PIC18F2525/2620/4525/4620 PIC18F2525/2620/4525/4620 Data Sheet Errata Clarifications/Corrections to the Data Sheet: In the Device Data Sheet (DS39626B), the following clarifications and corrections should be noted. Any silicon issues related to the PIC18F2525/2620/4525/ 4620 devices will be reported in a separate silicon errata. Please check the Microchip web site for any existing issues. 1. Module: I/O Ports The TRIS setting for the TX pin on PORTC in Table 10-5 of the Device Data Sheet was incorrectly stated as ‘1’. The correct TRIS setting for the TX pin on PORTC is ‘0’. 2. Module: Resets The PR2 initialization condition shown in Table 4-4 for MCLR Resets, WDT Reset, RESET Instruction, Stack Resets and Wake-up via WDT or Interrupt should read “uuuu uuuu” as shown in the following table (changes are shown in bold text): TABLE 4-4: Register PR2 INITIALIZATION CONDITIONS FOR ALL REGISTERS Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt 2525 2620 4525 4620 1111 1111 uuuu uuuu uuuu uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. 3. Module: Voltage-Frequency Graph The title information for Figure 26-2: VoltageFrequency Graph (Extended), references the wrong device family and has been changed to read as follows: FIGURE 26-2: PIC18F2525/2620/4525/4620 VOLTAGE-FREQUENCY GRAPH (EXTENDED) © 2005 Microchip Technology Inc. DS80222B-page 1 PIC18F2525/2620/4525/4620 4. Module: DC Characteristics In Section 26.3 “DC Characteristics” (page 336), the specifications for VIL parameters D033B and D034 have been clarified and now read as follows: 26.3 DC Characteristics: PIC18F2525/2620/4525/4620 (Industrial, Extended) PIC18LF2525/2620/4525/4620 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial DC CHARACTERISTICS Param Symbol No. VIL D033B D034 Characteristic Min Max Units VSS VSS 0.3 0.3 V V Conditions Input Low Voltage OSC1 T13CKI XT, LP modes 5. Module: A/D Converter Characteristics In Table 26-24: A/D Converter Characteristics (page 359), specification A40 has been added: TABLE 26-24: A/D CONVERTER CHARACTERISTICS: PIC18FX525/X620 (INDUSTRIAL, EXTENDED) PIC18LFX525/X620 (INDUSTRIAL) Param Symbol No. A40 Characteristic A/D Current from VDD PIC18FXXXX IAD PIC18LFXX20 Min Typ Max Units Conditions — — 180 — μA 90 — μA Average current during conversion 6. Module: Instruction Set In Table 24-2: PIC18FXXXX Instruction Set (pages 270-271), the ADDWF, ADDWFC and BTG instructions have been modified. The changes are shown in bold text: TABLE 26-25: PIC18FXXXX INSTRUCTION SET 16-Bit Instruction Word Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes BYTE-ORIENTED OPERATIONS ADDWF ADDWFC f, d, a f, d, a Add WREG and f Add WREG and Carry bit to f 1 1 0010 0010 01da 00da ffff ffff ffff C, DC, Z, OV, N ffff C, DC, Z, OV, N 1, 2 1, 2 1 0111 bbba ffff ffff None 1, 2 BIT-ORIENTED OPERATIONS BTG f, b, a Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 2: DS80222B-page 2 Bit Toggle f © 2005 Microchip Technology Inc. PIC18F2525/2620/4525/4620 7. Module: Timing Diagrams and Specifications Table 26-6: External Clock Timing Requirements (page 343), has been revised (changes and additions are shown in bold text). TABLE 26-6: Param. No. 1A EXTERNAL CLOCK TIMING REQUIREMENTS Symbol FOSC Characteristic Min Max Units External CLKI Frequency(1) DC 1 MHz DC 25 MHz HS Oscillator mode DC 31.25 kHz LP Oscillator mode DC 40 MHz EC Oscillator mode DC 4 MHz RC Oscillator mode Oscillator