SN74LVC125A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS290O – JANUARY 1993 – REVISED AUGUST 2005 FEATURES • 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4Y 3OE 3A 3Y RGY PACKAGE (TOP VIEW) 1A 1Y 2OE 2A 2Y VCC • 1 1 14 2 13 4OE 3 4 12 4A 5 6 10 3OE 9 3A 11 4Y 7 8 3Y • 1OE 1A 1Y 2OE 2A 2Y GND 1OE • • • D, DB, NS, OR PW PACKAGE (TOP VIEW) Operates From 1.65 V to 3.6 V Specified From –40°C to 85°C and –40°C to 125°C Inputs Accept Voltages to 5.5 V Max tpd of 4.8 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) GND • • DESCRIPTION/ORDERING INFORMATION This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC125A features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C QFN – RGY SN74LVC125ARGYR Tube of 50 SN74LVC125AD Reel of 2500 SN74LVC125ADR Reel of 250 SN74LVC125ADT SOP – NS Reel of 2000 SN74LVC125ANSR LVC125A SSOP – DB Reel of 2000 SN74LVC125ADBR LC125A Tube of 90 SN74LVC125APW Reel of 2000 SN74LVC125APWR Reel of 250 SN74LVC125APWT TSSOP – PW (1) TOP-SIDE MARKING Reel of 1000 SOIC – D –40°C to 125°C ORDERABLE PART NUMBER LC125A LVC125A LC125A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated SN74LVC125A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS290O – JANUARY 1993 – REVISED AUGUST 2005 FUNCTION TABLE (EACH BUFFER) INPUTS OE A OUTPUT Y L H H L L L H X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A 2OE 2A 1 2 3OE 3 1Y 3A 4 5 4OE 6 2Y 4A 10 9 8 3Y 13 12 11 4Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V range (2) –0.5 6.5 V –0.5 VCC + 0.5 VI Input voltage VO Output voltage range (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance D package (4) 86 DB package (4) 96 NS package (4) 76 PW package (4) 113 RGY package (5) Tstg Storage temperature range Ptot Power dissipation (1) (2) (3) (4) (5) (6) (7) 2 °C/W 47 –65 TA = –40°C to 125°C (6) (7) V 150 °C 500 mW Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. For the D package: above 70°C, the value of Ptot derates linearly with 8 mW/K. For the DB, NS, and PW packages: above 60°C, the value of Ptot derates linearly with 5.5 mW/K. SN74LVC125A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS290O – JANUARY 1993 – REVISED AUGUST 2005 Recommended Operating Conditions (1) TA = 25°C VCC Supply voltage VIH High-level input voltage Low-level input voltage VIL VI Input voltage VO Output voltage High-level output current IOH Operating Data retention only –40°C to 125°C MIN MAX MIN MAX MIN MAX 1.65 3.6 1.65 3.6 1.65 3.6 1.5 1.5 1.5 0.65 × VCC 0.65 × VCC 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 1.7 1.7 VCC = 2.7 V to 3.6 V 2 2 2 VCC = 1.65 V to 1.95 V 0.35 × VCC 0.35 × VCC 0.35 × VCC 0.7 0.7 0.7 VCC = 2.7 V to 3.6 V 0.8 0.8 0.8 0 5.5 0 5.5 V 0 VCC 0 VCC 0 VCC V VCC = 1.65 V –4 –4 –4 VCC = 2.3 V –8 –8 –8 VCC = 2.7 V –12 –12 –12 VCC = 3 V –24 –24 –24 4 4 4 8 8 8 12 12 12 VCC = 3 V 24 24 24 Input transition rise or fall rate 8 8 8 ∆t/∆v V 5.5 VCC = 2.7 V Low-level output current V 0 VCC = 2.3 V IOL UNIT V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.65 V (1) –40°C to 85°C mA mA ns/V All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH TA = 25°C MIN TYP –40°C to 85°C MAX 1.65 V to 3.6 V VCC – 0.2 MIN MAX –40°C to 125°C MIN VCC – 0.2 VCC – 0.3 IOH = –4 mA 1.65 V 1.29 1.2 1.05 IOH = –8 mA 2.3 V 1.9 1.7 1.55 2.7 V 