SLOS073D − MARCH 1976 − REVISED SEPTEMBER 2004 D Continuous Short-Circuit Protection D Wide Common-Mode and Differential D D D D D D D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) Voltage Ranges No Frequency Compensation Required Low Power Consumption No Latch-Up Unity-Gain Bandwidth . . . 3 MHz Typ Gain and Phase Match Between Amplifiers Low Noise . . . 8 nV/√Hz Typ at 1 kHz 1OUT 1IN− 1IN+ VCC− 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN− 2IN+ description/ordering information The RC4558 device is a dual general-purpose operational amplifier, with each half electrically similar to the µA741, except that offset null capability is not provided. The high common-mode input voltage range and the absence of latch-up make this amplifier ideal for voltage-follower applications. The device is short-circuit protected, and the internal frequency compensation ensures stability without external components. ORDERING INFORMATION 0°C 0 C to 70 70°C C TOP-SIDE MARKING MSOP/VSSOP (DGK) Reel of 2500 RC4558DGKR YR_‡ PDIP (P) Tube of 50 RC4558P RC4558P Tube of 75 RC4558D Reel of 2500 RC4558DR Reel of 2000 RC4558PSR Tube of 150 RC4558PW Reel of 2000 RC4558PWR MSOP/VSSOP (DGK) Reel of 2500 RC4558IDGKR YS_‡ PDIP (P) Tube of 50 RC4558IP RC4558IP Tube of 75 RC4558ID Reel of 2500 RC4558IDR Tube of 150 RC4558IPW Reel of 2000 RC4558IPWR SOIC (D) SOP (PS) TSSOP (PW) −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SOIC (D) TSSOP (PW) RC4558 R4558 R4558 R4558I R4558I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ The actual top-side marking has one additional character that designates the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! "#$ %!& % "! "! '! ! !( ! %% )*& % "!+ %! !!$* $%! !+ $$ "!!& POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLOS073D − MARCH 1976 − REVISED SEPTEMBER 2004 schematic (each amplifier) VCC+ IN− IN+ OUT VCC− absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage (see Note 1): VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Input voltage, VI (any input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V Duration of output short circuit to ground, one amplifier at a time (see Note 4) . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC−. 2. Differential voltages are at IN+ with respect to IN−. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS073D − MARCH 1976 − REVISED SEPTEMBER 2004 recommended operating conditions MIN VCC+ VCC− Supply voltage TA Operating free-air temperature MAX 5 15 −5 −15 RC4558 0 70 RC4558I −40 85 UNIT V °C electrical characteristics at specified free-air temperature, VCC+ = 15 V, VCC− = −15 V TEST CONDITIONS† PARAMETER MIN 25°C VIO Input offset voltage VO = 0 IIO Input offset current VO = 0 IIB Input bias current VO = 0 VICR Common-mode input voltage range 6 7.5 5 Full range 150 Full range RL = 10 kΩ RL = 2 kΩ RL ≥ 2 kΩ, VO = ±10 V ±12 ±14 25°C ±12 ±14 25°C ±10 ±13 Full range ±10 25°C 20 Full range 15 mV nA 500 800 25°C UNIT 200 300 25°C Maximum output voltage swing MAX 0.5 Full range 25°C VOM TYP nA V V 300 AVD Large-signal differential voltage amplification B1 ri Unity-gain bandwith 25°C 3 MHz Input resistance 25°C 0.3 5 MΩ CMRR Common-mode rejection ratio 25°C 70 90 dB kSVS Supply-voltage sensitivity (∆VIO/∆VCC) VCC = ±15 V to ±9 V Vn Equivalent input noise voltage (closed loop) AVD = 100, RS = 100 Ω, f = 1 kHz, BW = 1 Hz Supply current (both amplifiers) VO = 0, No load ICC VO = 0, No load Total power dissipation (both amplifiers) PD V/mV 25°C 30 150 25°C 8 25°C 2.5 5.6 µV/V nV/√Hz TA(min) TA(max) 3 6.6 2.3 5 25°C 75 170 TA(min) TA(max) 90 200 70 150 mA mW 85 RS = 1 kΩ, 25°C dB f = 10 kHz AVD = 100 105 † All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range is 0°C to 70°C for RC4558 and −40°C to 85°C for RC4558I. VO1/VO2 Open loop Crosstalk attenuation operating characteristics, VCC+ = 15 V, VCC− = −15 V, TA = 25°C PARAMETER tr Rise time Overshoot SR Slew rate at unity gain TEST CONDITIONS MIN VI = 20 mV, VI = 20 mV, RL = 2 kΩ, CL = 100 pF RL = 2 kΩ, CL = 100 pF VI = 10 V, RL = 2 kΩ, CL = 100 pF POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP 0.13 5 1.1 1.7 MAX UNIT ns % V/µs 3 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) RC4558D ACTIVE SOIC D 8 CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM RC4558DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR RC4558DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558ID ACTIVE SOIC D 8 CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM RC4558IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR RC4558IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC RC4558IPW ACTIVE TSSOP PW 8 150 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM RC4558IPWR ACTIVE TSSOP PW 8 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM RC4558P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC RC4558PSLE OBSOLETE RC4558PSR ACTIVE SO PS 8 None Call TI SO PS 8 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM RC4558PW ACTIVE TSSOP PW 8 150 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM RC4558PWLE OBSOLETE TSSOP PW 8 None Call TI RC4558PWR ACTIVE TSSOP PW 8 Pb-Free (RoHS) CU NIPDAU RC4558Y OBSOLETE XCEPT Y 0 None Call TI 75 75 2000 Pb-Free (RoHS) Pb-Free (RoHS) Call TI Call TI Level-1-250C-UNLIM Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2005 accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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