn
1.01 (.040")
1.01 (.040")*
2.29
(.090")
HDTV Hardware
Laptop/Desktop Computers
Network Hardware
Computer Peripherals
Digital Cameras
External Storage
Set-Top Boxes
1.27
(.050")
1.01 (.040")
1.27
(.050")
0.635
(.025")
0.076
(.003") MIN (TYP)
Note: For wave solder, increase the spacing
in both the horizontal and vertical dimensions by
0.254 (.010") where denoted by an asterisk (*)
0.762
(.030")
0.81
(.032") REF
CATALOG NUMBER
PIECES PER REEL
PGB102ST23WR
3,000
Equivalent Circuit
3
Design Consideration
Because of the fast rise-time of the ESD transient, placement of
PulseGuard suppressors is a key design consideration. To achieve
optimal ESD suppression, the devices should be placed on the circuit
board as close to the source of the ESD transient as possible. Install
PulseGuard suppressors directly behind the connector so that they are
the first board-level circuit component encountered by the ESD transient.
They are connected from signal/data line to ground.
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2.997
(.118")
2.032 (.080")*
0.51
(.020")
Ordering Information
204
2.032
(.080")
1.01 (.040")
1
2
PulseGuard ® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS
Pb
PGB1 Series Lead-Free SOT23 ESD Suppressor
Electrical Characteristics
Capacitance vs. Frequency
ESD Capability
** Note: 1,000 fF = 1 pF
70
IEC 61000-4-2 Direct Discharge ....................................................8kV
Capacitance (fF)
IEC 61000-4-2 Air Discharge .......................................................15kV
Trigger Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V typical
Clamping Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150V typical
Rated Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24VDC max
Capacitance2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.055pF
Response Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1ns
1
60
50
40
Leakage Current3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1nA
4
ESD Pulse Withstand4 . . . . . . . . . . . . . . . . . . . . . . 1,000 pulses minimum
1.0
Notes:
1.5
2.0
PULSEGUARD®
SUPPRESSORS
0.5
Frequency (GHz)
1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct
discharge method.
2. Capacitance measured at 1MHZ.
3. Leakage current measured at 6VDC.
4. Pulse Withstand- some shifting in characteristics may occur when
tested over multiple pulses at a very rapid rate.
Carrier Tape Specifications
Parts are delivered on 7” (178mm) reel, plastic carrier tape
Environmental Specifications
Tt
Operating Temperature: -65°C to +125°C.
Moisture Resistance, steady state: MIL-STD-833, method 1004.7,
Ds
Dd
85% RH, 85°C, 1000hrs.
1 min. cycle, 2grs each in X-Y-Z)
+
+
+
+
+
Tw
Pd
+
Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C,
30 min cycle, 10 cycles.
Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz,
+
Ph
Ps
Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer)
Pw
Solder leach resistance and terminal adhesion: Per EIA-576
Ct
test
Physical Specifications
Materials:
Body: Glass Epoxy
Terminations: 100% Copper/Nickel/Tin
Solderability: MIL-STD-202, Method 208 (95% coverage)
DESCRIPTION
Soldering Parameters:
Wave Solder – 260°C, 10 seconds maximum.
Reflow Solder – 260°C, 30 seconds maximum.
MEASUREMENT (MM)
Ct - Cover tape thickness
0.06
Dd - Drive hole diameter
1.50
Packaging Specifications
Ds - Drive hole spacing
4.00
8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 3,000 pieces per
reel, add packaging suffix, WR.
Pd - Pocket depth
1.02
Ph - Pocket height
3.23
Ps - Pocket spacing
4.00
Pw - Pocket width
2.46
Tt - Carrier tape thickness
0.30
Tw - Carrier tape width
8.00
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205