SCES338E − SEPTEMBER 2000 − REVISED APRIL 2005 D 2-V to 5.5-V VCC Operation D Max tpd of 7 ns at 5 V D Typical VOLP (Output Ground Bounce) D D D 1A 1B 2A 2B 2C 2Y GND <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 1C 1Y 3C 3B 3A 3Y SN54LV10A . . . FK PACKAGE (TOP VIEW) 1B 1A NC VCC 1C D SN54LV10A . . . J OR W PACKAGE SN74LV10A . . . D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) description/ordering information 2A NC 2B NC 2C These triple 3-input positive-NAND gates are designed for 2-V to 5.5-V VCC operation. The ’LV10A devices perform the Boolean function Y = A • B • C or Y = A + B + C in positive logic. 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y NC 3C NC 3B 2Y GND NC 3Y 3A These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. 4 NC − No internal connection ORDERING INFORMATION TOP-SIDE MARKING Tube of 50 SN74LV10AD Reel of 2500 SN74LV10ADR SOP − NS Reel of 2000 SN74LV10ANSR 74LV10A SSOP − DB Reel of 2000 SN74LV10ADBR LV10A Tube of 90 SN74LV10APW Reel of 2000 SN74LV10APWR Reel of 250 SN74LV10APWT TVSOP − DGV Reel of 2000 SN74LV10ADGVR LV10A CDIP − J Tube of 25 SNJ54LV10AJ SNJ54LV10AJ CFP − W Tube of 150 SNJ54LV10AW SNJ54LV10AW LCCC − FK Tube of 55 SNJ54LV10AFK SOIC − D −40°C to 85°C TSSOP − PW −55°C −55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA LV10A LV10A SNJ54LV10AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2005, Texas Instruments Incorporated !"#$ $%$ & $'("%$ !((#$ % ' )!*+%$ %#, (! $'(" )#'%$ )#( # #(" ' #-% $(!"#$ %$%( .%((%$/, (!$ )(#$0 # $ $##%(+/ $+!# #$0 ' %++ )%(%"##(, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCES338E − SEPTEMBER 2000 − REVISED APRIL 2005 FUNCTION TABLE (each gate) INPUTS A B C OUTPUT Y H H H L L X X H X L X H X X L H logic diagram, each gate (positive logic) A B C Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range applied in high or low state, VO (see Notes 1 and 2) . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range applied in power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCES338E − SEPTEMBER 2000 − REVISED APRIL 2005 recommended operating conditions (see Note 4) SN54LV10A VCC VIH High-level input voltage VIL Low-level input voltage VI VO Input voltage IOH IOL ∆t/∆v MIN MAX 2 5.5 Supply voltage VCC = 2 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V 2 5.5 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 Output voltage 0 0.5 0 VCC −50 VCC × 0.3 5.5 0 VCC −50 −2 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V V V V µA −2 −6 −6 −12 −12 VCC = 2 V VCC = 2.3 V to 2.7 V 50 50 2 2 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V 6 6 12 12 200 200 100 100 20 20 VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V V VCC × 0.3 VCC × 0.3 VCC × 0.3 5.5 VCC = 2 V VCC = 2.3 V to 2.7 V UNIT V 0.5 VCC × 0.3 VCC × 0.3 0 Input transition rise or fall rate MAX 1.5 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V Low-level output current MIN 1.5 VCC = 2 V VCC = 2.3 V to 2.7 V High-level output current SN74LV10A mA µA mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54LV10A PARAMETER VOH VOL TEST CONDITIONS IOH = −50 µA IOH = −2 mA 2 V to 5.5 V IOL = 50 µA IOL = 2 mA IOL = 6 mA IOL = 12 mA VI = 5.5 V or GND VI = VCC or GND, Ioff Ci VI or VO = 0 to 5.5 V VI = VCC or GND IO = 0 MIN TYP SN74LV10A MAX MIN VCC−0.1 2 VCC−0.1 2 3V 2.48 2.48 4.5 V 3.8 2.3 V IOH = −6 mA IOH = −12 mA II ICC VCC TYP MAX UNIT V 3.8 2 V to 5.5 V 0.1 0.1 2.3 V 0.4 0.4 3V 0.44 0.44 4.5 V V 0.55 0.55 0 to 5.5 V ±1 ±1 µA 5.5 V 20 20 µA 0 5 5 µA 3.3 V 1.9 1.9 pF & $'("%$ $#($ )(! $ # '("%1# ( #0$ )%# ' #1#+)"#$, &%(%#( %% %$ #( )#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0 %$0# ( $$!# ## )(! .! $#, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCES338E − SEPTEMBER 2000 − REVISED APRIL 2005 switching characteristics over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1) PARAMETER tpd tpd TA = 25°C TYP MAX FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A, B, or C Y CL = 15 pF 7.1* A, B, or C Y CL = 50 pF 10.3 MIN SN54LV10A SN74LV10A UNIT MIN MAX MIN MAX 13* 1* 15.5* 1 15.5 ns 17.1 1 20.5 1 20.5 ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tpd tpd TA = 25°C TYP MAX FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A, B, or C Y CL = 15 pF 5.2* 8.4* A, B, or C Y CL = 50 pF 7.4 11.9 MIN SN54LV10A MIN SN74LV10A MAX UNIT MAX MIN 1* 10* 1 10 ns 1 13.5 1 13.5 ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tpd tpd TA = 25°C TYP MAX FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A, B, or C Y CL = 15 pF 3.9* A, B, or C Y CL = 50 pF 5.4 MIN SN54LV10A SN74LV10A UNIT MIN MAX MIN MAX 5.9* 1* 7* 1 7 ns 7.9 1 9 1 9 ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5) SN74LV10A PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.2 0.8 V Quiet output, minimum dynamic VOL 0 −0.8 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 3.2 High-level dynamic input voltage V 2.31 V VIL(D) Low-level dynamic input voltage NOTE 5: Characteristics are for surface-mount packages only. 0.99 V VCC 3.3 V TYP UNIT 5V 16.7 operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS CL = 50 pF, & $'("%$ $#($ )(! $ # '("%1# ( #0$ )%# ' #1#+)"#$, &%(%#( %% %$ #( )#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0 %$0# ( $$!# ## )(! .! $#, 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 10 MHz 14 pF SCES338E − SEPTEMBER 2000 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input 0V tw tsu VCC 50% VCC Input 50% VCC th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC tPLH In-Phase Output 50% VCC VOH 50% VCC VOL VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V Output Waveform 1 S1 at VCC (see Note B) tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 50% VCC tPZL tPHL tPHL Out-of-Phase Output 0V VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV10AD ACTIVE SOIC D 14 SN74LV10ADBR ACTIVE SSOP DB SN74LV10ADBRE4 ACTIVE SSOP SN74LV10ADE4 ACTIVE SN74LV10ADGVR 50 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV10APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2005 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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