SGM321 SGM358 SGM324 PRODUCT DESCRIPTION The SGM321(single), SGM358(dual) and SGM324(quad) are rail-to-rail input and output voltage feedback amplifiers offering low cost. They have a wide input common-mode voltage range and output voltage swing, and take the minimum operating supply voltage down to 2.1V and the maximum recommended supply voltage is 5.5 V. All are specified over the extended – 40°C to +85°C temperature range. The SGM321/358/324 provide 1MHz bandwidth at a low current consumption of 60µA per amplifier. Very low input bias currents of 10pA, enable SGM321/358/ 324 to be used for integrators, photodiode amplifiers, and piezoelectric sensors. Rail-to-rail inputs and outputs are useful to designers buffering ASIC in single-supply systems. 1MHz, 60µA, Rail-to-Rail I/O CMOS Operational Amplifier FEATURES • Low Cost • Rail-to-Rail Input and Output 0.8mV Typical VOS • Unity Gain Stable • Gain Bandwidth Product: 1MHz • Very Low Input Bias Currents: 10pA • Operates on 2.1 V to 5.5 V Supplies • Input Voltage Range: - 0.1 V to +5.6 V with VS = 5.5 V • Low Supply Current: 60µA/Amplifier • Small Packaging SGM321 Available in SOT23-5 and SC70-5 SGM358 Available in SO-8, MSOP-8 and PDIP-8 SGM324 Available in SO-14, SO-16, TSSOP-14 and TSSOP-16 PIN CONFIGURATIONS (Top View) Applications for the series amplifiers include safety monitor- ing, portable equipment, battery and power supply control, and signal conditioning and interfacing for transducers in very low power systems. SGM358 SGM321 +IN The SGM321 is available in SOT23-5 and SC70-5 packages. The SGM358 comes in SO-8，MSOP-8 and PDIP-8 packages. The SGM324 is offered in SO-14, TSSOP-14, TSSOP-16 and SO-16 packages. 5 1 OUT A 1 8 +VS -INA 2 7 OUT B +INA 3 6 -INB -VS 4 5 +INB +VS -VS 2 -IN 3 4 OUT SOT23-5 / SC70-5 APPLICATIONS ASIC Input or Output Amplifier Sensor Interface Piezo Electric Transducer Amplifier Medical Instrumentation Mobile Communication Audio Output Portable Systems Smoke Detectors Notebook PC PCMCIA cards Battery –Powered equipment DSP interface Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com SO-8 / MSOP-8 / PDIP-8 SGM324 SGM324 OUT A 1 16 OUT D -IN A 2 15 -IND OUT A 1 14 OUT D +IN A 3 14 +IND -IN A 2 13 -IND +VS 4 13 -VS +IN A 3 12 +IND +INB 5 12 +INC +VS 4 11 -VS -INB 6 11 -INC +INB 5 10 +INC OUT B 7 10 OUT C -INB 6 NC 8 NC = NO CONNECT TSSOP-16 / SO-16 9 NC OUT B 7 9 -INC 8 OUT C TSSOP-14/SO-14 REV. D ELECTRICAL CHARACTERISTICS : VS = +5V (At RL = 100kΩ connected to Vs/2,and VOUT = Vs/2, unless otherwise noted) SGM321/358/324 PARAMETER CONDITION TYP MIN/MAX OVER TEMPERATURE +25℃ +25℃ -40℃ to 85℃ UNITS MIN / MAX ±0.8 ±5 ±5.6 INPUT CHARACTERISTICS Input Offset Voltage (VOS) Input Bias Current (IB) Input Offset Current (IOS) mV MAX 10 pA TYP 10 pA TYP - 0.1 to + 5.6 V TYP Common-Mode Voltage Range (VCM) VS = 5.5V Common-Mode Rejection Ratio(CMRR) VS = 5.5V, VCM = - 0.1V to 4 V 70 62 62 dB MIN VS = 5.5V, VCM = - 0.1V to 5.6 V 68 56 55 dB MIN Open-Loop Voltage Gain( AOL) RL = 5KΩ ,Vo = 0.1V to 4.9V 80 70 70 dB MIN RL =100KΩ ,Vo = 0.035V to 4.965V 84 80 80 dB MIN 2.7 µV/℃ TYP RL = 100KΩ 0.008 V TYP RL = 10KΩ 0.08 V TYP MIN Input Offset Voltage Drift (∆VOS/∆T) OUTPUT CHARACTERISTICS Output Voltage Swing from Rail Output Current (IOUT) POWER 23 20 18.8 mA 2.1 2.5 V MIN 5.5 5.5 V MAX SUPPLY Operating Voltage Range Power Supply Rejection Ratio (PSRR) Quiescent Current / Amplifier (IQ) DYNAMIC PERFORMANCE Vs = +2.5 V to + 5.5 V VCM = (-VS) + 0.5 82 60 58 dB MIN IOUT = 0 60 80 86 µA MAX 1 MHz TYP CL = 100pF Gain-Bandwidth Product (GBP) Slew Rate (SR) G = +1 , 2V Output Step 0.52 V/µs TYP Settling Time to 0.1%( tS) G = +1, 2 V Output Step 5.3 µs TYP Overload Recovery Time VIN ·Gain = Vs 2.6 µs TYP f = 1kHz 27 nV/ Hz TYP f = 10kHz 20 nV/ Hz TYP NOISE PERFORMANCE Voltage Noise Density (en) Specifications subject to change without notice. ２ SGM321/358/324 PACKAGE/ORDERING INFORMATION MODEL SGM321 SGM358 SGM324 ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM321YC5/TR SC70-5 Tape and Reel, 3000 321 SGM321YN5/TR SOT23-5 Tape and Reel, 3000 321 SGM358YS/TR SO-8 Tape and Reel, 2500 SGM358YS SGM358YMS/TR MSOP-8 Tape and Reel, 3000 SGM358YMS SGM358YP PDIP-8 Tube, 50 SGM358YP SGM324YS/TR SO-16 Tape and Reel, 2500 SGM324YS SGM324YTS/TR TSSOP-16 Tape and Reel, 3000 SGM324YTS SGM324YS14/TR SO-14 Tape and Reel, 2500 SGM324YS14 SGM324YTS14/TR TSSOP-14 Tape and Reel, 3000 SGM324YTS14 CAUTION ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . (–VS) – 0.5 V to (+VS )+0.5V Storage Temperature Range . . . . . . . . .–65℃ to +150℃ Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160℃ Operating Temperature Range . . . . . . . –45℃ to +85℃ This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Package Thermal Resistance @ TA = 25℃ SC70-5, θJA................................................................ 333℃/W SOT23-5, θJA.............................................................. 190℃/W SO-8, θJA......................................................................125℃/W MSOP-8, θJA.............................................................. 216℃/W SO-16, θJA..................................................................... 82℃/W TSSOP-16, θJA............................................................ 105℃/W Lead Temperature Range (Soldering 10 sec) .....................................................260℃ ESD Susceptibility HBM................................................................................4000V MM....................................................................................400V NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ３ SGM321/358/324 TYPICAL PERFORMANCE CHARACTERISTICS At TA = +25℃, VS = +5V, and RL = 100kΩ connected to Vs/2,unless otherwise noted. Small-Signal Step Response Large-Signal Step Response G = +1 CL = 100pF RL = 100KΩ 500mV/div 20mV/div G = +1 CL = 100pF RL = 100KΩ 2µs/div 10µs/div Small-Signal Overshoot vs.Load Capacitance Small-Signal Overshoot vs.Load Capacitance 60 G = -5 RFB = 100KΩ 50 Small-Signal Overshoot(%) 40 30 20 10 0 G = -1 RFB = 100KΩ 50 40 30 G = +1 RL = 100KΩ 20 10 0 10 100 1000 Load Capacitance(pF) 10000 10 6 100 1000 Load Capacitance(pF) 10000 Quiescent And Short-Circuit Current vs.Supply Voltage Maximum Output Voltage vs.Frequency 50 30 Quiescent Current(μA) VS = 5.5V 5 Output Voltage(Vp-p) G = -1 RFB = 5KΩ VS = 5V 4 Maximum Output Voltage Without Slew-Rate Induced Distortion 3 VS = 2.5V 2 1 0 1 10 100 1000 Frequency(kHz) 10000 45 25 35 15 ISC 30 10 25 5 2 ４ 20 IQ 40 2.5 3 3.5 4 4.5 Supply Voltage(V) 5 Short-Circuit Current(mA) Small-Signal Overshoot(%) 60 5.5 SGM321/358/324 TYPICAL PERFORMANCE CHARACTERISTICS At TA = +25℃, VS = +5V, and RL = 100kΩ connected to Vs/2,unless otherwise noted. Input Voltage Noise Spectral Density vs.Frequency CMRR And PSRR vs.Frequency 100 1000 Voltage Noise(nV/√Hz) 90 CMRR,PSRR(dB) 80 70 60 CMRR 50 40 PSRR 30 20 100 10 0 0.01 0.1 1 10 100 Frequency(kHz) 1000 10 0.01 10000 Output Voltage Swing vs.Output Current 10 100 Output Voltage Swing vs.Output Current 135℃ Sourcing Current 135℃ Output Voltage(V) 25℃ -50℃ 2 VS = 5V 25℃ 4 VS = 3V 1 -50℃ 25℃ 135℃ Sinking Current -50℃ Sourcing Current 3 2 Sinking Current -50℃ 1 25℃ 135℃ 0 0 0 4 8 12 16 20 0 5 10 Output Current(mA) 55 110 Open–Loop Gain(dB) 120 VS = 5V 45 VS = 3V VS = 2.5V 40 20 25 30 Open-Loop Gain vs.Temperature 60 50 15 Output Current(mA) Supply Current vs.Temperature Supply Current(μA) 1 Frequency(kHz) 5 3 Output Voltage(V) 0.1 35 30 RL = 5kΩ RL = 100kΩ 100 90 80 70 60 -50 -30 -10 10 30 50 70 Temperature(℃) 90 110 130 -50 -30 -10 ５ 10 30 50 70 Temperature(℃) 90 110 130 SGM321/358/324 TYPICAL PERFORMANCE CHARACTERISTICS At TA = +25℃, VS = +5V, and RL = 100kΩ connected to Vs/2,unless otherwise noted. Common-Mode Rejection Ratio vs.Temperature Power-Supply Rejection Ratio vs.Temperature 120 120 -Vs < VCM < (+Vs)-1.5V 110 110 100 90 PSRR(dB) CMRR(dB) 100 -Vs < VCM <(+Vs) 80 90 80 70 70 60 60 -50 -30 -10 10 30 50 70 Temperature(℃) -50 -30 -10 10 30 50 70 Temperature(℃) 90 110 130 90 110 130 Overload Recovery Time 2.5V Vs = 5V G = -5 VIN = 500mV 0V 500mV 0V Time(2µs/div) ６ SGM321/358/324 Power-Supply Bypassing and Layout APPLICATION NOTES The SGM3XX family operates from either a single +2.5V to +5.5V supply or dual ±1.25V to ±2.75V supplies. For single-supply operation, bypass the power supply VDD with a 0.1µF ceramic capacitor which should be placed close to the VDD pin. For dual-supply operation, both the VDD and the VSS supplies should be bypassed to ground with separate 0.1µF ceramic capacitors. 2.2µF tantalum capacitor can be added for better performance. Driving Capacitive Loads The SGM3XX can directly drive 250pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive drive capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure 1. The isolation resistor RISO and the load capacitor CL form a zero to increase stability. The bigger the RISO resistor value, the more stable VOUT will be. Note that this method results in a loss of gain accuracy because RISO forms a voltage divider with the RLOAD. VDD VDD 10µF 10µF 0.1µF 0.1µF RISO Vn VOUT SGM321 VIN Vn CL SGM321 VOUT Vp 10µF Vp Figure 1. Indirectly Driving Heavy Capacitive Load An improvement circuit is shown in