Frequency(1) 1 TOSC External CLKI Period(1) Oscillator Period(1) Note 1: XT, RC Oscillator mode 0.1 4 MHz XT Oscillator mode 4 25 MHz HS Oscillator mode 4 10 MHz HS + PLL Oscillator mode 5 200 kHz LP Oscillator mode 1000 — ns XT, RC Oscillator mode 40 — ns HS Oscillator mode 32 — μs LP Oscillator mode 25 — ns EC Oscillator mode 250 — ns RC Oscillator mode 250 1 μs XT Oscillator mode 40 250 ns HS Oscillator mode 100 250 ns HS + PLL Oscillator mode 5 200 μs LP Oscillator mode Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. 8. Module: EUSART The RX pin sampling information in Section 18.1.2 “Sampling” has changed. This section now reads as follows: 18.1.2 Conditions 9. Module: MSSP In Section 17.3.2 “Operation”, the following note has been added: Note: SAMPLING The data on the RX pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX pin when SYNC is clear or when BRG16 and BRGH are both not set. The data on the RX pin is sampled once when SYNC is set or when BRGH16 and BRGH are both set. 10. Module: QFN In the QFN pin diagram on page 3 and in Table 1-3: PIC18F4525/4620 Pinout I/O Descriptions, the following note has been added: Note: © 2005 Microchip Technology Inc. The SSPBUF register cannot be used with read-modify-write instructions, such as BCF, BTFSC, COMF, etc. It is recommended to connect the bottom pad of QFN package parts to VSS. DS80222B-page 3 PIC18F2525/2620/4525/4620 11. Module: Electrical Characteristics Parameters D031A and D041A have been added to Section 26-3 “DC Characteristics”, as shown below: 26.3 DC Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial DC CHARACTERISTICS Param Symbol No. VIL Characteristic Min Max Units VSS 0.8 V 2.1 VDD V Conditions Input Low Voltage I/O ports: D031A with SMBus buffer VIH Input High Voltage I/O ports: D041A with SMBus buffer 12. Module: Electrical Characteristics In Table 26-1: Memory Programming Requirements, parameters D132, D132A, D133 and D133A have been changed. The changes are shown in bold: TABLE 26-1: MEMORY PROGRAMMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial DC CHARACTERISTICS Param No. Sym Characteristic Min Typ† Max Units Conditions VDD for Block Erase 3.0 — 5.5 V Using ICSP™ port, 25°C D132A VIW VDD for Externally Timed Erase or Write 4.5 — 5.5 V Using ICSP port, 25°C D133 ICSP Block Erase Cycle Time — 4 — ms VDD ≥ 4.5V D133A TIW ICSP Erase or Write Cycle Time (externally timed) 1 — — ms VDD ≥ 4.5V, 25°C D133A TIW Self-Timed Write Cycle Time — 2 — ms Program Flash Memory D132 VIE TIE 13. Module: Pinout I/O Descriptions The QFN column has been removed from Table 1-2: PIC18F2525/2620 Pinout I/O Descriptions. The PIC18F2525/2620 devices are not available in a QFN package. DS80222B-page 4 © 2005 Microchip Technology Inc. PIC18F2525/2620/4525/4620 REVISION HISTORY Rev A Document (01/2005) First revision of this document. Data Sheet Clarification issues 1 (I/O Ports), 2 (Resets), 3 (Voltage-Frequency Graph), 4 (DC Characteristics), 5 (A/D Converter Characteristics), 6 (Instruction Set) and 7 (Timing Diagrams and Specifications). Rev B Document (09/2005) Added Data Sheet Clarification issues 8 (EUSART), 9 (MSSP), 10 (QFN), 11-12 (Electrical Characteristics) and 13 (Pinout I/O Descriptions). © 2005 Microchip Technology Inc. DS80222B-page 5 PIC18F2525/2620/4525/4620 NOTES: DS80222B-page 6 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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