PKF 5000 I 5–6 W DC/DC Power Modules Wide Input Series • SMD and through-hole versions with ultra low component height 8 mm (0.315 in.) • 18–72 V input voltage range • 82% efficiency (typ at 5 V) • 1,500 V dc isolation voltage • Switching frequency syncronization • MTBF > 4.9 million hours at +55°C case temperature (+40 °C ambient) • Low EMI measured according to CISPR 22 and FCC part 15J Patents US: D357901 DE: M94022763 The MacroDens™ PKF 5000 I series true component level on-board DC/DC power modules are intended as distributed power sources in decentralized 24, 48 and 60 V DC power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTBF of more than 4.9 million hour. The highly reliable and rugged over-moulded design and the ultra low height of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) and other demanding industrial applications, with board spacing down to 15 mm or 0.6 in. These DC/DC power modules are optimized for free convection cooling and have an operational ambient temperature E range in compliance with present and future application needs, including non temperature controlled environments. The mechanical design offers the choice of surface mount or through-hole versions, delivered in readyto-use tubes, trays or tape & reel package, and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured using highly automated manufacturing lines with a world-class quality commitment and a five-year warranty. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover. General Absolute Maximum Ratings Characteristics min max Unit TC Case temperature at full output power –45 +100 °C TS Storage temperature –55 +125 °C VI Continuous input voltage1) –0.5 +75 V dc VISO Isolation voltage (input to output test voltage) Wtr Transient input energy VRC Remote control voltage pin 10,11 Vadj Output adjust voltage pin 8, 9 1,500 V dc 0.01 Ws –5 +16 V dc –5 + 40 V dc Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. NOTES: Input TC < TCmax unless otherwise specified Characteristics Conditions min VI Input voltage range1) VIoff Turn-off input voltage (See typical characteristics) VIon Turn-on input voltage (See typical characteristics) CI Input capacitance PIi Input idling power IO = 0, TC = – 30…+ 90 °C PRC Input stand-by power max typ 18 15 72 16 1) The input voltage range 18…72 V dc meets the European Telecom Standard ETS 300 132-2 Nominal input voltage range in 48 V and 60 V dc power systems, – 40.5… –57.0 V and –50.0… – 72.0 V respectively. At input voltages exceeding 72 V (abnormal voltage) the power loss will be higher than at normal input voltage and TC must be limited to max +90 °C. Absolute max continuous input voltage is 75 V dc. Output characteristics will be marginally affected at input voltages exceeding 72 V. 2) The test is applicable for through-hole versions. Unit V V 17.4 17.9 V 1.4 mF (VI = 27V) (VI = 53 V) 244 240 mW (VI = 27V) TC = – 30…+ 90 °C RC connected to pin 17 (VI = 53 V) 18 67 mW Environmental Characteristics Characteristics Test procedure & conditions Vibration (Sinusoidal) JESD 22-B103 Frequency Amplitude Acceleration Number of cycles 10…500 Hz 0.75 mm 10 g 10 in each axis MIL-STD-883 Method 2026 Frequency Acceleration density spectrum Duration Reproducability 10…500 Hz Random vibration (IEC 68-2-34 Ed) Shock (Half sinus) (IEC 68-2-27 Ea) Temperature change (IEC 68-2-14 Na) Accelerated damp heat Solder resistability2) Aggressive environment 2 (IEC 68-2-6 Fc) JESD 22-B104 JESD 22-A104 JESD 22-A101 (IEC 68-2-3 Ca with bias) JESD 22-B106 (IEC 68-2-20 Tb 1A) IEC 68-2-11 Ka Peak acceleration Shock duration 0.5 g2/Hz 10 min in 3 directions medium (IEC 62-2-36) 200 g 3 ms Temperature Number of cycles –40°C…+125°C 500 Temperature Humidity Duration 85°C 85% RH 1000 hours Temperature, solder Duration 260°C 10…13 s Duration Temperature Concentration 96 h 35°C 5% EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Mechanical Data Through-hole version Foot print Component side 18 17 16 15 14 13 12 11 10 1 2 3 4 5 6 7 5.0 [0.197] 40.0 [1.575] 8 9 24.0 [0.945] 29.6 [1.165] Foot print Component side 2.8 [0.110] Surface-mount version 3.6 [0.142] 40.0 [1.575] Dimensions in mm (in) Dimensions in mm (in) Weight Connections Maximum 20 g (0.71 oz). Pin Designation Function 1 Out 1 Output 1. Positive voltage ref. to Rtn. 2 Rtn Output return. 3–6 NC Not connected. 7 Sync Synchronization input. 8 Vadj Output voltage adjust. To set typical output voltage (VOi) connect pin 8 to pin 9. 9 NOR Connection of Nominal Output voltage Resistor. (See output voltage adjust p. 12). 10 Aux Internally connected to pin 11. 11 RC Remote control and turn-on/off input voltage adjust. Used to turn-on and turn-off output. 12–16 NC Not connected. 17 –In Negative input. 18 +In Positive input. EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Case The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/°C. Connection Pins Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd). 3 Thermal Data Reflow Soldering Information Over-temperature protection The PKF series of DC/DC power modules are manufactured in surface mount technology. Extra precautions must therefore be taken when reflow soldering the surface mount version. Neglecting the soldering information given below may result in permanent damage or significant degradation of power module performance. The PKF series can be reflow soldered using IR, Natural Convection, Forced Convection or Combined IR/Convection Technologies. The high thermal mass of the component and its effect on DT (°C) requires that particular attention be paid to other temperature sensitive components. IR Reflow technology may require the overall profile time to be extended to approximately 8–10 minutes to ensure an acceptable DT. Higher activity flux may be more suitable to overcome the increase in oxidation and to avoid flux burn-up. The general profile parameters detailed in the diagram, with this extended time to reach peak temperatures, would then be suitable. Note! These are maximum parameters. Depending on process variations, an appropriate margin must be added. The PKF 5000 series will automatically shut down when the internal junction temperature of the control IC in the converter reaches typ. 150 °C. It will automatically re-start when the junction temperature cools below typ. 140 °C. Two-parameter model This model provides a more precise description of the thermal characteristics to be used for thermal calculations. Thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. The thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. One from the case to ambient air and one from case to PB (Printed Board). The thermal characteristics can be calculated from the following formula: TPB = (TC–TA)×(Rth C–PB+Rth C–A)/Rth C–A–Pd×Rth C–PB+TA Where: Pd: TC: TA: dissipated power, calculated as PO ×(l/h–1) max average case temperature ambient air temperature at the lower side of the power module temperature in the PB between the PKF connection pins TPB: Rth C-PB: thermal resistance from case to PB under the power module Rth C-A: thermal resistance from case to ambient air v: velocity of ambient air. Rth C-PB is constant and Rth C-A is dependent on the air velocity. Free convection is equal to an air velocity of approx. 0.2 – 0.3 m/s. See figure below. Palladium plating is used on the terminal pins. A pin temperature (Tp) in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37) for more than 25 seconds and a peak temperature above 195°C, is required to guarantee a reliable solder joint. Both pin 1 and pin 9 must be monitored. No responsibility is assumed if these recommendations are not strictly followed. 4 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Safety Electrical Data The PKF Series DC/DC power modules are designed in accordance with EN 60 950, Safety of information technology equipment including electrical business equipment. SEMKO approval pending. Fundamental circuit diagrams Single output The DC/DC power module shall be installed in an end-use equipment and considerations should be given to measuring the case temperature to comply with TC max when in operation. Abnormal component tests are conducted with the input protected by an external 3 A fuse. The need for repeating these tests in the end-use appliance shall be considered if installed in a circuit having higher rated devices. When the supply to the DC/DC power module meets all the requirements for SELV (<60 V dc), the output is considered to remain within SELV limits (level 3). The isolation is an operational insulation in accordance with EN 60 950. The DC/DC power module is intended to be supplied by isolated secondary circuitry and shall be installed in compliance with the requirements of the ultimate application. If they are connected to a 60 V DC system reinforced insulation must be provided in the power supply that isolates the input from the mains. Single fault testing in the power supply must be performed in combination with the DC/DC power module to demonstrate that the output meets the requirement for SELV. One pole of the input and one pole of the output is to be grounded or both are to be kept floating. Transient input voltage The terminal pins are only intended for connection to mating connectors of internal wiring inside the end-use equipment. These DC/DC power modules may be used in telephone equipment in accordance with paragraph 34 A.1 of UL 1459 (Standard for Telephone Equipment, second edition). The galvanic isolation is verified in an electric strength test. Test voltage (VISO) between input and output is 1,500 V dc for 60 s. In production the test duration is decreased to 1 s. The capacitor between input and output has a value of 1 nF and the leakage current is less than 1µA @ 53 V dc. The case is designed in non-conductive epoxy. Its flammability rating meets UL 94V-0. The oxygen index is 34%. Single voltage pulse at +25 °C ambient temperature. EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 5 PKF 5510 PI, SI TC = –30…+90°C, VI = 18 ...72V and pin 8 connected to pin 9 unless otherwise specified. Output Output 1 Characteristics VOi Conditions Unit min typ max 3.27 3.30 3.33 V 2.80 3.80 V IO = 0.15…1.5 A 3.00 3.46 IO = 0.15…1.5 A, VI = 19–72 V 3.13 3.46 IO = 0.2…1.5 A, VI = 20-72 V 3.17 3.42 Output voltage initial setting and accuracy TC = +25°C, I O = 1.5 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Idling voltage Line regulation Load regulation ttr Long term drift incl. 3.8 IO = 0 A IO = 1,5 A VI = 18…36 V 30 VI = 38…60 V 30 VI = 50…72 V 15 IO = 0.15…1.5 A, VI = 53 V 50 Load transient recovery time IO = 0.15…1.5 A, VI = 53 V load step = 0.75 A Vtr 4.3 V V mV 200 mV 100 ms +150 mV –150 mV –0.4 mV/°C Load transient voltage Tcoeff Temperature coefficient2) tr Ramp-up time IO = 1.5 A, 0.15…1.5 ×VO 2 ms ts Start-up time IO = 0.15…1.5A, VI = 53 V From VI connection to VO = 0…0.9×VOi 5 ms IO Output current POmax Max output power2) Calculated value Ilim Current limiting threshold TC <TCmax, VO = 3.0 V Isc Short circuit current VO = 0.2…0.5 V, TA = + 25 °C VOac Output ripple & noise IO = 1.5 A IO =1.5 A, TC = + 40…+ 90 ºC 0 1.5 5 1.65 W 2.30 20 0.6 …50 MHz SVR 1) 2) Supply voltage rejection (ac) 2.50 2.7 20 Hz…5 MHz f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p)) A A A 70 mVp-p 80 dBmV 45 dB See also Operating Information. See Typical Characteristics. Miscellaneous Characteristics h Conditions min typ VI = 27 V 78 80 VI = 53 V 75 78 max Unit % Efficiency IO = 1.5 A Pd 6 VI = 27 V 1.2 1.4 VI = 53 V 1.4 1.7 W Power dissipation EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 PKF 5611 PI, SI TC = –30…+90°C, VI = 18 ...72V and pin 8 connected to pin 9 unless otherwise specified. Output Output 1 Characteristics VOi Conditions Unit Output voltage initial setting and accuracy min typ max 5.02 5.05 5.08 V 4.30 5.80 V 4.85 5.25 V 6.0 V TC = +25°C, IO = 0.2 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Long term drift included Idling voltage IO = 0 A Line regulation Load regulation ttr IO = 1.2 A IO = 0.15…1.2 A 5.7 VI = 18…36 V 50 VI = 38…60 V 20 VI = 50…72 V 10 IO = 0.3…1.2 A, VI = 27 V Load transient recovery time IO = 0.12…12 A, VI = 53 V load step = 0.6 A Vtr 135 mV 330 ms +120 mV –120 mV –1.1 mV/°C Load transient voltage coefficient2) IO = 1.2 A, T C =+40…+ 90 ºC Tcoeff Temperature tr Ramp-up time IO = 1.2 A, 0.1…0.9 ×V O ts Start-up time IO = 0.1…1.2 A, V I = 53 V From VI connection to VO = 0…0.9 ×VOi IO Output current POmax Max output power2) Calculated value Ilim Current limiting threshold TC <TCmax, VO = 4.0 V Isc Short circuit current VO = 0.2…0.5 V, TA = + 25 °C VOac Output ripple & noise IO = 1.2 A 1 2 5 ms 4.8 10 ms 1.2 A 0 6 1.3 20 Hz…5 MHz W 1.8 2.0 A 2.0 3.5 A 50 150 mVp-p 80 dBmV 0.6 …50 MHz SVR 1) 2) mV Supply voltage rejection (ac) f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p)) 60 dB See also Operating Information. See Typical Characteristics. Miscellaneous Characteristics h Conditions min typ VI = 27 V 79 83 VI = 53 V 79 81 max Unit % Efficiency IO = 1.2 A Pd VI = 27 V 1.2 1.6 VI = 53 V 1.4 1.6 W Power dissipation EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 7 PKF 5617 PI, SI TC = –30…+90°C, VI = 18 ...72 V and pin 8 connected to pin 9 unless otherwise specified. Output Output 1 Characteristics VOi Conditions Unit Output voltage initial setting and accuracy min typ max 6.95 7.00 7.05 V 5.95 8.05 V 6.65 7.35 V 7.9 V TC = +25°C, IO = 0.72 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Long term drift included Idling voltage IO = 0 A, VI =53 V Line regulation Load regulation IO =0.86 A IO = 0.086…0.86 A 7.5 VI = 18…36 V 10 VI = 38…60 V 10 VI = 50…72 V 10 IO = 0.08…0.86 A, VI = 27 V Load transient recovery time ttr IO = 0.086…0.86 A, VI = 53 V load step = 0.43 A Vtr 120 mV 350 ms +130 mV –130 mV –1.2 mV/°C Load transient voltage coefficient2) IO = 0.86 A, TC = + 40… + 90 ºC Tcoeff Temperature tr Ramp-up time IO = IOmax, 0.1…0.9 ×VO, VI = 53 V ts Start-up time IO = 0.086…0.86 A, VI = 53 V From VI connection to VO = 0.9 ×VOi IO Output current power2) 1 3 5 ms 5 10 ms 0.86 A 0 POmax Max output Ilim Current limiting threshold TC <TCmax, VO = 4.0 V Isc Short circuit current VO = 0.2…0.5 V, TA = + 25 °C VOac Output ripple & noise IO =0.86 A 6 Calculated value 1.0 20 Hz…5 MHz W 1.2 1.6 A 1.8 3.5 A 50 150 mVp-p 80 dBmV 0.6 …50 MHz SVR *1) 12) mV Supply voltage rejection (ac) f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p)) 60 dB See also Operating Information. See Typical Characteristics. Miscellaneous Characteristics h Conditions min typ VI = 27 V 80 84 VI = 53 V 80 82 max Efficiency Unit % IO = 0.86 A Pd 8 VI = 27 V 1.1 1.5 VI = 53 V 1.3 1.5 W Power dissipation EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Typical Characteristics PKF 5510 PI, SI Output characteristic (typ) Power derating Efficiency (typ) @ TA = +25°C Temperature coefficient Turn-on/turn/off input voltage Dynamic load response (typ) @ +25C The output voltage deviation is determined by the load transient (dI/dt) 100 mV/div 1 A/div Load change: dI/dt » 4 A/ms 0.2 ms/div PKF 5611 PI, SI Output characteristic (typ) Power derating Efficiency (typ) @ TA = + 25°C Temperature coefficient Turn-on/turn/off input voltage Dynamic load response (typ) @ + 25C 100 mV/div The output voltage deviation is determined by the load transient (dI/dt) 1 A/div Load change: dI/dt » 4 A/ms 0.2 ms/div EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 9 PKF 5617 PI, SI Output characteristic (typ) Power derating Efficiency (typ) @ TA = +25°C Temperature coefficient Turn-on/turn/off input voltage Dynamic load response (typ) @ + 25C 100 mV/div The output voltage deviation is determined by the load transient (dI/dt) 1 A/div Load change: dI/dt » 4 A/ms 0.2 ms/div 10 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 EMC Specifications The fundamental switching frequency is 510 kHz ± 26 kHz. Conducted EMI (input teminals) EFT Electrical Fast Transients on the input terminals could affect the output voltage regulation causing functional errors on the Printed Board Assembly (PBA). The PKF power modules withstand EFT levels of 0.5 kV keeping VO within the tolerance band and 2.0 kV without destruction. Tested according to IEC publ. 801-4. Output Ripple & Noise (VOac) Output ripple is measured as the peak to peak voltage of the fundamental switching frequency. Operating Information Fuse Considerations PKF series typical conducted EMI performance Test set up To prevent excessive current from flowing through the input supply line, in the case of a short-circuit across the converter input, an external fuse should be installed in the non-earthed input supply line. We recommend using a fuse rated at approximately 2 to 4 times the value calculated in the formula below: PO max Iin max = (hmin × VI min) For further information, please refer to the fuse manufacturer . The PKF meets class A in VDE 0871/0878, FCC Part 15J, and CISPR 22 (EN 55022), except for the fundamental switching frequency. Conducted EMS Electro Magnetic Susceptibility is measured by injection of electrical disturbances on the input terminals. No deviation outside the VO tolerance band will occur under the following conditions: Frequency range Voltage level 0.15...300 MHz 1.0 Vrms Remote Control (RC) Turn-on or turn-off can be realized by using the RC-pin. If pin 11 is connected to pin 17 the power module turns off. Normal operation is achieved if pin 11 is open (NC) . To ensure safe turn-off the voltage difference between pin 11 and 17 shall be less than 2.0 V. RC is an TTL open collector compatible output with a sink capacity >300 mA (see fig. 1). The signal is amplitude modulated with 1 kHz/80% and applied both differential and common mode. Radiated EMS (Electro-Magnetic Fields) Radiated EMS is measured according to test methods in IEC Standard publ. 801-3. No deviation outside the VO tolerance band will occur under the following conditions: Frequency range 0.01...200 MHz 200...1,000 MHz 1...12 GHz Voltage level 3 Vrms/m 3 Vrms/m 10 Vrms/m Figure 1 ESD Electro Static Discharge is tested according to IEC publ. 801-2. No destruction will occur if the following voltage levels are applied to any of the terminal pins: Test Voltage level Air discharge ±4 kV Contact discharge ±2 kV EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Over Voltage Protection (OVP) The remote control can also be utilized for OVP by using the external circuitry in figure 2. Resistor values are for 5 V output applications, but can easily be adjusted for other output voltages and the desired OVP level. 11 Figure 4 Capacitive Load Figure 2 The PKF series has no maximum limit for capacitive load on the output. The power module may operate in current limiting mode during start-up, affecting the ramp-up and the start-up time. For optimum start performance we recommend maximum 100 mF/A of IO. Connect capacitors at the point of load for best performance. Output Voltage Adjust (Vadj) Output voltage, VO, can be adjusted by using an external resistor. Typical adjust range is ± 15%. If pin 8 and 9 are not connected together the output will decrease to a low value.To increase VO a resistor should be connected between pin 8/9 and 17, and to decrease VO a resistor should be connected between pin 8 and 9 (see fig. 4). Typical required resistor value to increase VO is given by: Radj = k1×(k2 – VO)/(VO – VOi), (kW) where VO is the desired output voltage VOi is the typical output voltage initial setting and k1=3.18 k1=3.18 k1=3.18 k2=3.86 k2=5.93 k2=8.05 PKF 5510 PKF 5611 PKF 5617 Parallel Operation Paralleling of several converters is easily accomplished by direct connection of the output voltage terminal pins. The load regulation characteristic is specifically designed for optimal paralleling performance. Load sharing between converters will be within ±10%. It is recommended not to exceed PO = n × 0.9 × PO max, where POmax is the maximum converter output power and n the number of paralleled converters, to prevent overloading any of the converters and thereby decreasing the reliability performance. Current Limiting Protection (Ilim) The output power is limited at loads above the output current limiting threshold (Ilim), specified as a minimum value. Typical required resistor value to decrease VO is given by: Radj = k3 × (VOi –VO)/(VO – k4), (kW) where k3=13.0 k3=12.6 k3=12.6 k4=2.75 k4=4.28 k4=5.95 Synchronization (Sync) PKF 5510 PKF 5611 PKF 5617 It is possible to synchronize the switching frequency to an external symmetrical clock signal. The input is TTL-compatible and referenced to the input pin 17. Characteristic High level Threshold level*) Low level Sink current Sync. frequency *) min typ 2.2 1.2 0 1.7 520 max unit 6.5 2.2 0.4 1.5 688 V V V mA kHz Rise time <10ns Input and Output Impedance Figure 3 Voltage Margining For voltage controlled margining e.g. at final test, the following setup can be used. By increasing the control voltage V1 to +10 V the output voltage decreases 5% of VOi, and by decreasing V1 to –10 V the output voltage increases 5%. 12 Both the source impedance of the power feeding and the load impedance will interact with the impedance of the DC/DC power module. It is most important to have the ratio between L and C as low as possible, i.e. a low characteristic impedance, both at the input and output, as the power modules have a low energy storage capability. Use an electrolytic capacitor across the input if the source is larger than 10 mH. Their equivalent series resistance together with the capacitance acts as a lossless damping filter. Suitable capacitor values are in the range 10–100 mF. EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 Delivery Package Information Capacity: Stacking pitch: Weight: Min. order quantity: Tubes 15 power modules/tray 10.16 mm Typ. 130 g 150 pcs (one box contains 10 full trays) The PKF-series is delivered in tubes (designated by /A) with a length of 500 mm (19.69 in), see fig. 5. Tape & Reel SMD versions, SI, can be delivered in standard tape & reel package (designated by /C) on request, see fig. 7. For more information, please contact your local Ericsson sales office. Figure 5 Specification Material: Max surface resistance: Color: Capacity: Weight: End stops: Antistatic coated PVC 1011W/ Transparent 10 power modules/tube Typ. 60 g Pins Trays SMD versions, SI, can be delivered in standard JEDEC trays (designated by /B) on request, see fig. 6. For more information, please contact your local Ericsson sales office. Figure 7 Specification Tape material: Tape width: Tape pitch: Max surface resistance: Tape color: Cover tape color: Reel diameter: Reel hub diameter: Reel capacity: Full reel weight: Min. order quantity: Conductive polystyrene (PS) 72 mm 36 mm 105W/ Black Transparent 13" 7" 150 pcs Typ. 3.7 kg 300 pcs (one box contains two reels) Figure 6 Specification Material: Max temperature: Max surface resistance: Color: Polypropylene (PP) 125 ºC 105W/ Black EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 13 Quality Reliability Meantime between failure (MTBF) is calculated to >4.9 million hours at full output power and a pin temperature of +55°C (TA = +40°C), using the Ericsson failure rate data system. The Ericsson failure rate data system is based on field failure rates and is continously updated. The data corresponds to actual failure rates of components used in Information Technology and Telecom equipment in temperature controlled environments (TA = –5… +65°C). The data is considered to have a confidence level of 90%. For more information see Design Note 002. Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 s and SPC, are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out by a burn-in procedure and an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Warranty Ericsson Microelectronics warrants to the original purchaser or end user that the products conform to this Data Sheet and are free from material and workmanship defects for a period of five (5) years from the date of manufacture, if the product is used within specified conditions and not opened. In case the product is discontinued, claims will be accepted up to three (3) years from the date of the discontinuation. For additional details on this limited warranty please refer to Ericsson Microelectronics AB’s “General Terms and Conditions of Sales”, or individual contract documents. Limitation of liability Ericsson Microelectronics does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person’s health or life). Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics’ general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. 14 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000 15 Product Program VI VO/IO max Output 1 24/48/60 V (max 75 V dc) 3.3 V/1.5 A 5 V/1.2 A 7 V/0.86 A Ordering No.*) PO max 5W 6W 6W Through-hole SMD PKF 5510 PI PKF 5611 PI PKF 5617 PI PKF 5510 SI PKF 5611 SI PKF 5617 SI *) Ericsson Microelectronics AB SE-164 81 KISTA, Sweden Phone: +46 8 757 5000 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int. +46 8 757 4700, Fax: +46 8 757 4776 See also Delivery Package Information The latest and most complete information can be found on our website! Data Sheet EN/LZT 146 32 R1A (Replaces EN/LZT 137 30 R5) © Ericsson Microelectronics AB, June 2000