SCES337I − MAY 2000 − REVISED JUNE 2006 D 2-V to 5.5-V VCC Operation D Typical VOLP (Output Ground Bounce) SN54LV07A . . . J OR W PACKAGE SN74LV07A . . . D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) <0.8 V at VCC = 3.3 V, TA = 25°C D Typical VOHV (Output VOH Undershoot) D D D 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y SN54LV07A . . . FK PACKAGE (TOP VIEW) 1Y 1A NC VCC 6A D 1A 1Y 2A 2Y 3A 3Y GND >2.3 V at VCC = 3.3 V, TA = 25°C Outputs Are Disabled During Power Up and Power Down With Inputs Tied to VCC Support Mixed-Mode Voltage Operation on All Ports Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) 2A NC 2Y NC 3A description/ordering information These hex buffers/drivers are designed for 2-V to 5.5-V VCC operation. 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 6Y NC 5A NC 5Y 3Y GND NC 4Y 4A The ’LV07A devices perform the Boolean function Y = A in positive logic. 4 The open-drain outputs require pullup resistors to perform correctly and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. NC − No internal connection These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. ORDERING INFORMATION TOP-SIDE MARKING Tube of 50 SN74LV07AD Reel of 2500 SN74LV07ADR SOP − NS Reel of 2000 SN74LV07ANSR 74LV07A SSOP − DB Reel of 2000 SN74LV07ADBR LV07A Tube of 90 SN74LV07APW Reel of 2000 SN74LV07APWR Reel of 250 SN74LV07APWT TVSOP − DGV Reel of 2000 SN74LV07ADGVR LV07A CDIP − J Tube of 25 SNJ54LV07AJ SNJ54LV07AJ CFP − W Tube of 150 SNJ54LV07AW SNJ54LV07AW SOIC − D −40°C to 85°C TSSOP − PW −55°C −55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA LV07A LV07A LCCC − FK Tube of 55 SNJ54LV07AFK SNJ54LV07AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2006, Texas Instruments Incorporated !"#$% !%&% ' %()#&% !"))$% & ( *"+,!&% &$- )"! !%()# *$!(!&% *$) $ $)# ( $.& %)"#$% &%&) /&))&%0)"!% *)!$%1 $ % %$!$&),0 %!,"$ $%1 ( &,, *&)&#$$)POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCES337I − MAY 2000 − REVISED JUNE 2006 FUNCTION TABLE (each buffer/driver) INPUT A OUTPUT Y H H L L logic diagram, each buffer/driver (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCES337I − MAY 2000 − REVISED JUNE 2006 recommended operating conditions (see Note 3) VCC VIH Supply voltage High-level input voltage VIL Low-level input voltage VI VO Input voltage IOL ∆t/∆v SN54LV07A SN74LV07A MIN MAX MIN MAX 2 5.5 2 5.5 VCC = 2 V VCC = 3 V 1.5 1.5 2.1 2.1 VCC = 5 V VCC = 2.3 V to 5.5 V 3.5 3.5 VCC × 0.7 VCC × 0.7 0.5 0.5 0.9 0.9 VCC = 5 V VCC = 2.3 V to 5.5 V 1.5 1.5 0 VCC × 0.3 5.5 0 VCC × 0.3 5.5 0 5.5 0 VCC = 2 V VCC = 2.3 V to 2.7 V Low-level output current VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V Input transition rise or fall rate V V VCC = 2 V VCC = 3 V Output voltage UNIT V V 5.5 V 50 50 µA 2 2 8 8 16 16 VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V 200 200 100 100 VCC = 4.5 V to 5.5 V 20 20 mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54LV07A PARAMETER VOL TEST CONDITIONS IOL = 50 µA IOL = 2 mA IOL = 8 mA IOL = 16 mA II IOH VI = 5.5 V or GND VI = VIH, ICC Ioff VI = VCC or GND, VI or VO= 0 to 5.5 V Ci VI = VCC or GND VCC MIN TYP MAX MIN TYP MAX 2 V to 5.5 V 0.1 0.1 2.3 V 0.4 0.4 3V 0.44 0.44 4.5 V 0.55 0.55 UNIT V ±1 ±1 µA 5.5 V ±2.5 ±2.5 µA 5.5 V 20 20 µA 5 µA 0 to 5.5 V VOH = VCC IO = 0 SN74LV07A 0 3.3 V 5 1.6 1.6 pF ' %()#&% !%!$)% *)"! % $ ()#&2$ ) $1% *&$ ( $2$,*#$%- '&)&!$)! && &% $) *$!(!&% &)$ $1% 1&,- $.& %)"#$% )$$)2$ $ )1 !&%1$ ) !%%"$ $$ *)"! /" %!$- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCES337I − MAY 2000 − REVISED JUNE 2006 switching characteristics over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A Y tPHL A Y tPLH A Y tPHL A LOAD CAPACITANCE MIN TA = 25°C TYP MAX CL = 15 pF CL = 50 pF Y SN54LV07A SN74LV07A MIN MAX MIN MAX 6.6∗ 10.4∗ 1∗ 13∗ 1 13 7.5∗ 10.4∗ 1∗ 13∗ 1 13 11.1 15.2 1 18 1 18 9.6 15.2 1 18 1 18 UNIT ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A Y tPHL A Y tPLH A Y tPHL A LOAD CAPACITANCE TA = 25°C MIN TYP MAX CL = 15 pF CL = 50 pF Y SN54LV07A SN74LV07A MIN MAX MIN MAX 5∗ 7.1∗ 1∗ 8.5∗ 1 8.5 5∗ 7.1∗ 1∗ 8.5∗ 1 8.5 8.2 10.6 1 12 1 12 6.6 10.6 1 12 1 12 UNIT ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A Y tPHL A Y tPLH A Y tPHL A LOAD CAPACITANCE TA = 25°C MIN TYP MAX CL = 15 pF CL = 50 pF Y SN54LV07A SN74LV07A MIN MAX MIN MAX 3.8∗ 5.5∗ 1∗ 6.5∗ 1 6.5 3.4∗ 5.5∗ 1∗ 6.5∗ 1 6.5 5.7 7.5 1 8.5 1 8.5 4.5 7.5 1 8.5 1 8.5 UNIT ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 4) SN74LV07A PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.4 0.8 V VOL(V) Quiet output, minimum dynamic VOL −0.1 −0.8 V VOH(V) Quiet output, minimum dynamic VOH 3.2 VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage V 2.31 V 0.99 V VCC 3.3 V TYP UNIT 5V 5.3 NOTE 4: Characteristics are for surface-mount packages only. operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS CL = 50 pF, ' %()#&% !%!$)% *)"! % $ ()#&2$ ) $1% *&$ ( $2$,*#$%- '&)&!$)! && &% $) *$!(!&% &)$ $1% 1&,- $.& %)"#$% )$$)2$ $ )1 !&%1$ ) !%%"$ $$ *)"! /" %!$- 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 10 MHz 2.9 pF SCES337I − MAY 2000 − REVISED JUNE 2006 PARAMETER MEASUREMENT INFORMATION VCC VCC RL = 1 kΩ From Output Under Test 50% VCC Input Test Point 50% VCC tPHL 0V tPLH ≈VCC CL (see Note A) 50% VCC Output VOL + 0.3 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES LOAD CIRCUIT FOR OPEN-DRAIN OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. C. The outputs are measured one at a time, with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV07AD ACTIVE SOIC D 14 SN74LV07ADBR ACTIVE SSOP DB SN74LV07ADBRE4 ACTIVE SSOP SN74LV07ADE4 ACTIVE SN74LV07ADG4 50 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV07APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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