SANKEN SI-3000ZD_11

1-1-4 Linear Regulator ICs
SI-3000ZD Series Surface-Mount, Low Dropout Voltage
■Features
■Absolute Maximum Ratings
• Compact surface-mount package (TO263-5)
Parameter
(Ta=25°C)
Symbol
Ratings
Unit
VIN*1
10
V
Output Control Terminal Voltage
VC
6
V
DC Output Current
IO*1
3.0
A
• Low circuit current at output OFF: Iq (OFF) ≤ 1µA
Power Dissipation
PD*3
3
W
• Built-in overcurrent and thermal protection
circuits
Junction Temperature
Tj
–30 to +125
°C
Operating Ambient Temperature
Top
–30 to +85
°C
Storage Temperature
Tstg
–40 to +125
°C
Thermal Resistance (Junction to Ambient Air)
θ j-a
33.3
°C/W
Thermal Resistance (Junction to Case)
θ j-c
3
°C/W
DC Input Voltage
• Output current: 3.0A
• Low dropout voltage: VDIF ≤ 0.6V (at IO = 3.0A)
■Applications
• Secondary stabilized power supply (local
power supply)
■Recommended Operating Conditions
Parameter
Symbol
Input Voltage
Ratings
*2
VIN
Output Current
Unit
to 6*1
IO
0 to 3
A
Top (a)
–20 to +85
°C
Operating Junction Temperature
Top (j)
–20 to +100
°C
Output Voltage Variable Range
VOADJ
1.2 to 5
V
Operating Ambient Temperature
Remarks
V
Only for SI-3011ZD. Refer to the block diagram.
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
*2: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower (SI-3011ZD).
*3: When mounted on glass-epoxy board of 40 × 40mm (copper laminate area 100%).
■Electrical Characteristics
(Ta=25°C, VC=2V, unless otherwise specified)
Ratings
Parameter
Symbol
SI-3011ZD (Variable type)
min.
Output Voltage
(Reference Voltage VADJ for SI-3011ZD)
1.078
Conditions
max.
min.
1.100
1.122
3.234
VIN=VO+1V, IO=10mA
Conditions
Load Regulation
VDIF
1
Conditions
RREJ
Conditions
*4
VC, IH
Control Voltage (Output OFF)*3
VC, IL
VC
Control Current(Output ON)
Terminal
Control Current(Output OFF)
VIN=5V, VC=0V
±0.3
±0.3
Tj=0 to 100°C
Tj=0 to 100°C
60
60
VIN=VO+1V, f=100 to 120HZ, IO=0.1A
VIN=5V, f=100 to 120HZ, IO=0.1A
0.8
100
100
VC=2.7V
–5
0
VC=0V
VC=2.7V
–5
0
VC=0V
mV
V
mA
µA
A
2
0.8
mV
dB
VIN=5V
2
V
mV/ °C
3.2
IC, IH
IC, IL
1.5
1
VIN=VO+1V
Conditions
Conditions
1
VIN=5V, IO=0A, VC=2V
3.2
Conditions
Control Voltage (Output ON)*3
1.5
VIN=VO+1V, VC=0V
∆VO/∆Ta
IS1
0.6
IO=3A
1
Conditions
Current*2
VIN=5V, IO=0 to 3A
VIN=VO+1V, IO=0A, VC=2V
Iq (OFF)
Ripple Rejection
40
0.6
Iq
Temperature Coefficient
of Output Voltage
10
IO=3A (VO=2.5V)
Conditions
Circuit Current at Output OFF
3.366
VIN=4.5 to 5.5V, IO=10mA
VIN=3.3V, IO=0 to 3A (VO=2.5V)
Conditions
Quiescent Circuit Current
3.300
40
Conditions
Dropout Voltage
max.
VIN=5V, IO=10mA
VIN=3.3 to 5V, IO=10mA (VO=2.5V)
∆VOLOAD
Unit
typ.
10
∆VOLINE
Line Regulation
Overcurrent Protection Starting
VO (VADJ)
SI-3033ZD
typ.
V
µA
µA
*1: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower.
*2: IS1 is specified at the –5% drop point of output voltage VO under the condition of Output Voltage parameter.
*3: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
*4: These products cannot be used for the following applications because the built-in foldback-type overcurrent protection may cause errors during start-up stage.
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage
78
ICs
SI-3000ZD Series
■External Dimensions (TO263-5)
(Unit : mm)
±0.2
10.0
(8.0)
±0.2
1.2
+0.10
1.3 –0.05
(2×R0.45)
±0.1
±0.2
(R0.3)
±0.2
4.9
2.54
±0.3
2.0
2.4
(R0.3)
(0.75)
±0.2
4.9
±0.10
0.88
Pin Assignment
q VC
w VIN
e GND (Common to the rear side of product)
r VO
t Sense
(ADJ for SI-3011ZD)
±0.3
±0.15
0.10
(3°)
(3°)
15.30
15.3
9.2±
±0.3
±0.2
(6.8)
(3°)
±0.2
(4.6)
±0.2
φ1.5 Dp:
(4.4)
±0.2
4.5
3-R0.3
9.2
(15°)
(1.75)
(0.40)
Case temperature
measurement point
0~6°
(0.5)
±0.1
±0.1
0.8
±0.25
)
(1.7
±0.25
(1.7
)
1
2
3
4
0.8
±0.25
(1.7
)
±0.25
(1.7
)
5
±0.2
9.9
(3°)
(3°)
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 1.48g
2-R0.3
±0.02
10.0
0.1
■Block Diagram
SI-3011ZD
VIN
2
4
*
R3
Drive
ON/
OFF
1
TSD
OCP
AMP1
5
-
+
+
REF
R1
+
CIN
VC
CIN: Input capacitor (Approx. 10µF)
CO: Output capacitor (47µF or larger)
The output voltage may oscillate if a low ESR type capacitor
(such as a ceramic capacitor) is used for the output capacitor in
the SI-3000ZD Series.
VO
+
ADJ
CO
-
R2
+
3
GND
SI-3033ZD
VIN
2
4
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
at left.
The recommended value for R2 is 10kΩ or 11kΩ.
VO
+
5
CIN
VC
ON/
OFF
1
TSD
OCP
AMP1
-
+
SENSE
+
REF
+
Drive
R1= (VO–VADJ) / (VADJ/R2)
*: Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended
value for R3 is 10kΩ.
CO
+
3
GND
■Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
Junction to Ambient Temperature
Thermal Resistance θ j-a (°C/W)
55
• A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic IC is mounted.
• Obtaining the junction temperature
Measure GND terminal temperature TC with a thermocouple, etc. Then substitute
this value in the following formula to obtain the junction temperature.
50
When Using Glass-Epoxy Board of 40 × 40 mm
45
40
Tj=PD×θ j–C+TC
PD= (VIN–VO)•IOUT
35
30
0
200
400
600
800
1000
1200
1400
1600
1800
Copper Laminate Area (mm2)
ICs
79