TI SN74LVC2G17DBVRG4

SN74LVC2G17
www.ti.com............................................................................................................................................... SCES381I – JANUARY 2002 – REVISED OCTOBER 2009
DUAL SCHMITT-TRIGGER BUFFER
FEATURES
1
• Available in the Texas Instruments NanoFree™
Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 5.4 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
2
DBV PACKAGE
(TOP VIEW)
1A
1
6
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
•
•
•
DCK PACKAGE
(TOP VIEW)
1Y
GND
2
5
VCC
2A
3
4
2Y
1A
1
6
YZP PACKAGE
(BOTTOM VIEW)
1Y
GND
2
5
VCC
2A
3
4
2Y
2A
3 4
GND
2 5
1A
1 6
2Y
VCC
1Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2009, Texas Instruments Incorporated
SN74LVC2G17
SCES381I – JANUARY 2002 – REVISED OCTOBER 2009............................................................................................................................................... www.ti.com
ORDERING INFORMATION
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
(1)
(2)
(3)
ORDERABLE
PART NUMBER
PACKAGE (1) (2)
TA
Reel of 3000
SN74LVC2G17YZPR
Reel of 3000
SN74LVC2G17DBVR
Reel of 250
SN74LVC2G17DBVT
Reel of 3000
SN74LVC2G17DCKR
Reel of 250
SN74LVC2G17DCKT
TOP-SIDE
MARKING (3)
_ _ _C7_
C17_
C7_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
1A
2A
1
6
3
4
1Y
2Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
(2)
VI
Input voltage range
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state (2) (3)
–0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance
(4)
TJ
Junction temperature under bias
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
2
DBV package
165
DCK package
259
YZP package
123
–65
V
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
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Copyright © 2002–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC2G17
SN74LVC2G17
www.ti.com............................................................................................................................................... SCES381I – JANUARY 2002 – REVISED OCTOBER 2009
Recommended Operating Conditions (1)
Operating
MIN
MAX
UNIT
VCC
Supply voltage
1.65
5.5
V
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
VCC = 1.65 V
–4
VCC = 2.3 V
IOH
High-level output current
–8
–16
VCC = 3 V
–24
VCC = 4.5 V
IOL
Low-level output current
–32
VCC = 1.65 V
4
VCC = 2.3 V
8
16
VCC = 3 V
(1)
Operating free-air temperature
mA
24
VCC = 4.5 V
TA
mA
32
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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3
SN74LVC2G17
SCES381I – JANUARY 2002 – REVISED OCTOBER 2009............................................................................................................................................... www.ti.com
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VT+
Positive-going input
threshold voltage
VT–
Negative-going input
threshold voltage
ΔVT
Hysteresis
(VT+ – VT–)
IOH = –100 µA
VOH
1
1.7
3V
1.3
2.0
4.5 V
1.9
3.1
5.5 V
2.2
3.7
1.65 V
0.3
0.7
2.3 V
0.4
1
3V
0.8
1.3
4.5 V
1.1
2
5.5 V
1.4
2.5
1.65 V
0.3
0.8
2.3 V
0.4
0.9
3V
0.4
1.1
4.5 V
0.6
1.3
5.5 V
0.7
1.4
1.2
1.9
4.5 V
IOL = 100 µA
1.65 V to 5.5 V
0.1
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
0.4
VI = 5.5 V or GND,
IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
0.55
4.5 V
VI or VO = 5.5 V
V
3.8
3V
ICC
V
2.3
IOH = –32 mA
Ioff
V
V
2.4
3V
VI = 5.5 V or GND
UNIT
VCC – 0.1
2.3 V
IOL = 32 mA
(1)
2.3 V
IOH = –8 mA
IOL = 24 mA
A input
1.4
1.65 V
IOL = 16 mA
II
0.7
1.65 V to 5.5 V
IOH = –24 mA
MAX
1.65 V
IOH = –4 mA
IOH = –16 mA
VOL
MIN TYP (1)
VCC
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
4
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
4
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
3.9
9.3
1.9
5.7
2.2
5.4
1.5
4.3
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UNIT
ns
Copyright © 2002–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC2G17
SN74LVC2G17
www.ti.com............................................................................................................................................... SCES381I – JANUARY 2002 – REVISED OCTOBER 2009
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
17
18
19
21
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Product Folder Link(s): SN74LVC2G17
UNIT
pF
5
SN74LVC2G17
SCES381I – JANUARY 2002 – REVISED OCTOBER 2009............................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
CL
(see Note A)
S1
Open
VLOAD
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
RL
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
£2 ns
£2 ns
£2.5 ns
£2.5 ns
VM
VLOAD
CL
RL
VD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kW
500 W
500 W
500 W
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
VM
VOL
tPHL
tPLZ
VLOAD/2
VM
tPZH
VM
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VOH
Output
VM
tPZL
tPHL
VM
Output
VI
Output
Control
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VD
VOL
tPHZ
VM
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVC2G17DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVRE4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVTE4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKRE4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKTE4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17YZPR
ACTIVE
DSBGA
YZP
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2009
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G17 :
SN74LVC2G17-Q1
• Automotive:
Enhanced
Product:
SN74LVC2G17-EP
•
NOTE: Qualified Version Definitions:
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Oct-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
SN74LVC2G17DBVR
SOT-23
DBV
6
3000
178.0
9.0
SN74LVC2G17DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
SN74LVC2G17DCKR
SC70
DCK
6
3000
180.0
9.2
2.24
SN74LVC2G17DCKT
SC70
DCK
6
250
180.0
9.2
2.24
SN74LVC2G17YZPR
DSBGA
YZP
6
3000
178.0
8.4
1.02
Pack Materials-Page 1
3.23
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.17
1.37
4.0
8.0
Q3
2.5
1.2
4.0
8.0
Q3
2.34
1.22
4.0
8.0
Q3
2.34
1.22
4.0
8.0
Q3
1.52
0.63
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Oct-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC2G17DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN74LVC2G17DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC2G17DCKR
SC70
DCK
6
3000
205.0
200.0
33.0
SN74LVC2G17DCKT
SC70
DCK
6
250
205.0
200.0
33.0
SN74LVC2G17YZPR
DSBGA
YZP
6
3000
220.0
220.0
35.0
Pack Materials-Page 2
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