INTEGRATED CIRCUITS DATA SHEET SAB6456 SAB6456T Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler Product specification File under Integrated Circuits, IC02 June 1986 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T GENERAL DESCRIPTION The SAB6456/SAB6456T is a prescaler for UHF/VHF tuners. It can be switched to divide-by-64 or divide-by-256 by the mode-control (MC) pin. The circuit has an input frequency range of 70 MHz to 1 GHz, has high input sensitivity and good harmonic suppression. Fig.1 Block diagram. QUICK REFERENCE DATA PARAMETER Supply voltage CONDITIONS pin 8 to pin 4 SYMBOL MIN. TYP. MAX. UNIT VCC 4,5 5,0 5,5 V Supply current pin 8 ICC − 21 − mA Input frequency range pins 2 and 3 fi 70 − 1000 MHz Vi(rms) − − 10 mV Vo(p-p) − 1 − V Tamb 0 − 80 °C Sensitivity to input voltage (r.m.s. value) Output voltage (peak-to-peak value) pins 6 and 7 Operating ambient temperature range PACKAGE OUTLINES SAB6456 : 8-lead DIL; plastic (SOT97); SOT97-1; 1996 November 18. SAB6456T: 8-lead mini-pack (SO8; SOT96A); SOT96-1; 1996 November 18. June 1986 2 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T PINNING 1. n.c. not connected 2. C1 3. C2 4. VEE ground (0 V) 5. MC mode control 6. QH 7. QL 8. VCC differential inputs complementary outputs positive supply voltage Fig.2 Pinning diagram. FUNCTIONAL DESCRIPTION The circuit comprises an input amplifier, a divider stage with selectable division ratio and an output stage. The input amplifier is driven by a sinusoidal signal from the local oscillator of a television tuner. The inputs (C1, C2) are differential and are biased internally to permit capacitive coupling. When driven asymmetrically the unused input should be connected to ground via a capacitor. The mode-control (MC) input to the divider stage is intended for static control of the division ratio, selection is made as follows: divide-by-64: MC pin open-circuit divide-by-256: MC pin connected to ground The divider stage may oscillate during no-signal conditions but this oscillation is suppressed when input signals are received. Two complementary signals (QH, QL) are provided by the output differential amplifier stage. The voltage-edges of the output signals are slowed internally to reduce harmonics in the television intermediate frequency band. June 1986 3 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T ELECTROSTATIC DISCHARGE PROTECTION Inputs and outputs have electrostatic discharge protection according to specification MIL-883C, class B. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC-134) PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT VCC − − 7,0 V Input voltage Vi − − VCC V Storage temperature range Tstg −55 − + 150 °C Junction temperature Tj − − + 150 °C Supply voltage pin 8 to pin 4 THERMAL RESISTANCE From junction to ambient 8-lead DIL; plastic (SOT-97A) Rth j-a 120 K/W on printed circuit board Rth j-a 260 K/W on ceramic substrate Rth j-a 170 K/W 8-lead mini-pack (SO-8; SOT-96A) D.C. CHARACTERISTICS VCC = 5 V; VEE = 0 V; Tamb = 25 °C; test IC mounted in a test socket or on a printed circuit board; measurements taken after thermal equilibrium is established PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Output voltage HIGH VOH − − VCC V Output voltage LOW VOL − − VCC − 0.8 V Supply current ICC − 21 28 mA (divide-by-256) VIL 0 − 0,2 V Input current LOW −IL − 25 60 µA VIH 1,4 − 3,0 V Mode-control (MC) Input voltage LOW Input voltage HIGH (divide-by-64) June 1986 pin 5 open-circuit 4 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T A.C. CHARACTERISTICS VCC = 4,5 to 5,5 V; VEE = 0 V; Tamb = 0 to +80 °C PARAMETER Sensitivity to input voltage (r.m.s. value) Input overload voltage (r.m.s. value) Input parallel resistance Input capacitance CONDITIONS SYMBOL MIN. TYP. MAX. UNIT 50 Ω system 70 MHz Vi(rms) − − 10 mV fi = 150 MHz Vi(rms) − − 10 mV fi = 300 MHz Vi(rms) − − 10 mV fi = 500 MHz Vi(rms) − − 10 mV fi = 900 MHz Vi(rms) − − 10 mV fi = 1000 MHz Vi(rms) − − 10 mV 1000 MHz Vi 300 − − mV fi = 50 Ω system fi = 70 MHz to 70 MHz Ri − 560 − Ω fi = 1000 MHz Ri − 30 − Ω fi = 70 MHz Ci − 5 − pF fi = 1000 MHz Ci − 1,5 − pF VOH − − VCC V − − VCC − 0,8 V Vo(p-p) 0,8 1,0 1,2 V Vo(p-p) 0,17 − − V −15 −23 − dB ∆Vo − − 0,1 V Ro − 500 − Ω fi = Output voltage HIGH Output voltage LOW VOL Output voltage swing (peak-to-peak value) fi = 70 MHz fi = 1000 MHz; RL = 820 Ω; CL = 60 pF Attenuation of third harmonic at output fi = 800 MHz; RL = 820 Ω; CL = 60 pF Output unbalance see Fig.3 Output resistance June 1986 5 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler Fig.4 Fig.3 Test circuit for output unbalance measurement. SAB6456 SAB6456T Typical input sensitivity curve: VCC = 5 V; Tamb = 25 °C. Fig.5 Smith chart of typical input impedance: Vi(rms) = 25 mV; VCC = 5 V; reference value = 50 Ω. June 1986 6 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN June 1986 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 7 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA June 1986 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 8 o 8 0o Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. June 1986 SAB6456 SAB6456T 9 Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1986 10