PZUxDB2 series Dual Zener diodes Rev. 01 — 31 March 2008 Product data sheet 1. Product profile 1.1 General description Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages. 1.2 Features n Non-repetitive peak reverse power dissipation: PZSM = 40 W n Total power dissipation: Ptot ≤ 250 mW n Tolerance series: B2: approximately ±2 % n Wide working voltage range: nominal 2.7 V to 24 V n Dual isolated diodes configuration n Small standard plastic package suitable for surface-mounted design n Small dark-green, halogen-free plastic package suitable for surface-mounted design n AEC-Q101 qualified 1.3 Applications n General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions VF forward voltage IF = 100 mA PZSM non-repetitive peak reverse power dissipation Min Typ Max Unit Per diode [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge [1] - - 1.1 V [2] - - 40 W PZUxDB2 series NXP Semiconductors Dual Zener diodes 2. Pinning information Table 2. Pinning Pin Description 1 anode (diode 1) 2 not connected 3 anode (diode 2) 4 cathode (diode 2) 5 cathode (diode 1) Simplified outline 5 1 Graphic symbol 4 2 5 4 3 1 2 3 006aab219 3. Ordering information Table 3. Ordering information Type number PZU2.7DB2 to PZU24DB2[1] Package Name Description Version SC-88A plastic surface-mounted package; 5 leads SOT353 PZU2.7DB2/DG to PZU24DB2/DG[1][2] [1] The series consists of 25 types with nominal working voltages from 2.7 V to 24 V. [2] /DG: halogen-free plastic package 4. Marking Table 4. Marking codes Type number Marking code[1] Type number[2] Marking code[1] PZU2.7DB2 T1* PZU2.7DB2/DG U1* PZU3.0DB2 T2* PZU3.0DB2/DG U2* PZU3.3DB2 T3* PZU3.3DB2/DG U3* PZU3.6DB2 T4* PZU3.6DB2/DG U4* PZU3.9DB2 T5* PZU3.9DB2/DG U5* PZU4.3DB2 T6* PZU4.3DB2/DG U6* PZU4.7DB2 T7* PZU4.7DB2/DG U7* PZU5.1DB2 T8* PZU5.1DB2/DG U8* PZU5.6DB2 T9* PZU5.6DB2/DG U9* PZU6.2DB2 TA* PZU6.2DB2/DG UA* PZU6.8DB2 TB* PZU6.8DB2/DG UB* PZU7.5DB2 TC* PZU7.5DB2/DG UC* PZU8.2DB2 TD* PZU8.2DB2/DG UD* PZU9.1DB2 TE* PZU9.1DB2/DG UE* PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 2 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes Table 4. Marking codes …continued Type number Marking code[1] Type number[2] Marking code[1] PZU10DB2 TF* PZU10DB2/DG UF* PZU11DB2 TG* PZU11DB2/DG UG* PZU12DB2 TH* PZU12DB2/DG UH* PZU13DB2 TK* PZU13DB2/DG UK* PZU14DB2 TL* PZU14DB2/DG UL* PZU15DB2 TM* PZU15DB2/DG UM* PZU16DB2 TN* PZU16DB2/DG UN* PZU18DB2 TP* PZU18DB2/DG UP* PZU20DB2 TR* PZU20DB2/DG UR* PZU22DB2 TS* PZU22DB2/DG US* PZU24DB2 TT* PZU24DB2/DG UT* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China [2] /DG: halogen-free plastic package 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit mA Per diode IF forward current - 200 IZSM non-repetitive peak reverse current [1] - see Table 8 PZSM non-repetitive peak reverse power dissipation [1] - 40 W [2] - 250 mW [3] - 275 mW Per device total power dissipation Ptot Tamb ≤ 25 °C Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] tp = 100 µs; square wave; Tj = 25 °C prior to surge [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 3 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit [1] - - 500 K/W [2] - - 455 K/W [3] - - 200 K/W Per device Rth(j-a) thermal resistance from junction to solder point Rth(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering points at pin 4 and pin 5. 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 10 mA - - 0.9 V IF = 100 mA - - 1.1 V Per diode [1] [1] forward voltage VF Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG Tj = 25 °C unless otherwise specified. PZUxDB2 Working PZUxDB2/DG voltage Differential resistance Reverse current r (Ω) dif VZ (V) IR (µA) Temperature coefficient SZ (mV/K) Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] IZ = 5 mA IZ = 0.5 mA IZ = 5 mA IZ = 5 mA Min Max Max Max Max VR (V) Typ Max Max 2.7 2.65 2.9 1000 100 20 1 −2.0 440 8 3.0 2.95 3.2 1000 95 10 1 −2.1 425 8 3.3 3.25 3.5 1000 95 5 1 −2.4 410 8 3.6 3.55 3.8 1000 90 5 1 −2.4 390 8 3.9 3.87 4.1 1000 90 3 1 −2.5 370 8 4.3 4.15 4.34 1000 90 3 1 −2.5 350 8 4.7 4.55 4.75 800 80 2 1 −1.4 325 8 5.1 4.98 5.2 250 60 2 1.5 0.3 300 5.5 5.6 5.49 5.73 100 40 1 2.5 1.9 275 5.5 6.2 6.06 6.33 80 30 0.5 3 2.7 250 5.5 6.8 6.65 6.93 60 20 0.5 3.5 3.4 215 5.5 7.5 7.28 7.6 60 10 0.5 4 4.0 170 3.5 PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 4 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG …continued Tj = 25 °C unless otherwise specified. PZUxDB2 Working PZUxDB2/DG voltage Differential resistance Reverse current r (Ω) dif VZ (V) IR (µA) Temperature coefficient SZ (mV/K) Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] IZ = 5 mA IZ = 0.5 mA IZ = 5 mA Min Max Max Max Max VR (V) Typ Max Max 8.2 8.02 8.36 60 10 0.5 5 4.6 150 3.5 9.1 8.85 9.23 60 10 0.5 6 5.5 120 3.5 10 9.77 10.21 60 10 0.1 7 6.4 110 3.5 11 10.76 11.22 60 10 0.1 8 7.4 108 3 12 11.74 12.24 80 10 0.1 9 8.4 105 3 13 12.91 13.49 80 10 0.1 10 9.4 103 2.5 14 13.7 14.3 80 10 0.1 11 10.4 101 2 15 14.34 14.98 80 15 0.05 11 11.4 99 2 16 15.85 16.51 80 20 0.05 12 12.4 97 1.5 18 17.56 18.35 80 20 0.05 13 14.4 93 1.5 20 19.52 20.39 100 20 0.05 15 16.4 88 1.5 22 21.54 22.47 100 25 0.05 17 18.4 84 1.3 24 23.72 24.78 120 30 0.05 19 20.4 80 1.3 [1] f = 1 MHz; VR = 0 V [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge IZ = 5 mA PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 5 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 006aab215 103 PZSM (W) mbg781 300 IF (mA) 102 200 10 100 1 10−4 10−3 0 0.6 10−2 0.8 1 tp (s) VF (V) Tj = 25 °C (prior to surge) Fig 1. Tj = 25 °C Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values Fig 2. 006aab216 0 Forward current as a function of forward voltage; typical values mgl274 10 12 SZ (mV/K) 4.3 −1 SZ (mV/K) 11 5 10 9.1 8.2 7.5 6.8 3.9 3.6 −2 6.2 5.6 5.1 0 3.3 4.7 3.0 2.7 −3 Fig 3. −5 0 20 40 IZ (mA) 60 0 4 8 12 Tj = 25 °C to 150 °C Tj = 25 °C to 150 °C PZU2.7DB2 to PZU4.3DB2 PZU4.7DB2 to PZU12DB2 PZU2.7DB2/DG to PZU4.3DB2/DG PZU4.7DB2/DG to PZU12DB2/DG Temperature coefficient as a function of working current; typical values Fig 4. IZ (mA) 20 Temperature coefficient as a function of working current; typical values PZUXDB2_SER_1 Product data sheet 16 © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 6 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 006aab217 102 IZ (mA) 3.0 3.3 3.6 3.9 4.3 4.7 1 VZ(nom) (V) = 6.8 IZ (mA) VZ(nom) (V) = 2.7 10 006aab218 102 7.5 8.2 9.1 10 11 12 13 14 15 10 5.1 6.2 5.6 1 10−1 10−1 10−2 10−2 10−3 16 20 18 10−3 0 1 2 3 4 5 6 7 0 5 10 15 VZ (V) Fig 5. 24 22 20 25 VZ (V) Tj = 25 °C Tj = 25 °C PZU2.7DB2 to PZU6.2DB2 PZU6.8DB2 to PZU24DB2 PZU2.7DB2/DG to PZU6.2DB2/DG PZU6.8DB2/DG to PZU24DB2/DG Working current as a function of working voltage; typical values Fig 6. Working current as a function of working voltage; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 7 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 9. Package outline 2.2 1.8 1.1 0.8 5 0.45 0.15 4 2.2 1.35 2.0 1.15 1 2 3 0.3 0.2 0.65 0.25 0.10 1.3 Dimensions in mm Fig 7. 04-11-16 Package outline SOT353 (SC-88A) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PZU2.7DB2 to PZU24DB2 Package SOT353 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -115 -135 PZU2.7DB2/DG to PZU24DB2/DG [1] For further information and the availability of packing methods, see Section 13. PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 8 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 11. Soldering 2.65 0.60 (1×) 0.40 0.90 2.10 2.35 0.50 (4×) solder lands 0.50 (4×) solder paste 1.20 solder resist 2.40 occupied area Dimensions in mm Fig 8. sot353_fr Reflow soldering footprint SOT353 (SC-88A) 2.25 2.65 0.30 1.00 4.00 4.50 2.70 0.70 solder lands 1.15 3.75 solder resist transport direction during soldering occupied area Dimensions in mm Fig 9. Wave soldering footprint SOT353 (SC-88A) PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 9 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PZUXDB2_SER_1 20080331 Product data sheet - - PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 10 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PZUXDB2_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 March 2008 11 of 12 PZUxDB2 series NXP Semiconductors Dual Zener diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 31 March 2008 Document identifier: PZUXDB2_SER_1