2.2 2.2 2.05 2.25 IOH = –12 mA VOL VCC MAX UNIT V 3V 2.4 2.4 IOH = –24 mA 3V 2.3 2.2 IOL = 100 µA 1.65 V to 3.6 V 0.1 0.2 IOL = 4 mA 1.65 V 0.24 0.45 0.6 IOL = 8 mA 2.3 V 0.3 0.7 0.75 IOL = 12 mA 2.7 V 0.4 0.4 0.6 IOL = 24 mA 3V 0.55 0.55 0.8 2 0.3 V II VI = 5.5 V or GND 3.6 V ±1 ±5 ±20 µA IOZ VO = VCC or GND 3.6 V ±1 ±10 ±20 µA ICC VI = VCC or GND, 3.6 V 1 10 40 µA 500 500 5000 µA ∆ICC Ci IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND VI = VCC or GND 2.7 V to 3.6 V 3.3 V 5 pF 3 SN74LVC125A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS290O – JANUARY 1993 – REVISED AUGUST 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tdis FROM (INPUT) TO (OUTPUT) A OE OE Y Y Y VCC TA = 25°C –40°C to 85°C TYP MAX MIN MAX MIN MAX 1.8 V ± 0.15 V 1 4.5 11.8 1 12.3 1 13.8 2.5 V ± 0.2 V 1 2.7 5.8 1 6.3 1 8.4 2.7 V 1 3 5.3 1 5.5 1 7 3.3 V ± 0.3 V 1 2.5 4.6 1 4.8 1 6 1.8 V ± 0.15 V 1 4.3 13.8 1 14.3 1 15.8 2.5 V ± 0.2 V 1 2.7 6.9 1 7.4 1 9.5 2.7 V 1 3.3 6.4 1 6.6 1 8.5 3.3 V ± 0.3 V 1 2.4 5.2 1 5.4 1 7 1.8 V ± 0.15 V 1 4.3 10.6 1 11.1 1 12.6 2.5 V ± 0.2 V 1 2.2 5.1 1 5.6 1 7.7 2.7 V 1 2.5 4.8 1 5 1 6.5 3.3 V ± 0.3 V 1 2.4 4.4 1 4.6 1 3.3 V ± 0.3 V tsk(o) –40°C to 125°C MIN 1 UNIT ns ns ns 6 1.5 ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance per gate TEST CONDITIONS f = 10 MHz VCC TYP 1.8 V 7.4 2.5 V 11.3 3.3 V 15 UNIT pF SN74LVC125A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS290O – JANUARY 1993 – REVISED AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH - V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC125AD ACTIVE SOIC D 14 SN74LVC125ADBLE OBSOLETE SSOP DB 14 SN74LVC125ADBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADRG3 PREVIEW SOIC D 14 2500 SN74LVC125ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ADTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWLE OBSOLETE TSSOP PW 14 SN74LVC125APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC125APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) TBD TBD TBD Addendum-Page 1 Lead/Ball Finish CU NIPDAU Call TI Call TI Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC125ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC125ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC125A : SN74LVC125A-Q1 • Automotive: Enhanced Product: SN74LVC125A-EP • NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Automotive • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC125ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74LVC125ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC125ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC125ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC125ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LVC125APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC125APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC125ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC125ADBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LVC125ADR SOIC D 14 2500 333.2 345.9 28.6 SN74LVC125ADR SOIC D 14 2500 346.0 346.0 33.0 SN74LVC125ADT SOIC D 14 250 346.0 346.0 33.0 SN74LVC125ANSR SO NS 14 2000 346.0 346.0 33.0 SN74LVC125APWR TSSOP PW 14 2000 346.0 346.0 29.0 SN74LVC125APWT TSSOP PW 14 250 346.0 346.0 29.0 SN74LVC125ARGYR VQFN RGY 14 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated