PMC Pm39F010 / Pm39F020 / Pm39F040 1 Mbit / 2 Mbit / 4 Mbit 5 Volt-only CMOS Flash Memory FEATURES Single Power Supply Operation - Low voltage range: 4.5 V - 5.5 V • Automatic Erase and Byte Program - Typical 16 µs/byte programming time - Typical 55 ms sector/block/chip erase time • Memory Organization - Pm39F010: 128K x 8 (1 Mbit) - Pm39F020: 256K x 8 (2 Mbit) - Pm39F040: 512K x 8 (4 Mbit) • Low Power Consumption - Typical 8 mA active read current - Typical 9 mA program/erase current - Typical 0.5 µA CMOS standby current • High Performance Read - 55/70 ns access time • High Product Endurance - Guarantee 100,000 program/erase cycles per single sector (preliminary) - Minimum 20 years data retention • Cost Effective Sector/Block Architecture - Uniform 4 Kbyte sectors - Uniform 64 Kbyte blocks (sector-group) • Industrial Standard Pin-out and Packaging - 32-pin Plastic DIP - 32-pin PLCC - 32-pin VSOP (TSOP 8mm x 14mm) - Optional lead-free (Pb-free) packages • Data# Polling and Toggle Bit Features • Hardware Data Protection GENERAL DESCRIPTION The Pm39F010/020/040 are 1 Mbit/2 Mbit/4 Mbit 5.0 Volt-only Flash Memories. These devices are designed to use a single low voltage, range from 4.5 Volt to 5.5 Volt, power supply to perform read, erase and program operations. The 12.0 Volt VPP power supply for program and erase operations are not required. The devices can be programmed in standard EPROM programmers as well. The memory arrays of Pm39F010/020/040 are divided into uniform 4 Kbyte sectors or uniform 64 Kbyte blocks (sector group - consists of sixteen adjacent sectors). The sector or block erase feature allows users to flexibly erase an memory area as small as 4 Kbyte or as large as 64 Kbyte by one single erase operation without affecting the data in others. The chip erase feature allows the whole memory array to be erased in one single erase operation. The devices can be programmed on a byte-by-byte basis after performing the erase operation. The devices have a standard microprocessor interface as well as a JEDEC standard pin-out/command set. The program operation is executed by issuing the program command code into command register. The internal control logic automatically handles the programming voltage ramp-up and timing. The erase operation is executed by issuing the chip erase, block, or sector erase command code into command register. The internal control logic automatically handles the erase voltage ramp-up and timing. The preprogramming on the array which has not been programmed is not required before an erase operation. The devices offer Data# Polling and Toggle Bit functions, the progress or completion of program and erase operations can be detected by reading the Data# Polling on I/O7 or the Toggle Bit on I/O6. The Pm39F010/020/040 are manufactured on PMC’s advanced nonvolatile CMOS technology, P-FLASH™. The devices are offered in 32-pin PDIP, PLCC and VSOP packages with access time of 55 and 70 ns. Programmable Microelectronics Corp. 1 Issue Date: March 2004, Rev:1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 A17 A17 WE# NC NC WE# WE# 1 VCC 2 VCC 3 31 30 VCC 4 A18 NC A3 A16 A4 A16 A5 A16 A5 A15 A6 A15 A6 A15 A6 A12 5 A12 A7 A12 39F010 A7 39F040 39F020 A7 39F020 39F040 39F010 CONNECTION DIAGRAMS 39F010 39F020 39F040 29 A14 A14 A14 6 28 A13 A13 A13 A5 7 27 A8 A8 A8 A4 A4 8 26 A9 A9 A9 A3 A3 9 25 A11 A11 A11 A2 A2 A2 10 24 OE# OE# OE# A1 A1 A1 11 23 A10 A10 A10 22 CE# CE# CE# 21 I/O7 I/O7 I/O7 I/O4 I/O5 I/O6 I/O4 I/O5 I/O6 I/O5 I/O6 20 I/O4 19 I/O3 18 I/O3 GND GND GND 17 I/O3 I/O2 I/O2 16 I/O2 15 I/O1 14 39F010 13 I/O1 I/O0 39F020 A0 I/O0 I/O1 A0 I/O0 39F040 A0 12 32 32-Pin PLCC 39F040 39F020 39F010 A11 A9 A8 A13 A14 A17 WE# V CC A18 A16 A15 A12 A7 A6 A5 A4 A11 A9 A8 A13 A14 A17 WE# V CC NC A16 A15 A12 A7 A6 A5 A4 A11 A9 A8 A13 A14 NC WE# V CC NC A16 A15 A12 A7 A6 A5 A4 1 2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 3 4 5 6 7 8 9 10 11 12 13 14 15 16 39F010 39F020 39F040 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 32-Pin VSOP Programmable Microelectronics Corp. 2 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 CONNECTION DIAGRAMS (CONTINUED) 39F040 39F020 39F010 A18 A16 A15 A12 A7 A6 A5 A4 A3 NC A16 A15 A12 A7 A6 A5 A4 A3 NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND A2 A2 A1 A1 A0 A0 I/O0 I/O0 I/O1 I/O1 I/O2 I/O2 GND GND 1 2 3 4 5 6 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 7 8 9 10 11 12 13 14 15 16 17 39F010 39F020 39F040 V CC WE# NC A14 A13 A8 A9 A11 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 V CC WE# A17 A14 A13 A8 A9 A11 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 V CC WE# A17 A14 A13 A8 A9 A11 OE# A10 CE# I/O7 I/O6 I/O5 I/O4 I/O3 32-Pin PDIP LOGIC SYMBOL A0-AMS 8 I/O0-I/O7 CE# OE# WE# Note: AMS is the most significant address where AMS = A16 for Pm39F010, A17 for Pm39F020, and A18 for Pm39F040. Programmable Microelectronics Corp. 3 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 PRODUCT ORDERING INFORMATION Pm39F0x0 -70 J C E Environmental Attribute E = Lead-free (Pb-free) Package Blank = Standard Package Temperature Range C = Commercial (0°C to +85°C) Package Type J = 32-pin Plastic J-Leaded Chip Carrier (32J) V = 32-pin Thin Small Outline Package (32V) P = 32-pin Plastic DIP (32P) Speed Option - 70 = 70ns - 55 = 55ns PMC Device Number Pm39F010 (1 Mbit) Pm39F020 (2 Mbit) Pm39F040 (4 Mbit) Programmable Microelectronics Corp. 4 Issue Date: March, 2004, Rev: 1.3 PMC Part Number Pm39F010 / Pm39F020 / Pm39F040 tACC(ns) Pm39F010-55JCE Pm39F010-55PCE Package Temperature Range 32J 55 Pm39F010-55VCE 32P 32V Pm39F010-70JCE 32J Pm39F010-70JC Pm39F010-70PCE 70 32P Pm39F010-70PC Pm39F010-70VCE 32V Pm39F010-70VC Pm39F020-55JCE Pm39F020-55PCE 32J 55 Pm39F020-55VCE 32P 32V Pm39F020-70JCE 32J Pm39F020-70JC Commercial (0oC to + 85oC) Pm39F020-70PCE 70 32P Pm39F020-70PC Pm39F020-70VCE 32V Pm39F020-70VC Pm39F040-55JCE Pm39F040-55PCE 32J 55 Pm39F040-55VCE 32P 32V Pm39F040-70JCE 32J Pm39F040-70JC Pm39F040-70PCE 70 32P Pm39F040-70PC Pm39F040-70VCE 32V Pm39F040-70VC Programmable Microelectronics Corp. 5 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 PIN DESCRIPTIONS SYMBOL TYPE DESCRIPTION A0 - AMS(1) INPUT Address Inputs: For memory addresses input. Addresses are internally latched on the falling edge of WE# during a write cycle. C E# INPUT Chip Enable: CE# goes low activates the device's internal circuitries for device operation. CE# goes high deselects the device and switches into standby mode to reduce the power consumption. WE# INPUT Write Enable: Activate the device for write operation. WE# is active low. OE# INPUT Output Enable: Control the device's output buffers during a read cycle. OE# is active low. INPUT/ OUTPUT Data Inputs/Outputs: Input command/data during a write cycle or output data during a read cycle. The I/O pins float to tri-state when OE# are disabled. I/O0 - I/O7 V CC Device Power Supply GND Ground NC No Connection Note: 1. AMS is the most significant address where AMS = A16 for Pm39F010, A17 for Pm39F020, and A18 for Pm39F040. Programmable Microelectronics Corp. 6 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 BLOCK DIAGRAM ERASE/PROGRAM VOLTAGE GENERATOR I/O0-I/O7 I/O BUFFERS HIGH VOLTAGE SWITCH WE# COMMAND REGISTER CE,OE LOGIC DATA LATCH SENSE AMP A0-A M S ADDRESS LATCH CE# OE# Y-DECODER Y-GATING X-DECODER MEMORY ARRAY DEVICE OPERATION READ OPERATION BYTE PROGRAMMING The access of Pm39F010/020/040 are similar to EPROM. To read data, three control functions must be satisfied: • CE# is the chip enable and should be pulled low ( VIL ). • OE# is the output enable and should be pulled low ( VIL). • WE# is the write enable and should remains high ( VIH ). The programming is a four-bus-cycle operation and the data is programmed into the devices (to a logical “0”) on a byte-by-byte basis. See Table 3 for Software Command Definition. A program operation is activated by writing the three-byte command sequence followed by program address and one byte of program data into the devices. The addresses are latched on the falling edge of WE# or CE# whichever occurs later, and the data are latched on the rising edge of WE# or CE# whichever occurs first. The internal control logic automatically handles the internal programming voltages and timing. PRODUCT IDENTIFICATION A data “0” can not be programmed back to a “1”. Only erase operation can convert the “0”s to “1”s. The Data# Polling on I/O7 or Toggle Bit on I/O6 can be used to detect the progress or completion of a program cycle. The product identification mode can be used to identify the manufacturer and the device through hardware or software read ID operation. See Table 1 for PMC Manufacturer ID and Device ID. The hardware ID mode is activated by applying a 12.0 Volt on A9 pin, typically used by an external programmer for selecting the right programming algorithm for the devices. Refer to Table 2 for Bus Operation Modes. The software ID mode is activated by a three-bus-cycle command. See Table 3 for Software Command Definition. Programmable Microelectronics Corp. 7 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 DEVICE OPERATION (CONTINUED) CHIP ERASE HARDWARE DATA PROTECTION The entire memory array can be erased through a chip erase operation. Pre-programs the devices are not required prior to a chip erase operation. Chip erase starts immediately after a six-bus-cycle chip erase command sequence. All commands will be ignored once the chip erase operation has started. The devices will return to standby mode after the completion of chip erase. Hardware data protection protects the devices from unintentional erase or program operation. It is performed in the following ways: (a) VCC sense: if VCC is below 3.8 V (typical), the write operation is inhibited. (b) Write inhibit: holding any of the signal OE# low, CE# high, or WE# high inhibits a write cycle. (c) Noise filter: pulses of less than 5 ns (typical) on the WE# or CE# input will not initiate a write operation. SECTOR AND BLOCK ERASE The memory array of Pm39F010/020/040 are organized into uniform 4 Kbyte sectors. A sector erase operation allows to erase any individual sector without affecting the data in others. The memory array of those devices are also organized into uniform 64 Kbyte blocks (sector group - consists of sixteen adjacent sectors). A block erase operation allows to erase any individual block. The sector or block erase operation is similar to chip erase. Table 1. Product Identification I/O7 DATA# POLLING Product Identification Data The Pm39F010/020/040 provide a Data# Polling feature to indicate the progress or completion of a program and erase cycles. During a program cycle, an attempt to read the devices will result in the complement of the last loaded data on I/O7. Once the program operation is completed, the true data of the last loaded data is valid on all outputs. During a sector, block, or chip erase cycle, an attempt to read the device will result a “0” on I/O7. After the erase operation is completed, an attempt to read the device will result a “1” on I/O7. Manufacturer ID 9D h Device ID: Pm39F010 1C h Pm39F020 4D h Pm39F040 4E h I/O6 TOGGLE BIT The Pm39F010/020/040 also provide a Toggle Bit feature to detect the progress or completion of a program and erase cycles. During a program or erase cycle, an attempt to read data from the device will result a toggling between “1” and “0” on I/O6. When the program or erase operation is complete, I/O6 will stop toggling and valid data will be read. Toggle bit may be accessed at any time during a program or erase cycle. Programmable Microelectronics Corp. 8 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 SECTOR/BLOCK ADDRESS TABLE Memory Density Block (1) Block 0 Block Siz e (Kbytes) Sector Sector Siz e (Kbytes) Address Range Sector 0 4 00000h - 00F F F h Sector 1 4 01000h - 01F F F h : : : Sector 15 4 0F 000h - 0F F F F h Sector 16 4 10000h - 10F F F h Sector 17 4 11000h - 11FFFh : : : Sector 31 4 1F 000h - 1F F F F h 64 1 Mbit 2 Mbit Block 1 64 4 Mbit Block 2 64 " " 20000h - 2F F F F h Block 3 64 " " 30000h - 3F F F F h Block 4 64 " " 40000h - 4F F F F h Block 5 64 " " 50000h - 5F F F F h Block 6 64 " " 60000h - 6F F F F h Block 7 64 " " 70000h - 7F F F F h Note: 1. A Block is a 64 Kbyte sector group which consists of sixteen adjecent sectors of 4 Kbyte each. Programmable Microelectronics Corp. 9 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 OPERATING MODES Table 2. Bus Operation Modes Mode CE# OE# WE# Read VIL VIL VIH Write VIL VIH VIL X DIN Standby VIH X X X High Z Output Disable X VIH X X High Z Product Identification Hardware VIL VIL ADDRESS X VIH Notes: 1. X can be VIL, VIH or addresses. 2. AMS = Most significant address; AMS = A16 for Pm39F010, A17 for Pm39F020, and A18 for Pm39F040. I/O (1) DOUT A2 - AMS (2) = X, A9 = VH (3), A1 = VIL, A0 = VIL Manufacturer ID A2 - AMS (2) = X, A9 = VH (3), A1 = VIL, A0 = VIH Device ID 3. VH = 12.0 V ± 0.5 V. COMMAND DEFINITION Table 3. Software Command Definition C ommand S eq u en ce B us C ycle 1st B u s C ycle Addr D ata 2n d B u s C ycle Addr D ata 3rd B us C ycle Addr D ata 4th B us C ycle Addr D ata 5th B us C ylce Addr D ata 6th B us C ycle Addr D ata Read 1 Addr D OUT C hi p Erase 6 555h A A h 2A A h 55h 555h 80h 555h A A h 2A A h 55h 555h 10h Sector Erase 6 555h A A h 2A A h 55h 555h 80h 555h A A h 2A A h 55h SA (1) 30h Block Erase 6 555h A A h 2A A h 55h 555h 80h 555h A A h 2A A h 55h BA (2) 50h Byte Program 4 555h A A h 2A A h 55h 555h A 0h Addr D IN Product ID Entry 3 555h A A h 2A A h 55h 555h 90h Product ID Exi t (3) 3 555h A A h 2A A h 55h 555h F 0h Product ID Exi t (3) 1 X X X h F 0h Notes: 1. SA = Sector address of the sector to be erased. 2. BA = Block address of the block to be erased. 3. Either one of the Product ID Exit command can be used. Programmable Microelectronics Corp. 10 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 DEVICE OPERATIONS FLOWCHARTS AUTOMATIC PROGRAMMING Start Load Data AAh to Address 555H Load Data 55h to Address 2AAh Load Data A0h to Address 555h Address Increment Load Program Data to Program Address I/O7 = Data? or I/O6 Stop Toggle? No Yes Last Address? No Yes Programming Completed Chart 1. Automatic Programming Flowchart Programmable Microelectronics Corp. 11 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 DEVICE OPERATIONS FLOWCHARTS (CONTINUED) AUTOMATIC ERASE Start Write Sector, Block, or Chip Erase Command No Data = FFh? or I/O6 Stop Toggle? Yes Erasure Completed CHIP ERASE COMMAND SECTOR ERASE COMMAND BLOCK ERASE COMMAND Load Data AAh to Address 555h Load Data AAh to Address 555h Load Data AAh to Address 555h Load Data 55h to Address 2AAh Load Data 55h to Address 2AAh Load Data 55h to Address 2AAh Load Data 80h to Address 555h Load Data 80h to Address 555h Load Data 80h to Address 555h Load Data AAh to Address 555h Load Data AAh to Address 555h Load Data AAh to Address 555h Load Data 55h to Address 2AAh Load Data 55h to Address 2AAh Load Data 55h to Address 2AAh Load Data 10h to Address 555h Load Data 30h to SA Load Data 50h to BA Chart 2. Automatic Erase Flowchart Programmable Microelectronics Corp. 12 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 DEVICE OPERATIONS FLOWCHARTS (CONTINUED) SOFTWARE PRODUCT IDENTIFICATION ENTRY SOFTWARE PRODUCT IDENTIFICATION EXIT Load Data AAh to Address 555h Load Data AAh to Address 555h Load Data 55h to Address 2AAh Load Data 55h to Address 2AAh Load Data 90h to Address 555h Load Data F0h to Address 555h Enter Product Identification M o d e (1,2) Exit Product Identification M o d e (3) Load Data F0h to Address XXXh or Exit Product Identification M o d e (3) Notes: 1. The device will enter Product Identification mode after excuting the Product ID Entry command. 2. Under Product Identification mode, the Manufacturer ID and Device ID of devices can be read at address X0000h and X0001h where X = Don’t Care. 3. The device returns to standby operation. Chart 3. Software Product Identification Entry/Exit Flowchart Programmable Microelectronics Corp. 13 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 ABSOLUTE MAXIMUM RATINGS (1) Temperature Under Bias -65oC to +125oC Storage Temperature -65oC to +125oC Standard Package 240oC 3 Seconds Lead-free Package 260oC 3 Seconds Surface Mount Lead Soldering Temperature Input Voltage with Respect to Ground on All Pins except A9 pin(2) -0.5 V to +6.25 V Input Voltage with Respect to Ground on A9 pin(3) -0.5 V to +13.0 V All Output Voltage with Respect to Ground -0.5 V to V CC + 0.6 V V CC (2) -0.5 V to +6.25 V Notes: 1. Stresses under those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device or any other conditions under those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condition for extended periods may affected device reliability. 2. Maximum DC voltage on input or I/O pins are +6.25 V. During voltage transitioning period, input or I/O pins may overshoot to VCC + 2.0 V for a period of time up to 20 ns. Minimum DC voltage on input or I/O pins are 0.5 V. During voltage transitioning period, input or I/O pins may undershoot GND to -2.0 V for a period of time up to 20 ns. 3. Maximum DC voltage on A9 pin is +13.0 V. During voltage transitioning period, A9 pin may overshoot to +14. 0 V for a period of time up to 20 ns. Minimum DC voltage on A9 pin is -0.5 V. During voltage transitioning period, A9 pin may undershoot GND to -2.0 V for a period of time up to 20 ns. DC AND AC OPERATING RANGE Part Number Pm39F010/020/040 Operating Temperature 0oC to 85oC Vcc Power Supply 4.5 V - 5.5 V Programmable Microelectronics Corp. 14 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 DC CHARACTERISTICS Symbol Parameter Condition Min Typ Max Units ILI Input Load Current VIN= 0 V to V CC +1 µA ILO Output Leakage Current VI/O = 0 V to V CC +1 µA ISB1 VCC Standby Current CMOS CE#, OE# = V CC ?0.5 V 0.5 10 µA ISB2 VCC Standby Current TTL 0.2 3 mA ICC1 VCC Active Read Current 8 20 mA ICC2(1) VCC Program/Erase Current 9 20 mA VIL Input Low Voltage -0.5 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 5.8 mA; V CC = V CCmin 0.45 V VOH Output High Voltage IOH = -400 µA; V CC = V CC min CE# = V IH to V CC f = 5 MHz; IOUT= 0 mA 2.4 V Note: 1. Characterized but not 100% tested. AC CHARACTERISTICS READ OPERATIONS CHARACTERISTICS Symbol Parameter Pm39F010-55 Pm39F020-55 Pm39F040-55 Min Max Min Units Max tRC Read Cycle Time tACC Address to Output Delay 55 70 ns tCE CE# to Output Delay 55 70 ns tOE OE# to Output Delay 25 35 ns tDF CE# or OE# to Output High Z 0 25 ns tOH Output Hold from OE#, CE# or Address, whichever occured first 0 0 ns tVCS V CC Set-up Time 50 50 µs Programmable Microelectronics Corp. 55 Pm39F010-70 Pm39F020-70 Pm39F040-70 15 70 15 0 ns Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 AC CHARACTERISTICS (CONTINUED) READ OPERATIONS AC WAVEFORMS t RC ADDRESS VALID ADDRESS t ACC t CE CE# t OE OE# t DF WE# tO H HIGH Z OUTPUT OUTPUT VALID t VCS VCC OUTPUT TEST LOAD INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL 5.0 V 1.8 K 3.0 V OUTPUT PIN Input 1.5 V AC Measurement Level 0.0 V C L = 30 pF 1.3 K PIN CAPACITANCE ( f = 1 MHz, T = 25°C ) Typ Max Units Conditions CIN 4 6 pF VIN = 0 V C OUT 8 12 pF VOUT = 0 V Note: These parameters are characterized but not 100% tested. Programmable Microelectronics Corp. 16 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 AC CHARACTERISTICS (CONTINUED) WRITE (PROGRAM/ERASE) OPERATIONS CHARACTERISTICS Symbol Pm39F010-55 Pm39F020-55 Pm39F040-55 Parameter Min Max Pm39F010-70 Pm39F020-70 Pm39F040-70 Min Units Max tWC Write Cycle Time 55 70 ns tAS Address Set-up Time 0 0 ns tAH Address Hold Time 30 30 ns tCS CE# and WE# Set-up Time 0 0 ns tCH CE# and WE# Hold Time 0 0 ns tOEH OE# High Hold Time 10 10 ns tDS Data Set-up Time 30 30 ns tDH Data Hold Time 0 0 ns tWP Write Pulse Width 30 35 ns tWPH Write Pulse Width High 20 20 ns tBP Byte Programming Time 30 30 µs tEC Chip or Block Erase Time 100 100 ms tVCS VCC Set-up Time 50 µs 50 PROGRAM OPERATIONS AC WAVEFORMS - WE# CONTROLLED Program Cycle OE# tC H tV C S CE# tW P tC S tB P tW P H WE# tA S A0 - A M S tA H 555 tW C DATA IN 555 2AA tD S AA ADDRESS tD H A0 55 INPUT DATA VALID DATA V CC Programmable Microelectronics Corp. 17 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 AC CHARACTERISTICS (CONTINUED) PROGRAM OPERATIONS AC WAVEFORMS - CE# CONTROLLED Program Cycle OE# tC H tV C S WE# tW P tC S tB P tW P H CE# tA S A0 - A M S tA H 555 555 2AA tW C tD S DATA IN AA ADDRESS tD H INPUT DATA A0 55 VALID DATA V CC CHIP ERASE OPERATIONS AC WAVEFORMS OE# tV C S CE# tW P tW P H WE# tA S AO - A M S DATA IN tA H 555 tW C tD H 2AA 555 555 2AA 555 tE C tD S AA 55 80 AA 55 10 V CC Programmable Microelectronics Corp. 18 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 AC CHARACTERISTICS (CONTINUED) SECTOR OR BLOCK ERASE OPERATIONS AC WAVEFORMS OE# tV C S CE# tW P tW P H WE# tA S 555 tW C AO - A M S tD H tA H 2AA 555 Sector or Block Address 2AA tE C tD S AA DATA IN 555 55 80 AA 55 30 or 50 V CC TOGGLE BIT AC WAVEFORMS WE# CE# tO E H OE# tD F tO E I/O6 DATA TOGGLE tO H STOP TOGGLING TOGGLE VALID DATA Note: Toggling CE#, OE#, or both OE# and CE# will operate Toggle Bit. Programmable Microelectronics Corp. 19 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 AC CHARACTERISTICS (CONTINUED) DATA# POLLING AC WAVEFORMS WE# t CH t CE CE# t OEH OE# t DF t OE tO H I/O7# I/O7 VALID DATA Note: Toggling CE#, OE#, or both OE# and CE# will operate Data# Polling. PROGRAM/ERASE PERFORMANCE Parameter Unit Typ Max Remarks Sector Erase Time ms 55 100 From writing erase command to erase completion Block Erase Time ms 55 100 From writing erase command to erase completion Chip Erase Time ms 55 100 From writing erase command to erase completion Byte Programming Time µs 16 30 Excludes the time of four-cycle program command execution Note: These parameters are characterized but not 100% tested. RELIABILITY CHARACTERISTICS (1) Parameter Endurance Data Retention ESD - Human Body Model ESD - Machine Model Latch-Up Min 100,000 Typ (2) Unit Test Method Cycles JEDEC Standard A117 20 Years JEDEC Standard A103 2,000 Volts JEDEC Standard A114 200 Volts JEDEC Standard A115 100 + ICC1 mA JEDEC Standard 78 Note: 1. These parameters are characterized but not 100% tested. 2. Preliminary specification only and will be formalized after cycling qualification test. Programmable Microelectronics Corp. 20 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 PACKAGE TYPE INFORMATION 32J 32-Pin Plastic Leaded Chip Carrier Dimensions in Inches (Millimeters) 12.57 12.32 11.51 11.35 0.74X30° 15.11 14.86 3.56 3.18 Pin 1 I.D. 2.41 1.93 14.05 13.89 SEATING PLANE 13.46 12.45 0.53 0.33 1.27 Typ. 0.81 0.66 32P 32-Pin Plastic DIP Dimensions in Inches (Millimeters) 1.655 1.645 .625 .600 32 17 .012 .008 .550 .530 .665 .625 Pin 1 I.D. 16 .065 .040 0° 10° .005 MIN .200 .170 SEATING PLANE .150 .120 .110 .090 Programmable Microelectronics Corp. .022 .016 .050 .015 21 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 PACKAGE TYPE INFORMATION (CONTINUED) 32V 32-Pin Thin Small Outline Package (TSOP 8mm x 14mm)(Millimeters) 1.05 0.95 Pin 1 I.D. 0.27 0.17 8.10 7.90 0.50 BSC 0.15 0.05 12.50 12.30 14.20 13.80 1.20 MAX 0.25 Programmable Microelectronics Corp. 0.20 0.10 0° 5° 0.70 0.50 22 Issue Date: March, 2004, Rev: 1.3 PMC Pm39F010 / Pm39F020 / Pm39F040 REVISION HISTORY D ate R evision N o. D escription of C hanges P ag e N o . March, 2003 1.0 Preli mi nary Informati on August, 2003 1.1 Removed 90 ns read speed grade and formal release; fi xed typo on p.6 All Added Lead-free package opti ons D ecember, 2003 1.2 1, 4, 13 Upgraded guranteed program/erase cycles from 50,000 to 100,000 (preli mi nary) Revi sed output test load to 30 pF for all speed Revi sed typo on package di mensi on i nformati on March, 2004 1.3 Programmable Microelectronics Corp. Extend the operati on range of temperature 23 1,4,14,15,16 1, 19 15 20, 21 All Issue Date: March, 2004, Rev: 1.3