SN54ACT241, SN74ACT241 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS516C – JUNE 1995 – REVISED OCTOBER 2002 D D 4.5-V to 5.5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 8.5 ns at 5 V Inputs Are TTL Compatible SN54ACT241 . . . FK PACKAGE (TOP VIEW) 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 2Y4 1A1 1OE VCC SN54ACT241 . . . J OR W PACKAGE SN74ACT241 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 2OE D D description/ordering information These octal buffers and line drivers are designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’ACT241 devices are organized as two 4-bit buffers/drivers with separate complementary output-enable (1OE and 2OE) inputs. When 1OE is low or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1OE is high or 2OE is low, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver. ORDERING INFORMATION PDIP – N –55°C to 125°C TOP-SIDE MARKING Tube SN74ACT241N Tube SN74ACT241DW Tape and reel SN74ACT241DWR SOP – NS Tape and reel SN74ACT241NSR ACT241 SSOP – DB Tape and reel SN74ACT241DBR AD241 TSSOP – PW Tape and reel SN74ACT241PWR AD241 CDIP – J Tube SNJ54ACT241J SNJ54ACT241J CFP – W Tube SNJ54ACT241W SNJ54ACT241W LCCC – FK Tube SNJ54ACT241FK SOIC – DW –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74ACT241N ACT241 SNJ54ACT241FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ACT241, SN74ACT241 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS516C – JUNE 1995 – REVISED OCTOBER 2002 FUNCTION TABLES INPUTS 1OE 1A OUTPUT 1Y L H H L L L H X Z INPUTS 2OE 2A OUTPUT 2Y H H H H L L L X Z logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ACT241, SN74ACT241 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS516C – JUNE 1995 – REVISED OCTOBER 2002 recommended operating conditions (see Note 3) SN54ACT241 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL ∆t/∆v Low-level output current High-level input voltage SN74ACT241 MIN 2 2 V V 0.8 Input transition rise or fall rate UNIT 0.8 V VCC VCC V –24 –24 mA 24 24 mA 8 8 ns/V VCC VCC 0 0 V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS 4.5 V IOH = –50 50 µA VOH IOH = –24 24 mA A IOH = –50 mA† IOH = –75 mA† MIN TA = 25°C TYP MAX SN54ACT241 MIN MAX MIN 4.49 4.4 5.5 V 5.4 5.49 5.4 5.4 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MAX UNIT 4.4 V 3.85 5.5 V IOL = 24 mA SN74ACT241 4.4 5.5 V IOL = 50 µA VOL VCC 3.85 4.5 V 0.001 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 0.1 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 V IOL = 50 mA† IOL = 75 mA† 5.5 V IOZ II VO = VCC or GND 5.5 V ±0.25 ±5 ±2.5 µA 5.5 V ±0.1 ±1 ±1 µA ICC VI = VCC or GND VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at GND or VCC 5.5 V 4 80 40 µA 1.6 1.5 mA ∆ICC‡ Ci VI = VCC or GND VI = VCC or GND 1.65 5.5 V 1.65 5.5 V 0.6 5V 2.5 Co 5V 8 † Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. ‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF pF 3 SN54ACT241, SN74ACT241 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS516C – JUNE 1995 – REVISED OCTOBER 2002 switching characteristics over recommended operating VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE or OE Y tPHZ tPLZ OE or OE Y MIN free-air TA = 25°C TYP MAX temperature SN54ACT241 SN74ACT241 MIN MAX MIN MAX 1.5 6 8.5 1 9.5 1.5 9.5 1.5 5.5 7.5 1 9 1.5 8.5 1.5 7 8.5 1 10 1 9.5 2 7 9.5 1 11.5 1.5 10.5 2 8 9.5 1 11 2 10.5 2.5 6.5 10 1 11.5 2 10.5 range, UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per buffer/driver CL = 50 pF, TYP f = 1 MHz UNIT 45 pF PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open 500 Ω LOAD CIRCUIT Output Control (low-level enabling) 3V Input 1.5 V 1.5 V 0V tPLH Output tPHL S1 Open 2 × VCC Open 3V 1.5 V 1.5 V 0V tPLZ tPZL ≈VCC Output Waveform 1 S1 at 2 × VCC (see Note B) VOH 50% VCC VOL 50% VCC TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 50% VCC tPHZ tPZH Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS VOL + 0.3 V VOL 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-89847012A ACTIVE LCCC FK 20 1 TBD 5962-8984701RA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-8984701SA ACTIVE CFP W 20 SN74ACT241DBLE OBSOLETE SSOP DB 20 SN74ACT241DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ACT241NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ACT241NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PWLE OBSOLETE TSSOP PW 20 SN74ACT241PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT241PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ACT241FK ACTIVE LCCC FK 20 1 TBD SNJ54ACT241J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54ACT241W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type TBD (1) Call TI Call TI Call TI POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jan-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ACT241DBR DB 20 SITE 41 330 16 8.2 7.5 2.5 12 16 Q1 SN74ACT241DWR DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 SN74ACT241PWR PW 20 SITE 41 330 16 6.95 7.1 1.6 8 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 4-Jan-2008 Package Pins Site Length (mm) Width (mm) Height (mm) SN74ACT241DBR DB 20 SITE 41 346.0 346.0 33.0 SN74ACT241DWR DW 20 SITE 41 346.0 346.0 41.0 SN74ACT241PWR PW 20 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265