Figure 2, It provides DC accuracy as well as AC stability. RF provides the DC accuracy by connecting the inverting signal with the output, CF and RIso serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier’s inverting input, thereby preserving phase margin in the overall feedback loop. VOUT SGM321 0.1µF VSS(GND) VSS Figure 3. Amplifier with Bypass Capacitors CF RF RISO SGM321 VIN VOUT CL RL Figure 2. Indirectly Driving Heavy Capacitive Load with DC Accuracy For no-buffer configuration, there are two others ways to increase the phase margin: (a) by increasing the amplifier’s gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node. ７ SGM321/358/324 Typical Application Circuits C Differential Amplifier R2 R1 The circuit shown in Figure 4 performs the difference function. If the resistors ratios are equal ( R4 / R3 = R2 / R1 ), then VOUT = ( Vp – Vn ) × R2 / R1 + Vref. VIN SGM321 R2 Vn VOUT R1 R3 = R1 // R2 VOUT SGM321 Vp R3 Figure 6. Low Pass Active Filter R4 Vref Figure 4. Differential Amplifier Instrumentation Amplifier The circuit in Figure 5 performs the same function as that in Figure 4 but with the high input impedance. R2 R1 SGM321 Vn VOUT SGM321 Vp SGM321 R3 R4 Vref Figure 5. Instrumentation Amplifier Low Pass Active Filter The low pass filter shown in Figure 6 has a DC gain of ( - R2 / R1 ) and the –3dB corner frequency is 1/2πR2C. Make sure the filter is within the bandwidth of the amplifier. The Large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistors value as low as possible and consistent with output loading consideration. ８ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS SC70-5 D θ e1 Symbol L1 E E1 L e b A1 C 0.20 Dimensions In Millimeters Min Max Min Max A 0.900 1.100 0.035 0.043 A1 0.000 0.100 0.000 0.004 A2 0.900 1.000 0.035 0.039 b 0.150 0.350 0.006 0.014 c 0.080 0.150 0.003 0.006 D 2.000 2.200 0.079 0.087 E 1.150 1.350 0.045 0.053 E1 2.150 2.450 0.085 0.096 e A A2 e1 0.650TYP 1.200 L ９ Dimensions In Inches 1.400 0.026TYP 0.047 0.525REF 0.055 0.021REF L1 0.260 0.460 0.010 0.018 θ 0° 8° 0° 8° SGM321/358/324 PACKAGE OUTLINE DIMENSIONS SOT23-5 D θ b 0.20 Symbol L E E1 e C A1 e1 Min Max Min Max 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e1 L A A2 Dimensions In Inches 1.050 e １０ Dimensions In Millimeters A L 0 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM321/358/324 PACKAGE OUTLINE DIMENSIONS SO-8 D C E E1 L Symbol θ e Min Max Min Max 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 B 0.330 0.510 0.013 0.020 C 0.190 0.250 0.007 0.010 D 4.780 5.000 0.188 0.197 E 3.800 4.000 0.150 0.157 E1 5.800 6.300 0.228 0.248 A1 1.270TYP 0.050TYP L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° A A2 Dimensions In Inches A e B Dimensions In Millimeters １１ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS MSOP-8 C E θ e A2 A A1 E1 L b Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max A A1 A2 b c D e E E1 L θ 0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.15 TYP 2.900 3.100 0.65 TYP 2.900 3.100 4.700 5.100 0.410 0.650 0° 6° 0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.026 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0° 6° D １２ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS PDIP-8 E1 Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max A A1 A2 B B1 C D E E1 e L E2 3.710 4.310 0.510 3.200 3.600 0.380 0.570 1.524(BSC) 0.204 0.360 9.000 9.400 6.200 6.600 7.320 7.920 2.540(BSC) 3.000 3.600 8.400 9.000 0.146 0.170 0.020 0.126 0.142 0.015 0.022 0.060(BSC) 0.008 0.014 0.354 0.370 0.244 0.260 0.288 0.312 0.100(BSC) 0.118 0.142 0.331 0.354 L A1 C A A2 e E2 B B1 E D １３ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS SO-14 D L2 L θ1 E E1 θ2 INDEX Φ0.8±0.1 DEP0.2±0.1 h Φ2.0±0.1 BTM E-MARK DEP0.1±0.05 θ h e b 0.25 B B M A3 A1 A2 0.10 θ4 b c BASE METAL b1 WITH PLATING c1 A θ3 L1 R R1 Symbol A A1 A2 A3 b b1 c c1 D E E1 e L L1 L2 R R1 h θ θ1 θ2 θ3 θ4 Dimensions In Millimeters MIN NOM MAX 1.35 0.10 1.25 0.55 0.36 0.35 0.16 0.15 8.53 5.80 3.80 0.45 0.07 0.07 0.30 0° 6° 6° 5° 5° 1.60 0.15 1.45 0.65 0.40 1.75 0.25 1.65 0.75 0.49 0.45 0.25 0.25 8.73 6.20 4.00 0.20 8.63 6.00 3.90 1.27 BSC 0.60 0.80 1.04 REF 0.25 BSC 0.40 8° 8° 7° 7° 0.50 8° 10° 10° 9° 9° SECTION B-B １４ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS SO-16 D L C E A A1 A2 b c D E E1 e L θ θ A1 A e A2 E1 Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max 1.350 1.750 0.100 0.250 1.350 1.550 0.330 0.510 0.170 0.250 9.800 10.20 3.800 4.000 5.800 6.200 1.270 (BSC) 0.400 1.270 0° 8° 0.053 0.069 0.004 0.010 0.053 0.061 0.013 0.020 0.007 0.010 0.386 0.402 0.150 0.157 0.228 0.244 0.050 (BSC) 0.016 0.050 0° 8° b １５ SGM321/358/324 PACKAGE OUTLINE DIMENSIONS TSSOP-14 D R1 MIN NOM MAX A — — 1.20 θ2 A1 0.05 — 0.15 S A2 0.90 1.00 1.05 A3 0.34 0.44 0.54 b 0.20 — 0.28 b1 0.20 0.22 0.24 c 0.10 — 0.19 c1 0.10 0.13 0.15 D 4.86 4.96 5.06 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 R E E1 B L B θ1 L1 L2 +0 e b b1 A1 c θ3 e L 0.65 BSC 0.45 L1 SECTION B-B １６ 0.60 0.75 1.00 REF L2 c1 A A2 BASE METAL A3 #1 PIN INDEX Φ1.0±0.05 0.1-0.1 DEP 0.10 Dimensions In Millimeters Symbol 0.25 BSC R 0.09 — — R1 0.09 — — S θ1 0.20 — — 0° — 8° θ2 10° 12° 14° θ3 10° 12° 14° SGM321/358/324 PACKAGE OUTLINE DIMENSIONS TSSOP-16 A b E E1 Symbol PIN #1 IDENT. A2 A e C θ A L D D E b c E1 A A2 A1 e L H θ Dimensions In Millimeters Min Max 4.900 4.300 0.190 0.090 6.250 5.100 4.500 0.300 0.200 6.550 1.100 0.800 1.000 0.020 0.150 0.65 (BSC) 0.500 0.700 0.25(TYP) 1° 7° Dimensions In Inches Min Max 0.193 0.169 0.007 0.004 0.246 0.201 0.177 0.012 0.008 0.258 0.043 0.031 0.039 0.001 0.006 0.026 (BSC) 0.020 0.028 0.01(TYP) 1° 7° H A1 １７ SGM321/358/324 REVISION HISTORY Location Page 11/06— Data Sheet changed from REV.A to REV.B Changes to ABSOLUTE MAXIMUM ATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 04/07— Data Sheet changed from REV.B to REV.C Adds Output Voltage Swing from Rail test condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 06/07— Data Sheet changed from REV.C to REV. D Adds SO-14 and TSSOP-14 Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1, 3, 14, 16 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １８ SGM321/358/324