SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
D Auto-powerdown Plus
D Operate With 3-V to 5.5-V VCC Supply
D Always-Active Noninverting Receiver
D
D
D
D
D
D
D
DB, DW, OR PW PACKAGE
(TOP VIEW)
C2 +
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
FORCEON
FORCEOFF
Output (ROUT1B)
Support Operation From 250 kbit/s to
1 Mbit/s
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accept 5-V Logic Input With 3.3-V Supply
Inter-Operable With SN65C3243,
SN75C3243
RS-232 Bus-Pin ESD Protection Exceeds
±15-kV Using Human-Body Model (HBM)
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Sub-Notebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
INVALID
description/ordering information
The ’C3238 devices consist of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The charge pump and four small external
capacitors allow operation from a single 3-V to 5.5-V supply. In addition, these devices include an always-active
noninverting output (ROUT1B), which allows applications using the ring indicator to transmit data while the
device is powered down. These devices operate at data signaling rates up to 1 Mbit/s and at an increased
slew-rate range of 24 V/µs to 150 V/µs.
ORDERING INFORMATION
SOIC (DW)
−0°C
70°C
−0
C to 70
C
SSOP (DB)
TSSOP (PW)
SOIC (DW)
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
TSSOP (PW)
Tube of 20
SN75C3238DW
Reel of 1000
SN75C3238DWR
Reel of 2000
SN75C3238DBR
Tube of 50
SN75C3238PW
Reel of 2000
SN75C3238PWR
Tube of 20
SN65C3238DW
Reel of 1000
SN65C3238DWR
Reel of 2000
SN65C3238DBR
Tube of 50
SN65C3238PW
Reel of 2000
SN65C3238PWR
TOP-SIDE
MARKING
75C3238
75C3238
CA3238
65C3238
65C3238
CB3238
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
description/ordering information (continued)
Flexible control options for power management are featured when the serial-port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for 30 s, the
built-in charge-pump and drivers are powered down, reducing the supply current to 1 µA. By disconnecting the
serial port or placing the peripheral drivers off, auto-powerdown plus will occur if there is no activity in the logic
levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and FORCEOFF are high.
With auto-powerdown plus enabled, the device automatically activates once a valid signal is applied to any
receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less
than −2.7 V or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver
input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DRIVER STATUS
DIN
FORCEON
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
X
X
L
X
Z
Powered off
Normal operation with
auto-powerdown plus disabled
DOUT
L
H
H
X
H
H
H
H
X
L
L
L
H
<30 s
H
H
L
H
<30 s
L
L
L
H
>30 s
Z
H
L
H
>30 s
Z
Normal operation with
auto-powerdown plus enabled
Powered off by
auto-powerdown plus feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUTS
RIN2
RIN1,
RIN3−RIN5
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
L
X
L
H
X
L
L
L
L
H
H
L
ROUT1B
ROUT
X
L
Z
X
H
Z
H
<30 s
L
H
H
<30 s
L
L
H
<30 s
H
H
H
H
H
<30 s
H
L
Open
Open
H
>30 s
L
H
RECEIVER STATUS
Powered off while
ROUT1B is active
Normal operation with
auto-powerdown plus
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
logic diagram (positive logic)
DIN1
DIN2
DIN3
DIN4
DIN5
FORCEOFF
FORCEON
ROUT1B
ROUT1
ROUT2
ROUT3
24
5
23
6
22
7
19
10
17
12
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
14
13
Auto-powerdown
Plus
15
INVALID
16
21
8
20
9
18
11
RIN1
RIN2
RIN3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
Operating free-air temperature
MIN
NOM
MAX
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
3
3.3
3.6
4.5
5
5.5
VCC = 5 V
2.4
UNIT
V
2
V
0.8
V
0
5.5
V
V
−25
25
SN75C3238
0
70
SN65C3238
−40
85
°C
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
ICC
Input leakage current
Supply current
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP‡
MAX
±0.01
±1
µA
0.5
2
mA
Auto-powerdown plus
disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown plus
enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
UNIT
µA
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP†
VOH
VOL
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
IIH
IIL
High-level input current
VI = VCC
VI at GND
Low-level input current
±0.01
IOS
Short-circuit output current‡
VCC = 3.6 V,
VCC = 5.5 V,
ro
Output resistance
VCC, V+, and V− = 0 V,
VO = 0 V
VO = 0 V
VO = ±2 V
VO = ±12 V,
300
MAX
UNIT
V
V
±1
µA
±0.01
±1
µA
±35
±60
±40
±90
mA
Ω
10M
±25
VCC = 3 V to 3.6 V
µA
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Ioff
Output leakage current
FORCEOFF = GND
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
Maximum data rate
(see Figure 1)
TEST CONDITIONS
kΩ
RL = 3 kΩ,
One DOUT switching
MIN
CL = 1000 pF
CL = 250 pF,
CL = 1000 pF,
TYP†
MAX
UNIT
250
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ, See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
CL = 150 pF to 1000 pF,
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
1000
kbit/s
1000
25
18
ns
150
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
MIN
TYP†
VCC − 0.6 V
VCC − 0.1 V
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MAX
V
0.4
1.5
2.4
1.8
2.4
0.6
1.2
0.8
1.5
FORCEOFF = 0 V
±0.05
V
V
V
0.3
Output leakage current (except ROUT1B)
UNIT
V
±10
µA
ri
Input resistance
VI = ±3 V to ±25 V
3
5
7
kΩ
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
ten
tdis
Output enable time
Propagation delay time, high- to low-level output
Output disable time
Pulse skew‡
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
MIN
TYP†
MAX
UNIT
150
ns
150
ns
200
ns
200
ns
tsk(p)
See Figure 3
50
ns
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
AUTO-POWERDOWN PLUS SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP†
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC − 0.6
V
V
0.4
V
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
tvalid
tinvalid
MIN
TYP†
MAX
UNIT
Propagation delay time, low- to high-level output
0.1
µs
Propagation delay time, high- to low-level output
50
µs
25
µs
ten
Supply enable time
tdis
Receiver or driver edge to auto-powerdown plus
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
POST OFFICE BOX 655303
15
• DALLAS, TEXAS 75265
30
60
s
7
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
6V
SR(tr) +
t THL or t TLH
tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
GND
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
VOH
Output
RS-232 Input
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
−0.3 V
Indeterminate
Autopowerdown
plus
INVALID
−2.7 V
CL = 30 pF
(see Note A)
Valid RS-232 Level, INVALID High
† Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
DIN
DOUT
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, ZO = 50 Ω,
50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Receiver
Input
3V
2.7 V
0V
0V
−2.7 V
−3 V
tinvalid
tvalid
INVALID
Output
Driver
Input
50%
VCC
50%
0V
3 V to 5 V
50%
50%
0V
≈5.5 V
Driver
Output
≈−5.5 V
tdis
ten
tdis
V+
V+
V+ −0.3 V
Supply
Voltages
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
ten
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
APPLICATION INFORMATION
CBYPASS = 0.1 µF
+
−
1
2
+
C2
V+
28
27
+
GND
−
−
3
4
+
−
C1+
C2+
C2−
VCC
V−
C1−
C4
DOUT1
DOUT2
DOUT3
RIN1
C3†
+
−
26
C1
25
5
24
6
23
7
22
8
21
9
20
DIN1
DIN2
DIN3
ROUT1
Serial Port
RIN2
ROUT2
Logic I/Os
5 kΩ
DOUT4
RIN3
10
19
11
18
DIN4
ROUT3
5 kΩ
DOUT5
12
17
16
DIN5
ROUT1B
5 kΩ
FORCEON
FORCEOFF
Autopowerdown
Plus
13
14
15
INVALID
† C3 can be connected to VCC or GND.
NOTE A: Resistor values shown are nominal.
VCC vs CAPACITOR VALUES
VCC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
C1
C2, C3, and C4
0.1 µF
0.22 µF
0.047 µ F
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
Figure 6. Typical Operating Circuit and Capacitor Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65C3238DB
PREVIEW
SSOP
DB
28
SN65C3238DBR
ACTIVE
SSOP
DB
SN65C3238DBRE4
ACTIVE
SSOP
SN65C3238DBRG4
ACTIVE
SN65C3238DW
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238DWE4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238DWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238DWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238DWRE4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238DWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PWE4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3238PWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DB
PREVIEW
SSOP
DB
28
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DWE4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3238DWRE4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN75C3238DWRG4
ACTIVE
SOIC
DW
28
SN75C3238PW
ACTIVE
TSSOP
PW
28
50
SN75C3238PWE4
ACTIVE
TSSOP
PW
28
SN75C3238PWG4
ACTIVE
TSSOP
PW
28
SN75C3238PWR
ACTIVE
TSSOP
PW
SN75C3238PWRE4
ACTIVE
TSSOP
SN75C3238PWRG4
ACTIVE
TSSOP
1000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jul-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65C3238DBR
DB
28
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN65C3238DWR
DW
28
TAI
330
32
11.35
18.67
3.1
16
32
Q1
SN65C3238PWR
PW
28
TAI
330
16
6.9
10.2
1.8
12
16
Q1
SN65C3238PWR
PW
28
MLA
330
16
7.1
10.4
1.6
12
16
Q1
SN75C3238DBR
DB
28
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN75C3238DWR
DW
28
TAI
330
32
11.35
18.67
3.1
16
32
Q1
SN75C3238PWR
PW
28
TAI
330
16
6.9
10.2
1.8
12
16
Q1
SN75C3238PWR
PW
28
MLA
330
16
7.1
10.4
1.6
12
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN65C3238DBR
DB
28
MLA
346.0
346.0
33.0
SN65C3238DWR
DW
28
TAI
346.0
346.0
49.0
SN65C3238PWR
PW
28
TAI
346.0
346.0
33.0
SN65C3238PWR
PW
28
MLA
346.0
346.0
33.0
SN75C3238DBR
DB
28
MLA
346.0
346.0
33.0
SN75C3238DWR
DW
28
TAI
346.0
346.0
49.0
SN75C3238PWR
PW
28
TAI
346.0
346.0
33.0
SN75C3238PWR
PW
28
MLA
346.0
346.0
33.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated