TI SN74LVCH16543ADLR

SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
FEATURES
•
•
•
•
•
•
•
•
•
•
•
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 5.4 ns at 3.3 V
Typical VOLP (Output Ground Bounce) < 0.8 V
at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With
3.3-V VCC)
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1OEAB
1LEAB
1CEAB
GND
1A1
1A2
VCC
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
VCC
2A7
2A8
GND
2CEAB
2LEAB
2OEAB
DESCRIPTION/ORDERING INFORMATION
This 16-bit registered transceiver is designed for
1.65-V to 3.6-V VCC operation.
The SN74LVCH16543A can be used as two 8-bit
transceivers or one 16-bit transceiver. Separate
latch-enable (LEAB or LEBA) and output-enable
(OEAB or OEBA) inputs are provided for each
register, to permit independent control in either
direction of data flow.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OEBA
1LEBA
1CEBA
GND
1B1
1B2
VCC
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
VCC
2B7
2B8
GND
2CEBA
2LEBA
2OEBA
ORDERING INFORMATION
PACKAGE (1)
TA
Tape and reel
SN74LVCH16543ADLR
TSSOP – DGG
Tape and reel
SN74LVCH16543ADGGR
LVCH16543A
TVSOP – DGV
Tape and reel
SN74LVCH16543ADGVR
LDH543A
VFBGA – GQL
VFBGA – ZQL (Pb-free)
(1)
TOP-SIDE MARKING
SN74LVCH16543ADL
SSOP – DL
–40°C to 85°C
ORDERABLE PART NUMBER
Tube
Tape and reel
SN74LVCH16543AGQLR
SN74LVCH16543AZQLR
LVCH16543A
LDH543A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1993–2005, Texas Instruments Incorporated
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The A-to-B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and
LEAB is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB puts the A latches
in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect the data
present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and
OEBA inputs.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or
pulldown resistors with the bus-hold circuitry is not recommended. The bus-hold circuitry is part of the input
circuit and is not disabled by OE or DIR.
GQL OR ZQL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
TERMINAL ASSIGNMENTS
2
1
2
3
4
5
6
A
1CEAB
1LEAB
1OEAB
1OEBA
1LEBA
1CEBA
B
1A2
1A1
GND
GND
1B1
1B2
C
1A4
1A3
VCC
VCC
1B3
1B4
D
1A6
1A5
GND
GND
1B5
1B6
E
1A8
1A7
1B7
1B8
F
2A1
2A2
2B2
2B1
G
2A3
2A4
GND
GND
2B4
2B3
H
2A5
2A6
VCC
VCC
2B6
2B5
J
2A7
2A8
GND
GND
2B8
2B7
K
2CEAB
2LEAB
2OEAB
2OEBA
2LEBA
2CEBA
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
FUNCTION TABLE (1)
(EACH 8-BIT SECTION)
INPUTS
(1)
(2)
OEAB
A
OUTPUT
B
X
X
X
Z
X
H
X
Z
L
H
L
X
B0 (2)
L
L
L
L
L
L
L
L
H
H
CEAB
LEAB
H
X
A-to-B data flow is shown; B-to-A flow control is the same, except
that it uses CEBA, LEBA, and OEBA.
Output level before the indicated steady-state input conditions were
established
3
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
1OEBA
1CEBA
1LEBA
1OEAB
1CEAB
1LEAB
1A1
56
54
55
1
3
2
C1
5
1D
52
1B1
C1
1D
To Seven Other Channels
2OEBA
2CEBA
2LEBA
2OEAB
2CEAB
2LEAB
2A1
29
31
30
28
26
27
C1
15
1D
C1
1D
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, and DL packages.
4
42
2B1
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
Absolute Maximum Ratings
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
(1)
(2)
(3)
(4)
DGG package
64
DGV package
48
DL package
56
GQL/ZQL package
42
Storage temperature range
–65
V
°C/W
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
MIN
MAX
1.65
3.6
1.5
Low-level input voltage
VI
Input voltage
VO
Output voltage
1.7
VCC = 2.7 V to 3.6 V
2
High-level output current
0.35 × VCC
0.7
VCC = 2.7 V to 3.6 V
0.8
0
5.5
High or low state
0
VCC
3-state
0
5.5
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
V
V
–4
VCC = 2.3 V
–8
VCC = 2.7 V
–12
VCC = 3 V
–24
VCC = 1.65 V
IOL
V
VCC = 2.3 V to 2.7 V
VCC = 1.65 V
IOH
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VIL
UNIT
mA
4
VCC = 2.3 V
8
VCC = 2.7 V
12
VCC = 3 V
24
–40
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –100 µA
VOH
1.65 V to 3.6 V
Control inputs
Ioff
1.2
IOH = –8 mA
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = –24 mA
3V
2.2
IOL = 100 µA
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.7
IOL = 12 mA
2.7 V
0.4
3V
0.55
VI = 0 to 5.5 V
0
1.65 V
VI = 1.07 V
VI = 0.7 V
VI = 0 to 3.6 V (3)
±10
µA
45
µA
75
–75
±500
3.6 V
VO = 0 V or (VCC to 5.5 V)
∆ICC
µA
–45
3V
VI = 2 V
ICC
±5
(2)
2.3 V
VI = 1.7 V
VI = 0.8 V
IOZ (4)
V
(2)
VI = 0.58 V
A or B ports
UNIT
V
3.6 V
VI or VO = 5.5 V
II(hold)
MAX
VCC – 0.2
1.65 V
IOL = 24 mA
II
TYP (1)
IOH = –4 mA
IOH = –12 mA
VOL
MIN
±5
2.3 V to 3.6 V
VI = VCC or GND,
IO = 0
3.6 V ≤ VI ≤ 5.5 V (5),
IO = 0
20
3.6 V
One input at VCC – 0.6 V, Other inputs at VCC or GND
20
2.7 V to 3.6 V
500
µA
µA
µA
Ci
Control inputs
VI = VCC or GND
3.3 V
5
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
8
pF
(1)
(2)
(3)
(4)
(5)
All typical values are at VCC = 3.3 V, TA = 25°C.
This information was not available at the time of publication.
This is the bus-hold maximum dynamic current required to switch the input from one state to another.
For the total leakage current in an I/O port, consult the II(hold) specification for the input voltage condition, 0 V < VI < VCC, and the IOZ
specification for the input voltage conditions, VI = 0 V or VI = VCC to 5.5 V. The bus-hold current, at input voltage greater than VCC, is
negligible.
This applies in the disabled state only.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
MIN
MAX
VCC = 2.5 V
± 0.2 V
MIN
MAX
VCC = 2.7 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN
UNIT
MAX
tw
Pulse duration, LE or CE low
(1)
(1)
3.3
3.3
ns
tsu
Setup time, data before LE or CE↓
(1)
(1)
1.1
1.1
ns
Hold time, data after LE or CE↓
(1)
(1)
1.9
1.9
ns
th
(1)
6
This information was not available at the time of publication.
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
ten
tdis
ten
tdis
(1)
FROM
(INPUT)
TO
(OUTPUT)
A or B
B or A
LE
A or B
CE
A or B
OE
A or B
VCC = 1.8 V
± 0.15 V
MIN
VCC = 2.5 V
± 0.2 V
MAX
MIN
MAX
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
VCC = 2.7 V
MIN
VCC = 3.3 V
± 0.3 V
MAX
MIN
MAX
(1)
6.1
1.2
5.4
(1)
7.4
1.5
6.1
(1)
(1)
7.9
1.2
6.6
(1)
(1)
7.1
1.5
6.6
(1)
(1)
(1)
7.6
1
6.3
(1)
(1)
(1)
6.9
1.5
6.3
UNIT
ns
ns
ns
This information was not available at the time of publication.
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
(1)
Power dissipation capacitance
per transceiver
Outputs enabled
Outputs disabled
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
(1)
44
(1)
(1)
4
UNIT
pF
This information was not available at the time of publication.
7
SN74LVCH16543A
16-BIT REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS317M – NOVEMBER 1993 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVCH16543ADGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16543ADGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16543ADGVRE4
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16543ADGVRG4
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16543ADLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543ADGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543ADGVR
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543ADL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543ADLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543ADLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16543AGQLR
NRND
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
SNPB
Level-1-240C-UNLIM
SN74LVCH16543AZQLR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TBD
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.6
1.8
12.0
24.0
Q1
SN74LVCH16543ADGGR TSSOP
DGG
56
2000
330.0
24.4
SN74LVCH16543ADGVR TVSOP
DGV
56
2000
330.0
24.4
6.8
11.7
1.6
12.0
24.0
Q1
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
SN74LVCH16543AGQLR BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
330.0
16.4
4.8
7.3
1.45
8.0
16.0
Q1
SN74LVCH16543AZQLR BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.4
4.8
7.3
1.45
8.0
16.0
Q1
SN74LVCH16543ADLR
SSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVCH16543ADGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74LVCH16543ADGVR
TVSOP
DGV
56
2000
346.0
346.0
41.0
SN74LVCH16543ADLR
SSOP
DL
56
1000
346.0
346.0
49.0
SN74LVCH16543AGQLR BGA MICROSTAR
JUNIOR
GQL
56
1000
346.0
346.0
33.0
SN74LVCH16543AZQLR BGA MICROSTAR
JUNIOR
ZQL
56
1000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated