INTEGRATED CIRCUITS DATA SHEET SAA1300 Tuner switching circuit Product specification File under Integrated Circuits, IC12 June 1987 Philips Semiconductors Product specification Tuner switching circuit SAA1300 The SAA1300 is for switching on and off the supply lines of various circuit parts via an I2C bus signal. Furthermore, it can be used to supply current for switching diodes in radio and television tuners. It contains 5 output stages, which are capable of supplying up to 85 mA in the ON state or sinking up to −100 µA in the OFF state. Current limiting and short-circuit protection are included. The output stages are driven by a shift register/latch combination which is loaded via data from the I2C bus. A power-on reset of the latches ensures the OFF state of the output stages (OUT 2 to OUT 5) without data reception from the I2C bus. A subaddressing system allows the connection of up to three circuits on the same I2C bus lines; one of the outputs (OUT 1, pin 7) can also be used as an input to select the device via a simple internal A/D converter. Fig.1 Block diagram. PACKAGE OUTLINE 9-lead SIL; plastic (SOT142); SOT142-1; 1996 September 05. June 1987 2 Philips Semiconductors Product specification Tuner switching circuit SAA1300 PINNING PIN NO. SYMBOL FUNCTION 1 GND ground 2 VP positive supply 3 OUT 5 4 OUT 4 5 OUT 3 6 OUT 2 7 OUT 1 output and subaddressing input 8 SDA serial data line 9 SCL serial clock line outputs I2C bus I2C BUS INFORMATION Address, first byte 0 1 0 0 0 A B 0 where, A B 0 0 FUNCTION general address CONDITION OUT 1 = output 0 1 OUT 1 = input address accepted if VOUT 1 = VOUT L (LOW) 1 0 OUT 1 = input address accepted if VOUT 1 = VOUT H (HIGH) 1 1 OUT 1 = input address accepted if VOUT 1 = VOUT M (MEDIUM) Data, second byte OUT 5, OUT 4, OUT 3, OUT 2, OUT 1, X, X, X The I/O output stage (OUT 1) is switched as an input stage after a power-on reset. It depends on the contents of the first data transmission whether the output stage is switched as an output or remains as an input. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage VP max. 13,2 V Input voltage range at SDA, SCL VI −0,5 to + 6,0 V Input voltage range at OUT 1 VI −0,5 to + 12,5 V Output voltage range at OUT 1 to OUT 5 VO −0,5 to + 12,5 V Input current at SDA, SCL II max. 20 mA Input current at OUT 1 II max. 20 mA Total power dissipation Ptot max. 825 mW Storage temperature range Tstg −40 to + 125 °C Operating ambient temperature ranges Tamb −20 to + 80 °C June 1987 3 Philips Semiconductors Product specification Tuner switching circuit SAA1300 CHARACTERISTICS VP = 8 V; Tamb = 24 °C; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply (pin 2) VP 4 8 12 V 5 outputs LOW IPL 5 10 15 mA 5 outputs HIGH Supply voltage range Supply current IPH 30 50 70 mA Power on reset level output stage in “OFF” condition VPR − 3,5 3,8 V Maximum power dissipation(1) Pmax − 650 − mW Input voltage HIGH VIH 3,0 − 5,5 V Input voltage LOW VIL 0 − 1,5 V Input current HIGH −IIH − − 10 µA Input current LOW IIH − − 0,4 µA Acknowledge sink current IACK 2,5 − − mA Maximum input frequency fi max 100 − − kHz IOso +85 − +150 mA IOso 60 − − mA VOH Vp−2 − − V IOsi −100 −300 − µA VOL − − 100 mV VOM VP−0,5 − − V V Inputs SDA, SCL (pins 8 and 9) Outputs OUT 1 to OUT 5 (pins 3 to 7) Maximum output current; source: “ON” Maximum output current; source: “ON” Tamb = 80 °C Output voltage HIGH at IOso = 85 mA Output current; sink “OFF” Output voltage LOW at IOsi = −100 µA Output voltage MEDIUM at IO = 10 mA OUT 1 used as subaddressing input Input voltage HIGH (code 1 0) VOUT 1H 0,72 VP − VP Input voltage MEDIUM (code 1 1) VOUT 1M 0,39 VP − 0,61 VP V Input voltage LOW (code 0 1) VOUT 1L 0 − 0,28 VP V Note 1. Outputs must not be driven simultaneously at maximum source current. June 1987 4 Philips Semiconductors Product specification Tuner switching circuit SAA1300 PACKAGE OUTLINE SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1 D D1 A2 D2 A3 seating plane E A pin 1 index c L 1 9 b e Z b2 Q w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 b b1 b2 c D (1) D1 D2 E (1) e L Q w Z (1) max. mm 12 11 3.7 1.8 1.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 18.6 18.2 6.48 6.20 2.54 3.9 3.4 1.75 1.55 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-09 97-12-16 SOT142-1 June 1987 EUROPEAN PROJECTION 5 Philips Semiconductors Product specification Tuner switching circuit SAA1300 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. June 1987 6