SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 D D D D SN54ABT241 . . . J OR W PACKAGE SN74ABT241A . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SN54ABT241 . . . FK PACKAGE (TOP VIEW) description 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT240, SN74ABT240A, and ’ABT244A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs. VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2OE D State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Drive Outputs (–32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package 2Y4 1A1 1OE VCC D To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The SN54ABT241 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT241A is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-ΙΙB is a trademark of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 FUNCTION TABLES INPUTS 1OE 1A OUTPUT 1Y L H H L L L H X Z INPUTS 2OE 2A OUTPUT 2Y H H H H L L L X Z logic symbol† 1OE 1A1 1A2 1A3 1A4 1 2OE EN 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 EN 11 9 13 7 15 5 17 3 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 2 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 POST OFFICE BOX 655303 19 11 9 13 7 15 5 17 3 • DALLAS, TEXAS 75265 2Y1 2Y2 2Y3 2Y4 2Y1 2Y2 2Y3 2Y4 SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT241A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. recommended operating conditions (see Note 3) SN54ABT241 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC –24 Low-level output current 48 ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABT241A MIN 2 2 0.8 Input voltage 0 Outputs enabled TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0 5 –55 125 –40 UNIT V V 0.8 V VCC –32 V mA 64 mA 5 ns/V 85 °C 3 SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V Vhys II Ioff ICEX IO‡ Co SN54ABT241 MIN –1.2 MAX SN74ABT241A MIN –1.2 2.5 2.5 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* IOL = 64 mA VI = VCC or GND VO = 2.7 V VCC = 5.5 V, VCC = 0, VO = 0.5 V VI or VO ≤ 4.5 V VCC = 5.5 V, VO = 5.5 V VCC = 5.5 V, Outputs high VO = 2.5 V Outputs high V V 0.55 0.55* 0.55 V mV ±1 ±1 ±1 µA 10 10 10 µA –10 –10 –10 µA ±100 µA ±100 50 –50 UNIT 2 0.55 –100 –180 50 –50 –180 –50 50 µA –180 mA 1 250 250 250 µA Outputs low 24 30 30 30 mA Outputs disabled 0.5 250 250 250 µA Outputs enabled 1.5 1.5 1.5 Outputs disabled 0.05 0.05 0.05 1.5 1.5 1.5 Data inputs VCC = 5.5 V, One input at 3.4 V,, Other inputs at VCC or GND Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V POST OFFICE BOX 655303 mA 4 pF 5.5 pF * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. § This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 4 MAX –1.2 2.5 VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 5 5 V, V IO = 0, 0 VI = VCC or GND ICC Ci TA = 25°C TYP† MAX 100 IOZH IOZL ∆ICC§ MIN • DALLAS, TEXAS 75265 SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABT241 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE or OE Y tPHZ tPLZ OE or OE Y VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.6 4.1 0.8 5.3 1 2.9 4.2 0.8 5 1.1 4.8 6.3 1 7 1.3 4.3 5.8 1 7 1.1 4.6 6.1 0.8 7.9 1 3.9 5.4 0.8 6.2 UNIT ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN74ABT241A PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE or OE Y tPHZ tPLZ OE or OE Y POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.6 4.1 1 4.6 1 2.9 4.4 1 4.6 1.1 4.8 6.3 1.1 6.8 1.3 4.3 5.8 1.3 6.8 1.6 4.6 6.1 1.6 7.1 1 3.9 5.4 1 5.9 UNIT ns ns ns 5 SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCBS184D – JANUARY 1991 – REVISED JANUARY 1997 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9322701Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629322701Q2A SNJ54ABT 241FK 5962-9322701QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9322701QR A SNJ54ABT241J 5962-9322701QSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9322701QS A SNJ54ABT241W SN74ABT241ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85 SN74ABT241ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A SN74ABT241ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A SN74ABT241ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A SN74ABT241ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT241A SN74ABT241ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT241A SN74ABT241ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT241A SN74ABT241ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT241A SN74ABT241ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT241A SN74ABT241AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74ABT241AN SN74ABT241ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74ABT241AN SN74ABT241APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A SN74ABT241APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty SN74ABT241APWG4 ACTIVE TSSOP PW 20 SN74ABT241APWLE OBSOLETE TSSOP PW 20 SN74ABT241APWR ACTIVE TSSOP PW SN74ABT241APWRE4 ACTIVE TSSOP SN74ABT241APWRG4 ACTIVE SNJ54ABT241FK Eco Plan Lead/Ball Finish (2) 70 Green (RoHS & no Sb/Br) TBD 20 2000 Green (RoHS & no Sb/Br) PW 20 2000 Green (RoHS & no Sb/Br) TSSOP PW 20 2000 ACTIVE LCCC FK 20 SNJ54ABT241J ACTIVE CDIP J SNJ54ABT241W ACTIVE CFP W MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU (4/5) Level-1-260C-UNLIM -40 to 85 AB241A Call TI Call TI -40 to 85 CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB241A 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629322701Q2A SNJ54ABT 241FK 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9322701QR A SNJ54ABT241J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9322701QS A SNJ54ABT241W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 25-Sep-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF SN54ABT241 : • Catalog: SN74ABT241 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74ABT241ADBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ABT241ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ABT241APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT241ADBR SSOP DB 20 2000 367.0 367.0 38.0 SN74ABT241ADWR SOIC DW 20 2000 367.0 367.0 45.0 SN74ABT241APWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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