CHIP ATTENUATORS KAMAYA OHM RAC10 1A, RAC16 1A, 2A •Features 1. The RAC10 1A and RAC16 1A, 2A Series are small size chip attenuators, suitable for high density surface packaging. 2.Suitable for use as DC and up to UHF band frequencies. 3.Similar foot print for chip resistor networks. 4.Standard impedance of 50 ohm and 75 ohm are available up to 600 ohm available on request. 5.Replaces conventional attenuation circuits with one chip in place of three discrete resistors. 1 Q 2 W W a 2 b Q b 1 a •Dimensions and Circuit RAC16 : Impedance on Termination 1 Attenuation factor on Termination 3 Dot mark on Termination 4 RAC10 : Dot mark on Termination 1 Attenuation factor on Termination 2 to 3 Circuit 4 3 1 2 4 3 H 3 H 4 P L P RAC16 1A, 2A RAC10 1A L Unbalanced Type Unit : mm Style Terminal Style RAC10 1A C A RAC16 1A.2A L 1.0±0.05 1.6±0.1 W 1.0±0.05 1.6±0.1 H 0.35±0.10 0.55 +0.05 −0.10 Q 0.33±0.10 0.5 ±0.1 a 0.15±0.10 0.25±0.10 b 0.25 +0.05 −0.10 0.25 +0.15 −0.10 *P 0.65 0.8 *Unit weight/pc. 1.1mg 3.5mg *Values for reference Classification •Product Example RAC 10 Product Type Size A 1 Characteristic Impedance Circuits Style Product Type Size Code Width 10 1.0mm 16 1.6mm Characteristic Impedance Code Characteristic Impedance 1 50 ohm 2 75 ohm Circuits Code Circuits A Unbalanced πType 30 1 Attenuation Factor Attenuation Factor Code Attenuation Factor X 0.5dB 1 1dB 2 2dB 3 3dB 4 4dB 5 5dB 6 6dB 7 7dB 8 8dB 9 9dB A 10dB B 11dB C 12dB Code D 13dB A E 14dB F 15dB C G 16dB L 20dB C TH Terminal Style Packaging * Packaging Code Packaging B Bulk(Loose Packaging) TP Paper Tape. TH Paper Tape.(2mm pitch) *Refer to Taping and Packaging information in page 34.35 Terminal Style Termination Style Application Without corner RAC16 Type With corner RAC10 Application RAC10.16 RAC16 RAC10 KAMAYA OHM CHIP ATTENUATORS RAC10 1A, RAC16 1A, 2A •Ratings Style Characteristic Impedance RAC10 1A RAC16 1A RAC16 2A Attenuation dB Attenuation Factor Tolerance dB Attenuation Range VSWR Voltage standing wave Ratio 0.5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 20 1 2 3 6 10 1 2 3 6 10 ±0.1 DC≤f≤3GHz 1.1max. DC ≤ f ≤ 1.5GHz 1.5GHz < f ≤ 3GHz 1.2max. 1.3max. 50 ohm 50 ohm 75 ohm Rated Input Power mW/element Category Temperature Range °C 100 −40∼+125 ±0.3 ±0.4 ±0.75 ±0.8 ±2.5 ±0.3 ±0.3 ±0.5 ±0.75 ±0.75 ±0.3 ±0.3 ±0.5 DC ≤ f ≤ 3GHz 1.3max. DC ≤ f ≤ 3GHz 1.2max. ±0.75 *The following information is available. 1. 0dB attenuation. 2. Test methods for Attenuation Factor and VSWR characteristics. •Performance Characteristics Description Characteristic impedance 0.5−2dB JIS C 5201-1 : 1998 Requirements 3dB−5dB 6dB−20dB Test Methods Measuring Circuit 50 ohm, 75 ohm 1 2 R1 R2 4 R2 RL 3 Insulation resistance At least 100M ohm 50Vd.c., 60s Solderability In accordance with Clause 4.17.4.5 Clause 4.17 Dip into 235°C solder bath for 2s. Resistance to soldering heat Rapid change of temperature Within±0.1dB Within±0.2dB Within±0.3dB RL=50 ohm 75 ohm Clause 4.18 Dip into 260°C solder bath for 5s. No major visible damage. Within±0.1dB Within±0.2dB Within±0.3dB Clause 4.19 5 cycles between −55°C and +125°C No major visible damage. Endurance at 85˚C Within±0.1dB Within±0.2dB Within±0.3dB Clause 4.25.1 Rated voltage, 1.5h"ON", 0.5h"OFF" 85°C, 1000h. Bend strength of the face plating Within±0.1dB Within±0.2dB Within±0.3dB Clause 4.33 Amount of bend 3mm, 10s 31