SM6HT ® HIGH TEMPERATURE TRANSIL™ FOR AUTOMOTIVE APPLICATIONS FEATURES ■ High performance TRANSIL designed to fit high temperature environment like automotive applications ■ High reliability planar technology ■ High performance in voltage regulation mode ■ Very low leakage current: IR max. = 5µA @ Tamb = 150°C ■ ■ ■ ■ Peak pulse power: 600W (10/1000µs) Fast response time Unidirectinal type Low clamping factor SMB (JEDEC DO-214AA) DESCRIPTION This high performance Transil series has been designed to fit high temperature environment such as automotive applications, using surface mount technology. These devices are using high reliability planar technology resulting in high performances in voltage regulation mode and low leakage current at high temperature. Table 1: Order Codes Part Number Marking SM6HTxxx See page 2 Table 2: Absolute Maximum Rating (Tamb = 25°C) Symbol PPP P IFSM Parameter Unit 600 W Peak pulse power dissipation (see note 1) Tj initial = Tamb Power dissipation on infinite heatsink Tamb = 50°C 5 W Non repetitive surge peak forward current for unidirectional types tp = 10 ms Tj initial = Tamb 75 A -65 to 175 °C 260 °C Value 20 100 Unit °C/W °C/W Tstg / Tj Storage and operating junction temperature range TL Value Maximum lead temperature for soldering during 10 s. Note 1: for a surge greater than the maximum values, the diode will fail in short-circuit. Table 3: Thermal Resistances Symbol Parameter Rth(j-l) Junction to leads Rth(j-a) Junction to ambient on printed circuit on recommended pad layout January 2005 REV. 5 1/6 SM6HT Table 4: Electrical Characteristics (Tamb = 25°C) Symbol Parameter I IF VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage VF VCL VBR VRM V IRM IRM Leakage current IPP Peak pulse current VF Forward voltage drop Types Marking IPP IRM @ VRM VBR Tamb=25°C Tamb=150°C max max µA µA @ IR note1 min V V nom max V V mA VCL @ IPP αT 10/1000µs max max note2 V A 10-4/°C SM6HT24A EMB 20.5 22.8 24 25.2 33.2 18.0 9.4 SM6HT27A EPB 23.1 25.7 27 28.4 37.5 16.0 9.6 SM6HT30A ERB 25.6 28.5 30 31.5 41.5 14.5 9.7 SM6HT36A EVB 30.8 34.2 36 37.8 49.9 12.0 9.9 SM6HT39A EXB 33.3 37.1 39 41.0 53.9 11.1 10.0 SM6HT43A EYB 36.8 40.9 43 45.2 59.3 10.1 10.1 Note 1: Note 2: 2/6 Pulse test : tp < 50 ms. 2 ∆VBR = αT x (Tamb - 25) x VBR(25°C). 5 1 SM6HT Figure 1: Peak power dissipation versus initial junction temperature Figure 2: Continuous power versus ambient temperature PPP[Tj initial] / PPP[Tj initial=25°C] dissipation P(W) 1.1 6 1.0 Rth(j-a)=Rth(j-l) 0.9 5 0.8 4 0.7 0.6 3 0.5 0.4 2 Rth(j-a)=100°C/W 0.3 0.2 1 0.1 Tamb(°C) Tj initial(°C) 0 0.0 0 25 50 75 100 125 150 175 200 Figure 3: Peak pulse power versus exponential pulse duration (Tj initial=25°C) 0 25 50 75 100 125 150 175 Figure 4: Clamping voltage versus peak pulse current (Tj initial=25°C) IPP(A) PPP(kW) 1E+2 10.0 SM6HT30A SM6HT27A SM6HT36A SM6HT39A SM6HT24A tp = 20µs 1E+1 SM6HT43A 1.0 1E+0 tp = 1ms tp(ms) VCL(V) 0.1 1E-1 0.01 0.10 1.00 10.00 Figure 5: Junction capacitance versus reverse applied voltage (typical values) 10 100 Figure 6: Peak forward voltage drop versus peak forward current (typical values) C(pF) IFM(A) 1000 100.0 F=1MHz Tj=175°C 500 10.0 SM6HT24A Tj=25°C SM6HT27A 200 1.0 SM6HT30A SM6HT36A SM6HT39A VR(V) 100 1 10 VFM(V) SM6HT43A 0.1 100 200 0.5 1.0 1.5 2.0 2.5 3.0 3.5 3/6 SM6HT Figure 7: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout) Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, e(Cu)=35µm) Rth(j-a)(°C/W) Zth(j-a)(°C/W) 100 1E+2 90 80 1E+1 70 60 1E+0 50 tp(ms) S(cm²) 1E-1 40 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 9: Variation of leakage current versus junction temperature (typical values) IR(µA) 2E+0 1E+0 1E-1 Tj(°C) 4E-2 25 4/6 50 75 100 125 150 175 0 1 2 3 4 5 SM6HT Figure 10: SMB Package Mechanical Data DIMENSIONS E1 REF. D E A1 A2 C L b Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 Figure 11: Foot Print Dimensions (millimeters) 2.3 1.52 2.75 1.52 Table 5: Ordering Information Part Number Marking Package Weight Base qty Delivery mode SM6HTxxx See page 2 SMB 0.107 g 2500 Tape & reel Table 6: Revision History Date Revision Apr-1999 4A 26-Jan-2005 5 Description of Changes Last update. Figure 9 on page 4: leakage current improved. 5/6 SM6HT Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6